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CXG1064ATN

CXG1064ATN

  • 厂商:

    SONY(索尼)

  • 封装:

  • 描述:

    CXG1064ATN - High Power 2 ´ 4 Antenna Switch MMIC with Integrated Control Logic - Sony Corporation

  • 数据手册
  • 价格&库存
CXG1064ATN 数据手册
CXG1064ATN High Power 2 × 4 Antenna Switch MMIC with Integrated Control Logic Description The CXG1064ATN is a high power antenna switch MMIC. The CXG1064ATN is suited to connect Tx/Rx to one of 4 antennas in cellular handset such as PDC. The CXG1064ATN has the integrated control logic and can be operated with CMOS input. This IC is designed using the Sony’s GaAs J-FET process which enable the CXG1064ATN to be operated with low voltage. Features • Low insertion loss : 0.35 dB (Typ.) @900 MHz, 0.45 dB (Typ.) @1.5 GHz • Small package : TSSOP-16 pin • High power handling : P1dB : 37 dBm • CMOS compatible input control • Low bias voltage : VDD=3.0 V Applications 2 × 4 antenna switch for digital cellular telephones such as PDC handsets. Structure GaAs J-FET MMIC 16 pin TSSOP (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Bias voltage VDD 7 • Control voltage Vctl 5 • Operating temperature Topr –35 to +85 • Storage temperature Tstg –65 to +150 V V °C °C GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E98Y52-TE CXG1064ATN Block Diagram RF4 (Ant/Ext.1) F2 RF5 (Rx) RF6 (Diversity 1) F7 F5 F1 F4 F3 F6 F8 RF3 (Tx) RF2 (Ant/Ext.2) RF1 (Diversity 2) Package Outline/Pin Configuration RF4 GND RF5 GND RF6 GND VDD CTLA 16 16pin TSSOP (PLASTIC) 1 RF3 GND RF2 GND RF1 GND CTLC CTLB Recommended Circuit L1 100pF 10 GND L1 11 RF5 100pF 12 GND L1 13 RF6 100pF 14 GND GND CXG1064ATN RF1 GND RF2 GND 9 L1 RF4 RF3 8 100pF 7 L1 6 100pF 5 L1 4 100pF 3 15 VDD 100pF 16 CTLA 100pF CTLC 2 100pF 1kΩ 1kΩ CTLB 1 100pF 1kΩ ∗ DC blocking capacitors (CRF) are needed. ∗ Recommended to use bypass capacitors (Cbypass). ∗ Recommended to use control resistors (RCTL), when it is necessary to improve the electrostatic discharge strength (ESD). —2— CXG1064ATN Truth Table CTLA H H L L L L Control CTLB L L L L H H CTLC L H L H L H ON RF3 → RF2 RF3 → RF4 RF5 → RF2 RF5 → RF4 RF5 → RF6 RF5 → RF1 F1 OFF ON ON OFF OFF OFF F2 ON OFF OFF ON OFF OFF F3 OFF ON ON OFF OFF OFF F4 ON OFF OFF ON OFF OFF F5 OFF OFF OFF OFF ON OFF F6 OFF OFF OFF OFF OFF ON F7 ON ON ON ON OFF ON F8 ON ON ON ON ON OFF DC Bias Condition Parameter Vctl (H) A to C Vctl (L) A to C VDD Min. 2.4 0 2.6 Typ. (Ta=25 °C) Max. 3.6 0.8 4.5 Unit. V V V —3— CXG1064ATN Electrical Characteristics 1 Parameter Insertion loss RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 Each ON Port RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 Frequency 889 MHz to 960 MHz 810 MHz to 885 MHz 810 MHz to 885 MHz 889 MHz to 960 MHz 810 MHz to 885 MHz 810 MHz to 885 MHz 810 MHz to 960 MHz 889 MHz to 960 MHz 889 MHz to 960 MHz 889 MHz to 960 MHz 889 MHz to 960 MHz Condition ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 (Vctl (L)=0 V, Vctl (H)=3 V, Ta=25 °C) Min. Typ. 0.35 0.35 0.55 0.55 0.5 0.5 20 22 22 20 34 26 Max. 0.60 0.60 0.80 0.80 0.75 0.75 Unit. dB dB dB dB dB dB dB dB dB dB dB dB Isolation 18 18 18 18 25 22 VSWR ACP (±50 kHz) ACP (±100 kHz) 2nd Harmonics 3rd Harmonics Control current Bias current Switching speed 1.4 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 VDD=3.0 V VDD=2.8 V –70 –70 –75 –75 –70 –70 –70 –70 60 0.6 0.6 1 –60 –55 –70 –65 –60 –60 –60 –55 120 1.1 1.0 5 dBc dBc dBc dBc dBc dBc dBc dBc µA mA mA µs ∗1 Input signal : ACP (±50 kHz) < –65 dBc, ACP (±100 kHz) < –75 dBc 2nd Harmonics < –65 dBc, 3rd Harmonics < –65 dBc ∗2 Pin=29.5 dBm, VDD=3.0 V ∗3 Pin=29.5 dBm, VDD=2.8 V ∗4 Pin=7 dBm, VDD=3.0 ∗5 Pin=7 dBm, VDD=2.8 —4— CXG1064ATN Electrical Characteristics 2 Parameter Insertion loss RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 Each ON Port RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 Frequency 1429 MHz to 1453 MHz 1477 MHz to 1501 MHz 