CXA2640ER
3-Channel 2-LD Driver for Optical Disc Drive
Description The CXA2640ER is a laser driver IC capable of driving two high output lasers (CD/DVD) for writeable optical discs. Features • CD maximum drive current: 300mA DVD maximum drive current: 250mA • Capable of generating three-value write waveform through control of one read channel and two write channels • Rise/Fall times = 1ns • Read Channel: ×100 • Write Channel: ×840 (CD), ×400 (DVD) • Read channel has extensive low-noise design 1.5nA/√Hz (@20MHz, ILD = 35mA, IMOD = 40mAp-p) • Internal high frequency modulator circuit Frequency variable range: 200 to 600MHz Maximum modulator current amplitude: 100mAp-p Can be set separately for CD and DVD. • Timing input for generating write waveform can be adapted to both differential input (LVDS/LVPECL) and single end input (3.3V CMOS/TTL). • Single 5V power supply Applications CD-R, CD-RW, DVD-R, DVD+RW, DVD-RW and DVD-RAM for high-speed writeable optical disc drives Structure Bipolar silicon monolithic IC 24 pin VQFN (Plastic)
Absolute Maximum Ratings (Ta = 25°C) • Supply voltage Vcc 5.5 • Storage temperature Tstg –65 to +150 • Allowable power dissipation PD TBD Operating Conditions • Supply voltage Vcc • Operating temperature Topr
V °C
4.5 to 5.5 –10 to +75
V °C
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
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E02223A3Z
CXA2640ER
Block Diagram and Pin Configuration
OUTENREF
xOUTEN3
xOUTEN2
OUTEN3
6
5
4
3
2
IIN1 7 OSC LOGIC CONT IIN2 8 Iref IIN3 9 Iref Iref Vcc1 10 Vcc1 Iref VBG Vcc2 11 Vcc2 Vcc_LD Vref RAMP1 (DVD) RAMP2 (CD) RFREQ1 (DVD) RFREQ2 (CD)
OUTEN2
VBG
1
GND1
24 GND1
23 OSCEN
22 LDEN2
21 LDEN1
GND2 Vcc_LD
20 GND2
LDOUT2 12
CD side IIN1: ×100 IIN2, 3: ×840
19 LDOUT1 Vcc_LD 14
R FREQ2
DVD side IIN1: ×100 IIN2, 3: ×400
13
R FREQ1
15
R FREQ COMP
16
Vcc_LD
17
RAMP1
18
RAMP2
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CXA2640ER
Pin Description Pin No. 1 2 3 4 Symbol OUTEN2 xOUTEN2 OUTEN3 xOUTEN3 I/O I I — I I —
1 2 3 4 2k
Pin voltage DC AC
Equivalent circuit
Description IIN2 set current control signal input. (positive logic)
300
IIN2 set current control signal input. (negative logic) IIN3 set current control signal input. (positive logic) IIN3 set current control signal input. (negative logic)
5
5
OUTENREF
O
1.65V
—
40k
300
Reference voltage output for current control signal. Connects decoupling capacitance to ground.
6
6
VBG
O
1.26V
—
12.6k
300
Internal reference voltage decoupling.
7
IIN1
I
—
—
100 7 700
Current setting 1. The set current ×100 is output when LDEN1 or LDEN2 = high.
8
IIN2
I
—
—
500 8 9 1k
Current setting pin 2. The set current ×400 is output through LDOUT1 when LDEN1 = high. The set current ×840 is output through LDOUT2 when LDEN2 = high. Current setting pin 3. The set current ×400 is output through LDOUT1 when LDEN1 = high. The set current ×840 is output through LDOUT2 when LDEN2 = high. Supply voltage for control system and modulator system. Supply voltage for timing system and current switch.
9
IIN3
I
10 11
Vcc1 Vcc2
I I
— —
— — –3–
— —
CXA2640ER
Pin No.
Symbol
I/O
Pin voltage DC AC
Equivalent circuit
Description
12
LDOUT2
O
—
—
12
CD laser drive current output. Enabled when LDEN2 = high.
13
R FREQ1
O — —
300 13 14 8p
Modulator frequency setting 1. Enabled when LDEN1 = high. Connects resistance to ground. Modulator frequency setting 2. Enabled when LDEN2 = high. Connects resistance to ground.
14
R FREQ2
O
15
R FREQ COMP
O
300
—
—
15 8p
Modulator frequency variation adjustment. Connects resistance to ground.
16
Vcc_LD
—
—
—
—
Output stage supply voltage. Modulator amplitude setting 1. Enabled when LDEN1 = high. Connects resistance to ground. Modulator amplitude setting 2. Enabled when LDEN2 = high. Connects resistance to ground.
