0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
CXP819P60M

CXP819P60M

  • 厂商:

    SONY(索尼)

  • 封装:

  • 描述:

    CXP819P60M - CMOS 8-bit Single Chip Microcomputer - Sony Corporation

  • 数据手册
  • 价格&库存
CXP819P60M 数据手册
CXP819P60M CMOS 8-bit Single Chip Microcomputer Description The CXP819P60M is a CMOS 8-bit micro-computer which consists of A/D converter, serial interface, timer/counter, time base timer, vector interruption, high precision timing pattern generation circuit, PWM generator, PWM for tuner, 32kHz timer/event counter, remote control receiving circuit, general purpose prescaler, and external signal, as well as basic configurations like 8-bit CPU, PROM, RAM and I/O port. They are integrated into a single chip. Also the CXP819P60M provides sleep/stop function which enables to lower power consumption and ultra-low speed instruction mode in 32kHz operation. This IC is the PROM-incorporated version of the CXP81960M with built-in mask ROM. This provides the additional feature of being able to write directly into the program. Thus, it is most suitable for evaluation use during system development and for small-quantity production. 100 pin QFP (PIastic) 100 pin LQFP (PIastic) Structure Silicon gate CMOS IC Features • A wide instruction set (213 instructions) which cover various types of data — 16-bit operation/multiplication and division/boolean bit operation instructions • Minimum instruction cycle 250ns at 16MHz operation (4.5 to 5.5V) 333ns at 12MHz operation (2.7 to 5.5V) 122µs at 32kHz operation • Incorporated PROM capacity 60K bytes • Incorporated RAM capacity 2048 bytes • Peripheral functions — A/D converter 8-bit, 12-channel, successive approximation system (Conversion time 20.0µs/16MHz) — Serial Interface Incorporated buffer RAM (1 to 32 bytes auto transfer) 1-channel Incorporated 8-bit and 8-stage FIFO for data (1 to 8 bytes auto transfer) 1-channel — Timer 8-bit timer, 8-bit timer/counter, 19-bit time base timer, 32kHz timer/counter — High precision timing pattern generator PPG 19-pin 32-stage programmable RTG 5-pin 2-channel — PWM/DA gate output PWM 12-bit, 2-channel (Repetitive frequency 62kHz/16MHz) DA gate pulse output 13-bit, 4-channel — FRC capture unit Incorporated 26-bit and 8-stage FIFO — PWM output 14-bit, 1-channel — Remote control receiving circuit 8-bit pulse measurement counter with on-chip, 6-stage FIFO — General purpose prescaler 7-bit (PG5 input frequency divided, FRC capture possible) • Interruption 20 factors, 15 vectors, multi-interruption possible • Standby mode SLEEP/STOP • Package 100-pin plastic QFP/LQFP Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E95512-PS Block Diagram AVREF AVDD PE0/INT0 AVss PI4/INT1/NMI SPC700 CPU CORE PORT B CLOCK GENERATOR/ SYSTEM CONTROL 8 PORT A AN0 to AN3 PF0/AN4 to PF7/AN11 2 8 NMI 12 A/D CONVERTER PE1/INT2 TEX TX EXTAL XTAL RST MP VDD Vss Vpp PA0 to PA7 CS0 SI0 SO0 SCK0 RAM PORT C SERIAL INTERFACE UNIT (CH0) PB0 to PB7 8 PC0 to PC7 2 