CXA1511L

CXA1511L/M Preamplifier for Remote Control Signal Reception Description The CXA1511L/M is a bipolar IC used for preamplifiers that receive signals in infrared remote control systems. These ICs consist of a first-stage amplifier, limiter amplifier, band-pass filter, band elimination filter, signal waveform detection circuit and waveform shaping circuit. Features • Low power consumption (VCC = 5V, 9mW typ.) • Low supply voltage (VCC = 5V) • Filters (center frequency can be varied through external resistor: fo = 30kHz to 60kHz, 40kHz typ.) • Elimination of inductors prevents magnetic field inductance interference. • Optical reception diode can be coupled directly. • Collector output (pull-up resistor, TTL and CMOS can be connected directly) Applications TVs, VCRs, audio equipment Structure Bipolar silicon monolithic IC Block Diagram and Pin Configuration 8 pin SIP (Plastic) 8 pin SOP (Plastic) Absolute Maximum Ratings 7 V • Supply voltage VCC • Operating temperature Topr –20 to +75 °C • Storage temperature Tstg –65 to +150 °C • Allowable power dissipation PD 600 mW (SIP) • Allowable power dissipation PD 300 mW (SOP) Operating Conditions • Supply voltage 4.7 to 5.3 V Head Amp IN 1 ABLC Photo Diode Limiter Amp BPF Delector & Hysteresis BEF Comparator Integralor Comparator 2 C1 470, 680 0.01µ 3456 C2 GND fo N.C. 78 OUT VCC 0.01µ 200k (fo = 40kHz) VCC = 5V Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E94301A8X CXA1511L/M Pin Description Pin No. 1 Symbol Pin voltage 2.8V Pin voltage depends on the DC Characteristics Measurement Circuit. Equivalent circuit Description Input pin. Connect optical reception diode to GND. Connect a resistor and capacitor in series to GND, and set the frequency response and gain of "Head Amp". When the resistor is large and the capacitor small, the gain is small. When the capacitor is large, sensitivity decreases in relation to the transient response. Connect a detection capacitor to GND. When the capacitor is large, sensitivity decreases in relation to the mean value detection and transient response. When the capacitor is small, fluctuation of the peak detection and output pulse width increases. The capacitor in usage is 0.01µF (typ.). Set output pulse width fluctuation and noise elimination characteristics to be optimum. GND pin. Adopt a pattern design that will allow external parts to be located as closely as possible to this pin. Ground them all at the same point. The transport distance and noise elimination characteristics are greatly influenced by the pattern design surrounding the GND. 5 VCC IN 47k 160k VCC 1 2 C1 2.8V 40µA↓ 8k VCC ↓40µA 2 8k VCC 330k 3 C2 1.9V 30nA↓ ↓30µA 3 8k 4 GND 5 fo 1.4V 4p 8k VCC Connect a resistor to the power supply. Set the center frequency of the built-in BPF. See "External resistor at Pin 5 vs. Center frequency response" on Page 6. –2– CXA1511L/M Pin No. 6 Symbol N.C. Pin voltage Equivalent circuit Description No connected pin. Connect to GND. VCC 5.0V (High) 7 OUT 0.6V (Low) 24k 30k 7 14k 30k Output pin. 8 VCC 5.0V Supply voltage pin. DC Characteristics Measurement Circuit (CXA1511L) (CXA1511M) CXA1511L 1 2 3 4 5 6 7 8 5V 200k 8 470 0.01µ 0.01µ 5V 1 470 200k 7 6 5 CXA1511M 2 3 4 0.01µ 0.01µ –3– Electrical Characteristics Measurement condition Signal S1, 3, 7 S1, 2, 3, 4, 7 S3, 7, 8 40kHz CW 30kHz, 37kHz CW 40kHz, 48kHz CW 40kHz CW 200mVp-p S1, 2, 6, 7 A 31 40 64 kΩ 40µVp-p S2, 5, 6, 9 B 5 19 — dB 40µVp-p S2, 5, 6, 9 B 5 10 — dB Note 1) Note 2) Note 3) Input level is taken Vi and measuring value is taken Vx. µs 2.8 mA measuring value (f = 37kHz) measuring value (f = 30kHz) Burst wave signal with a 1.2ms, 40kHz cycle is input. 