SKY77768-11

DATA SHEET SKY77768 Power Amplifier Module for WCDMA / HSDPA / HSUPA / HSPA+ / LTE – Band VIII (880 MHz–915 MHz) Applications Description • WCDMA handsets The SKY77768 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full 880-915 MHz bandwidth coverage into a single compact package. Because of high efficiencies attained throughout the entire power range, the SKY77768 delivers unsurpassed talk-time advantages. The SKY77768 meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), and Long Term Evolution (LTE) data transmission with high power added efficiency. An integrated directional coupler eliminates the need for any external coupler. • HSDPA • HSUPA • HSPA+ • LTE Features • Low voltage positive bias supply 3.2 V to 4.2 V • Good linearity • High efficiency - 50% at 28.5 dBm • Large dynamic range • Small, low profile package - 3 mm x 3 mm x 0.9 mm - 10-pad configuration • Power down control • InGaP The Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all amplifier active circuitry, including input and interstage matching circuits. The silicon CMOS support die, providing precision biasing for the MMIC affords a true CMOS-compatible control interface. Output match into a 50-ohm load, realized off-chip within the module package, optimizes efficiency and power performance. The SKY77768 is manufactured with Skyworks' InGaP GaAs Heterojunction Bipolar Transistor (HBT) process which provides for all positive voltage DC supply operation and maintains high efficiency and good linearity. While primary bias to the SKY77768 can be supplied directly from any suitable battery with an output of 3.2 V to 4.2 V, optimal performance is obtained with VCC2 sourced from a DCDC power supply adjusted within 0.5 V to 3.6 V based on target output power levels. Power down executes by setting VENABLE to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery. • Supports low collector voltage operation • Digital Enable • No VREF required • CMOS compatible control signals • Integrated Directional Coupler FIGURE 1. SKY77768 FUNCTIONAL BLOCK DIAGRAM Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012 1 DATA SHEET SKY77768 POWER AMPLIFIER MODULE for WCDMA / HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz) Electrical Specifications The following tables list the electrical characteristics of the SKY77768 Power Amplifier. Table 1 lists the absolute maximum ratings and Table 2 shows the recommended operating conditions. Electrical specifications for nominal operating conditions are listed in Table 4. Table 3 presents a truth table for the power settings. Tables 5 through 8 provide the standard test configurations for WCDMA (STC1), HSDPA (STC2), and HSUPA (STC3, STC4) respectively. TABLE 1. ABSOLUTE MAXIMUM OPERATING CONDITIONS No damage assuming only one parameter set at limit at a time with all other parameters set at nominal value. Parameter Symbol RF Input Power Supply Voltage1 No RF Minimum Nominal Maximum Unit PIN — 0 10 dBm VCC1 — 3.8 6.0 Volts — 3.8 5.0 — 3.4 6.0 With RF No RF VCC2 — 3.4 4.6 Enable Control Voltage With RF VEN — 1.8 4.2 Volts Mode Control Voltage VMODE0 — 1.8 4.2 Volts Case Temperature2 VMODE1 — 1.8 4.2 Operating TCASE –30 +25 +110 Storage TSTG –40 — +150 Minimum Nominal Maximum Unit dBm 1 Overvoltage shutdown circuitry turns on at approximately 5 V. 2 Case Operating Temperature (TCASE) refers to the temperature of the GROUND PAD at the underside of the package. °C TABLE 2. RECOMMENDED OPERATING CONDITIONS Parameter RF Output Power1 Symbol WCDMA 28.50 — — HSDPA POUT_MAX 27.50 — — HSUPA 24.85 — — LTE Operating Frequency Supply Voltage Enable Control Voltage Mode Control Voltage — — 880.0 897.5 915.0 MHz VCC1 3.02 3.4 4.5 Volts VCC2 0.5 — 3.6 Low VEN_L 0.0 0.0 0.5 High VEN_H 1.35 1.8 3.1 Low VMODE0 0.0 0.0 0.5 VMODE1 0.0 0.0 0.5 VMODE0 1.35 1.8 3.1 VMODE1 1.35 1.8 3.1 TCASE –20 +25 +85 High Case Operating Temperature3 2 27.50 ƒO Volts Volts °C 1 For VCC < 3.4 V, output power back-off = 0.5 dB. 2 Recommended minimum VCC for maximum power output is indicated. VCC2 down to 0.5 V may be used for backed-off power when using DC/DC converter to conserve battery current. 