CXA1600M

CXA1600M/P 8-pin Single-chip AM Radio with Built-in Power Amplifier For the availability of this product, please contact the sales office. Description The CXA1600M/P is an 8-pin single-chip bipolar IC for AM radios. This IC includes all functions from the front-end to the power amplifier. The CXA1600M/P doesn’t require any external filter, making external ceramic filter attachment unnecessary. Features • EIAJ output=100 mW (typ.) (VCC=3 V, RL=8 Ω) • Built-in electrical volume control. • No ceramic filter required. • Few peripheral components. Applications AM radio Structure Bipolar silicon monolithic IC CXA1600M 8 pin SOP (Plastic) CXA1600P 8 pin DIP (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Supply voltage VCC 7 • Operating temperature Topr –20 to +75 • Storage temperature Tstg –65 to +150 Operating Conditions Supply voltage V °C °C VCC 1.8 to 4.5 V Block Diagram RF IN 8 OL AGC 7 LO OSC 6 VCC 5 RF AMP MIXER OSC OVERLOAD AGC BPF IF AMP AGC IF DET VOL AF POWER AMP 1 AGC 2 VOL 3 GND 4 SP OUT Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E92311B8X CXA1600M/P Pin Description No. Symbol Voltage (typ.) Equivalent Circuit Description VCC=3 V VCC 1 AGC 0.61 V AGC 1 Connect with a capacitor. GND VCC 2 VOL 0.1 V VOL 2 Connect to the midpoint of the volume control. GND 3 GND 0V VCC Ground 4 SP OUT 1.28 V 4 SP OUT Audio output. Connect with a capacitor. GND 5 VCC 3V VCC 6 LO OSC Power supply 6 LO OSC VCC Oscillation output. Connect with an oscillation coil. GND —2— CXA1600M/P No. Symbol Voltage (typ.) Equivalent Circuit Description VCC 7 OL AGC 0.62 V 7 OL AGC Connect with a capacitor. GND VCC 8 RF IN 8 RF IN 3V RF input. Connect with the antenna circuit. GND Electrical Characteristics Item 1 2 3 Non-signal circuit current EIAJ output (with 8 Ω load) Volume attenuation No signal f=1 MHz, fMOD=1 kHz, 30 % Vin=90 dBµV f=1 MHz, fMOD=1 kHz, 30 % Vin=90 dBµV, Volume=minimum Short circuit at RF IN with a 1µF capacitor. Measure the level at SP OUT. Volume=maximum f=1.010 MHz, fMOD=1 kHz, 30 % Vin=35 dBµV. Test conditions Min. 4.8 80 Typ. 6 100 –70 VCC=3 V, Ta=25 °C Max. 10 Unit mA mW –65 dBm 4 Overall noise level –25 –15 dBm 5 Selectivity 14 19 dB —3— CXA1600M/P AM I/O Characteristics S+N 0 0dB=–10dBV VCC=3V f=1MHz fMOD=1kHz MOD=30% –10 –20 Output level [dB] –30 8 7 –40 Noise –50 6 5 4 3 –60 THD 2 1 0 20 30 40 50 60 70 80 90 100 110 120 Bar antenna input level [dBµV/m] Selectivity Characteristics 0 –10 Output level [dB] –20 –30 –40 –50 –60 –110 –100 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 10 20 30 Input frequency (fIN-fO) [kHz] —4— THD - Distortion factor [%] CXA1600M/P Notes on Applications Application 1 VARIABLE CAPACITOR: HQ-025A of Toko Co., Ltd. or equivalent Bar ANT D1, D2: 1S1555 OSC COIL VOSC=400mVp-p 130µH 220µ GND 160p 160p fIN 4.7µ C2 C3 1500p D1 GND 8 RF IN 7 OL AGC 6 C7 D2 GND fOSC LO OSC 5 VCC RF AMP MIXER fIF OSC OVERLOAD AGC BPF IF AMP AGC IF DET VOL AGC VOL AF POWER AMP GND SP OUT C6 1 2 3 4 22µ 100k C1 0.1µ 220µ C5 8Ω SP 2.2µ R1 GND The CXA1600M/P operates on the new system using very low intermediate frequency (approx. 