INTERRUPT CONTROLLER PI7/SI1 PI6/SO1 PI5/SCK1 FIFO PROM 60K BYTES RAM 2048 BYTES SERIAL INTERFACE UNIT (CH1) PE1/EC 8 BIT TIMER/COUNTER 0 PI3/TO 8 BIT TIMER 1 PORT D 8 PD0 to PD7 2 6 4 PE0 to PE1 PE2 to PE7 PF0 to PF3 PORT F PI2/PWM 32kHz TIMER/COUNTER PORT G 2 2 4 PROGRAMMABLE PATTERN GENERATOR 19 RAM REALTIME PULSE GENERATOR CH0 5 CH1 12 BIT PWM GENERATOR CH1 PORT H PORT I PA0/PPO0 to PC2/PPO18 PC3/RTO3 to PC7/RTO7 PORT J –2– 2 FIFO FIFO FRC CAPTURE UNIT PG6/EXI0 PG7/EXI1 PI1/RMC REMOCON INPUT PRESCALER/ TIME BASE TIMER PORT E 4 PF4 to PF7 8 PG0 to PG7 14 BIT PWM GENERATOR 8 PH0 to PH7 12 BIT PWM GENERATOR CH0 PE2/PWM0 PE4/DAA0 PE6/DAB0 PE3/PWM1 PE5/DAA1 PE7/DAB1 7 PI1 to PI7 PG5/PCK PROGRAMMABLE PRESCALER 8 PJ0 to PJ7 CXP819P60M CXP819P60M Pin Configuration 1 (Top View) 100-pin QFP package PB6/PPO14 PB7/PPO15 PA0/PPO0 PA1/PPO1 PA2/PPO2 PA3/PPO3 PA4/PPO4 PA5/PPO5 PA6/PPO6 PA7/PPO7 PI3/TO/ADJ PI4/INT1/NMI Vpp VSS 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 PB5/PPO13 PB4/PPO12 PB3/PPO11 PB2/PPO10 PB1/PPO9 PB0/PPO8 PC7/RTO7 PC6/RTO6 PC5/RTO5 PC4/RTO4 PC3/RTO3 PC2/PPO18 PC1/PPO17 PC0/PPO16 PJ7 PJ6 PJ5 PJ4 PJ3 PJ2 PJ1 PJ0 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 PI6/SO1 PI7/SI1 PE0/INT0 PE1/EC/INT2 PE2/PWM0 PE3/PWM1 PE4/DAA0 PE5/DAA1 PE6/DAB0 PE7/DAB1 PG0 PG1 PG2 PG3 PG4 PG5/PCK PG6/EXI0 PG7/EXI1 AN0 AN1 AN2 AN3 PF0/AN4 PF1/AN5 PF2/AN6 PF3/AN7 AVDD AVREF AVSS PF4/AN8 TX TEX VDD PI1/RMC PI2/PWM Note) 1. Vpp (Pin 90) is always connected to VDD. 2. Vss (Pins 41 and 88) are both connected to GND. 3. MP (Pin 39) is always connected to GND. –3– PF7/AN11 PF6/AN10 PF5/AN9 EXTAL SCK0 XTAL RST SO0 PH7 PH6 PH5 PH4 PH3 PH2 PH1 PH0 CS0 VSS MP SI0 PI5/SCK1 CXP819P60M Pin Configuration 2 (Top View) 100-pin LQFP package PB4/PPO12 PB5/PPO13 PB6/PPO14 PB7/PPO15 PA0/PPO0 PA1/PPO1 PA2/PPO2 PA3/PPO3 PA4/PPO4 PA5/PPO5 PA6/PPO6 PA7/PPO7 PI3/TO/ADJ PI4/INT1/NMI PI5/SCK1 PI1/RMC PI2/PWM PI6/SO1 VSS 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 PB3/PPO11 PB2/PPO10 PB1/PPO9 PB0/PPO8 PC7/RTO7 PC6/RTO6 PC5/RTO5 PC4/RTO4 PC3/RTO3 PC2/PPO18 PC1/PPO17 PC0/PPO16 PJ7 PJ6 PJ5 PJ4 PJ3 PJ2 PJ1 PJ0 PD7 PD6 PD5 PD4 PD3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 PE1/EC/INT2 PE2/PWM0 PE3/PWM1 PE4/DAA0 PE5/DAA1 PE6/DAB0 PE7/DAB1 PG0 PG1 PG2 PG3 PG4 PG5/PCK PG6/EXI0 PG7/EXI1 AN0 AN1 AN2 AN3 PF0/AN4 PF1/AN5 PF2/AN6 PF3/AN7 AVDD AVREF TX TEX Vpp VDD PF5/AN9 PF4/AN8 PI7/SI1 Note) 1. Vpp (Pin 88) is always connected to VDD. 2. Vss (Pins 39 and 86) are both connected to GND. 3. MP (Pin 37) is always connected to GND. –4– PF7/AN11 PF6/AN10 EXTAL SCK0 XTAL AVSS SO0 RST PD2 PD1 PD0 PH7 PH6 PH5 PH4 PH3 PH2 PH1 PH0 CS0 VSS SI0 MP PE0/INT0 CXP819P60M Pin Description Symbol PA0/PPO0 to PA7/PPO7 I/O Output/ Real time output (Port A) 8-bit output port. Data is gated with PPO contents by OR-gate and they are output. (8 pins) (Port B) 8-bit output port. Data is gated with PPO contents by OR-gate and they are output. (8 pins) (Port C) 8-bit