17
RAMP1
O
300 17 18 8p
18
RAMP2
O
19
LDOUT1
O
19
DVD laser drive current output. Enabled when LDEN1 = high.
20
GND2
—
—
—
—
Ground.
–4–
CXA2640ER
Pin No.
Symbol
I/O
Pin voltage DC AC
Equivalent circuit
Description DVD output control. (positive logic) When LDEN1 = high, the current set at IIN1 is output through LDOUT1. CD output control. (positive logic) When LDEN2 = high, the current set at IIN1 is output through LDOUT2.
21
LDEN1
I
—
—
21 22 200k 300
22
LDEN2
I
—
—
300
23
OSCEN
I
—
—
23
Modulator control. (positive logic) Outputs modulator waveform when OSCEN = high.
24
GND1
—
—
—
—
Ground.
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CXA2640ER
Electrical Characteristics No. 1 2 Measurement item Current consumption 1 Current consumption 2 Symbol Icc1 Icc2 Min. Typ. Max. 10 86 16 22 Unit mA mA
(Vcc = 5V, Ta = 25°C) Condition LDEN1, 2 = L LDEN1 (2) = H, IOUT1 = 60mA, OSCEN = H, AMP = 40mAp-p LDEN = H, IOUT1 = 60mA, IOUT2 = 120mA (Duty = 25%), IOUT3 = 60mA (Duty = 50%), IOUT = IOUT1 + IOUT2 + IOUT3 LDEN = H, IOUT1 = 30mA, IOUT2 = 120mA (Duty = 25%), IOUT3 = 60mA (Duty = 50%), IOUT = IOUT1 + IOUT2 + IOUT3
123 160
3
Current consumption 3
Icc3
128 183 238
mA
4
Current consumption 3-1
Icc3_1
100 144 188
mA
5 6 7 8 9 10 11 12 13 Input voltage high level Input voltage low level Input voltage high level Input voltage amplitude LD drive current 1 LD drive current 2, 3 Total LD drive current 1 (DVD) Total LD drive current 2 (CD) Minimum LD drive current 1 (DVD) Minimum LD drive current 2 (CD) Output current noise 1 (DVD) Output current noise 2 (CD) VSH VSL VDH VDL IOUTR IOUTW IOUT1 IOUT2 OFFSET1 2 — Vcc 1.3 3 3 — — — — 4 V V V V mA mA mA mA mA Vcc = 4.5V, VOP = 3V Vcc = 4.5V, VOP = 2.5V IIN1 = IIN2 = IIN3 = 0µA, LDEN1 = OUTEN2 = OUTEN3 = H IIN1 = IIN2 = IIN3 = 0µA, LDEN2 = OUTEN2 = OUTEN3 = H
GND — 0.8 0.2 100 250 250 300 300 350 — —
14
OFFSET2
—
—
4
mA
15
NOISE1
—
1.5
—
f = 400MHz, ILD = 35mA, nA/√Hz Imod = 40mAp-p (20MHz: NOISE) f = 400MHz, ILD = 35mA, nA/√Hz Imod = 20mAp-p (20MHz: NOISE)
16
NOISE2
—
1.5
—
17 18 Propagation delay Rise time (Tr) DELAY TR — — 3 1.5 — — ns ns ILD = 50 to 100mA pulse Settling 10% to 90% (resistance load) ILD = 100 to 50mA pulse Settling 10% to 90% (resistance load)
19
Fall time (Tf)
TF
— –6–
1.5
—
ns
CXA2640ER
No. 20 21 22 23 24 25
Measurement item Input resistance 1 (Pin 7) Input resistance 2 (Pins 8, 9) Input/output gain 1 Input/output gain 2, 3 (DVD) Input/output gain 2, 3 (CD) ILD control linearity 1 (DVD)
Symbol ZIINR ZIINW GAINR
Min. Typ. Max. 0.56 0.8 1.04 1.05 1.5 1.95 95 105 115 440 935 2.5
Unit kΩ kΩ — — — %
Condition
GAINW1 360 400 GAINW2 765 840 LINEA1 –3.5 —
Based on linearity when ILD = 50 to 150mA Vcc = 4.5V, VI = 1.75V, RL = 5Ω, ILD = 250mA Based on linearity when ILD = 50 to 150mA Vcc = 4.5V, V2 = 1V, RL = 5Ω, ILD = 300mA
26
ILD control linearity 2 (CD) Input/output gain relative precision Input/output transmission band
LINEA2
–3.5
—
2.5
%
27 28
GACCU FBAND
–5 7
— —
5 —
% MHz Frequency for input/output gain of –3dB
29 30 31 32 33 34 35 36 Frequency variable range Amplitude variable range Frequency variation Frequency temperature characteristic Amplitude variation Amplitude temperature characteristic OSCEN response time (ON) OSCEN response time (OFF) VARIF VARIAMP FREQ TFREQ AMP TAMP 200 — –10 — 0 — — — — 319 31 116 5 5 600 100 10 MHz mA % fmod = 400MHz fmod = 400MHz
— ppm/°C fmod = 300MHz 42 mAp-p fmod = 400MHz, fmod = 300MHz, RAMP = 10kΩ
— ppm/°C — — ns ns
OSCRES1 — OSCRES2 —
