CXA1726AM

CXA1726AM/AS Multiplier IC for Displays Description The CXA1726AM/AS is a multiplier IC which is used for dynamic convergence, dynamic focus and others in CRT display monitors and projectors. It is used in conjunction with an IC (CXA1470AM/AS) which generates waveforms for deflection compensation. Features Analog multiplier • Maximum input voltage • Maximum output voltage • Frequency response • 4 inputs, 1 output • 2 inputs, 1 output Operational amplifier • Maximum output voltage • Frequency response Analog switch • Maximum output voltage • Frequency response Absolute Maximum Ratings • Supply voltage • Operating temperature • Storage temperature • Allowable power dissipation 30 pin SDIP (Plastic) 30 pin SOP (Plastic) 4ch ±1.3V ±2.7V (RL = 3.9kΩ) 1.0MHz (–3dB) 2ch 2ch 2ch ±3.65V (RL = 1kΩ) 1MHz (–3dB) 1ch Applications • CRT display monitors • Projectors Structure Bipolar silicon monolithic IC Operating Condition Supply voltage VCC VEE 5 ± 0.25 –5 ± 0.25 V V VCC 7 VEE –7 Topr –20 to +75 Tstg –65 to +150 PD (CXA1726AM) 625 (CXA1726AS) 1350 V V °C °C mW mW Block Diagram and Pin Configuration (Top View) IN5Xa 28 IN5Xb 27 IN5Ya 26 IN5Yb 20 IN7Xa 19 IN7Xb 18 IN7Ya 25 OUT5 22 OUT6 30 SW2 23 IN6+ 21 OUT7 24 IN6– IN7Yb mul. IN4Y 14 17 16 VEE GND 15 29 L H L H L H mul. L H L H mul. OUT3 11 IN3+ 10 mul. OUT1b 5 OUT1a Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– OUT4 12 OUT2 8 IN4X 13 2 3 VCC 1 4 IN2X 6 IN2Y 7 SW1 IN3– 9 IN1 L H E94607B7X CXA1726AM/AS Pin Description Pin No. 1 Symbol VCC Pin voltage 5V Equivalent circuit Description Positive supply voltage pin. 50µA 500 2 2 SW1 2.3V Control pin of switch unit. The signal input from IN1 is selected for "a" side or "b" side by the SW1 applied voltage. When SW1 is 2V or less, low turns to "a" side; it is 2.6V or more, high turns to "b" side. 50µA 500 3 3 IN1 0V Input pin of switch unit. 100µA 4 5 OUT1 a OUT1 b 4 5 2mA Output pins of switch unit. The pin which is not selected is GND. 500 6 13 IN2 X IN4 X 0V 0V 6 13 Multiplier IN X input pins. 100µA 100µA –2– CXA1726AM/AS Pin No. Symbol Pin voltage Equivalent circuit Description 100µA 100µA 7 14 IN2 Y IN4 Y 0V 0V 7 14 500 Multiplier IN Y input pins. 8 12 21 25 OUT2 OUT4 OUT7 OUT5 0V 0V 0V 0V 56k 8 12 21 25 50µA Multiplier output pins. 9 24 10 23 IN3– IN6– IN3+ IN6+ 1k 9 24 50µA 10 23 Operational amplifier input pins. 100µA 11 22 OUT3 OUT6 11 22 Operational amplifier output pins. 15 16 GND VEE 0V –5V GND Negative supply voltage pin. –3– CXA1726AM/AS Pin No. 18 20 27 29 17 19 26 28 Symbol IN7 Ya IN7 Xa IN5 Ya IN5 Xa Pin voltage Equivalent circuit Description 50µA 500 0V IN7 Yb IN7 Xb IN5 Yb IN5 Xb 17 18 19 20 26 27 28 29 Input pins of multiplier with switch. 