I/O port, enables to specify I/O by bit unit. Data is gated with PPO or RTO contents by OR-gate and they are output. (8 pins) Description PB0/PPO8 to PB7/PPO15 PC0/PPO16 to PC2/PPO18 PC3/RTO3 to PC7/RTO7 Output/ Real time output I/O/ Real time output I/O/ Real time output Programmable pattern generator (PPG) output. Functions as high precision real time pulse output port. (19 pins) Real time pulse generator (RTG) output. Functions as high precision real time pulse output port. (5 pins) PD0 to PD7 I/O (Port D) 8-bit I/O port. Enable to specify I/O by 4-bit unit. Enables to drive 12mA sink current. (8 pins) Input pin to request external interruption. Active when falling edge. (Port E) 8-bit port. Lower 2 bits are input pins and upper 6 bits are output pins. (8 pins) External event input pin for timer/counter. PWM output pins. (2 pins) Input pin to request external interruption. Active when falling edge. PE0/INT0 Input/Input PE1/EC/INT2 PE2/PWM0 PE3/PWM1 PE4/DAA0 PE5/DAA1 PE6/DAB0 PE7/DAB1 AN0 to AN3 PF0/AN4 to PF3/AN7 PF4/AN8 to PF7/AN11 SCK0 SO0 SI0 CS0 Input/Input/Input Output/Output Output/Output Output/Output Output/Output Output/Output Output/Output Input Input/Input DA gate pulse output pins. (4 pins) Analog input pins to A/D converter. (12 pins) (Port F) Lower 4 bits are input port and upper 4 bits are output port. Lower 4 bits also serve as standby release input pin. (8 pins) Output/Input I/O Ouput Input Input Serial clock (CH0) I/O pin. Serial data (CH0) output pin. Serial data (CH0) input pin. Serial chip select (CH0) input pin. –5– CXP819P60M Symbol PG0 to PG4 PG5/PCK PG6/EXI0 PG7/EXI1 Input I/O (Port G) 8-bit input port. (8 pins) Description 7 bit general purpose prescaler input pin. External input pin to FRC capture unit. PH0 to PH7 Output (Port H) 8-bit output port ; Medium withstand voltage (12V) and high current (12mA), N-ch open drain output. (8 pins) Remote control receiving circuit input pin. 14-bit PWM output pin. (Port I) 7-bit I/O port. I/O port can be specified by bit unit. (7 pins) Timer/counter, 32kHz oscillation adjustment output pin. Input pin to request external interruption and non-maskable interruption. Active when falling edge. Serial clock (CH1) I/O pin. Serial data (CH1) output pin. Serial data (CH1) input pin. (Port J) 8-bit I/O port. Function as standby release input can be specified by bit unit. I/O can be specified by bit unit. Connecting pin of crystal oscillator for system clock. When supplying the external clock, input the external clock to EXTAL pin and input opposite phase clock to XTAL pin. Connecting pin of crystal oscillator for 32kHz timer clock. When used as event counter, input to TEX pin and leave TX pin open. (Feedback resistor is not removed.) System reset pin of active "L" level. Microprocessor mode input pin. Always connect to GND. Positive power supply pin of A/D converter. PI1/RMC PI2/PWM PI3/TO/ADJ PI4/INT1/ NMI PI5/SCK1 PI6/SO1 PI7/SI1 PJ0 to PJ7 EXTAL XTAL TEX TX RST