DATA SHEET
SKY73022-11: 700 – 1000 MHz High Gain and Linearity
Diversity Downconversion Mixer
Applications
Description
x 2G/3G base station transceivers:
GSM/EDGE, CDMA, UMTS/WCDMA, iDEN
The SKY73022-11 is a fully integrated diversity mixer that
includes Local Oscillator (LO) drivers, an LO switch, high linearity
mixers, and large dynamic range Intermediate Frequency (IF)
amplifiers. Low loss RF baluns have also been included to reduce
design complications and lower system cost.
x Small, MCM (36-pin, 6 x 6 mm) Pb-free package (MSL3, 260 qC
per JEDEC J-STD-020)
Skyworks offers lead (Pb)-free RoHS (Restriction of
Hazardous Substances) compliant packaging.
VCC_LO
The SKY73022-11 is manufactured using a robust silicon BiCMOS
process and has been designed for optimum long-term reliability.
The SKY73022-11 diversity downconversion mixer is provided in
a compact, 36-pin 6 x 6 mm Multi-Chip Module (MCM). A
functional block diagram is shown in Figure 1. The pin
configuration and package are shown in Figure 2. Signal pin
assignments and functional pin descriptions are provided in
Table 1.
VCC_IFA
x Operating frequency range: 700 to 1000 MHz
x IF frequency range: 40 to 300 MHz
x Conversion gain: 9.4 dB
x Input IP3: +25.3 dBm
x Output IP3: +34.7 dBm
x Noise figure: 9.0 dB
x Integrated LO drivers
x Integrated low loss RF baluns
x High linearity IF amplifiers
x On-chip SPDT LO switch (greater than 53 dB LO-to-LO isolation)
IFA+
IFA–
Features
The SKY73022-11 features an input IP3 of +25.3 dBm and a
Noise Figure (NF) of 9.0 dB, making the device an ideal solution
for high dynamic range systems such as 2G/3G base station
receivers. The LO switch provides more than 53 dB of isolation
between LO inputs and supports the switching time required for
GSM/EDGE base stations.
RIFA
x Land mobile radio
x ISM band transceivers
x High performance radio links
x RF identification
RFA
LO1
LO2
RFB
VCC_IFB
IFB+
IFB–
RIFB
LO_SEL
VCC_LO
S643
Figure 1. SKY73022-11 Block Diagram
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1
VCC_RFA
NC
GND
IFA–
IFA+
NC
VCC_IFA
RIFA
NC
DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
36
35
34
33
32
31
30
29
28
3
25
GND
VCC_LO
4
24
GND
GND
5
23
LO_SEL
VCC_LO
6
22
GND
GND
7
21
VCC_LO
NC
8
20
GND
RFB
9
19
LO1
10
11
12
13
14
15
16
17
18
NC
GND
RIFB
GND
VCC_IFB
26
NC
2
IFB–
NC
IFB+
LO2
GND
27
NC
1
VCC_RFB
RFA
S646
Figure 2. SKY73022-11 Pinout – 36-Pin MCM
Table 1. SKY73022-11 Signal Descriptions
Pin #
Name
Description
Pin #
Name
Description
1
RFA
Channel A RF input
19
LO1
Local oscillator 1 input
2
NC
No connect
20
GND
Ground
3
GND
Ground
21
VCC_LO
DC supply, +5 V
4
VCC_LO
DC supply, +5 V
22
GND
Ground
5
GND
Ground
23
LO_SEL
Local oscillator select switch control
6
VCC_LO
DC supply, +5 V
24
GND
Ground
7
GND
Ground
25
GND
Ground
8
NC
No connect
26
GND
Ground
9
RFB
Channel B RF input
27
LO2
Local oscillator 2 input
10
VCC_RFB
Channel B RF DC supply, +5 V
28
NC
No connect
11
NC
No connect
29
RIFA
Channel A IF bias adjust
12
GND
Ground
30
VCC_IFA
Channel A IF DC supply, +5 V
13
IFB+
Positive channel B IF output
31
NC
No connect
14
IFB–
Negative channel B IF output
32
IFA+
Positive channel A IF output
15
NC
No connect
33
IFA–
Negative channel A IF output
16
VCC_IFB
Channel B IF DC supply, +5 V
34
GND
Ground
17
RIFB
Channel B IF bias adjust
35
NC
No connect
18
NC
No connect
36
VCC_RFA
Channel A RF DC supply, +5 V
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DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
Functional Description
The SKY73022-11 is a high gain diversity mixer, optimized for
base station receiver applications. The device consists of two
diversity channels (A and B), each consisting of a low loss RF
balun, high linearity passive mixer, and a low noise IF amplifier.