37 LDEN response time 1 (ON) RLDRES1 — — 700 ns Time to reach 90% of Read set current (same condition as current consumption 2) Time to reach 10% of Read set current (same condition as current consumption 2) Time to reach 90% of Write set current (same condition as current consumption 3) Time to reach 10% of Write set current (same condition as current consumption 3)
38
LDEN response time 1 (OFF)
RLDRES2
—
—
10
ns
39
LDEN response time 2 (ON)
WLDRES1 —
—
700
ns
40
LDEN response time 2 (OFF)
WLDRES2 —
—
10
ns
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CXA2640ER
Electrical Characteristics Measurement Circuit
VCC
1µ
22µ
GND 6.8k 6.8k 1µ 22k 11k 11k
18
17
16
15
14
13
VCC_LD
RAMP2
RAMP1
R FREQ COMP
R FREQ2
R FREQ1
V1
5
5 LDOUT2 12
V2
19 LDOUT1
20 GND2
VCC2 11 1µ
21 LDEN1
VCC1 10 1µ
22 LDEN2
IIN3 9 1µ
23 OSCEN
IIN2 8 1µ
OUTEN2
OUTEN3
24 GND1
OUTENREF
xOUTEN2
xOUTEN3
IIN1 7
1 100
2
3 100
4
5
1µ
VBG
1µ
6
1µ
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CXA2640ER
Description of Operation (1) LD Drive Current Value Setting The current controlled by the current setting pins IIN1, IIN2 and IIN3 is output from the LDOUT1 and LDOUT2 pins. IIN1, IIN 2 and IIN3 can be set respectively by LDEN1, LDEN2, OUTEN and xOUTEN for the output drive current from the LDOUT pin. (2) Differential Input and Single-end Input External processing is required for the differential input and single-end input switching. For the single-end input, if the device is used at the active Low, the OUTENREF pin and the OUTEN pin should be shorted externally; if it is used at the active High, the OUTENREF pin and the xOUTEN pin should be shorted externally. Leave the OUTENREF pin open for the differential input. (3) Modulator Circuit The modulator ON/OFF is controlled by the OSCEN pin. For the DVD side, the modulator frequency is varied by the external resistor connected to the RFREQ1 pin and the modulator amplitude can be varied by the external resistor value connected to the RAMP1 pin. For the CD side, the modulator frequency is varied by the external resistor connected to the RFREQ2 pin and the modulator amplitude can be varied by the external resistor value connected to the RAMP2 pin. (4) RFREQ COMP Pin The current depending on the internal resistor is generated using the RFREQ COMP pin external resistor to suppress the dispersion of the modulator frequency depending on the internal resistor. The RFREQ COMP pin external resistor is recommended to be fixed to 22kΩ. (5) Modulator Level Adjustment The modulator level adjustment can be performed by varying the IIN1 input current value.
Modulator OFF
Imod – Modulator amplitude [Ap-p]
Modulator amplitude
Modulator level adjustment
Iread – Output drive current [A]
Imod
Modulator level [Ap-p]
Iread
0
IIN1 – Input current [A]
RAMP resistance value [Ω] RAMP pin voltage (1.26V) RAMP external resistance value
IIN1 input current [A] 1/2Imod
Iread = IIN1 × 104
Imod ≈
× 200
Iread < 1/2Imod
Iread < 1/2Imod
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CXA2640ER
Description of Functions 1. Logic table Output control LDEN1 L H H H H L L L L H LDEN2 L L L L L H H H H H xOUTEN2 xOUTEN3 X H L H L H L H L X X H H L L H H L L X OSCEN X L L L L L L L L X LDOUT1 (DVD) OFF 100 × IIN1 OFF OFF LDOUT2 (CD)
100 × IIN1 + 400 × IIN2 OFF 100 × IIN1 + 400 × IIN3 OFF 100 × IIN1 + 400 × IIN2 OFF + 400 × IIN3 OFF OFF OFF OFF OFF (inhibit) 100 × IIN1 100 × IIN1 + 840 × IIN2 100 × IIN1 + 840 × IIN3 100 × IIN1 + 840 × IIN2 + 800 × IIN3 OFF (inhibit)
Module control LDEN1 L H H L L H LDEN2 L L L H H H xOUTEN2 xOUTEN3 X X X X X X X X X X X X OSCEN X L H L H X OFF MODOFF MODON (Rfreq1, Ramp1) OFF OFF OFF (inhibit) LDOUT1 OFF OFF OFF MODOFF MODON (Rfreq2, Ramp2) OFF (inhibit) LDOUT2
Note: Module control does not depend on a data timing signals.