MP AVDD AVREF AVss VDD Vpp Vss I/O/Input I/O/Output I/O/Output/Output I/O/Input/Input I/O/I/O I/O/Output I/O/Input I/O Input Output Input Output Input Input Input Reference voltage input pin of A/D converter. GND pin of A/D converter. Positive power supply pin. Positive power supply pin for built-in PROM writing. Please connect to VDD for normal operation. GND pin. Connect both Vss pins to GND. –6– CXP819P60M Input/Output Circuit Formats for Pins Pin Port A Port B PA0/PPO0 to PA7/PPO7 PB0/PPO8 to PB7/PPO15 Data bus RD (Port A or Port B) PPO data Circuit format When reset Port A or Port B Hi-Z Output becomes active from high impedance by data writing to port register. 16 pins Port C PC0/PPO16 to PC2/PPO18 PC3/RTO3 to PC7/RTO7 PPO, RTO data Port C data IP (Every bit) Data bus RD (Port C) Input protection circuit Hi-Z Port C direction 8 pins Port D PD0 to PD7 Port D data IP (Every 4 bits) PD0 to 3 PD4 to 7 RD (Port D) High current 12mA Hi-Z Port D direction Data bus 8 pins –7– CXP819P60M Pin Port E PE0/INT0 Circuit format When reset Data bus RD (Port E) Interruption circuit IP Input protection circuit Hi-Z 1 pin Port E PE1/EC/INT2 Data bus RD (Port E) Interruption circuit/ event counter IP Hi-Z Input protection circuit 1 pin Port E DA gate output or PWM output PE2/PWM0 PE3/PWM1 PE4/DAA0 PE5/DAA1 Hi-Z control Port E data MPX Hi-Z Port/DA output select Data bus 4 pins Port E RD (Port E) DA gate output Hi-Z control MPX PE6/DAB0 PE7/DAB1 Port E data H level Port/DA output select Data bus 2 pins RD (Port E) –8– CXP819P60M Pin Circuit format Input multiplexer IP A/D converter When reset AN0 to AN3 4 pins Port F Hi-Z Input multiplexer PF0/AN4 to PF3/AN7 IP A/D converter Hi-Z Data bus 4 pins Port F RD (Port F) PF4/AN8 to PF7/AN11 Port F data Data bus RD (Port F) Port/AD select Hi-Z IP A/D converter 4 pins Port G PG0 to PG4 PG5/PCK Input multiplexer Schmitt input IP RD (Port G) Data bus Hi-Z PG5 ··· To general purpose prescaler 6 pins Port G Schmitt input PG6/EXI0 PG7/EXI1 IP FRC capture unit Data bus Hi-Z 2 pins Port H RD (Port G) Medium withstand voltage 12V PH0 to PH7 Port H data Hi-Z Large current 12mA Data bus 8 pins RD (Port H) –9– CXP819P60M Pin Port I Port I function select PI2 ··· From 14-bit PWM PI3 ··· From timer/counter, 32kHz timer Circuit format When reset PI2/PWM PI3/TO/ADJ MPX Port I data Port I direction Hi-Z IP Data bus 2 pins Port I RD (Port I) Port I data PI1/RMC PI4/INT1/NMI PI7/SI1 Data bus Port I direction Hi-Z IP RD (Port I) PI1 ··· To remote control circuit PI4 ··· To interruption circuit PI7 ··· To serial CH1 Schmitt input 3 pins Port I Port I function select From serial CH1 MPX Port I data Port I direction MPX Note) PI5 is schmitt input PI6 is inverter input RD (Port I) To serial CH1 PI5/SCK1 PI6/SO1 Hi-Z IP Data bus 2 pins – 10 – CXP819P60M Pin Port J Port J data Circuit format When reset Port J direction PJ0 to PJ7 Data bus RD (Port J) Standby release Data bus RD (Port J direction ) Edge detection IP