55 kHz). (Actual IF frequency is determined by internal B.P.F.fo.) fIF = 1 fOSC–fIN ≈ 55 kHz 2 Please take care of choice of the coil and variable capacitor as follows. (See next page.) —5— C4 3V CXA1600M/P Coil data APPlication 1 AM OSC 3 2 1 S 4 5 6 Wire diameter ø 0.08 mm 2UEW f (kHz) 796 L (µH) 1 to 3 130 QO 1 to 3 70 Number of widings (µH) 1 to 4 4 to 3 32.5 97.5 AM Bar Antenna f (kHz) 796 L (µH) 560 3 to 2 140 2 to 1 420 S 1 2 3 APPlication 2 AM OSC 3 2 1 S 4 5 6 Wire diameter ø 0.08 mm 2UEW f (kHz) 796 L (µH) 1 to 3 210 QO 1 to 3 70 Number of widings (µH) 1 to 4 4 to 3 71.3 138.7 AM Bar Antenna f (kHz) 796 L (µH) 900 3 to 2 180 2 to 1 720 S 1 2 3 —6— CXA1600M/P Application Circuit 1 VARIABLE CAPACITOR used (Equivalent capacitor) Bar ANT D1, D2: 1S1555 OSC COIL VARIABLE CAPACITOR: HQ-025A of Toko Co., Ltd. or equivalent 130µH 220µ GND 160p 160p 4.7µ C2 C3 1500p D1 GND 8 7 6 C7 D2 GND 5 RF IN OL AGC LO OSC VCC RF AMP MIXER OSC OVERLOAD AGC BPF IF AMP AGC IF DET VOL AGC VOL AF POWER AMP GND SP OUT C6 1 2 3 4 22µ 100k C1 0.1µ 220µ C5 8Ω SP 2.2µ R1 GND Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. —7— C4 3V CXA1600M/P Application Circuit 2 VARIABLE CAPACITOR used (Non-Equivalent capacitor) Bar ANT D1, D2: 1S1555 OSC COIL VARIABLE CAPACITOR: CRF=160p, COSC=80p 210µH 220µ GND 160p 4.7µ C3 220p D1 GND GND 6 OL AGC LO OSC 5 VCC 8 RF IN 7 RF AMP MIXER OVERLOAD AGC BPF IF AMP AGC VOL AGC 1 22µ 2 VOL 3 AF POWER AMP GND 4 C6 220µ C5 8Ω SP SP OUT 100k C1 80p C2 OSC IF DET 2.2µ GND Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. —8— C4 0.1µ R1 C7 D2 3V CXA1600M/P Package Outline CXA1600M Unit : mm 8PIN SOP (PLASTIC) + 0.4 1.25 – 0.15 + 0.4 5.0 – 0.1 8 5 A 0.10 + 0.3 4.4 – 0.1 1 4 1.27 b 0.24 M 0° to 10° (0.15) + 0.1 0.15 – 0.05 b = 0.4 ± 0.03 + 0.03 0.15 – 0.01 + 0.1 b = 0.4 – 0.05 (0.4) DETAIL A DETAIL B : SOLDER DETAIL B : PALLADIUM PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SOP-8P-L03 SOP008-P-0225 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER/PALLADIUM PLATING 42/COPPER ALLOY 0.1g NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame). CXA1600P 8PIN DIP (PLASTIC) 8 5 7.62 + 0.3 6.4 – 0.1 + 0.4 9.4 – 0.1 + 0.1 0.05 0.25 – 0° to 15° EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.5g 1 2.54 4 0.5 ± 0.1 1.2 ± 0.15 3.0 MIN 0.5 MIN + 0.4 3.7 – 0.1 PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE DIP-8P-01 DIP008-P-0300 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS —9— 0.5 ± 0.2 B 6.4 ± 0.4 + 0.15 0.1 – 0.1