CXA2586M

CXA2586M PDIC for CD-ROM/DVD-ROM Description CXA2586M is a PDIC (photodetector IC) developed as a photodetector for the optical pickup of CD-ROM/DVD-ROM. The photodiode and circuit blocks operate at high speed. (Typ. 100MHz) • Focus servo : astigmatic method • Tracking servo (CD) : three-spot method • Tracking servo (DVD) : differential phase detection method Features • High-speed I-V amplifier (current-voltage conversion circuit) • High-speed photodiode • Adding amplifier (addition of A to D) • Compact transparent molded package (SOP) Applications Optical pickup for CD-ROM/DVD-ROM PD-S-19-B (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Supply voltage VCC 5.5 V • Operating temperature Topr –10 to +70 °C • Storage temperature Tstg –40 to +100 °C • Allowable power dissipation 300 mW PD Operating Conditions • Supply voltage1 • Supply voltage2 VCC VC 4.5 to 5.5 1.5 to VCC–1.5 V V Structure Bipolar silicon monolithic IC Block Diagram and Pin Configuration Fo 10 VCC VC GND Eo 9 8 7 6 Ao Bo Co Do VREF 1 Do 2 Ao 3 RF 4 Bo 5 Co ∗ The components marked by A, B, C, D, E and F are the photodiodes (photo sensitivity. About 0.4A/W @650nm, 780nm) Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E99430B01 CXA2586M Pin Description Pin No. Symbol I/O Equivalent circuit Description 2 4 1 5 Ao Bo Co Do 2 O 4 5 1 Output of voltage signals converted from optical signals 6 10 Eo Fo O 6 10 300 200µA 37k 37k VC Output of voltage signals converted from optical signals 3 RF O 3 7k Output of addition of Ao to Do 7 GND I For dual power supply : negative power supply For a single power supply : GND 8 Vc I 8 For dual power supply : GND For a single power supply : center voltage input 9 VCC I Positive power supply —2— CXA2586M Electrical and Optical Characteristics Item Current consumption Output offset voltage (A to D) Output offset voltage (E, F) Output offset voltage (RF) Symbol ICC Voff Voff Voff Conditions In the dark In the dark, Vc reference In the dark, Vc reference In the dark, GND reference A-B, in the dark C-D, in the dark (A+C) – (B+D), in the dark E-F, in the dark A+B+C+D, in the dark λ=650 nm, 780 nm, Po=10 µW λ=650 nm, 780 nm, Po=10 µW λ=650 nm, 780 nm, Po=10 µW λ=650 nm, 780 nm, Po=10 µW λ=650 nm, 780 nm, Po=10 µW λ=650 nm, 780 nm, Po=100 µW λ=650 nm, 780 nm, Po=100 µW λ=650 nm, 780 nm, Po=100 µW λ=650 nm, 780 nm Po=10 µWDC, 4 µWp-p 100 kHz reference, –3 dB λ=650 nm,780 nm Po=10 µWDC, 4 µWp-p 100 kHz reference, –3 dB λ=650 nm, 780 nm Po=10 µWDC, 4 µWp-p 100 kHz reference, –3 dB 100 kHz to 50 MHz 100 kHz to 50 MHz f=50 MHz, RBW=30 kHz f=50 MHz, RBW=30 kHz (VCC=5.0 V, VC=2.5 V, Ta=25 °C) Min. — –25 –15 1.25 –20 –20 –20 –15 –100 180 312 302 1.71 1.67 3.8 3.8 3.8 70 Typ. 15 0 0 1.4 0 0 0 0 0 246 447 432 1.81 1.76 4.0 4.0 4.0 100 Max. 20 25 15 1.55 20 20 20 15 100 312 581 561 1.90 1.84 — — — — Unit mA mV mV V mV mV mV mV mV mV mV mV — — V V V MHz Output voltage difference ∆Voff Sum of output offset voltages Output voltage (A to D) Output voltage (E, F) Output voltage (RF) Output voltage ratio (E, F/A to D) Output voltage ratio (RF/A to D) Maximum output voltage (A to D) Maximum output voltage (E, F) Maximum output voltage (RF) Frequency response (A to D) Voffs Vo Vo Vo VOR VOR Vo Vo Vo fc Frequency response (E, F) fc 1 5 — MHz Frequency response (RF) Group delay difference (A to D) Group delay