CXM3513ER

High Power DP3T Switch with Logic Control CXM3513ER Description The CXM3513ER can be used in wireless communication systems, for example, triple-band W-CDMA handsets. This IC has a decoder with 3 CMOS control inputs. The Sony JPHEMT process is used for low insertion loss and low distortion characteristic. (Applications: Antenna switch for cellular handsets, triple-band W-CDMA) Features Low insertion loss: 0.36dB @900MHz, 0.43dB @1.95GHz 3 CMOS compatible control lines Package Small package size: 20-pin VQFN (2.4mm × 3.2mm × 0.9mm) Structure GaAs JPHEMT MMIC Absolute Maximum Ratings (Ta = 25°C) Bias voltage Control voltage Operating temperature Storage temperature VDD Vctl Topr Tstg 7 5 –35 to +85 –65 to +150 V V °C °C This IC is ESD sensitive device. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E06636A69 CXM3513ER Block Diagram and Pin Configuration GND GND 8 F11 10 9 RF3 GND GND RF1 GND GND GND 7 6 RF2 11 F10 12 GND EXT GND ANT GND GND F5 5 F2 F8 4 F6 F3 13 14 F9 15 F4 F1 F7 3 2 16 17 18 19 20 1 CTLB CTLC -2- CTLA VDD CXM3513ER Recommended Circuit RF Port CRF 1000pF 10 GND CRF 9 RF2 8 GND 7 GND GND 6 CRF 12 GND 13 GND CRF EXT 5 22pF GND 4 CRF 14 RF1 1000pF 15 GND CTLC CTLB 16 GND VDD CTLA GND 2 GND 1 ANT 3 22pF RF Port 1000pF 11 RF3 RF Port RF Port RF Port 17 18 19 20 Cbypass (Cbypass) (Cbypass) (Cbypass) 100pF (100pF) (100pF) (100pF) VDD Vctl Vctl Vctl When using this IC, the following external components should be used: CRF: This capacitor is used for RF decoupling and must be used for all applications. Cbypass: This capacitor is used for DC line filtering. -3- CXM3513ER Truth Table State 1 2 3 4 5 6 CTL A CTL B CTL C Mode F1 F2 ON F3 F4 F5 ON F6 OFF ON F7 F8 ON ON ON F9 ON ON ON ON OFF F10 OFF OFF ON ON ON ON F11 ON ON OFF OFF ON ON H L H L H L L L L L H H L L H H L L ANT-RF3 OFF OFF OFF OFF OFF OFF ON OFF OFF OFF OFF EXT-RF3 OFF OFF OFF OFF ANT-RF2 OFF OFF ANT-RF1 ON ON OFF ON OFF EXT-RF2 OFF OFF OFF OFF OFF EXT-RF1 OFF OFF OFF ON OFF OFF OFF OFF OFF OFF OFF OFF ON OFF OFF DC Bias Conditions (Ta = –35 to +85°C) Item Vctl (H) Vctl (L) VDD Min. 1.44 0 2.7 Typ. 1.85 — 2.85 Max. VDD 0.3 3.2 Unit V V V -4- CXM3513ER Electrical Characteristic (Ta = 25°C, VDD = 2.85V) Item Symbol State EXT-RF1 Insertion Loss IL EXT-RF2 EXT-RF3 EXT-RF1 Isolation ISO EXT-RF2 EXT-RF3 VSWR VSWR ANT EXT Condition 830 to 885MHz 1750 to 1880MHz 1920 to 2170MHz 25 28 28 25 24 24 830 to 885MHz 1750 to 1880MHz 1920 to 2170MHz 50Ω 50Ω