3 Equivalent to –30 °C to +75 °C Ambient Operating Temperature Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F SKY77768 POWER AMPLIFIER MODULE for WCDMA / HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz) DATA SHEET TABLE 3. MODES OF OPERATION Power Setting ENABLE VMODE0 VMODE1 VCC Power Down Mode Low Low Low On Standby Mode Low — — On High Power Mode (17.0 dBm ≤ POUT ≤ 28.5 dBm) High Low — On Medium Power Mode (7.0 dBm ≤ POUT ≤ 17.0 dBm) High High Low On Low Power Mode (POUT ≤ 7.0 dBm) High High High On TABLE 4. ELECTRICAL SPECIFICATIONS FOR NOMINAL OPERATING CONDITIONS Per Table 2 over dynamic range up to 28.5 dBm output power for STC1 modulation, unless otherwise specified. Characteristics Symbol Gain1 Rx Band Gain Power Added Efficiency Total Supply Current Quiescent Current Condition Minimum Typical Maximum Unit dB GLOW POUT = 7.0 dBm VCC2 = 0.8 V 10.0 14.0 21.5 GMED POUT = 17.0 dBm VCC2 = 1.5 V 19.0 24.0 28.0 GHIGH POUT = 28.5 dBm 25.0 28.0 31.0 RxG — — — –0.5 RxG_GPS — — — –3.0 RxG_ISM — — — –6.0 PAELOW POUT = 7.0 dBm 10.5 13.0 — PAEMED POUT = 17.0 dBm 22.0 26.5 — PAEHIGH POUT = 28.5 dBm 43.0 50.0 — ICC_LOW POUT = 7.0 dBm — 44 55 ICC_MED POUT = 17.0 dBm — 122 150 ICC_HIGH POUT = 28.5 dBm — 420 500 IQ_LOW Low Power Mode — 22 28 IQ_MED Medium Power Mode — 38 45 dB % mA mA Enable Control Current IEN — — 20 40 µA Mode Control Current IMODE0 — — 20 40 µA IMODE1 — — 20 40 — — 20 Total Supply Current in Power Down Mode IPD ICC1 Current ICC1_HIGH Adjacent Channel Leakage power Ratio2 5 MHz offset ACLR5 10 MHz offset ACLR10 VCC = 3.4 V VEN = Low VMODE0 = Low VMODE1 = Low — µA — — 10 mA POUT = 7.0 dBm — –43 –40.0 dBc POUT = 17.0 dBm — –45 –40.0 POUT = 28.5 dBm — –41 –38.5 POUT = 7.0 dBm — –59 –50.0 POUT = 17.0 dBm — –56 –50.0 POUT = 28.5 dBm — –58 –50.0 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012 3 DATA SHEET SKY77768 POWER AMPLIFIER MODULE for WCDMA / HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz) TABLE 4. [CONTINUED] ELECTRICAL SPECIFICATIONS FOR NOMINAL OPERATING CONDITIONS Per Table 2 over dynamic range up to 28.5 dBm output power for STC1 modulation, unless otherwise specified. Characteristics Adjacent Channel Leakage power Ratio3 Symbol EUTRA offset ACLR_EUTRA UTRA offset ACLR1_UTRA ACLR2_UTRA Harmonic Suppression Second f02 Third Tx Noise in Rx Bands1 Condition Minimum Typical Maximum Unit dBc POUT ≤ (POUT_MAX – MPR4) — –40 — — — –42 — — — — — POUT ≤ 28.5 dBm — –45 –35 — –50 –45 Rx Band 1 925 MHz–960 MHz — –136 –134 GPS Rx 1574 MHz–1577 MHz — — –140 ISM Rx 2400 MHz–2483.5 MHz — — –143 EVM1 POUT = POUT_MAX — — 3.35 EVM2 POUT = POUT_MAX – 3 — — 2.50 EVM Rise / Fall Time DC RF Coupling Factor f03 TON_DC — — — 20 TOFF_DC — — — 20 TON_RF — — — 6 TOFF_RF — — — 6 CPL dBc dBm/Hz % µs POUT = POUT_MAX –22 –20 –18 dB CPL_OUT / POUT Power Ratio Variation Over Output VSWR 2.5:1 VSWR at POUT all VSWR phases CPL_IN 50 Ω terminated — ±0.4 — dB Daisy-chain VSWR CPL_IN and CPL_OUT ports 698 MHz to 2620 MHz VEN = Low — — 1.3:1 Insertion Loss CPL_IN to CPL_OUT ports 698 MHz to 2620 MHz VEN = Low — — 0.45 Input Voltage Standing Wave Ratio VSWR Stability (Spurious output)1 S 6:1 VSWR All phases — Ruggedness – no damage1,5 Ru POUT ≤ 28.5 dBm — 1.2:1 1.9:1 — — — –70 dBc 10:1 — — VSWR 1 Over conditions 2 ACLR is expressed as a ratio of total adjacent power to WCDMA modulated in-band, both measured in 3.84 MHz bandwidth at specified offsets. 