CXG1017N

CXG1028ATN GSM900/1800/1900 SPDT TX/RX Switch Description The CXG1028ATN is a high power SPDT switch suitable for Digital Cellular applications. This device is part of a growing family of MMIC Antenna switches for digital cellular and cordless radios. It uses the state-of-the-art Sony GaAs JFET process. Features • Positive voltage supply only • Low insertion loss, typically 0.3dB at 34.5dBm, 900MHz • Low Harmonics: –64.5dBc Max. at 34.5dBm (Vctl = 5V, 25°C) • Stable Characteristics over wide temperature range • Fast switching-100ns Typical • Low current consumption, 190µA typical at 5V • 10 pin TSSOP package (3.2 × 2.8mm) Applications • GSM900 handportable applications • GSM1800 handportable • GSM1900 handportable • GSM900/1800/1900 Base station • Other digital cellular and wireless local loop applications Typical Application Internal Antenna 10 pin TSSOP (Plastic) ESD As with other GaAs semiconductors, ESD precautions must be adhered to. PA TX IN CXG1028ATN RX OUT LNA Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E98527-PS CXG1028ATN Electrical Characteristics Measurement Conditions, unless otherwise stated:Ta = 25°C. Parameter Insertion loss Symbol IL CW Min. Typ. 0.3 0.5 20 22 17 1.2 ∗1 Output Harmonics 2fo,3fo ∗2 ∗1 Input Power for 0.2dB Compression P0.2dB ∗2 ∗1 Input Power for 1dB Compression Switching Speed TSW Control Current P1dB TSW ICTL ∗2 36 35 –35 36 35 38 37 100 190 350 –30 dBm dBm dBm dBm dBm dBm ns µA Max. 0.6 0.8 Unit dB dB dB dB ∗1, ∗3 ∗2, ∗4 ∗1, ∗3 Isolation VSWR ISO VSWR ∗2, ∗4 Condition ∗1 Pin = 34.5dBm, 880 to 915MHz, 0/5V Control ∗2 Pin = 32dBm, 1710 to 1785MHz, 0/5V Control ∗3 Pin = 10dBm, 925 to 960MHz, 0/3V Control ∗4 Pin = 10dBm, 1805 to 1880MHz, 0/3V Control Control Voltage Selection, Vctl (H) The choice of control voltage will determine the compression characteristic of the switch and the generation of harmonics. The table above indicates P0.2dB, P1dB. The graphs below indicate the sensitivity of harmonic levels: 2nd Harmonic with Power/Control Volts –40 Vctl = 0/3V Vctl = 0/3.5V –50 –20 3rd Harmonic with Power/Control Volts Vctl = 0/3V –30 –40 –50 –60 –70 –80 Vctl = 0/3.5V Vctl = 0/4V Vctl = 0/4.5V Vctl = 0/5V Harmonic level [dBc] Vctl = 0/4.5V –60 Vctl = 0/5V –70 Harmonic level [dBc] Vctl = 0/4V –80 32 33 34 Input power [dBm] 35 36 –90 32 33 34 Input power [dBm] 35 36 –2– CXG1028ATN Compression Characteristics Measurement Conditions: Vctl (L) = 0V, Ta = 25°C Insertion loss, isolation vs. Input power 0 Insertion loss –2 0 VCTL (H) = 5V VCTL (H) = 4V VCTL (H) = 3V 5 –4 Insertion loss (dB) –6 10 Isolation VCTL (H) = 3V VCTL (H) = 4V VCTL (H) = 5V 15 20 24 28 32 36 40 Input power (dBm) Frequency Characteristics Measurement Conditions: Vctl (L) = 0V, Vctl (H) = 5V, Pin = 0dBm CW, Ta = 25°C Insertion loss, isolation vs. Frequency 0 Insertion loss –1 –10 0 Insertion loss (dB) –2 Isolation –3 –20 –30 –4 –40 –5 0 1 2 3 Frequency (GHz) –50 –3– Isolation (dB) Isolation (dB) CXG1028ATN Schematic/Pinout Pin No. 1 CTLB GND Port1 GND CTLA 10pin TSSOP (PLASTIC) 10 Port3 GND GND GND Port2 FUNCTION CONTROL B GROUND RF PORT1 GROUND CONTROL A RF PORT2 GROUND GROUND GROUND RF PORT3 1 2 3 4 5 6 7 8 9 Block Diagram/Truth Table 10 VCTLA Port3 Port1 Port2 VCTLB Low High Port1-Port2 ON Port1-Port3 OFF Port1-Port2 OFF Port1-Port3 ON High Low External Circuitry CTLB Rctl 1kΩ C2 100pF Port3 1 C1 100pF 10 Rrf 100kΩ 2 Port1 9 3 C2 100pF CXG1028ATN 8 4 Rctl CTLA 1kΩ 7 C2 Port2 100pF 5 C1 100pF 6 Rrf 100kΩ When using the CXG1028ATN, the following external components should be used: C1: This is used for signal line filtering 100pF is recommended. C2: This is used for RF De-coupling and must be used in all applications. 100pF is recommended. Rrf: This resistor is used to stabilize the dc operating point at high power levels. A value of 100kΩ is recommended. Rctl: This resistor is used to reduce the current consumption or to give improved ESD performance. –4– CXG1028ATN ESD Precautions As this is a GaAs MMIC, ESD precautions must be adhered to, as outlined in sony's standard Data Book. Please contact Sony if detailed ESD performance data is required. Absolute Maximum Ratings (Ta = 25°C) • Control voltage Vctl 6 V • Control Current Ictl 2 mA • Operating temperature Topr –35 to +85 °C • Storage temperature Tstg –65 to +150 °C • Input Power Pin 38 dBm Tape and Reel Information This device is available in Tape and Reel. Order CXG1028ATN-T2 Reel Quantity: 1000 pieces/reel Reel Dimensions: 254mm Plastic reel. 12mm width embossed taping. –5– CXG1028ATN Sony GSM Lineup MCU Flash SRAM 64K × 16 SGM2016AM-21-T7 LNA 90MHz I SAW RX Q AD Speech Codec DSP PLL2 IT362/IT402 IT363/IT403 IT413 PLL1 CXA3021R TX I Q DA CXG1037FN GSM1800/1900 RX SPDT Antenna Switches CXG1028ATN GSM 900/1800/1900 CXG1006N GSM 1800/1900 HP ANT CAR ANT TX CXG1017N GSM 900/1800/1900 CXG1045N GSM 900/1800/1900 Sony IC –6– CXG1028ATN Package Outline Unit: mm 10PIN TSSOP(PLASTIC) 1.2MAX ∗2.8 ± 0.1 10 6 0.1 ∗2.2 ± 0.1 + 0.15 0.1 – 0.05 3.2 ± 0.2 1 5 0.5 0.25 0° to 10° + 0.08 0.22 – 0.07 0.1 M (0.2) + 0.08 0.22 – 0.07 DETAIL A NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-10P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g –7– (0.1) + 0.025 0.12 – 0.015 A 0.45 ± 0.15