Two LO amplifiers (independent of channels A and B) are also
included that allow the SKY73022-11 to connect directly to the
output of a Voltage Controlled Oscillator (VCO). This eliminates the
extra gain stages needed by most discrete passive mixers. A
Single Pole, Double Throw (SPDT) switch has been included to
select between two different LO inputs for frequency hopping
applications (i.e., GSM).
RF Baluns and Passive Mixer
The RF baluns provide a single ended input, which can easily be
matched to 50 : using a simple external matching circuit. The RF
baluns offer very low loss, and excellent amplitude and phase
balance.
The high linearity SKY73022-11 is a passive, double balanced
mixer that provides a very low conversion loss, and excellent 3rd
Order Input Insertion Point (IIP3).
Additionally, the balanced nature of the mixer provides for high
port-to-port isolation.
LO Buffers and SPDT LO Switch
The LO buffers allow the input power of the SKY73022-11 to be in
the range of r6 dBm. The LO section is optimized for high-side
LO injection. However, each of the two LOs can be driven over a
wide frequency range with only slight degradation in
performance.
LO_SEL Input
LO Path Selected
High
LO1 (pin 19) enabled
Low
LO2 (pin 27) enabled
For applications that do not require frequency hopping, LO_SEL is
fixed to one state and the appropriate LO input is used. An internal
pull-down resistor enables the LO2 input.
IF Amplifier
The SKY73022-11 includes high dynamic range IF amplifiers that
follow the passive mixers in the signal path. The outputs require a
supply voltage connection using inductive chokes. These choke
inductors should be high-Q and have the ability to handle 200 mA
or greater.
A simple matching network allows the output ports to be matched
to a balanced 200 : impedance. The IF amplifiers are optimized
for IF frequencies between 40 and 300 MHz. The IF amplifiers can
be operated outside of this range, but with a slight degradation in
performance.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY73022-11 are provided
in Table 2 and the recommended operating conditions in Table 3.
Electrical characteristics for the SKY73022-11 are provided in
Table 4.
Typical performance characteristics of the SKY73022-11 are
illustrated in Figures 3 through 33.
A high isolation SPDT switch allows the SKY73022-11 to be used
for frequency hopping applications. This switch provides greater
than 53 dB of LO1 to LO2 isolation:
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DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
Table 2. SKY73022-11 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
4.5
5.5
V
Supply voltage, +5 V (VCC_LO, VCC_RFA,
VCC_RFB, VCC_IFA, and VCC_IFB)
VCC
Supply current
ICC
420
mA
RF input power
PRF
+20
dBm
LO input power
PLO
+20
dBm
Operating case temperature
TC
–40
+85
qC
Junction temperature
TJ
150
qC
Storage case temperature
TSTG
–40
+125
qC
Notes: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
Nominal thermal resistance (junction to center ground pad) is 5.1 qC/W.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY73022-11 Recommended Operating Conditions (Note 1)
Parameter
Symbol
Minimum
Typical
Maximum
Units
4.75
5.00
5.25
V
Supply voltage, +5 V (VCC_LO, VCC_RFA,
VCC_RFB, VCC_IFA, and VCC_IFB)
VCC
Supply current
ICC
LO input power
PLO
–6
LO select input:
high
low
LO_SELH
LO_SELL
2.2
Operating case temperature
TC
RF frequency range
LO frequency range (Note 1)
IF frequency range
FIF
380
0
mA
+6
dBm
0.8
V
V
–40
+85
qC
FRF
700
1000
MHz
FLO
900
1250
MHz
40
300
MHz
Note 1: The SKY73022-11 has been optimized for high-side LO injection. However, the LO can be used outside of the specified frequency range with degraded performance.
