CXG1022

CXG1022TM High-Frequency SPDT Antenna Switch Description The CXG1022TM is an antenna switch MMIC. This IC is designed using the Sony’s GaAs J-FET process and operates at a single positive power supply with an ultra-small package. Features • Single positive power supply operation • Insertion loss 0.4 dB (Typ.) at 2.0 GHz • Medium power switching P1dB (Typ.) 29 dBm at 2.0 GHz VCTL (H)=3.0 V 33 dBm at 2.0 GHZ VCTL (H)=4.0 V • Ultra-small TSSOP package Applications Antenna switch for digital cordless telephones Structure GaAs J-FET MMIC 10 pin TSSOP (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Control voltage Vctl 6 • Operating temperature Topr –35 to +85 • Storage temperature Tstg –65 to +150 Operating Condition Control voltage V °C °C 0/3 V Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E96547A71-TE CXG1022TM Electrical Characteristics VCTL (L) =0 V, VCTL (H) =3 V, PIN=21.5 dBm Item Insertion loss Isolation Insertion loss Isolation Input VSWR Output VSWR Switching time Control pin current Symbol IL1 ISO1 IL2 ISO2 VSWRIN VSWROUT TSW ICTL Condition f=1.0 GHz f=2.0 GHz 23 Min. 28 Typ. 0.3 31 0.4 26 1.3 1.3 50 50 Max. 0.6 0.8 1.5 1.5 100 (Ta=25 °C) Unit dB dB dB dB ns µA VCTL (L) =0 V, f =2.0 GHz, RRF=200 kΩ 1 dB gain compression point output 1 dB gain compression point output P1dB (3) P1dB (4) VCTL (H) =3 V VCTL (H) =4 V 26 30 29 33 (Ta=25 °C) dBm dBm Block Diagram Pin Configuration 1 CTLB Port3 GND Port1 Port2 GND CTLA 10pin TSSOP (PLASTIC) 10 Port3 GND GND GND Port2 Port1 VCTLA High Low VCTLB Low High Port1-Port2 ON Port1-Port3 OFF Port1-Port2 OFF Port1-Port3 ON —2— CXG1022TM Recommended Circuit CTLB 100pF Port3 1 10 RRF 100pF 2 Port1 9 3 100pF CXG1022TM 8 4 CTLA 100pF 7 Port2 5 6 RRF 100pF ∗ RRF (200kΩ) is used to stabilized the electrical characteristics at high power signal input Example of Representative Characteristics (Ta=25 °C) Insertion loss, isolation vs. Input power 0 Insertion loss –2 VCTL (H)=5V VCTL (H)=4V VCTL (H)=3V 10 0 –4 Insertion loss (dB) –6 VCTL (H)=3V VCTL (H)=4V VCTL (H)=5V Isolation 20 30 20 24 28 32 36 40 Input power (dBm) Insertion loss, isolation vs. Frequency 0 Insertion loss –1 –10 0 Insertion loss (dB) –2 –20 –3 Isolation –30 –4 –40 –5 0 1 2 3 Frequency (GHz) –50 —3— Isolation (dB) Isolation (dB) CXG1022TM Package Outline Unit : mm 10PIN TSSOP(PLASTIC) 1.2MAX ∗2.8 ± 0.1 10 6 0.1 ∗2.2 ± 0.1 + 0.15 0.1 – 0.05 3.2 ± 0.2 1 5 0.5 0.25 0° to 10° 0.22 0.1 M (0.2) + 0.08 0.22 – 0.07 DETAIL A NOTE: “∗” Dimensions do not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-10P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g —4— (0.1) + 0.025 0.12 – 0.015 A 0.45 ± 0.15