USB2240/USB2241
Ultra Fast USB 2.0 Multi-Format Flash Media Controller
PRODUCT FEATURES
General Description
The SMSC USB2240/USB2241 is a USB 2.0 compliant, high speed Mass Storage Class Peripheral Controller intended for reading and writing to more than 20 popular flash media formats from the xD Picture CardTM (xD)1, Memory StickTM (MS), Secure Digital (SD), and MultiMediaCardTM (MMC) families. The SMSC USB2240/USB2241 is a fully integrated, single chip solution capable of ultra high performance operation. Average sustained transfer rates exceeding 35MB/s are possible if the media and host can support those rates. Internal Card Power FET
— 200mA — "Fold-back" short circuit current protected
Datasheet
8051 8-bit microprocessor
— 60MHz - single cycle execution — 64KB ROM; 14KB RAM
Internal Regulator for 1.8V core operation Optimized pinout improves signal routing, easing implementation and allowing for improved signal integrity.
Mask Programmable Features
General Features
36-pin QFN lead-free RoHS compliant package Targeted for applications in which single or "combo" media sockets are used Hardware-controlled data flow architecture for all selfmapped media Pipelined hardware support for access to non-selfmapped media
VID/PID/Language ID 28-character Manufacturer ID and Product string 12-hex digit (max) Serial Number string Customizable Vendor specific data LED blink interval or duration Optimized for low latency interrupt handling Reduced memory footprint Please see the USB2240/USB2241 Software Release Notes for additional Software Features Flash Media Card Reader/Writer Printers Desktop and Mobile PCs Consumer A/V Media Players/Viewers Vista ReadyBoostTM Compatible with Microsoft Vista, Windows XP, Windows ME, Windows 2K SP4, Apple OSx, and Linux Mass Storage Class Drivers
Software Features
Hardware Features
Applications
Single Chip Flash Media Controller with multiplexed interface for use with “combo” card sockets
— Memory Stick Specification 1.43 — Memory Stick Pro Format Specification 1.02 — Memory Stick Pro-HG Duo Format Specification 1.01
– Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro
— xD Picture Card 1.2 — Secure Digital 2.0
–
— MultiMediaCard Specification 4.2
– 1/4/8 bit MMC
HS-SD, HC-SD, TransFlash™ and reduced form factor media
SDIO and MMC Streaming Mode support Extended configuration options
— xD player mode operation — Socket switch polarities, etc.
Media Activity LED
GPIO configuration and polarity
— Up to 8 GPIOs for special function use: LED indicators, power control to memory devices, etc. The number of actual GPIO’s depends on the implementation configuration used. — One GPIO with up to 200 mA drive.
On Board 24MHz Crystal Driver Circuit Optional external 24MHz clock input
1.) xD Picture Card not applicable to USB2241
SMSC USB2240/USB2241
DATASHEET
Revision 2.6 (05-08-08)
Ultra Fast USB 2.0 Multi-Format Flash Media Controller Datasheet
ORDER NUMBER: USB2240/USB2241-AEZG-XX for 36 pin, QFN Lead-Free RoHS Compliant Package “XX” in the order number indicates the internal ROM firmware revision level. Please contact your SMSC sales representative for more information.