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DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
Table 4. SKY73022-11 Electrical Specifications (Note 1)
(Voltage Supply = +5 V, TC = +25 qC, LO = 0 dBm, RF Frequency = 900 MHz, IF Frequency = 201 MHz, LO Frequency = 1101 MHz, Unless
Otherwise Noted)
Parameter
Conversion gain
Symbol
G
Gain variation over temperature
Noise Figure
NF
Noise Figure variation over temperature
Test Condition
Min
Typical
7.7
9.4
dB
FRF = 900 MHz,
TC = –40 to +85 qC
±1.0
dB
FRF = 900 MHz
9.0
dB
FRF = 900 MHz,
TC = –40 to +85 qC
±0.9
dB
20.5
dB
+25.3
dBm
FRF = 900 and 900.8 MHz,
TC = –40 to +85 qC
±0.1
dB
+34.7
dBm
FRF = 824 to 915 MHz,
VCC = 4.75 to 5.25 V,
PLO = –3 to +3 dBm
Noise Figure with a blocker signal
NFBLK
Blocking signal input
power = +8 dBm
Third order input intercept point
IIP3
FRF = 900 and 900.8 MHz,
PRF = –10 dBm/each tone,
VCC = 4.75 to 5.25 V,
PLO = –3 to +3 dBm
Input IP3 variation over temperature
+22.6
Max
Units
Third order output intercept point
OIP3
FRF = 900 and 900.8 MHz,
PRF = –10 dBm/each tone,
VCC = 4.75 to 5.25 V,
PLO = –3 to +3 dBm
2RF – 2LO
2x2
PRF = –10 dBm
–75
–63
dBc
3RF – 3LO
3x3
PRF = –10 dBm
–80
–70
dBc
Input 1 dB compression point
IP1dB
FRF = 824 to 915 MHz,
VCC = 4.75 to 5.25 V,
PLO = –3 to +3 dBm
Output 1 dB compression point
OP1dB
+11.5
+13.3
dBm
+21.7
dBm
LO1-to-LO2 isolation
FRF = 900 MHz,
FLO = 1101 MHz
53
dB
Channel-to-channel isolation
FRF = 900 MHz,
FLO = 1101 MHz
56
dB
RF to IF isolation
FRF = 900 MHz
52
dB
LO leakage:
@ RF port
@ IF port
FRF = 900 MHz,
FLO = 1101 MHz
LO_SEL input
42
–20
LO switching time
–46
–44
–33
–30
dBm
dBm
+150
+250
PA
0.5
Ps
RF port input return loss
ZIN_RF
With external matching
components
14
dB
LO port input return loss
ZIN_LO
With external matching
components
14
dB
IF port input return loss
ZOUT_IF
With external matching
components
14
dB
Note 1: Performance is guaranteed only under the conditions listed in this Table and is not guaranteed over the full operating or storage temperature ranges. Operation at elevated
temperatures may reduce reliability of the device.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
12.0
12.0
4.75 V
5.00 V
5.25 V
11.5
–40 ˚C
+25 ˚C
+85 ˚C
11.5
11.0
Mixer A Gain (dB)
Mixer A Gain (dB)
11.0
10.5
10.0
9.5
9.0
8.5
8.0
10.5
10.0
9.5
9.0
8.5
8.0
7.5
7.5
7.0
824
834
844
854
864
874
884
894
904
7.0
914
824
834
844
854
RF Frequency (MHz)
Figure 3. Mixer A Gain vs Frequency and Supply Voltage
904
914
4.75 V
5.00 V
5.25 V
11.0
Mixer B Gain (dB)
Mixer A Gain (dB)
894
11.5
–3 dBm
0 dBm
+3 dBm
11.0
10.5
10.0
9.5
9.0
8.5
10.5
10.0
9.5
9.0
8.5
8.0
8.0
7.5
7.5
7.0
834
844
854
864
874
884
894
904
824
914
834
844
854
RF Frequency (MHz)
864
874
884
894
904
914
RF Frequency (MHz)
Figure 5. Mixer A Gain vs Frequency and LO Power
Figure 6. Mixer B Gain vs Frequency and Supply Voltage
12.0
12.0
–40 ˚C
+25 ˚C
+85 ˚C
11.5
–3 dBm
0 dBm
+3 dBm
11.5
11.0
Mixer B Gain (dB)
11.0
Mixer B Gain (dB)
884
12.0
11.5
10.5
10.0
9.5
9.0
8.5
10.5
10.0
9.5
9.0
8.5
8.0
8.0
7.5
7.0
824