difference (RF) Output noise level (A to D) Output noise level (RF) fc ∆ Gd ∆ Gd Vn Vn 80 — — — — 105 1 1 –87 –76 — 5 5 –82 –71 MHz ns ns dBm dBm Note 1) Output offset voltage: Vc is the reference for A to F, GND for RF. Note 2) Output voltage: Vc is the reference for A to F, GND for RF. However, the offset voltage is excluded. Note 3) Output voltage, frequency response, group delay, output noise level: Confirmation of design. Note 4) Measurement by the optical input: Measurement is made by emitting the light to the center of each photodiode. In regard of the frequency response of A to D and RF, the same response can be obtained by emitting the light to the A to D photodiodes evenly. —3— CXA2586M Measurement Circuit 1 Do Fo 10 5.0V 2 Ao VCC 9 2.5V 3 1µF RF VC 8 4 Bo GND 7 5 Co Eo 6 ∗ All loads are 10 kΩ//10 pF. For RF, the DC current is cut by 1 µF. Reference Surface and Photodetector Position 10 6 F E The center of the package Note) 1 4.7 ± 0.1 5 0.52 ± 0.2 Reference surface 3.5 ± 0.1 Surface that senses the incident light Note) The sink depth of the mirror surface (0.03 ± 0.02) is not included. Deviation from the center of photodetector X, Y : ± 0.2 θ : ±2° —4— (Unit : mm) CXA2586M Photodetector Pattern Dimensions 124 22 88 F D 200 120 A B C E 6deg. (Unit : µm) —5— CXA2586M Example of Representative Characteristics A to D I-V amplifier frequency response 2 0 Gain [dB] –2 –4 –6 –8 1M 3M 5M 7M 10M 30M 50M 70M 100M 300M Frequency [Hz] RF amplifier frequency response 2 0 Gain [dB] –2 –4 –6 –8 1M 3M 5M 7M 10M 30M 50M 70M 100M 300M Frequency [Hz] E and F IV amplifier frequency response 2 0 Gain [dB] –2 –4 –6 –8 100k 300k 500k 700k 1M Frequency [Hz] 3M 5M 7M 10M —6— CXA2586M Note on Operation 1. Power supply The CXA2586M can be used with a single power supply or dual power supply. However, this IC is not provided with a center voltage generating circuit, and so when used with a single power supply the center voltage must be supplied from the RF amplifier or some other device. The connection of the power supply for each case is as shown. (9) VCC Positive power supply Positive power supply (8) VC GND Center voltage (7) GND Negative power supply GND Dual power supply Single power supply The potential difference between the VCC pin and GND should be in the range of 4.5 to 5.5 V in both of a single power supply and dual power supply. 2. Soldering The reflow soldering is not guaranteed for the CXA2586M. 3. Mechanical strength for package The mechanical strength for the package is not guaranteed for the CXA2586M. Do not employ the mounting method which gives much weight to the package. 4. Visual inspection standard Separate specifications and limit samples must be exchanged regarding visual inspection standards for the photodetector. 5. Bypass capacitor The 0.1 µF capacitor is connected between the VCC and Vc pins, and the Vc and GND pins respectively to lower the power supply line impedance. Take the FPC (flexible printed circuit) pattern and the like into consideration so that the bypass capacitor is located close to the PDIC. —7— CXA2586M Package Outline Unit : mm PD-S-19-B 1.5 ± 0.1 + 0.4 5.0 – 0.1 10 6 φ2.5 Mirror 0.9 ± 0.1 + 0.1 0.15 – 0.05 15° + 0.2 4.0 – 0.1 8.0 ± 0.3 Datum plane 1 0.3 ± 0.1 0.8 5 0.3 MIN 0.16 M 10° 5° SONY CODE EIAJ CODE JEDEC CODE PD-S-19-B PACKAGE WEIGHT 0.06g 10° —8— Sony Corporation