80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123 Copyright © 2008 SMSC or its subsidiaries. All rights reserved. Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders. SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT; TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
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Table of Contents
Chapter 1 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Chapter 2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Chapter 3 Pin Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1 36-Pin Package xD/SD/MS Interfaces Multiplexed. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Chapter 4 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Chapter 5 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.1 5.2 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Chapter 6 Pin Reset State Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1 36-Pin Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Chapter 7 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.1 7.2 7.3 7.4 Maximum Guaranteed Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Recommended Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 22 23 25
Chapter 8 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
8.1 Oscillator/Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Chapter 9 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Chapter 10 GPIO Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
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List of Figures
Figure 2.1 Figure 2.2 Figure 4.1 Figure 4.2 Figure 6.1 Figure 6.2 Figure 7.1 Figure 8.1 Figure 8.2 Figure 9.1 USB2240 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 USB2241 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 USB2240 36-Pin QFN Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 USB2241 36-Pin QFN Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Pin Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Legend for Pin Reset States Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Supply Rise Time Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Typical Crystal Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Formula to Find Value of C1 and C2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 USB2240/USB2241 36-QFN, 6x6mm Body, 0.5mm Pitch. . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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List of Tables
Table 3.1 USB2240 36-Pin QFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 3.2 USB2241 36-Pin QFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 5.1 USB2240/USB2241 36-Pin QFN Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 5.2 Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 6.1 USB2240/USB2241 36-Pin Reset States Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 7.1 Pin Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 10.1 GPIO Usage (ROM Rev 0x00) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
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Chapter 1 Acronyms
SD: Secure Digital SDC: Secure Digital Controller MMC: MultiMediaCard MS: Memory Stick MSC: Memory Stick Controller xD: xD Picture Card
*Note: In order to develop, make, use, or sell readers and/or other products using or incorporating any of the SMSC devices made the subject of this document or to use related SMSC software programs, technical information and licenses under patent and other intellectual property rights from or through various persons or entities, including without limitation media standard companies, forums, and associations, and other patent holders may be required. These media standard companies, forums, and associations include without limitation the following: Sony Corporation (Memory Stick, Memory Stick Pro); SD3 LLC (Secure Digital); MultiMedia Card Association (MultiMediaCard); the SSFDC Forum (SmartMedia); the Compact Flash Association (Compact Flash); and Fuji Photo Film Co., Ltd., Olympus Optical Co., Ltd., and Toshiba Corporation (xD-Picture Card). SMSC does not make such licenses or technical information available; does not promise or represent that any such licenses or technical information will actually be obtainable from or through the various persons or entities (including the media standard companies, forums, and associations), or with respect to the terms under which they may be made available; and is not responsible for the accuracy or sufficiency of, or otherwise with respect to, any such technical information. SMSC's obligations (if any) under the Terms of Sale Agreement, or any other agreement with any customer, or otherwise, with respect to infringement, including without limitation any obligations to defend or settle claims, to reimburse for costs, or to pay damages, shall not apply to any of the devices made the subject of this document or any software programs related to any of such devices, or to any combinations involving any of them, with respect to infringement or claimed infringement of any existing or future patents related to solid state disk or other flash memory technology or applications ("Solid State Disk Patents"). By making any purchase of any of the devices made the subject of this document, the customer represents, warrants, and agrees that it has obtained all necessary licenses under then-existing Solid State Disk Patents for the manufacture, use and sale of solid state disk and other flash memory products and that the customer will timely obtain at no cost or expense to SMSC all necessary licenses under Solid State Disk Patents; that the manufacture and testing by or for SMSC of the units of any of the devices made the subject of this document which may be sold to the customer, and any sale by SMSC of such units to the customer, are valid exercises of the customer's rights and licenses under such Solid State Disk Patents; that SMSC shall have no obligation for royalties or otherwise under any Solid State Disk Patents by reason of any such manufacture, use, or sale of such units; and that SMSC shall have no obligation for any costs or expenses related to the customer's obtaining or having obtained rights or licenses under any Solid State Disk Patents. SMSC MAKES NO WARRANTIES, EXPRESS, IMPLIED, OR STATUTORY, IN REGARD TO INFRINGEMENT OR OTHER VIOLATION OF INTELLECTUAL PROPERTY RIGHTS. SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES AGAINST INFRINGEMENT AND THE LIKE. No license is granted by SMSC expressly, by implication, by estoppel or otherwise, under any patent, trademark, copyright, mask work right, trade secret, or other intellectual property right. **To obtain this software program the appropriate SMSC Software License Agreement must be executed and in effect. Forms of these Software License Agreements may be obtained by contacting SMSC.
