CXG1024N

CXG1024N High-Frequency SPDT Antenna Switch For the availability of this product, please contact the sales office. Description The CXG1024N is a high power antenna switch MMIC to connect TX/RX to one of 4 antennas. This IC is designed using the Sony’s GaAs J-FET process and operates at a single positive power supply. Features • Single positive power supply operation • Low insertion loss 0.4 dB (Typ.) at 1.0 GHz (TX Port) • Isolation 21 dB (Typ.) at 1.0 GHz (TX Port) • High power switching P1 dB (Typ.) 32 dBm at 1.5 GHz VCTL (H)=3.0 V 35 dBm at 1.5 GHz VCTL (H)=4.0 V 16 pin SSOP (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Supply voltage VDD 8 V • Control voltage Vctl (H)–Vctl (L) 8 V • Operating temperature Topr –35 to +85 °C • Storage temperature Tstg –65 to +150 °C • Input Power Pin (RF2, RF3, RF4) 37 dBm Pin (RF1, RF5, RF6) 30 dBm Applications Antenna switch for digital cellular telephones Structure GaAs J-FET MMIC Function Block Diagram Diversity Antenna 1 Diversity Antenna 2 Antenna 2 RX Antenna 1 TX Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E96526-TE CXG1024N Pin Configuration and Recommended Circuit 100pF 1 RF1 CTLC CTLC CTLD 16 RF6 CTLD 100pF 100pF VDD 100pF RF2 100pF GND CTLB 100pF RF3 100pF 100kΩ GND 8 CTLB GND 9 RF4 CTLA CTLA CTLB GND CTLA RF5 100kΩ GND 100pF 100PF 100pF 100pF Logic Table ON-Port RF3–RF2 RF3–RF4 RF5–RF2 RF5–RF4 RF5–RF6 RF5–RF1 CTLA H L L H L L CTLB L H H L L L CTLC H or L H or L L L L H CTLD H or L H or L L L H L Recommended Operating Conditions Item Control Voltage (high) Control Voltage (low) Difference of Control Voltage Supply voltage Symbol Vctl (H) Vctl (L) Vctl (H)–Vctl (L) VDD Min. –6 Vctl (H)–0.6 Vctl (H)–0.5 6 Vctl (H)–0.4 Typ. Max. 6 —2— CXG1024N Electrical Characteristics Symbol Signal Passes RF3–RF2 RF3–RF4 Test Condition ∗2 Pin=30 dBm ∗2 Pin=20 dBm ∗2 Pin=20 dBm ∗2 Pin=20 dBm ∗2 Pin=30 dBm ∗2 Pin=20 dBm ∗2 Pin=30 dBm ∗2 Pin=20 dBm ∗3 ∗2 ∗1 ∗3 ∗2 ∗1 Frequency 1 GHz 1.5 GHz 2 GHz 1 GHz 1.5 GHz 2 GHz 1 GHz 1.5 GHz 2 GHz 1 GHz 1.5 GHz 2 GHz 1 GHz 1.5 GHz 2 GHz 1 GHz 1.5 GHz 2 GHz 0.1 to 2 GHz 18 15 12 21 17 15 Min. Typ. 0.4 0.5 0.7 0.5 0.65 0.9 0.6 0.75 1.2 0.4 0.5 0.7 21 18 15 24 20 18 1.3 1.5 (Ta=25 °C) Max. 0.65 0.8 1.0 0.8 0.95 1.2 0.9 1.05 1.5 0.7 0.8 1.0 Unit RF5–RF2 Insertion Loss IL. RF5–RF4 dB RF5–RF1 RF5–RF6 RF3–RF2 RF3–RF4 RF5–RF2 RF5–RF4 RF5–RF1 RF5–RF6 RF3–RF2 RF3–RF4 RF5–RF2 RF5–RF4 RF5–RF1 RF5–RF6 RF3–RF2 RF3–RF4 P1 dB RF5–RF2 RF5–RF4 RF5–RF1 RF5–RF6 Isolation ISO. dB VSWR VS. 0.1 to 2 GHz 1.3 1.5 1 dB Compression Power Switching Time Control Current Supply Current tSW Ictl IDD ∗2 ∗2 1.5 GHz 1.5 GHz 1.5 GHz 1.5 GHz 1.5 GHz 1.5 GHz 0.1 to 2 GHz 30 33 35 22 25 27 32 35 37 24 27 29 200 100 100 dBm nsec µA µA ∗1 : Vctl (H)=5 V, Vctl (L)=0 V, VDD=4.5 V ∗2 : Vctl (H)=4 V, Vctl (L)=0 V, VDD=3.5 V ∗3 : Vctl (H)=3 V, Vctl (L)=0 V, VDD=2.5 V —3— CXG1024N Insertion Loss and Isolation vs. Frequency (RF3–RF2, RF3–RF4) 0 0 Insertion Loss 0.4 –10 Insertion Loss [dB] 0.8 Isolation –20 1.2 –30 1.6 –40 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 Frequency [GHz] Insertion Loss and Isolation vs. Frequency (RF5–RF2, RF5–RF4) 0 0 0.4 Insertion Loss –10 Insertion Loss [dB] 0.8 –20 Isolation 1.2 –30 1.6 –40 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 Frequency [GHz] —4— Isolation [dB] Isolation [dB] CXG1024N Insertion Loss and Isolation vs. Frequency (RF5–RF1, RF5–RF6) 0 0 Insertion Loss 0.4 –10 Insertion Loss [dB] 0.8 Isolation –20 1.2 –30 1.6 –40 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 Frequency [GHz] —5— Isolation [dB] CXG1024N Package Outline Unit : mm 16PIN SSOP (PLASTIC) ∗5.0 ± 0.1 + 0.2 1.25 – 0.1 0.1 16 9 A ∗4.4 ± 0.1 1 + 0.1 0.22 – 0.05 8 0.65 ± 0.12 + 0.05 0.15 – 0.02 0.1 ± 0.1 0° to 10° DETAIL A NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SSOP-16P-L01 SSOP016-P-0044 LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER / PALLADIUM PLATING COPPER / 42 ALLOY 0.1g —6— 0.5 ± 0.2 6.4 ± 0.2