7.5
7.0
824
834
844
854
864
874
884
894
904
914
834
844
854
874
884
894
904
914
Figure 8. Mixer B Gain vs Frequency and LO Power
Figure 7. Mixer B Gain vs Frequency and Temperature
15
15
4.75 V
5.00 V
5.25 V
14
13
–40 ˚C
+25 ˚C
+85 ˚C
14
13
Mixer A NF (dB)
12
11
10
9
8
12
11
10
9
8
7
7
6
6
5
824
864
RF Frequency (MHz)
RF Frequency (MHz)
Mixer A NF (dB)
874
Figure 4. Mixer A Gain vs Frequency and Temperature
12.0
7.0
824
864
RF Frequency (MHz)
5
834
844
854
864
874
884
894
904
RF Frequency (MHz)
Figure 9. Mixer A Noise Figure vs Frequency and Supply
Voltage
914
824
834
844
854
864
874
884
894
904
914
RF Frequency (MHz)
Figure 10. Mixer A Noise Figure vs Frequency and Temperature
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DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
15
15
4.75 V
5.00 V
5.25 V
14
13
13
Mixer B NF (dB)
12
Mixer B NF (dB)
–40 ˚C
+25 ˚C
+85 ˚C
14
11
10
9
8
7
12
11
10
9
8
7
6
6
5
824
834
844
854
864
874
884
894
904
5
914
824
834
844
854
RF Frequency (MHz)
864
874
884
894
904
914
RF Frequency (MHz)
Figure 11. Mixer B Noise Figure vs Frequency and Supply
Voltage
Figure 12. Mixer B Noise Figure vs Frequency and Temperature
30
28
28
Mixer A IIP3 (dBm)
4.75 V
5.00 V
5.25 V
29
Mixer A IIP3 (dB)
–40 ˚C
+25 ˚C
+85 ˚C
29
30
27
26
25
24
27
26
25
24
23
23
22
22
21
20
21
824
834
844
854
20
824
834
844
854
864
874
884
894
904
864
874
884
894
904
914
RF Frequency (MHz)
914
RF Frequency (MHz)
Figure 14. Mixer A IIP3 vs Frequency and Temperature
Figure 13. Mixer A IIP3 vs Frequency and Supply Voltage
30
28
28
27
Mixer B IIP3 (dB)
–3 dBm
0 dBm
+3 dBm
29
Mixer A IIP3 (dBm)
4.75 V
5.00 V
5.25 V
29
30
26
25
24
23
27
26
25
24
23
22
21
22
20
21
824
834
844
854
20
824
834
844
854
864
874
884
894
904
864
874
884
894
904
914
RF Frequency (MHz)
914
RF Frequency (MHz)
Figure 16. Mixer B IIP3 vs Frequency and Supply Voltage
Figure 15. Mixer A IIP3 vs Frequency and LO Power
30
29
30
Mixer B IIP3 (dBm)
28
Mixer B IIP3 (dBm)
–40 ˚C
+25 ˚C
+85 ˚C
29
27
26
25
24
23
–3 dBm
0 dBm
+3 dBm
28
27
26
25
24
23
22
21
22
20
824
21
20
824
834
844
854
864
874
884
894
904
914
834
844
854
864
874
884
894
904
914
RF Frequency (MHz)
RF Frequency (MHz)
Figure 18. Mixer B IIP3 vs Frequency and LO Power
Figure 17. Mixer B IIP3 vs Frequency and Temperature
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DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
15.0
15.0
4.75 V
5.00 V
5.25 V
Mixer A IP1dB (dBm)
14.0
–40 ˚C
+25 ˚C
+85 ˚C
14.5
Mixer A IP1dB (dBm)
14.5
13.5
13.0
12.5
12.0
11.5
11.0
10.5
14.5
13.5
13.0
12.5
12.0
11.5
11.0
10.5
10.0
10.0
824
834
844
854
864
874
884
894
904
914
824
834
844
854
RF Frequency (MHz)
Figure 19. Mixer A Input P1dB vs Frequency and Supply Voltage
14.0
13.5
13.0
12.5
12.0
11.5
11.0
904
914
4.75 V
5.00 V
5.25 V
14.0
13.5
13.0
12.5
12.0
11.5
11.0
10.5
10.5
10.0
10.0
824
834
844
854
864
874
884
894
904
914
824
834
844
854
RF Frequency (MHz)
864
874
884
894
904
914
RF Frequency (MHz)
Figure 21. Mixer A Input P1dB vs Frequency and LO Power