3 LTE: EVM and ACLR are measured with QPSK modulation with 1.4 MHz bandwidth and 5 resource blocks. (Maximum Power Reduction = 0 dBm per 3GPP TS36.101. 4 MPR is the maximum power reduction as defined in 3GPP TS36.101 5 All phases, time = 10 seconds. 4 dB Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F SKY77768 POWER AMPLIFIER MODULE for WCDMA / HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz) DATA SHEET TABLE 5. STANDARD TEST CONFIGURATION – STC1 WCDMA MODE Parameter Level Spread Code Spread Factor I/Q βc βd βhs βec βed Relative Power (dB) DPCCH 15 kbps 0 256 Q 8/15 — — — — –6.547 DPDCH 60 kbps 16 64 I — 15/15 — — — –1.087 TABLE 6. STANDARD TEST CONFIGURATION – STC2 HSDPA MODE Parameter Level Spread Code Spread Factor I/Q βc βd βhs βec βed Relative Power (dB) DPCCH 15 kbps 0 256 Q 12/15 — — — — –7.095 DPDCH 60 kbps 16 64 I — 15/15 — — — –5.157 HS-DPCCH 15 kbps 64 256 Q — — 24/15 — — –3.012 TABLE 7. STANDARD TEST CONFIGURATION – STC3 HSUPA MODE Parameter Level Spread Code Spread Factor I/Q βc βd βhs βec βed Relative Power (dB) DPCCH 15 kbps 0 256 Q 8/15 — — — — –19.391 DPDCH 960 kbps 1 4 I — 15/15 — — — –13.931 HS- DPCCH 15 kbps 64 256 Q — — 8/15 — — –19.391 E-DPCCH 15 kbps 1 256 I — — — 10/15 — –17.338 E-DPDCH 960 kbps 2 4 I — — — — 71.5/15 –0.371 TABLE 8. STANDARD TEST CONFIGURATION – STC4 HSUPA MODE Parameter Level Spread Code Spread Factor I/Q βc βd βhs βec βed Relative Power (dB) DPCCH 15 kbps 0 256 Q 6/15 — — — — –12.499 DPDCH 960 kbps 1 4 I — 15/15 — — — –4.540 HS- DPCCH 15 kbps 64 256 Q — — 2/15 — — –22.041 E-DPCCH 15 kbps 1 256 I — — — 12/15 — –6.478 E-DPDCH 960 kbps 2 4 I — — — — 15/15 –4.425 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012 5 DATA SHEET SKY77768 POWER AMPLIFIER MODULE for WCDMA / HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz) Evaluation Board Description The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77768, the evaluation board schematic and assembly diagrams are included for preliminary analysis and design. Figure 2 shows the basic schematic of the board for the 880 MHz to 915 MHz range shown in Figure 3. Figure 4 is a schematic of the recommended application shown in Figure 5. FIGURE 2. EVALUATION BOARD SCHEMATIC FIGURE 3. EVALUATION BOARD ASSEMBLY DIAGRAM 6 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F SKY77768 POWER AMPLIFIER MODULE for WCDMA/ HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz) DATA SHEET FIGURE 4. SKY77768 SCHEMATIC FOR RECOMMENDED APPLICATION DIAGRAM FIGURE 5. SKY77768 RECOMMENDED APPLICATION DIAGRAM Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012 7 DATA SHEET SKY77768 POWER AMPLIFIER MODULE for WCDMA / HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz) Package Dimensions The SKY77768 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 6 is a mechanical drawing of the pad layout for this package. Figure 7 provides a recommended phone board layout footprint for the PAM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50-ohm terminals. FIGURE 6. DIMENSIONAL DIAGRAM FOR 3 mm X 3 mm X 0.9 mm PACKAGE – SKY77768 SPECIFIC 8 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F SKY77768 POWER AMPLIFIER MODULE for WCDMA/ HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz) DATA SHEET FIGURE 7. PHONE PCB LAYOUT DIAGRAM – 3 mm X 