Hi-Z 8 pins CS0 SI0 IP Schmitt input To SIO Hi-Z 2 pins SO0 SO0 from SIO Hi-Z 1 pin SO0 output enable Internal serial clock from SIO SCK0 SCK0 output enable External serial clock to SIO IP Hi-Z 1 pin Schmitt input EXTAL XTAL EXTAL IP • Shows the circuit composition during oscillation. Oscillation • Feedback resistor is removed during stop. 2 pins XTAL – 11 – CXP819P60M Pin Circuit format 32kHz timer counter • Shows the circuit composition during oscillation. • Feedback resistor is removed during 32kHz oscillation circuit stop by software. At this time TEX pin outputs "L" level and TX pin outputs "H" level. When reset TEX TX TEX IP Oscillation 2 pins TX Pull-up resistor RST Schmitt input IP L level 1 pin MP IP CPU mode Hi-Z 1 pin – 12 – CXP819P60M Absolute Maximum Ratings Item Symbol VDD Vpp Supply voltage AVDD AVSS Input voltage Output voltage Medium withstand output voltage High level output current High level total output current Low level output current VIN VOUT VOUTP IOH ΣIOH IOL IOLC Low level total output current Operating temperature Storage temperature Allowable power dissipation ΣIOL Topr Tstg PD Rating –0.3 to +7.0 –0.3 to +13 AVss to +7.0∗1 –0.3 to +0.3 –0.3 to +7.0∗2 –0.3 to +7.0∗2 –0.3 to +15.0 –5 –50 15 20 130 –10 to +75 –55 to +150 600 380 mW Unit V V V V V V V mA mA mA mA mA °C °C QFP package type LQFP package type Total of output pins PH pin Remarks (Vss = 0V) On-chip PROM power supply Other than large current output pins: per pin Large current port pin∗3: per pin Total of output pins ∗1 AVDD and VDD should be set to a same voltage. ∗2 VIN and VOUT should not exceed VDD + 0.3V. ∗3 The large current operation transistors are the N-CH transistors of the PD and PH ports. Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should better take place under the recommended operating conditions. Exceeding those conditions may adversely affect the reliability of the LSI. – 13 – CXP819P60M Recommended Operating Conditions Item Symbol Min. 2.7 2.7 2.5 2.0 Analog power supply AVDD VIH High level input voltage VIHS 3.0 0.7VDD 0.8VDD Max. 5.5 5.5 5.5 5.5 5.5 VDD VDD 5.5 Unit V V V V V V V V V V V V V V V °C Remarks (Vss = 0V) Guaranteed range during high speed mode (1/2 dividing clock) operation Guaranteed range during low speed mode (1/16 dividing clock) operation Guaranteed operation range by TEX clock Guaranteed data hold operation range during STOP ∗1 ∗2 CMOS schmitt input∗3 and PE0/INT0 pin CMOS schmitt input∗6 EXTAL pin∗4, ∗7 and TEX pin∗5, ∗7 EXTAL pin∗4, ∗8 and TEX pin∗5, ∗8 ∗2, ∗7 ∗2, ∗8 CMOS schmitt input∗3 and PE0/INT0 pin EXTAL pin∗4, ∗7 and TEX pin∗5, ∗7 EXTAL pin∗4, ∗8 and TEX pin∗5, ∗8 Supply voltage VDD VIHEX VDD – 0.4 VDD + 0.3 VDD – 0.2 VDD + 0.2 0 0 0.3VDD 0.2VDD 0.2VDD 0.4 0.2 +75 VIL Low level input voltage VILS VILEX Operating temperature Topr ∗1 ∗2 ∗3 ∗4 ∗5 ∗6 ∗7 ∗8 0 –0.3 –0.3 –10 AVDD and VDD should be set to a same voltage. Normal input port (each pin of PC, PD, PF0 to PF3, PG, PI and PJ), MP