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Ultra Fast USB 2.0 Multi-Format Flash Media Controller Datasheet
Chapter 2 Block Diagram
AUTO_ CBW PROC
SD/ MMC
USB Host
PHY
SIE CTL
BUS INTFC
BUS INTFC
FMDU CTL
FMI MS Multiplexed Interface
xD
EP0 TX EP0 RX BUS INTFC RAM
4K total
1.8V Reg
EP1 RX EP1 TX EP2 RX EP2 TX
XDATA BRIDGE + BUS ARBITER
PLL
PWR_FET1
GPIO10/CARD_PWR
GPIOs RAM 10KB ROM 64KB Clock Generation and Control
8051 PROCESSOR SFR RAM
8 pins
ADDR MAP
Program Memory I/O Bus
Figure 2.1 USB2240 Block Diagram
SMSC USB2240/USB2241
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AUTO_ CBW PROC
USB Host
SD/ MMC PHY
SIE CTL BUS INTFC BUS INTFC FMDU CTL
FMI Multiplexed Interface MS
EP0 TX EP0 RX BUS INTFC RAM
4K total
1.8V Reg
EP1 RX EP1 TX EP2 RX EP2 TX
XDATA BRIDGE + BUS ARBITER
PLL
PWR_FET1
GPIO10/CARD_PWR
GPIOs RAM 10KB ROM 64KB Clock Generation and Control
8051 PROCESSOR SFR RAM
8 pins
ADDR MAP
Program Memory I/O Bus
Figure 2.2 USB2241 Block Diagram
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Ultra Fast USB 2.0 Multi-Format Flash Media Controller Datasheet
Chapter 3 Pin Table
3.1 36-Pin Package xD/SD/MS Interfaces Multiplexed
Table 3.1 USB2240 36-Pin QFN Package xD/MS/SD INTERFACE (18 PINS) xD_D3 / SD_D1 / MS_D5 xD_nWP / SD_CLK / MS_BS xD_D6 / SD_D3 / MS_D3 xD_D4 / GPIO6 (SD_WP) / MS_SCLK xD_D2 / SD_D0 / MS_D4 xD_ALE / SD_D5 / MS_D1 xD_D5 / SD_D2 xD_D1 / SD_D7 / MS_D6 xD_CLE / SD_CMD / MS_D0 xD_nRE xD_D0 / SD_D6 / MS_D7 xD_D7 / SD_D4 / MS_D2 xD_nWE
xD_nB/R
xD_nCE
GPIO12 (MS_INS)
GPIO14 (xD_nCD)
GPIO15 (SD_nCD) USB INTERFACE (7 PINS)
USB+ VDD18PLL
USBXTAL1 (CLKIN) MISC (7 Pins)
RBIAS XTAL2
VDDA33
nRESET TEST
GPIO2 / RXD / SDA GPIO1 (LED1)
GPIO4 GPIO10 (CRD_PWR)
GPIO7 / TXD / SCK / MS_SKT_SEL
DIGITAL, POWER (4 PINS) (3) VDD33 (1) VDD18 TOTAL 36
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Table 3.2 USB2241 36-Pin QFN Package MS/SD INTERFACE (14 PINS) SD_D1 / MS_D5 SD_CLK / MS_BS SD_D3 / MS_D3 SD_D0 / MS_D4 SD_D5 / MS_D1 SD_D7 / MS_D6 SD_CMD / MS_D0 GPIO6 (SD_WP) / MS_SCLK SD_D6 / MS_D7 SD_D4 / MS_D2
SD_D2
GPIO12 (MS_INS)
GPIO14
GPIO15 (SD_nCD) USB INTERFACE (7 PINS)
USB+ VDD18PLL
USBXTAL1 (CLKIN) MISC (11 Pins)
RBIAS XTAL2
VDDA33
nRESET TEST
GPIO2 / RXD / SDA GPIO1 (LED1)
GPIO4 GPIO10 (CRD_PWR)
GPIO7 / TXD / SCK / MS_SKT_SEL (4) NC
DIGITAL, POWER (4 PINS) (3) VDD33 (1) VDD18 TOTAL 36
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Chapter 4 Pin Configuration