50µA 500 30 50µA Switch pin to select "a" side or "b" side of multiplier with switch. "a" side ≤ 2.0V "b" side ≥ 2.6V 30 SW2 50µA 50µA Electrical Characteristics Multiplier No. 1 2 3 4 5 6 Item Output offset voltage Scale factor Frequency response Input dynamic range Symbol VO SF GT VIN Conditions X = Y = 0V X = Y = 1V → V1 X = –Y = 1V → V2 (| V1 | + | V2 |)/2 = SF X = 1V, Y = SG1 Measurement point OUT Min. –110 0.95 –3 Typ. 16 1 –0.5 Max. 110 1.05 1 ±2.3 ±2.7 X = Y = 1V X = 1V, Y = SG2 7 Delay time DT Input Output t 100% 50% 0% Measure "t". Unit mV — dB V V µA Output dynamic range VOUT Input bias current IIB X, Y –3 3 Y, OUT 50 125 200 ns –4– CXA1726AM/AS Operational Amplifier No. 8 9 10 11 12 Item Input bias current Voltage gain Symbol IIB AV Conditions IN = 0V Measurement point IN OUT Min. –1 50 Typ. 0.35 80 ±3.65 Inversed input pin = SG1 Non-inversed input pin = GND IN = 0V –3 –6 –0.15 –2 1.4 +6 Max. 1 Unit µA dB V dB mV Output dynamic range VOUT Frequency response Input offset voltage GT VI Switch No. 13 14 15 16 17 18 Item Frequency response Symbol GT Conditions IN = SG1 Measurement point OUT SW SW OUT IN = 0V IN = 0V X = 1V, Y = SG2 19 Delay time DT Input Output t 100% 50% 0% Measure "t". Min. –3 2.5 Typ. –0.15 Max. 1 Unit dB V Switch threshold high VSH Switch threshold low Output dynamic range Input bias current Output offset voltage VSL VOUT IIB VO 2.0 ±3.1 –1 –15 –0.4 –3 1 15 V V µA mV IN OUT IN, OUT 50 113 200 ns No. 20 21 Item Current consumption 1 Current consumption 2 Symbol ICC IEE Conditions Measurement point A1 A16 Min. 21 –33 Typ. 26 –26 Max. 33 –21 Unit mA mA –5– Electrical Characteristics Measurement Circuit VCC SW2 30 S30 SW1 2 L S29 IN5Xb 28 S28 OUT1a 4 L S27A IN5Yb S26A 25 mul. IN2Y 7 OUT2 8 IN3– 9 IN3+ 10 OUT3 11 OUT4 12 mul. IN4X 13 mul. IN4Y 14 GND 15 16 H 17 IN7Yb S17A VEE A1G A1 1 10k IN5Xa 29 1V 5V 10k IN1 3 1V L IN5Ya 27 S27B S27C 1V mul. H S2 SG1 S3 SG2 3.9k OUT1b 5 26 OUT5 3.9k 24 IN6+ 10k 22 OUT6 1k 21 OUT7 3.9k L H 20 IN7Xa S20 19 IN7Xb S19 18 L IN7Ya S18A S18B 1V 1V IN6– S24 23 5p H IN2X 6 H H L 1V SG2 3.9k S26B S26C 1V 1V 1V S6 SG2 SG1 –6– 1V 1V S7C S7B S7A 10k 10µ 10µ 10k 3.9k SG1 S9 5p 10k 1k 3.9k SG2 1V S13 SG2 S18C S17B 1V 1V SG2 S14B S14A CXA1726AM/AS 1V 1V S14C S17C 5V 1V 1V CXA1726AM/AS Application Circuit V.SIN 2 C2 0.001µ C1 22µ R2 10k R4 5.6k GND GND 15 14 13 12 GND 11 R1 22k C3 22µ V1 5V R3 3.3k GND 10 9 8 7 6 5 4 3 2 1 GND GND SW1 IN1 A1726AM/AS OUT1b OUT1a OUT4 OUT3 OUT2 IN4 Y IN4 X IN2 Y IN2 X GND IN3+ IN3– IN7 Yb IN7 Ya IN7 Xb IN7 Xa OUT7 OUT6 OUT5 IN5 Yb IN5 Ya IN5 Xb IN5 Xa IN6+ VEE 16 17 18 19 20 21 22 23 R5 10k IN6– 24 25 26 27 28 29 30 C4 22µ GND V2 5V GND R8 5.6k GND R7 5.6k GND R6 5.6k C5 5p R9 33k GND SW2 C7 47µ VCC 0.1µ C6 0.047µ V3 5V VDIN HDIN GND 14 13 12 11 10 9 8 7 GND 6 5 GND GND 4 3 GND GND 2 1 HSQ VSQ VPARA+ VPARA– VSAW+ VSAW– A1470AM/AS HPARA– HPARA+ HSAW– HSAW+ VGND VGEN VAGC HBIAS HAGC HGND VCLP HCLP HDLY VREF VBIAS IREF HDIN VDIN VSIN 15 16 17 18 19 20 21 22 23 24 25 26 27 R18 51k 28 GND C8 1µ GND C9 0.047µ GND C10 1µ GND R11 2.2k GND C11 0.1µ R14 1k R13 8.2k R12 1.5k V4 5V GND VEE VCC V4 C12 47µ GND GND GND GND Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. –7– CXA1726AM/AS Input Signals SG1 GND 5Vp-p f = 1MHz SG2 3Vp-p GND f = 200kHz Description of Operation • Multiplier The input X and Y signals of the multiplier are multiplied and output to the OUT pins. • Operational amplifier This inputs the signals which have been output from the multiplier. ∗ Care is required with ringing in the operational amplifier. Placing a 5p capacitor in parallel with the feedback resistor is recommended as a preventive measure. • Switch The signal input from IN1 is selected for "a" side or "b" side by the SW1 applied voltage. When SW1 is 2V or less, low turns to "a" side; it is 2.6V or more, high turns to "b" side. The unselected output pin is connected to GND. ∗ For the multipliers with a switch, "a" side or "b" side is selected under the same conditions. –8– CXA1726AM/AS Multiplier frequency response [dB] 0 Input X = DC 1V Y = 5Vp-p Sine wave X Y mul. OUT –4 –8 –12 –14 10k 100k 1M 10M [Hz] Operational amplifier frequency response [dB] Input 5Vp-p Sine wave 10k –4 IN –8 10k OUT 0 –12 10k 100k 1M 10M [Hz] Multiplier gain characteristics 2 OUT [V] 1 Input X = 1V Y = –2 to +2V –2 –1 0 1 2 –1 –2 Y [V] –9– CXA1726AM/AS Package Outline CXA1726AM Unit: mm 30PIN SOP(PLASTIC) + 0.4 2.3 – 0.15 0.1 16 + 0.4 18.8 – 0.1 30 10.3 ± 0.4 + 0.3 7.6 – 0.1 + 0.2 0.1 – 0.05 (9.3) 15 1 0.45 ± 0.1 1.27 0.2 M + 0.1 0.2 – 0.05 0° to 10° DETAIL A PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SOP-30P-L03 SOP030-P-0375 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.7g CXA1726AS 30PIN SDIP (PLASTIC) + 0.4 26.9 – 0.1 30 16 + 0.3 8.5 – 0.1 + 0.1 05 0.25 – 0. 1 1.778 15 0.5 MIN + 0.4 3.7 – 0.1 10.16 Two kinds of package surface: 1.All mat surface type. 2.All mirror surface type. 0.5 ± 0.1 0.9 ± 0.15 PACKAGE STRUCTURE MOLDING COMPOUND SONY CODE EIAJ CODE JEDEC CODE SDIP-30P-01 SDIP030-P-0400 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER/PALLADIUM PLATING COPPER ALLOY 1.8g NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame). – 10 – 3.0 MIN 0.5 ± 0.2 0° to 15° A