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CXG1235XR

CXG1235XR

  • 厂商:

    SONY(索尼)

  • 封装:

  • 描述:

    CXG1235XR - SP5T Antenna Switch - Sony Corporation

  • 数据手册
  • 价格&库存
CXG1235XR 数据手册
SP5T Antenna Switch CXG1235XR Description The CXG1235XR is an SP5T antenna switch. On chip logic reduces component count and simplifies PCB layout by allowing direct connection of the switch to digital baseband control lines with the CMOS logic levels. It requires 3 CMOS control lines. The Sony GaAs JPHEMT MMIC Process is used for low insertion loss. Features Insertion loss: 0.40dB (Typ.) @960MHz 0.50dB (Typ.) @2170MHz Lead-Free and RoHS compliant Package Small package size: 16-pin XQFN (2.3mm × 2.3mm × 0.35mm) (Typ.) Structure GaAs JPHEMT MMIC Absolute Maximum Ratings Bias voltage Control voltage Input power max. Input power max. Operating temperature Storage temperature Allowable power dissipation *1 VDD Vctl 7 5 27 24 –35 to +85 –65 to +150 V V dBm dBm °C °C (Ta = 25°C) (Ta = 25°C) (824 to 915MHz, Ta = 25°C) (1710 to 1980MHz, Ta = 25°C) PD 100 mW *1 25mm × 25mm × t: 0.8mm, Mounted on standard board (FR-4) This IC is ESD sensitive device. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E08227 CXG1235XR Block Diagram Ant F1 F6 RF1 F7 F2 RF2 F3 F8 RF3 F9 F4 F10 F5 RF5 RF4 Pin Configuration 8 CTLC 7 CTLB 6 CTLA GND 9 5 VDD 4 ANT 3 GND 2 RF5 10 GND 11 RF1 RF4 12 GND 13 RF3 14 GND 15 RF2 16 1 GND 16-pin XQFN 2.3mm × 2.3mm × 0.35mm (Typ.) -2- CXG1235XR Truth Table Port ANT – RF1 ANT – RF2 ANT – RF3 ANT – RF4 ANT – RF5 A H H H L L B L H L L/H L/H C H L L L H F1 ON OFF OFF OFF OFF F2 OFF ON OFF OFF OFF F3 OFF OFF ON OFF OFF F4 OFF OFF OFF ON OFF F5 OFF OFF OFF OFF ON F6 OFF ON ON ON ON F7 ON OFF ON ON ON F8 ON ON OFF ON ON F9 ON ON ON OFF ON F10 ON ON ON ON OFF DC Bias Condition (Ta = +25°C) Item Vctl (H) Vctl (L) VDD Min. 1.5 0 2.6 Typ. 1.8 — 2.8 Max. 3.6 0.3 3.6 V Unit -3- CXG1235XR Electrical Characteristics (Ta = +25°C, VDD = 2.8V, Vctl = 0V/1.8V) Item Insertion loss VSWR Symbol IL VSWR 2fo Harmonics 3fo 2fo 3fo IMD2 Input IP2 IMD3 Input IP3 Control current Supply current Switching speed IMD2 IIP2 IMD3 IIP3 Ictl Idd Swt Ant – RF1, 2, 3, 4, 5 Ant – RF1, 2, 3, 4, 5 *5 Port *1 Condition *2 Min. — — — — — — — — 89 — 53 — — — Typ. 0.40 0.50 1.2 –50 –45 –50 –50 –94 99 –91 58 10 160 3 Max. 0.55 0.65 1.5 –35 –35 –35 –35 –84 — –81 — 25 260 6 Unit dB — Ant – RF1, 2, 3, 4, 5 869 to 2170MHz *3 Ant – RF1, 2, 3, 4, 5 *4 dBm dBm dBm dBm dBm μA μA μs *6 Vctl = 1.8V VDD = 2.8V (state: HLH) 50% Ctl to 90% RF Electrical characteristics are measured with all RF ports terminated in 50Ω. *1 *2 *3 *4 *5 *6 Power incident on Ant, Pin = 0dBm, 869 to 960MHz. Power incident on Ant, Pin = 0dBm, 1805 to 2170MHz. Power incident on RFx, Pin = 24dBm, 824 to 915MHz. Power incident on RFx, Pin = 21dBm, 1710 to 1980MHz. Pin = 20dBm, Ftx = 1950MHz, PBlocker = –15dBm, FBlocker = 190MHz, Fim = 2140MHz, IIP2 = Pin + (PBlocker – IMD2) Pin = 20dBm, Ftx = 1950MHz, PBlocker = –15dBm, FBlocker = 1760MHz, Fim = 2140MHz, IIP3 = Pin + (PBlocker – IMD3)/2 -4- CXG1235XR (Ta = +25°C, VDD = 2.8V, Vctl = 0V/1.8V) Item Symbol Port Active Port Ant – RF2 Ant – RF3 Ant – RF4 Ant – RF5 Ant – RF2 Ant – RF3 Ant – RF4 Ant – RF5 Ant – RF1 Ant – RF3 Ant – RF4 Ant – RF5 Ant – RF1 Ant – RF3 Ant – RF4 Ant – RF5 Ant – RF1 Ant – RF2 Ant – RF4 Ant – RF5 Ant – RF1 Ant – RF2 Ant – RF4 Ant – RF5 Ant – RF1 Ant – RF2 Ant – RF3 Ant – RF5 Ant – RF1 Ant – RF2 Ant – RF3 Ant – RF5 Ant – RF1 Ant – RF2 Ant – RF3 Ant – RF4 Ant – RF1 Ant – RF2 Ant – RF3 Ant – RF4 Condition Min. 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 Typ. 35 33 33 33 32 38 34 31 31 35 32 31 24 40 33 29 30 35 34 30 26 36 28 24 31 35 32 32 27 42 28 28 31 35 31 34 27 40 32 35 Max. — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — Unit *1 RF1 *2 *1 RF2 *2 *1 Isolation ISO. RF3 dB *2 *1 RF4 *2 *1 RF5 *2 Electrical characteristics are measured with all RF ports terminated in 50Ω. *1 *2 Power incident on Ant, Pin = 0dBm, 869 to 960MHz. Power incident on Ant, Pin = 0dBm, 1805 to 2170MHz. -5- CXG1235XR Recommended Circuit CtlC CtlB CtlA VDD Cbypass (100pF) Cbypass (100pF) Cbypass (100pF) Cbypass (100pF) CTLC 8 CTLB 7 CTLA 6 VDD 5 CRF (56pF) ANT 4 ANT ∗1 (56nH) 9 GND CRF (56pF) RF5 10 RF5 GND 3 CRF (56pF) 11 GND CRF (56pF) RF4 12 RF4 13 GND 15 GND 14 RF3 16 RF2 RF1 2 RF1 GND 1 CRF (56pF) CRF (56pF) RF3 RF2 When using this IC, the following external components should be used: CRF: This capacitor is used for RF decoupling and must be used all applications. Cbypass: This capacitor is used for DC line filtering. 100pF is recommended. ∗1 Inductor (56nH) is recommended on Ant port for ESD protection. Capacitors are required on all RF ports for DC blocking. -6- CXG1235XR Package Outline (Unit: mm) LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm -7- Sony Corporation
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