CXG1013N

CXG1013N 1.7 to 2.0 GHz Low Noise Amplifier/Down Conversion Mixer Description The CXG1013N is a low noise amplifier/down conversion mixer MMIC,designed using the Sony's GaAs J-FET process. Features • Low noise NF=1.8 dB (Typ.) at 1.9 GHz (low noise amplifier) • Low distortion Input IP3=–0.5 dBm (Typ.) at 1.9 GHz (mixer) • Low LO input power operation –12 dBm • Single 3.0V power supply operation • 16-pin SSOP package Applications • Japan digital cordless phone(PHS) • DECT • PCN • PCS Structure GaAs J-FET MMIC SSOP-16P-L01 (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Supply voltage VDD 6 • Operating temperature Topr –35 to +85 • Storage temperature Tstg –65 to +150 • Power dissipation PD 150 • Current consumption IDD(low noise amplifier) 20 IDD(LO amplifier) 10 IDD(mixer,IF amplifier) 20 • Input power PIN +5 Operating Condition • Suppy voltage V °C °C mW mA mA mA dBm 3.0 V Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E96623-TE CXG1013N Electrical Characteristics VDD=3.0 V, fRF=1.9 GHz, fLO=1.66 GHz, PLO=–12 dBm, when 50 kΩ I/O matching; unless otherwise specified (Ta=25 °C) Item Current consumption Power gain Low noise Noise figure amplifier Input IP3 Isolation Current consumption Conversion gain Mixer Noise figure Input IP3 LO to RF leak level Total Current consumption Symbol IDD GP NF IIP3 ISO IDD GC NF IIP3 PLK IDD Min. — 12.5 — –8 25 — 7 — –3 — — Typ. 2.5 14.5 1.8 –5 30 5.5 9 7.2 –0.5 –19 8.0 Max. 3.5 16.5 2.6 — — 8.0 11 9.2 — –14 10.0 Unit mA dB dB dBm dB mA dB dB dBm dBm mA Measurement condition When no signal When no signal When no signal Block Diagram LNA LNA RFIN MIX LOIN LO AMP IF AMP IFOUT MIX RFIN LNA RFOUT Pin Configuration 1 LNA RFIN NC CAP GND GND LOIN CAP VDD (LO AMP) 16pin SSOP (PLASTIC) 16 LNA RFOUT/VDD (LNA) NC NC GND GND MIX RFIN CAP IF OUT/VDD (MIX, IF AMP) —2— CXG1013N Recommended Circuit L1 LNA RFIN L2 C1 L3 C2 LNA RFOUT R1 L4 VDD (LNA) C13 C12 C11 1 2 3 4 5 L7 C3 16 15 14 C5 C6 13 12 L5 LOIN L8 C14 6 7 8 L9 11 C15 10 R2 L6 MIX RFIN 9 IFOUT C4 C7 L10 C9 C10 VDD (MIX, IF AMP) VDD (LO AMP) C8 L1 L2 L3 L4 L5 L6 L7 L8 L9 8.2 nH 10 nH 2.2 nH 2.2 nH 8.2 nH 22 nH 6.8 nH 3.3 nH 10 nH L10 C1 C2 C3 C4 C5 C6 C7 C8 68 nH 100 pF 100 pF 100 pF 7 pF 1000 pF 10 nF 1000 pF 10 nF C9 C10 C11 C12 C13 C14 C15 R1 R2 1000 pF 10 nF 100 pF 1000 pF 10 nF 1000 pF 0.1 µF 1 kΩ 620 Ω —3— CXG1013N Recommended Evaluation Board Front 50mm LNA RF IN L1 C13 C12 C11 L8 L7C3 L9 C6 L4 C5 L2 C1 C2 LNA RF OUT L3 R1 L5 L6 MIX RF IN C9 C7C10 C4 C8 L10 LO IN IF OUT GND VDD (LNA) VDD (LO AMP) VDD (MIX, IF AMP) Back R2 C15 C14 GND VDD (MIX, IF AMP) VDD (LO AMP) VDD (LNA) Glass fabric-base epoxy 4-layer board(2 × 0.3mm thickness) GND for the 2nd and 3rd layers. —4— CXG1013N Example of Representative Characteristics (Ta=25 °C) LNA block POUT,IM3 10 VS. PIN 10 MIX block POUT,IM3 VS. PIN POUT-RF output Power (dBm) POUT-IF output Power (dBm) POUT -10 POUT -10 -30 IM3 -50 VDD=3.0V fRF1=1.9GHz fRF2=1.9006GHz -30 IM3 -50 VDD=3.0V fRF1=1.9GHz fRF2=1.9006GHz fLO=1.66GHz PLO=-12dBm -70 -70 -90 -40 -30 -20 -10 0 -90 -35 -25 -15 -5 5 PIN-RF input power (dBm) PIN-RF input power (dBm) MIX block GC,NF 10 VS. PLO 15 4 MIX block IIP3,PLK VS. PLO -5 -10 GC-Conversion gain(dB) NF-Noise figure (dB) IIP3-Input IP3 (dBm) Gc 8 6 4 2 0 -25 13 11 9 7 5 2 IIP3 VDD=3.0V fRF=1.9GHz fLO=1.66GHz 0 -2 PLK -15 -20 VDD=3.0V fRF=1.9GHz fLO=1.66GHz NF -4 -6 -25 -25 -30 -20 -15 -10 -5 0 5 -20 -15 -10 -5 0 5 PLO-LO input power (dBm) PLO-LO input power (dBm) —5— PLK -LO to RF leak level (dBm) CXG1013N Package Outline Unit : mm 16PIN SSOP (PLASTIC) ∗5.0 ± 0.1 + 0.2 1.25 – 0.1 0.1 16 9 A ∗4.4 ± 0.1 1 + 0.1 0.22 – 0.05 8 0.65 ± 0.12 + 0.05 0.15 – 0.02 0.1 ± 0.1 0° to 10° DETAIL A NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SSOP-16P-L01 SSOP016-P-0044 LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER / PALLADIUM PLATING COPPER / 42 ALLOY 0.1g —6— 0.5 ± 0.2 6.4 ± 0.2