1.8 30µVp-p S2, 5, 6, 9 B 75 81 85 dB C — 0.6 1.3 V A 0.6 1.2 1.8 V A 2.3 2.8 3.3 V 100µA is flown out from Pin 1. Level ON-SW Measurement point Min. Typ. Max. Unit Remarks (VCC = 5V, Ta = 25°C) No. Item Symbol 1 Input pin voltage (1) VIN1 2 Input pin voltage (2) VIN2 3 L level output voltage VOL 4 Voltage gain AV 5 BPF characteristics (1) AVQ1 6 BPF characteristics (2) AVQ2 7 Input impedance rin burst wave S3, 7 A1=20log D 1.0 60µVp-p S2, 5, 6, 7 C 440 550 770 8 Detecting ability Det –4– A2=20log 9 Current consumption Icc Note 1) The level ratio between AC level at 37kHz and that at 30kHz is taken A1 [dB]. Note 2) The level ratio between AC level at 40kHz and that at 48kHz is taken A2 [dB]. measuring value (f = 40kHz) measuring value (f = 48kHz) Note 3) rin= 47kΩ [kΩ] (Vi/Vx) –1) CXA1511L/M CXA1511L/M Electrical Characteristics Measurement Circuit 1 2 470 0.01µ S1 S2 S3 3 4 5 6 7 8 D C A R6 47k S4 0.47µ S7 S8 S9 S5 330k S6 SG E1 1.0V 0.01µ 200k E2 5.0V 0.47µ I1 100µA 50 B Application Circuit (CXA1511L) (CXA1511M) 47 +5V 47µ CXA1511L 200k 1% (fo = 40kHz) 6 5 1 2 3 470, 680 4 5 6 7 8 8 OUT 7 Photo Diode PH302B 0.01µ 0.01µ 200k OUT 1% (fo = 40kHz) 47 47µ +5V Photo Diode PH302B 1 CXA1511M 2 3 470, 680 4 Description of Operation (See the Block Diagram.) Receives infrared signals transmitted from the infrared remote control commander with a photodiode to output them as rectangular waves. I/O pin Pin 1 Input waveform 40µVp-p to 2.5Vp-p 600µs typ. 40kHz (typ.) 0.01µ 0.01µ Waveform Operation Converts the signal current of a photodiode into voltage and amplifies it. Pin 3 BPF output waveform Hysteresis comparator input waveform Pin 7 Output waveform 5V 0.6V (typ.) Suppresses the noise component with BPF and BEF. Detects the signal component and performs wave detection. Integrates the signal component and outputs it as rectangular wave from the hysteresis comparator. –5– CXA1511L/M Example of Representative Characteristics External resistor at Pin 2 vs. AV1 characteristics 0 VCC vs. ICC characteristics BPF relative voltage gain [dB] (Pin 3) –5 VIN = 50µVp-p (Pin 1) f = 40kHz Ta = 25°C VCC = 5V Ta = 25°C 2.0 –10 ICC [mA] 1.5 –15 –20 100 1k 10k External resistor at Pin 2 [Ω] 1.0 4.0 5.0 VCC [V] 6.0 I1 vs. VIN2 characteristics Input voltage at Pin 1 vs. Output voltage at Pin 3 characteristics 5 f = 40kHz Ta = 25°C VCC = 5V Ta = 25°C VCC = 5V 4 BPF output (Pin 3) VIN2 [V] 3 1 0.5 2 1 0.1 10µ 0 100µ VIN 1m [Vp-p] (Pin 1 input) 10m 100m 1 10 I1 [µA] 100 f vs. AV1 characteristics 80 Ta = 25°C VCC = 5V 100 External resistor at Pin 5 vs. Center frequency response Ta = 25°C VCC = 5V VIN = 50µVp-p (Pin 1) Center frequency [kHz] 70 80 Av1 [dB] 60 60 50 40 40 20 30 10 20 30 40 f [kHz] 100 0 0 100 200 300 400 External resistor at Pin 5 [kΩ] –6– CXA1511L/M Package Outline CXA1511L Unit: mm 8PIN SIP (PLASTIC) + 0.5 19.0 – 0.2 2.8 ± 0.2 + 0.5 6.4 – 0.2 1.2 MIN 3.0 1 8 8.3 MAX + 0.1 0.25 – 0.05 2.54 0.5 ± 0.1 + 0.3 1.2 – 0.1 1.2 ± 0.1 PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SIP-8P-02 SIP008-P-0340 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.7g CXA1511M + 0.4 5.0 – 0.1 8 5 8PIN SOP (PLASTIC) + 0.4 1.25 – 0.15 0.10 A + 0.3 4.4 – 0.1 6.4 ± 0.4 + 0.15 0.1 – 0.1 0.5 ± 0.2 0° to 10° (0.15) + 0.1 0.15 – 0.05 b = 0.4 ± 0.03 + 0.03 0.15 – 0.01 + 0.1 b = 0.4 – 0.05 (0.4) DETAIL A DETAIL B : PALLADIUM 1 4 1.27 b 0.24 M B DETAIL B : SOLDER PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SOP-8P-L03 SOP008-P-0225 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER/PALLADIUM PLATING 42/COPPER ALLOY 0.1g NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame). –7–