1477 MHz to 1501 MHz 1429 MHz to 1453 MHz 1477 MHz to 1501 MHz 1477 MHz to 1501 MHz 1429 MHz to 1501 MHz 1429 MHz to 1453 MHz 1429 MHz to 1453 MHz 1429 MHz to 1453 MHz 1429 MHz to 1453 MHz Condition ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 (Vctl (L)=0 V, Vctl (H)=3 V, Ta=25 °C) Min. Typ. 0.45 0.45 0.65 0.65 0.60 0.60 16 18 18 16 30 21 Max. 0.70 0.70 0.95 0.95 0.90 0.90 Unit. dB dB dB dB dB dB dB dB dB dB dB dB Isolation 14 16 16 14 25 18 VSWR ACP (±50 kHz) ACP (±100 kHz) 2nd Harmonics 3rd Harmonics Control current Bias current Switching speed 1.4 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 VDD=3.0 V VDD=2.8 V –70 –70 –75 –75 –75 –70 –70 –70 60 0.6 0.6 1 –60 –55 –70 –65 –60 –55 –60 –55 120 1.1 1.0 5 dBc dBc dBc dBc dBc dBc dBc dBc µA mA mA µs ∗1 Input signal : ACP (±50 kHz) < –65 dBc, ACP (±100 kHz) < –75 dBc 2nd Harmonics < –65 dBc, 3rd Harmonics < –65 dBc ∗2 Pin=29.5 dBm, VDD=3.0 V ∗3 Pin=29.5 dBm, VDD=2.8 V ∗4 Pin=7 dBm, VDD=3.0 ∗5 Pin=7 dBm, VDD=2.8 —5— CXG1064ATN Electrical Characteristics 3 Parameter Insertion loss RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 Each ON Port RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 Frequency 889 MHz to 960 MHz 810 MHz to 885 MHz 810 MHz to 885 MHz 889 MHz to 960 MHz 810 MHz to 885 MHz 810 MHz to 885 MHz 810 MHz to 960 MHz 889 MHz to 960 MHz 889 MHz to 960 MHz 889 MHz to 960 MHz 889 MHz to 960 MHz ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 (Vctl (L)=0 V, Vctl (H)=3 V, Ta=–35 °C to +85 °C) Condition Min. Typ. 0.35 0.35 0.55 0.55 0.5 0.5 20 22 22 20 34 26 Max. 0.90 0.90 1.10 1.10 1.05 1.05 Unit. dB dB dB dB dB dB dB dB dB dB dB dB Isolation 18 18 18 18 25 22 VSWR ACP (±50 kHz) ACP (±100 kHz) 2nd Harmonics 3rd Harmonics Control current Bias current Switching speed 1.4 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 VDD=3.0 V VDD=2.8 V –70 –70 –75 –75 –70 –70 –70 –70 60 0.6 0.6 1 –55 –50 –65 –60 –55 –55 –55 –50 150 1.3 1.2 5 dBc dBc dBc dBc dBc dBc dBc dBc µA mA mA µs ∗1 Input signal : ACP (±50 kHz) < –65 dBc, ACP (±100 kHz) < –75 dBc 2nd Harmonics < –65 dBc, 3rd Harmonics < –65 dBc ∗2 Pin=29.5 dBm, VDD=3.0 V ∗3 Pin=29.5 dBm, VDD=2.8 V ∗4 Pin=7 dBm, VDD=3.0 ∗5 Pin=7 dBm, VDD=2.8 —6— CXG1064ATN Electrical Characteristics 4 Parameter Insertion loss RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 Each ON Port RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 Frequency 1429 MHz to 1453 MHz 1477 MHz to 1501 MHz 1477 MHz to 1501 MHz 1429 MHz to 1453 MHz 1477 MHz to 1501 MHz 1477 MHz to 1501 MHz 1429 MHz to 1501 MHz 1429 MHz to 1453 MHz 1429 MHz to 1453 MHz 1429 MHz to 1453 MHz 1429 MHz to 1453 MHz ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 (Vctl (L)=0 V, Vctl (H)=3 V, Ta=–35 °C to +85 °C) Condition Min. Typ. 0.45 0.45 0.65 0.65 0.60 0.60 16 18 18 16 30 21 Max. 1.00 1.00 1.25 1.25 1.2 1.2 Unit. dB dB dB dB dB dB dB dB dB dB dB dB Isolation 14 16 16 14 25 18 VSWR ACP (±50 kHz) ACP (±100 kHz) 2nd Harmonics 3rd Harmonics Control current Bias current Switching speed 1.4 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 VDD=3.0 V VDD=2.8 V –70 –70 –75 –75 –75 –70 –70 –70 60 0.6 0.6 1 –55 –50 –65 –60 –55 –50 –55 –50 150 1.3 1.2 5 dBc dBc dBc dBc dBc dBc dBc dBc µA mA mA µs ∗1 Input signal : ACP (±50 kHz) < –65 dBc, ACP (±100 kHz) < –75 dBc 2nd Harmonics < –65 dBc, 3rd Harmonics < –65 dBc ∗2 Pin=29.5 dBm, VDD=3.0 V ∗3 Pin=29.5 dBm, VDD=2.8 V ∗4 Pin=7 dBm, VDD=3.0 ∗5 Pin=7 dBm, VDD=2.8 —7— CXG1064ATN Package Outline Unit : mm 16PIN TSSOP(PLASTIC) 1.2MAX 4.1 2.05 A 16 X S B 9 X2 0.2 SAB 0.08 S 0.1 (3.0) 0.1 ± 0.05 0.25 2.9 0.1 X 0.5 0.1 SA B 0° to 8° 0.08 M S A B 0.2 ± 0.02 + 0.036 0.22 – 0.03 DETAIL B PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-16P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.03g —8— 0.1 ± 0.01 + 0.026 0.12 – 0.02 0.45 ± 0.1 1 8 X4 3.9
CXG1064ATN 价格&库存

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