Figure 22. Mixer B Input P1dB vs Frequency and Supply Voltage
15.0
15.0
–40 ˚C
+25 ˚C
+85 ˚C
14.5
–3 dBm
0 dBm
+3 dBm
14.5
Mixer B IP1dB (dBm)
14.5
13.5
13.0
12.5
12.0
11.5
11.0
14.0
13.5
13.0
12.5
12.0
11.5
11.0
10.5
10.5
10.0
10.0
824
834
844
854
864
874
884
894
904
824
914
834
844
854
864
874
884
894
904
914
RF Frequency (MHz)
RF Frequency (MHz)
Figure 23. Mixer B Input P1dB vs Frequency and Temperature
Figure 24. Mixer B Input P1dB vs Frequency and LO Power
–55
–55
–40 ˚C
+25 ˚C
+85 ˚C
–59
–40 ˚C
+25 ˚C
+85 ˚C
–59
Mixer B 2x2 (dBc)
–63
–67
–71
–75
–79
–83
–87
–63
–67
–71
–75
–79
–83
–87
–91
–95
–91
–95
824
834
844
854
864
874
884
894
904
914
RF Frequency (MHz)
Figure 25. Mixer A 2RF-2LO vs Frequency and Temperature
824
834
844
854
864
874
884
894
904
RF Frequency (MHz)
Figure 26. Mixer B 2RF-2LO vs Frequency and Temperature
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8
894
14.5
Mixer B IP1dB (dBm)
Mixer A IP1dB (dBm)
884
15.0
–3 dBm
0 dBm
+3 dBm
14.5
Mixer B IP1dB (dBm)
874
Figure 20. Mixer A Input P1dB vs Frequency and Temperature
15.0
Mixer A 2x2 (dBc)
864
RF Frequency (MHz)
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914
DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
60
60
–40 ˚C
+25 ˚C
+85 ˚C
56
–40 ˚C
+25 ˚C
+85 ˚C
58
Mixer B RF to IF Isolation (dB)
Mixer A RF to IF Isolation (dB)
58
54
52
50
48
46
44
42
56
54
52
50
48
46
44
42
40
824
834
844
854
864
874
884
894
904
40
914
824
834
844
854
884
894
904
914
–35
–40 ˚C
+25 ˚C
+85 ˚C
–37
–39
Mixer A LO to RF Leakage (dBm)
Mixer A LO to IF Leakage (dBm)
–35
–41
–43
–45
–47
–49
–51
–53
834
844
854
864
874
884
894
904
–39
–41
–43
–45
–47
–49
–51
–53
–55
824
914
–40 ˚C
+25 ˚C
+85 ˚C
–37
834
844
854
864
874
884
894
904
914
RF Frequency (MHz)
RF Frequency (MHz)
Figure 30. Mixer A LO to RF Leakage vs Frequency and
Temperature
Figure 29. Mixer A LO to IF Leakage vs Frequency and
Temperature
65
–35
–40 ˚C
+25 ˚C
+85 ˚C
–37
–39
–40 ˚C
+25 ˚C
+85 ˚C
63
LO1 to LO2 Isolation (dB)
Mixer B LO to RF Leakage (dBm)
874
Figure 28. Mixer B RF to IF Isolation vs Frequency and
Temperature
Figure 27. Mixer A RF to IF Isolation vs Frequency and
Temperature
–55
824
864
RF Frequency (MHz)
RF Frequency (MHz)
–41
–43
–45
–47
–49
–51
–53
61
59
57
55
53
51
49
47
–55
824
834
844
854
864
874
884
894
904
914
45
824
834
844
854
864
874
884
894
904
914
RF Frequency (MHz)
RF Frequency (MHz)
Figure 32. LO1 to LO2 Isolation vs Frequency and Supply
Voltage
Figure 31. Mixer B LO to RF Leakage vs Frequency and
Temperature
Channel-to-Channel Isolation (dB)
65
–40 ˚C
+25 ˚C
+85 ˚C
62
59
56
53
50
47
44
41
38
35
824
834
844
854
864
874
884
894
904
914
RF Frequency (MHz)
Figure 33. Channel A to Channel B IF Isolation vs Frequency
and Supply Voltage
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DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
Evaluation Board Description
ground pad to dissipate the maximum heat produced by the
circuit board. For more information on soldering the
SKY73022-11, refer to the Package and Handling Information
section of this Data Sheet.