pin. Each pin of SCK0, RST, PE1/EC/INT2, PI1/RMC, PI4/INT1/NMI, PI5/SCK1 and PI7/SI1. It specifies only when the external clock is input. It specifies only when the external event count clock is input. Each pin of CS0, SI0, and PG. In case of 4.5 to 5.5V supply voltage (VDD). In case of 2.7 to 3.3V supply voltage (VDD). – 14 – CXP819P60M Electrical Characteristics DC Characteristics (VDD = 4.5 to 5.5V) Item High level output voltage Low level output voltage Symbol VOH Pins PA to PD, PE2 to PE7, PF4 to PF7, PH (VOL only) PI1 to PI7 PJ, SO0, SCK0 PD, PH IIHE IILE Input current IIHT IILT IILR TEX RST PA to PG, PI, PJ, MP AN0 to AN3, CS0, SI0, SO0 SCK0 EXTAL Conditions VDD = 4.5V, IOH = –0.5mA VDD = 4.5V, IOH = –1.2mA VDD = 4.5V, IOL = 1.8mA VDD = 4.5V, IOL = 3.6mA VDD = 4.5V, IOL = 12.0mA VDD = 5.5V, VIH = 5.5V VDD = 5.5V, VIL = 0.4V VDD = 5.5V, VIH = 5.5V VDD = 5.5V, VIL = 0.4V 0.5 –0.5 0.1 –0.1 –1.5 (Ta = –10 to +75°C, Vss = 0V) Min. 4.0 3.5 0.4 0.6 1.5 40 –40 10 –10 –400 Typ. Max. Unit V V V V V µA µA µA µA µA VOL I/O leakage current IIZ VDD = 5.5V, VI = 0, 5.5V ±10 µA Open drain output leakage current (N-CH Tr OFF in state) ILOH PH VDD = 5.5V VOH = 12V 16MHz crystal oscillation (C1 = C2 = 15pF) VDD = 5V ± 0.5V∗2 SLEEP mode VDD = 5V ± 0.5V 1.7 28 50 µA IDD1 50 mA IDDS1 8 mA Supply current∗1 IDD2 32kHz crystal oscillation (C1 = C2 = 47pF) VDD VDD = 2.75V ± 0.25V SLEEP mode VDD = 2.75V ± 0.25V 7 30 µA 0.6 1.8 mA IDDS2 IDDS3 STOP mode (EXTAL and TEX pins oscillation stop) VDD = 5V ± 0.5V 30 µA Input capacity CIN Other than VDD, Clock 1MHz Vss, AVDD, and 0V other than the measured pins AVss 10 20 pF ∗1 When entire output pins are open. ∗2 When setting upper 2 bits (CPU clock selection) of clock control register CLC (address: 00FEH) to "00" and operating in high speed mode (1/2 dividing clock). – 15 – CXP819P60M DC Characteristics (VDD = 2.7 to 3.3V) Item High level output voltage Low level output voltage Symbol VOH Pins PA to PD, PE2 to PE7, PF4 to PF7, PH (VOL only) PI1 to PI7 PJ, SO0, SCK0 PD, PH IIHE IILE Input current IIHT IILT IILR TEX RST PA to PG, PI, PJ, MP AN0 to AN3, CS0, SI0, SO0 SCK0 PH EXTAL Conditions VDD = 2.7V, IOH = –0.12mA VDD = 2.7V, IOH = –0.45mA VDD = 2.7V, IOL = 1.0mA VDD = 2.7V, IOL = 1.4mA VDD = 2.7V, IOL = 4.5mA VDD = 3.3V, VIH = 3.3V VDD = 3.3V, VIL = 0.3V VDD = 3.3V, VIH = 3.3V VDD = 3.3V, VIL = 0.3V (Ta = –10 to +75°C, Vss = 0V) Min. 2.5 2.1 0.25 0.4 0.9 0.3 –0.3 0.1 –0.1 –0.9 20 –20 10 –10 –200 Typ. Max. Unit V V V V V µA µA µA µA µA VOL I/O leakage current IIZ VDD = 3.3V, VI = 0, 3.3V ±10 µA Open drain output leakage current ILOH VDD = 3.3V, VOH = 12V 12MHz crystal oscillation (C1 = C2 = 15pF) VDD = 3.0V ± 0.3V∗2 SLEEP mode 10 50 µA IDD1 30 mA Supply current∗1 IDDS1 VDD VDD = 3.0V ± 0.3V STOP mode (EXTAL and TEX pins oscillation stop) VDD = 3.0V ± 0.3V 0.7 2.5 mA IDDS3 30 µA Input capacity CIN Other than VDD, Clock 1MHz Vss, AVDD, and 0V other than the measured pins AVss 10 20 pF ∗1 When entire