xD_D6 / SD_D3 / MS_D3
GPIO10 (CRD_PWR)
GPIO2 / RXD / SDA
GPIO15 (SD_nCD)
xD_D7 / SD_D4 / MS_D2
GPIO12 (MS_INS)
xD_D5 / SD_D2
27
26
25
24
23
22
VDD33
21
20
TEST GPIO4 xD_D4 / GPIO6 (SD_WP) / MS_SCLK GPIO7 / TXD / SCK / MS_SKT_SEL XTAL2 XTAL1 / CLKIN VDD18PLL RBIAS VDDA33
28 29 30 31 32 33 34 35 36 1 2 3 4 5 6 7 8 9
19 18 17 16
GPIO14 (xD_nCD)
nRESET xD_nB/R xD_nRE xD_nCE VDD33 VDD18 xD_nWE xD_CLE / SD_CMD / MS_D0 xD_ALE / SD_D5 / MS_D1
SMSC USB2240 (Top View QFN-36)
Thermal Slug (must be connected to VSS)
15 14 13 12 11 10
GPIO1 (LED1)
USB+
USB-
xD_D3 / SD_D1 / MS_D5
xD_D2 / SD_D0 / MS_D4
VDD33
Indicates pins on the bottom of the device.
Figure 4.1 USB2240 36-Pin QFN Diagram
SMSC USB2240/USB2241
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11
xD_nWP / SD_CLK / MS_BS
xD_D1 / SD_D7 / MS_D6
xD_D0 / SD_D6 / MS_D7
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GPIO10 (CRD_PWR)
GPIO2 / RXD / SDA
GPIO15 (SD_nCD)
GPIO12 (MS_INS)
SD_D3 / MS_D3
SD_D4 / MS_D2
27
26
25
24
23
22
21
20
TEST GPIO4 GPIO6 (SD_WP) / MS_SCLK GPIO7 / TXD / SCK / MS_SKT_SEL XTAL2 XTAL1 / CLKIN VDD18PLL RBIAS VDDA33
28 29 30 31 32 33 34 35 36 1 2 3 4 5 6 7 8 9
19 18 17 16
GPIO14
SD_D2
VDD33
nRESET NC NC NC VDD33 VDD18 NC SD_CMD / MS_D0 SD_D5 / MS_D1
SMSC USB2241 (Top View QFN-36)
Thermal Slug (must be connected to VSS)
15 14 13 12 11 10
GPIO1 (LED1)
USB+
USB-
Indicates pins on the bottom of the device.
Figure 4.2 USB2241 36-Pin QFN Diagram
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SD_CLK / MS_BS
SD_D1 / MS_D5
SD_D0 / MS_D4
SD_D7 / MS_D6
SD_D6 / MS_D7
VDD33
SMSC USB2240/USB2241
Ultra Fast USB 2.0 Multi-Format Flash Media Controller
Datasheet
Chapter 5 Pin Descriptions
This section provides a detailed description of each signal. The signals are arranged in functional groups according to their associated interface. The “n” symbol in the signal name indicates that the active, or asserted, state occurs when the signal is at a low voltage level. When “n” is not present before the signal name, the signal is asserted at the high voltage level. The terms assertion and negation are used exclusively. This is done to avoid confusion when working with a mixture of “active low” and “active high” signals. The term assert, or assertion, indicates that a signal is active, independent of whether that level is represented by a high or low voltage. The term negate, or negation, indicates that a signal is inactive.