The SKY73022-11 Evaluation Board is used to test the
performance of the SKY73022-11 downconversion mixer. An
assembly drawing for the Evaluation Board is shown in Figure 34
and the layer detail is provided in Figure 35.
3. Skyworks recommends including external bypass capacitors
on the VCC voltage inputs of the device.
4. Components L5, L6, L14, and L15 (see Figure 36) are high-Q,
low loss inductors. These inductors must be able to pass
currents in excess of 200 mA DC.
Circuit Design Configurations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
5. Components R1 and R2 (see Figure 36) allow for external
adjustment of the IF amplifier bias points. For operation as
specified in Tables 3 and 4, these resistors are not required.
1. Paths to ground should be made as short and as low
impedance as possible.
2. The ground pad of the SKY73022-11 provides critical
electrical and thermal functionality. This pad is the main
thermal conduit for heat dissipation. Since the circuit board
acts as the heat sink, it must shunt as much heat as possible
from the device. Therefore, design the connection to the
A schematic diagram for the SKY73022-11 Evaluation Board is
shown in Figure 36.
J9
J5
C34
C35
L17
L16
J4
C2
L12
L13
C25
T2
C32
L1
C28
C29
R4
J8
C33
C39
C26
L2
L14
L15
C38
C3
L11
R2
C27
C1
R5
C23
C22
C20
C4
J1
C24
C21
J2
C5
C17
C8
C7
C41
C6
L5
C14
L6
R6 R1
C40
L4
C13
C12
L3
J7
T1
C18
L10
C11
C19
J3
R3
L18
C36
J10
L8
L19
C37
C15
L9
C16
J6
S905
Figure 34. SKY73022-11 Evaluation Board Assembly Diagram
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DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
Layer 1: Top -- Metal
Layer 2: Ground
Layer 3: Power Plane
Layer 4: Solid Ground Plane
S904
Figure 35. SKY73022-11 Evaluation Board Layer Detail
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11
DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
R4
0Ω
DB714
L14
470 nH
L13
8.2 nH
T2
J5
C28
22 pF
L15
470 nH
VCC
L12
0Ω
C27
33 pF
C26
1 μF
VCC
R2
DNI
x
RFA
30
29
NC
28
LO2
GND
NC
GND
VCC_LO
NC
Element Jumper
11
12
13
14
15
x
10
16
17
C21
33 pF
22
VCC
21
20
19
C17
33 pF
L10
0Ω
C20
1 μF
J3
NC
RIFB
LO1
VCC
J2
C22
12 pF
23
18
R1
DNI
x
RFB
GND
VCC_IFB
9
GND
NC
8
GND
IFB–
C7
1.5 pF
x
LO_SEL
VCC_LO
x
C8
0Ω
SKY73022-11
GND
IFB+
L4
18 nH
C23
33 pF
24
GND
7
L3
0Ω
GND
VCC_LO
NC
6
J7
GND
VCC_RFB
5
J8
25
4
C5
33 pF
27
26
2
3
VCC
L11
0Ω
NC
31
RIFA
32
IFA+
33
IFA–
34
VCC_IFA
C3
1.5 pF
1
35
NC
C1
0Ω
GND
L2
18 nH
VCC_RFA
L1
0Ω
x
36
J4
x
x
VCC
VCC
VCC
L5
470 nH
C13
1 μF
C14
33 pF
J6
VCC
L6
470 nH
T1
L8
8.2 nH
C16
22 pF
L9
0Ω
DB714
Note: The Evaluation Board can be converted to
provide a differential output by removing components
T1, T2, R3, and R4.