3 mm, 10-PAD PACKAGE – SKY77768 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012 9 DATA SHEET SKY77768 POWER AMPLIFIER MODULE for WCDMA / HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz) Package Description Figure 8 shows the pad functions and the pad numbering convention, which starts with pad 1 in the upper left and increments counter-clockwise around the package. Typical case markings are illustrated in Figure 9. when the part is subjected to high temperature during solder assembly. The SKY77768 is capable of withstanding an MSL3/260 °C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 °C per second; maximum temperature should not exceed 260 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 260 °C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. Production quantities of this product are shipped in the standard tape-and-reel format (Figure 10). FIGURE 8. SKY77768 PAD NAMES AND CONFIGURATION (TOP VIEW) Electrostatic Discharge (ESD) Sensitivity The SKY77768 meets class 1C JESD22-A114 Human Body Model (HBM), class IV JESD22-C101 Charged-Device Model (CDM), and class A JESD22-A115 Machine Model (MM) electrostatic discharge (ESD) sensitivity classification. To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the ESD handling precautions listed below. • Personnel Grounding - Wrist Straps - Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges • Protective Workstation - Dissipative Table Top - Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Solder Conductive Suckers - Static Sensors FIGURE 9. TYPICAL CASE MARKINGS Package Handling Information Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur 10 • Facility - Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 1,000 MΩ to GND) • Protective Packaging and Transportation - Bags and Pouches (Faraday Shield) - Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts - Protective Work Order Holders Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F SKY77768 POWER AMPLIFIER MODULE for WCDMA/ HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz) DATA SHEET FIGURE 10. DIMENSIONAL DIAGRAM FOR CARRIER TAPE BODY SIZE – 3 mm X 3 mm X 0.75 / 0.90 mm – MCM Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012 11 Ordering Information Product Name Order Number Evaluation Board Part Number SKY77768 Power Amplifier Module SKY77768-11 EN40-D345-003 Revision History Revision Date Description A December 20, 2011 Initial Release – Information B January 25, 2012 Revise: Figure 1; Table 1 C March 9, 2012 Revise: Table 4; Figures 2, 3, 6, 7 Add: Figures 4, 5 D September 19, 2012 Revise: Figures 2–5; Tables 2, 4; Ordering Information Table (last page) E October 26, 2012 Revise: Change Data Sheet status from ADVANCE to FINAL; Table 4; Ordering Information table F November 29, 2012 Revise: Table 1 (Supply Voltage, Case Operating Temperature); Table 2 (Case Operating Temperature footnote) References Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Standard SMT Reflow Profiles: JEDEC Standard J–STD–020 Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A114 Human Body Model (HBM) Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A115 Machine Model (MM) Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-C101 Charged Device Model (CDM). Copyright © 2011, 2012, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale. THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, “Breakthrough Simplicity,” DCR, Helios, HIP3, Innovation to Go, Intera, iPAC, LIPA, Polar Loop, and System Smart are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. 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