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CXA2640ER
2. Timing Chart
(DVD side)
LDOUT1
LDEN1 LDEN2 OSCEN OUTEN2 xOUTEN2 OUTEN3 xOUTEN3
(CD side)
LDOUT2
LDEN1 LDEN2 OSCEN OUTEN2 xOUTEN2 OUTEN3 xOUTEN3
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CXA2640ER
Notes on Operation • Arrange the external resistors connected to the IIN1, IIN2 and IIN3 pins near the IC package to reduce the affects from other signal lines. • Wiring between the output LDOUT pin and the laser diode, and wiring between the Vcc_LD pin and external decoupling capacitors should be the shortest. Making the distance for wiring long increases output waveform overshoots and undershoots caused by the affect of wiring inductance. • The Vcc_LD pin's external decoupling capacity ground can be grounded to the GND grounding the load from the LDOUT pin. This reverses the phase of the drive waveform at the LDOUT and Vcc_LD and moves in the direction that suppresses overshoots and undershoots. • Temperature guarantee Thermal resistance (θj-a) when the CXA2640ER is mounted on PWB varies according to the set (PWB) and because it is difficult to predict along with the tendency for higher power for power consumption (Po), the following points should be considered when using. Use in a range that does not exceed a junction temperature of 150°C. Also, power consumption (PO) should be below allowable power dissipation (PD). Use with the thermal resistance (θj-a) of the PWB mounting lowered so that it can be operated normally at a maximum operating temperature of 75°C. To lower θj-a, radiating measures on the set, such as widening the GND region with the set PWB are needed. Also, the diepad on the CXA2640ER 24-pin VQFN package is exposed on the backside, so thermal transmission from the IC backside to the PWB is excellent. For that reason, it is possible to release heat from the PBC to the set chassis thereby lowering the thermal resistance of the PWB mount. Find the thermal resistance (θj-a) when mounted on PWB and power consumption (PO) using the following method. Po = (Icc × Vcc) – (Iop × Vop) Icc: IC current consumption when operating (Including Iop) Iop: Output drive current flowed from the LDOUT pin to the Laser Diode Vop: Operating voltage of the laser diode It is also possible for Po when a modulator is ON (Imod = 40mAp-p), although the precision will decrease. On the DVD side: Po = (50mA + IIN1 × 2.6 + (IIN2 + IIN3) × 10) × VCC + (Iop × (Vcc – Vop)) On the CD side: Po = (50mA + IIN1 × 2.6 + (IIN2 + IIN3) × 21) × VCC + (Iop × (Vcc – Vop))
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CXA2640ER
Thermal resistance (θ j-a) when mounted on PWB • The thermal resistance (θc-a) is obtained by measuring the Package surface temperature using a thermo couple or a radiation thermometer. In order to improve the precision of measurement, it is desired to calculate by the following formula. ∆Package surface temperature when Iop is variable/∆Po Assume the thermal resistance (θj-c) to be approximately 2°C/W. • Diode thermal coefficient –2.27mV/°C and the positive protection diode thermal characteristics are used to find this. The V2 voltage found in (2) below cancels the voltage decrease caused by the wiring resistance between the positive protection diode connection Vcc and the Vcc pins as reference and is measured to find the precise temperature characteristics of the positive protection diode. (1) V1 to OSCEN pin voltage to Vcc pin voltage, Icc1 to current consumption when 0V is applied to the