R3
0Ω
Some component labels may be different than the
corresponding component symbol shown here.
Component values, however, are accurate as of the
date of this Data Sheet.
Figure 36. SKY73022-11 Evaluation Board Schematic
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J10
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S760_A
DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
Package Dimensions
The PCB layout footprint for the SKY73022-11 is provided in
Figure 37. Figure 38 shows the package dimensions for the 36pin MCM, and Figure 39 provides the tape and reel dimensions.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
THE SKY73022-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 qC. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design & SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel, document number 101568.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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13
DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
6.3
36X 0.5
0.35
Component Outline
0.25
0.05
0.15
0.05
0.75 0.85
36X 0.5
12X 0.075
Stencil and
Metallization
6.3
24X 0.65
Component Outline
Soldermask Opening
SMT Pad Detail
Scale: 2X
9X This Rotation
9X Rotated 180o
9X Rotated 90o CW
9X Rotated 90o CCW
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
12X 0.075
24X 0.65
Stencil Aperture
Top View
6.4
6.3
0.5
Pitch
Typ
2X 2.795
Pin 1
6.4
3.8
2X 2.795
1.9
6.3
4
1.9
Component Outline
3.8
Component Outline
0.25 Around
Ground Pins
4
Metallization
Top View
Thermal Via Array.
∅0.3 mm on 0.5 mm pitch.
Additional vias in common ground
pad will improve thermal performance
NOTE: thermal vias should be tented
and filled with solder mask, 30-35 μm
Cu plating recommended.
Solder Mask Opening
Top View
Note: The cross-hatched area represents the merger of the center
ground pad +10 individual I/O ground pads. All I/O ground
pads should have at least one via connected to internal ground
planes for optimum electrical performance.
All measurements are in millimeters
S1125
Figure 37. PCB Layout Footprint for the SKY73022-11 6 x 6 mm MCM
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DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
18X 2.9
Pin 1 Indicator
C
Pin 36
4X 2
B
6
Pin 1 Indicator
(See Detail D)
Pin 1
4X 1.5
4X 0.5
4X 1
A
4X 2
4X 1
4X 1.5
6
4X 0.5
2X 1.9
18X 2.9
A
1.1 ± 0.1
36x SMT Pad
0.15 A B C
3X R0.2
2X 1.9
0.1
0.15 A B C
Top View
Side View
Bottom View
Solder Mask Opening
0.2 A B C
0.5 ± 0.1
(0.2 x 0.2)
(0.1)
0.25 ± 0.05
0.4 ± 0.05
Detail D
Metal Pad Edge
All measurements are in millimeters
Detail A
Pads are solder mask defined on one edge and metal
defined on three edges.
S689_A
Dimensioning and tolerancing according to ASME Y14.5M-1994
Figure 38. SKY73022-11 36-Pin MCM Package Dimensions
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DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
2.00 ± 0.05
4.00
8.00
∅1.50 ± 0.10
0.30 ± 0.02
B
6.35
A
12.00 ± 0.30
A
1.75 ± 0.10
5.50 ± 0.05
Pin #1 Indicator
(see Notes)
7o Max.
B
∅1.50 Min.
1.59
6.35
B
8o Max.
Notes:
1. Carrier tape: black conductive polystyrene
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width
4. All dimensions are in millimeters
5. Pin 1 orientation is in top left corner for the following Skyworks products:
A
SKY73022-21, -31
SKY73023-21, -31
For all other 6 x 6 mm MCM/RFLGA products, pin 1 orientation is
in top right corner.
S1183
Figure 39. SKY73022-11 Tape and Reel Dimensions
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DATA SHEET • SKY73022-11 DOWNCONVERSION MIXER
Ordering Information
Model Name
SKY73022-11 700-1000 MHz Downconversion Mixer
Manufacturing Part Number
SKY73022-11 (Pb-free package)
Evaluation Kit Part Number
TW16-D720
Copyright © 2007, 2008, 2009 Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by
Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or
information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions
of Sale.
THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A
PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY
DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS
SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION,
LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGE.
Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,
death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any
damages resulting from such improper use or sale.
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands
and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com,
are incorporated by reference.
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