VDD = 2.85V Min. Typ. 0.36 0.36 0.39 0.40 0.43 0.45 30 33 33 30 29 29 1.1 1.1 32 5 ±5MHz, 3.84MHz BW, *1, *2, *3 ±10MHz, 3.84MHz BW, *1, *2, *3 *1, *2, *3 *1, *2, *3 Max. 0.56 0.56 0.64 0.65 0.68 0.70 Unit dB dB dB dB dB dB dB dB dB dB dB dB ANT-RF1 830 to 885MHz ANT-RF2 1750 to 1880MHz ANT-RF3 1920 to 2170MHz ANT-RF1 830 to 885MHz ANT-RF2 1750 to 1880MHz ANT-RF3 1920 to 2170MHz 1.4 1.4 — — dBm 1dB compression P1dB input power Switching speed ACLR Harmonics Bias current Control current TSW ACLR1 ACLR2 2fo 3fo Idd Ictl IMD2_1_1 IMD2_1_2 IMD2_1_3 IMD2 IMD2_2_1 IMD2_2_2 IMD2_2_3 EXT-RF1 EXT-RF2 EXT-RF3 EXT-RF1 EXT-RF2 EXT-RF3 10 –50 –55 –70 –70 210 5 –97 –95 –95 –95 –100 –97 –105 –105 –105 –100 –105 –100 us dBc dBc dBc dBc μA μA dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm –60 –65 –90 –90 105 0.1 –107 –105 –105 –105 –110 –107 –115 –115 –115 –110 –115 –110 VDD = 2.85V Vctl (H) = 2.85V ANT-RF1 fud = fRx – fTx, *4 fud = fRx – fTx, *4 ANT-RF2 fud = fRx – fTx, *5 fud = fRx – fTx, *5 fud = fRx – fTx, *6 ANT-RF3 fud = fRx – fTx, *6 ANT-RF1 fud = fRx + fTx, *4 fud = fRx + fTx, *4 fud = fRx + fTx, *5 ANT-RF2 fud = fRx + fTx, *5 ANT-RF3 fud = fRx + fTx, *6 fud = fRx + fTx, *6 -5- CXM3513ER Item Symbol IMD3_1_1 IMD3_1_2 IMD3_1_3 State EXT-RF1 EXT-RF2 EXT-RF3 EXT-RF1 EXT-RF2 EXT-RF3 Condition fud = 2 × fTx – fRx, *4 fud = 2 × fTx – fRx, *5 Min. Typ. –107 –107 –107 –107 –107 –107 –110 –110 –110 –110 –110 –110 Max. –97 –97 –97 –97 –97 –97 –100 –100 –100 –100 –100 –100 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm ANT-RF1 fud = 2 × fTx – fRx, *4 ANT-RF2 fud = 2 × fTx – fRx, *5 ANT-RF3 fud = 2 × fTx – fRx, *6 fud = 2 × fTx – fRx, *6 fud = 2 × fTx + fRx, *4 IMD3 IMD3_2_1 IMD3_2_2 IMD3_2_3 ANT-RF1 fud = 2 × fTx + fRx, *4 ANT-RF2 fud = 2 × fTx + fRx, *5 fud = 2 × fTx + fRx, *5 fud = 2 × fTx + fRx, *6 ANT-RF3 fud = 2 × fTx + fRx, *6 *1 *2 *3 *4 *5 *6 Pin = 25dBm, Vctl = 0/1.85V, VDD = 2.85V, 830 to 840MHz Pin = 25dBm, Vctl = 0/1.85V, VDD = 2.85V, 1750 to 1785MHz Pin = 25dBm, Vctl = 0/1.85V, VDD = 2.85V, 1920 to 1980MHz Pin = 20dBm, Vctl = 0/1.85V, VDD = 2.85V, fTx = 830 to 840MHz, Pin = –15dBm, fRx = 875 to 885MHz Pin = 20dBm, Vctl = 0/1.85V, VDD = 2.85V, fTx = 1750 to 1785MHz, Pin = –15dBm, fRx = 1845 to 1880MHz Pin = 20dBm, Vctl = 0/1.85V, VDD = 2.85V, fTx = 1920 to 1980MHz, Pin = –15dBm, fRx = 2110 to 2170MHz -6- CXM3513ER Package Outline (Unit: mm) LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm -7- Sony Corporation