5.1
Pin Descriptions
Table 5.1 USB2240/USB2241 36-Pin QFN Pin Descriptions 36-PIN QFN BUFFER TYPE
NAME
SYMBOL
DESCRIPTION
xD INTERFACE (APPLIES ONLY TO USB2240) xD Data xD_D[7:0] 20 23 25 30 4 5 7 8 9 I/O12PD The bi-directional data signal has an internal weak pull-down resistor.
xD Write Protect xD Address Strobe
xD_nWP
O12PD
This pin is an active low write protect signal for the xD device. This pin has a weak pull-down resistor that is permanently enabled. This pin is an active high Address Latch Enable signal for the xD device. This pin has a weak pull-down resistor that is permanently enabled.
xD_ALE
10
O12PD
xD Command Strobe
xD_CLE
11
O12PD
This pin is an active high Command Latch Enable signal for the xD device. This pin has a weak pull-down resistor that is permanently enabled.
xD Read Enable
xD_nRE
16
O12PU
This pin is an active low read strobe signal for xD device. When using the internal FET, this pin has an internal weak pull-up resistor that is tied to the output of the internal Power FET, and is controlled by the SM_PU bit of the SM_CTL register. If an external FET is used (Internal FET is disabled), then the internal pull-up is not available (external pull-ups must be used).
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Datasheet
Table 5.1 USB2240/USB2241 36-Pin QFN Pin Descriptions (continued) 36-PIN QFN 12 BUFFER TYPE O12PU
NAME xD Write Enable
SYMBOL xD_nWE
DESCRIPTION This pin is an active low write strobe signal for xD device. When using the internal FET, this pin has an internal weak pull-up resistor that is tied to the output of the internal Power FET, and is controlled by the SM_PU bit of the SM_CTL register. If an external FET is used (Internal FET is disabled), then the internal pull-up is not available (external pull-ups must be used).
xD Busy or Data Ready
xD_nB/R
17
IPU
This pin is connected to the BSY/RDY pin of the xD device. When using the internal FET, this pin has an internal weak pull-up resistor that is tied to the output of the internal Power FET, and is controlled by the SM_PU bit of the SM_CTL register. If an external FET is used (Internal FET is disabled), then the internal pull-up is not available (external pull-ups must be used).
xD Card Detection GPIO xD Chip Enable
GPIO14 (xD_nCD) xD_nCE
19 15
I/O12 O12PU
This is a GPIO designated as the xD card detection pin. This pin is the active low chip enable signal to the xD device. When using the internal FET, this pin has an internal weak pull-up resistor that is tied to the output of the internal Power FET, and is controlled by the SM_PU bit of the SMC_CTL register. If an external FET is used (Internal FET is disabled), then the internal pull-up is not available (external pull-ups must be used).
MEMORY STICK INTERFACE MS System Data In/Out MS_D[7:0] 8 7 4 5 23 20 10 11 I/O12PD These pins are the bi-directional data signals for the MS device. In serial mode, the most significant bit (MSB) of each byte is transmitted first by either MSC or MS device on MS_D0. MS_D0, MS_D2, and MS_D3 have weak pull-down resistors. MS_D1 has a pull down resistor if in parallel mode, otherwise it is disabled. In 4 or 8 bit parallel mode, there is a weak pull-down resistor on all MS_D7 - 0 signals. The resistors are controlled by MSC_SYSTEM_0, MSC_MODE_CTL and MSC_PRO_HG registers. This pin is connected to the BS pin of the MS device. It is used to control the Bus States 0, 1, 2 and 3 (BS0, BS1, BS2 and BS3) of the MS device. MS System CLK MS_SCLK 30 O12 This pin is an output clock signal to the MS device. The clock frequency is software configurable.
MS Bus State
MS_BS
9
O12
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Datasheet
Table 5.1 USB2240/USB2241 36-Pin QFN Pin Descriptions (continued) 36-PIN QFN 24 BUFFER TYPE IPU
NAME MS Card Insertion GPIO
SYMBOL GPIO12 (MS_INS)
DESCRIPTION This is a GPIO designated as the Memory StickTM card detection pin.
