CXG1063TN

CXG1063TN High Power 2 × 4 Antenna Switch MMIC Description The CXG1063TN is a high power antenna switch MMIC. The CXG1063TN is suited to connect Tx/Rx to one of 4 antennas in cellular handset such as PDC. This IC is designed using the Sony's GaAs J-FET process which enable the CXG1063TN to be operated with low voltage. Features • Low Control voltage • Low Insertion Loss: 16 pin TSSOP (Plastic) 0.4dB (Typ.) @900MHz, 0.5dB (Typ.) @1.5GHz • Small Package: TSSOP-16pin • High Power Handling: PldB: 36dBm @VDD = Vctl (H) = 4V Application 2 × 4 antenna switch for digital cellular telephones such as PDC handsets. Structure GaAs J-FET MMIC Absolute Maximum Ratings (Ta = 25°C) • Control voltage Vctl 7 • Operating temperature Topr –35 to +85 • Storage temperature Tstg –65 to +150 Operating Condition (Ta = 25°C) Control voltage Vctl (H) – Vctl (L) = 2.5 to 6V V °C °C Pin Configuration Block Diagram RF1 RF1 9 CTLC RF2 11 CTLB CTLA RF3 13 CTLB CTLA 4 RF4 CTLD 6 RF5 8 RF6 9 8 7 6 5 4 3 2 1 RF6 GND RF5 GND RF4 VDD CTLB CTLD GND 10 RF2 11 GND 12 RF3 13 GND 14 CTLA 15 CTLC 16 • GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E98747-PS CXG1063TN Recommended Circuit RF1 100pF 9 8 100pF RF6 10 7 GND RF5 100pF RF2 100pF 11 6 12 5 GND RF4 100pF VDD 100pF RF3 100pF GND CTLA 13 220kΩ 14 4 3 1kΩ 1kΩ 15 100pF 16 100pF 2 100pF 1 100pF 1kΩ 1kΩ CTLB CTLC CTLD –2– CXG1063TN Electrical Characteristics Item RF3-RF2 RF3-RF4 Insertion loss RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 RF3-RF2 RF3-RF4 Isolation RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 VSWR ACP (±50kHz) ACP (±100kHz) 2nd, 3rd harmonics RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 Frequency 889MHz to 960MHz 810MHz to 885MHz 889MHz to 960MHz 810MHz to 885MHz 810MHz to 960MHz 889MHz to 960MHz 889MHz to 960MHz 889MHz to 960MHz Pin = 30dBm ∗1, ∗2, ∗4 Pin = 30dBm ∗1, ∗2, ∗4 Pin = 30dBm ∗1, ∗2, ∗4 ∗1 Control current Ictl (H) ∗2 ∗3 ∗1 Bias current IDD ∗2 ∗3 Switching speed ∗1 ∗2 ∗3 ∗4 Vctl (L) = 0V, Vctl (H) = 4V, VDD = 4V Vctl (L) = –2.5V, Vctl (H) = 3V, VDD = 3V Vctl (L) = 0V, Vctl (H) = 3V, VDD = 3V Input signal: ACP (±50kHz) < –65dBc, ACP (±100kHz) < –75dBc, 2nd harmonics < –65dBc, 3rd harmonics < –65dBc –65 –70 –65 20 15 15 40 25 25 200 Condition Pin = 30dBm ∗1, ∗2 Pin = 10dBm ∗3 Pin = 10dBm ∗3 Pin = 30dBm ∗1, ∗2 Pin = 10dBm ∗3 Pin = 10dBm ∗3 18 18 21 Min. Typ. 0.40 0.55 0.50 21 21 25 (Ta = 25°C) Max. 0.65 0.80 0.75 Unit dB dB dB dB dB dB 1.3 –60 –65 –60 60 50 50 90 70 70 dBc dBc dBc µA µA µA µA µA µA ns –3– CXG1063TN Electrical Characteristics Item RF3-RF2 RF3-RF4 Insertion loss RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 RF3-RF2 RF3-RF4 Isolation RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 VSWR ACP (±50kHz) ACP (±100kHz) 2nd, 3rd harmonics RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 Frequency 1429MHz to 1453MHz 1477MHz to 1501MHz 1429MHz to 1453MHz 1477MHz to 1501MHz 1429MHz to 1501MHz 1429MHz to 1453MHz 1429MHz to 1453MHz 1429MHz to 1453MHz Pin = 30dBm ∗1, ∗2, ∗4 Pin = 30dBm ∗1, ∗2, ∗4 Pin = 30dBm ∗1, ∗2, ∗4 ∗1 Control current Ictl (H) ∗2 ∗3 ∗1 Bias current IDD ∗2 ∗3 Switching speed ∗1 ∗2 ∗3 ∗4 Vctl (L) = 0V, Vctl (H) = 4V, VDD = 4V Vctl (L) = –2.5V, Vctl (H) = 3V, VDD = 3V Vctl (L) = 0V, Vctl (H) = 3V, VDD = 3V Input signal: ACP (±50kHz) < –65dBc, ACP (±100kHz) < –75dBc, 2nd harmonics < –65dBc, 3rd Harmonics < –65dBc –65 –70 –65 20 15 15 40 25 25 200 Condition Pin = 30dBm ∗1, ∗2 Pin = 10dBm ∗3 Pin = 10dBm ∗3 Pin = 30dBm ∗1, ∗2 Pin = 10dBm ∗3 Pin = 10dBm ∗3 15 15 17 Min. Typ. 0.50 0.65 0.60 18 18 21 (Ta = 25°C) Max. 0.75 0.90 0.8 Unit dB dB dB dB dB dB 1.3 –60 –65 –60 60 50 50 90 70 70 dBc dBc dBc µA µA µA µA µA µA ns –4– CXG1063TN Package Outline Unit: mm 16PIN TSSOP(PLASTIC) 1.2MAX 4.1 2.05 A 16 X S B 9 X2 0.2 SAB 0.08 S 0.1 (3.0) 0.1 ± 0.05 0.25 2.9 0.1 X 0.5 0.1 SA B 0° to 8° 0.08 M S A B 0.2 ± 0.02 + 0.036 0.22 – 0.03 DETAIL B PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-16P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.03g –5– 0.1 ± 0.01 + 0.026 0.12 – 0.02 0.45 ± 0.1 1 8 X4 3.9