IIN1, IIN2 and IIN3 pins. (2) V2 to OSCEN pin voltage to Vcc pin voltage immediately after applying the arbitrary voltage to the IINx pin. (3) V3 to OSCEN pin voltage to Vcc pin voltage, Icc3 to consumption current when applying the arbitrary voltage to the IINx pin and heat reaches equilibrium. ∆Tj using the voltage drop (V1 to V2) between the positive protection diode connection Vcc and the Vcc pins that are the reference, as described above are: ∆Tj = ((V3 + (V1 – V2)) – V1)/–2.27mV/°C Thermal resistance (θj-a) is: θj-a = ∆Tj/((Icc3 – Icc1) × Vcc – Iop × Vop) • Allowable power dissipation (PD) ≥ PO [W] PD = (150°C – Ambient temperature)/θj-a • Maximum operating temperature (150°C – ∆Tj) ≥ 75°C
VCC 23 OSCEN VCC Pin voltage measurement point 1MΩ 10V 5V 11 5V GND 5V
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CXA2640ER
Example of Representative Characteristics
IIN1 input current vs. CD/DVD output current characteristics
Vcc = 5V, resistance load 120 400 350
IIN2/3 input current vs. CD/DVD output current characteristics
Vcc = 5V, resistance load
100
CD/DVD output current [mA]
CD/DVD output current [mA]
300 250 200 150 100 50
80
CD DVD
60
CD
DVD
40
20
0 0 200 400 600 800 1000 1200 IIN1 input current [µA]
0 0 100 200 300 400 500 600 700 800 IIN2/3 input current [µA]
Modulator frequency control characteristics
RAMP = 3.3kΩ (approximately 40mAp-p) RFREQ_COMP = 22kΩ, IIN1 = 642µA 800
RAMP resistance value vs. modulator waveform peak current characteristics
RFREQ = 12kΩ (approximately 390MHz) RFREQ_COMP = 22kΩ, IIN1 = 642µA 80
Modulator peak to peak current [mAp-p]
20 25
700
70 60 50 40 30 20 10 0
Modulator frequency [MHz]
600 500 400 300 200 100 0 0 5 10 15 RFREQ resistance [kΩ]
0
2
4
6
8
10
12
RAMP resistance value [kΩ]
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CXA2640ER
Application circuit 1
Timing Control Logic LVDS/LVPECL 100 0.1µ 0.1µ 100
OUTENREF
xOUTEN3
xOUTEN2
OUTEN3
6 7 IIN1
5
4
3
2
1 24
OUTEN2
VBG
GND1
Voltage DAC
IIN2
8
23
OSCEN
IIN3
9
22
LDEN2
10 Vcc1 1µ 11 1µ Vcc2 12 13 14 15 16 17 18
21
LDEN1
20
GND2
19 LDOUT1 LD1
LDOUT2 LD2
R FREQ COMP
R FREQ1
R FREQ2
RAMP1
Vcc_LD
1µ 10k 10k 6.2k 6.2k
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
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RAMP2
Mode Control Logic CMOS 3.3/TTL
CXA2640ER
Application circuit 2
Timing Control Logic CMOS 3.3/TTL 0.1µ 0.1µ
OUTENREF
xOUTEN3
xOUTEN2
OUTEN3
6 7 IIN1
Voltage DAC
5
4
3
2
1 24
OUTEN2
VBG
GND1
Mode Control Logic CMOS 3.3/TTL
IIN2
8
23
OSCEN
IIN3
9
22
LDEN2
10 Vcc1 1µ 11 1µ Vcc2 12 13
R FREQ1
21
LDEN1
20
GND2
19 LDOUT1 14
R FREQ2
LDOUT2 LD2
15
R FREQ COMP
16
Vcc_LD
17
RAMP1
18
RAMP2
LD1
1µ 10k 10k 6.2k 6.2k
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
– 16 –
CXA2640ER
Package Outline
Unit: mm
24PIN VQFN(PLASTIC)
4.0 3.6 C 13 0.7 0.9 ± 0.1 2.0 0.6 ± 0.1 0.05 S
18 19
A
12
B
4R 0. 3 9) .3 (0
45 ˚
PIN 1 INDEX 24 7 1 6 0.4 x4 0.1 S A-B C x4 0.1 S A-B C 0.05 M S A-B C
S
C
0. 6
0.03 ± 0.03(∗1) (Stand Off)
Solder Plating 0.13 ± 0.025 + 0.09 0.14 – 0.03 TERMINAL SECTION
NOTE: 1) The dimensions of the terminal section apply to the ranges of 0.1mm and 0.25mm from the end of a terminal. 2) The dimension of ( ∗1) is apply to DiePad and the lead.
PACKAGE STRUCTURE
PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE VQFN-24P-04 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.04g
LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm
0.2 ± 0.01
0.225 ± 0.03
(0 .1 5)
1.0
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Sony Corporation