SECURE DIGITAL INTERFACE SD Data SD_D[7:0] 7 8 10 20 23 25 4 5 9 I/O12PU The bi-directional signals should have weak pull-up resistors. The register can be controlled by: SD_MMC_INTF_EN bit of SDC_MODE_CTL
SD Clock
SD_CLK
O12
This is an output clock signal to SD/MMC device. The clock frequency is software configurable.
SD Command
SD_CMD
11
I/O12PU
This is a bi-directional signal that connects to the CMD signal of SD/MMC device. The bi-directional signal should have an internal weak pull-up resistor. The pull-up register can be controlled by: SD_MMC_INTF_EN bit of SDC_MODE CTL This is a GPIO designated as the Secure Digital card mechanical write detect pin. This is a GPIO designated as the Secure Digital card detection pin.
SD Write Protected GPIO SD Card Detect GPIO
GPIO6 (SD_nWP) GPIO15 (SD_nCD)
30 26
I/O12 I/O12
USB INTERFACE USB Bus Data USB Transceiver Bias 24MHz Crystal or external clock input 24MHz Crystal USB+ USBRBIAS 2 3 35 I/O-U I-R These pins connect to the USB bus data signals. A 12.0k , 1.0% resistor is attached from VSSA to this pin in order to set the transceiver's internal bias currents. This pin can be connected to one terminal of the crystal or can be connected to an external 24 clock when a crystal is not used. This is the other terminal of the crystal, or left open when an external clock source is used to drive XTAL1/CLKIN. It may not be used to drive any external circuitry other than the crystal circuit.
XTAL1 (CLKIN) XTAL2
33
ICLKx
32
OCLKx
MISC General Purpose I/O GPIO1 (LED1) 1 I/O12 This pin may be used either as input, edge sensitive interrupt input, or output. In addition, as an output, the GPIO1 can be used output controlled by the LED1_GPIO1 register.
SMSC USB2240/USB2241
DATASHEET
15
Revision 2.6 (05-08-08)
Ultra Fast USB 2.0 Multi-Format Flash Media Controller
Datasheet
Table 5.1 USB2240/USB2241 36-Pin QFN Pin Descriptions (continued) 36-PIN QFN 27 BUFFER TYPE I/O12 I
NAME General Purpose I/O
SYMBOL GPIO2 / RXD / SDA
DESCRIPTION GPIO: This pin may be used either as input, edge sensitive interrupt input, or output. RXD: In addition to the above, the signal can be used as input to the RXD of UART in the device, when the TXD_RXD_SEL bit in UTIL_CONFIG1 register is cleared to "0". SDA: This is the data pin when used with an external serial EEPROM. This pin may be used either as input, edge sensitive interrupt input, or output. For the USB2240 only, this pin can be used as the xD card detection pin.
I/O12 General Purpose I/O GPIO4 29 I/O12
General Purpose I/O
GPIO7 / TXD / SCK /
31
I/O12 O12
GPIO: This pin may be used either as input, edge sensitive interrupt input, or output. TXD: In addition, as an output, the GPIO7 can be used as an output TXD of UART in the device, when the GPIO2/TXD bit in UTL_CONFIG register is set to "1" SCK: This is the clock output when used with an external EEPROM. MS_SKT_SEL: On the positive edge of nRESET, this pin is sampled to determined the Memory Stick socket size. 1 = 8 bit 0 = 4 bit
MS_SKT_SEL
O12 I
General Purpose I/O
GPIO10 (CRD_PWR)
21
I/O200
GPIO: This pin may be used either as input, edge sensitive interrupt input, or output. CRD_PWR: Card Power drive of 3.3V @ either 100mA or 200mA.
RESET Input
nRESET
18
IS
This active low signal is used by the system to reset the chip. The active low pulse should be at least 1μs wide. This signal is used for testing the chip. User should normally tie this pin low externally, if the test function is not used.
TEST Input
TEST
28
I
DIGITAL / ANALOG / POWER +1.8V Core power VDD18 13 All VDD18 pins must be connected together on the circuit board. +1.8V core power. This pin must have a 1.0μF (or greater) ±20% (ESR