output pins are open. ∗2 When setting upper 2 bits (CPU clock selection) of clock control register CLC (address: 00FEH) to "00" and operating in high speed mode (1/2 dividing clock). – 16 – CXP819P60M AC Characteristics (1) Clock timing Item System clock frequency System clock input pulse width System clock input rise and fall times Event count clock input pulse width Event count clock input rise and fall times System clock frequency Event count clock input pulse width Event count clock input rise and fall times Symbol fC Pins XTAL EXTAL XTAL EXTAL XTAL EXTAL EC EC TEX TX TEX TEX Fig. 1, Fig. 2 Fig. 1, (Ta = –10 to +75°C, VDD = 2.7 to 5.5V, Vss = 0V) Conditions VDD = 4.5 to 5.5V Min. 1 1 VDD = 4.5 to 5.5V 28 37.5 200 ns ns 20 32.768 10 20 ns kHz µs ms Max. 16 12 ns Unit MHz tXL, tXH tCR, tCF tEH, tEL tER, tEF fC Fig. 2 (External clock drive) Fig. 1, Fig. 2 (External clock drive) Fig. 3 Fig. 3 Fig. 2 VDD = 2.5 to 5.5V (32kHz clock applied condition) Fig. 3 Fig. 3 tsys × 4∗ tTL, tTH tTR, tTF ∗ tsys indicates three values according to the contents of the clock control register (address; 00FEH) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11") Fig. 1. Clock timing 1/fc VDD – 0.4V EXTAL 0.4V tXH tCF tXL tCR Fig. 2. Clock applied condition Crystal oscillation Ceramic oscillation External clock 32kHz clock applied condition crystal oscillation EXTAL C1 XTAL C2 EXTAL XTAL C1 TEX TX C2 74HC04 Fig. 3. Event count clock timing 0.8VDD 0.2VDD TEX EC tEH tTH tEF tTF tEL tTL tER tTR – 17 – CXP819P60M (2) Serial transfer (CH0) Item CS ↓ → SCK delay time CS ↑ → SCK floating delay time CS ↓ → SO delay time CS ↓ → SO floating delay time CS high level width SCK cycle time SCK high and low level widths SI input setup time (against SCK ↑) SI input hold time (against SCK ↑) SCK ↓ → SO delay time Symbol Pin SCK0 (Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V) Condition Chip select transfer mode (SCK = output mode) Chip select transfer mode (SCK = output mode) Chip select transfer mode Chip select transfer mode Chip select transfer mode Input mode SCK0 Output mode Input mode SCK0 Output mode SCK input mode SI0 SCK output mode SCK input mode SI0 SCK output mode SCK input mode SO0 SCK output mode Min. Max. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns 2tsys + 200 100 ns ns tDCSK tsys + 200 tsys + 200 tsys + 200 tsys + 200 tsys + 200 2tsys + 200 16000/fc tDCSKF SCK0 tDCSO SO0 tDCSOF SO0 tWHCS CS0 tKCY tKH tKL tSIK tKSI tKSO tsys + 100 8000/fc – 100 –tsys + 100 200 2tsys + 100 100 Note 1) tsys indicates three values according to the contents of the clock control register (address; 00FEH) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11") Note 2) CS, SCK, SI and SO means each pin of CS → CS0, SCK → SCK0, SI → SI0, and SO → SO0 respectively. Note 3) The load of SCK output mode and SO output delay time is 50pF + 1TTL. – 18 – CXP819P60M Serial transfer (CH0) Item CS ↓ → SCK delay time CS ↑ → SCK floating delay time CS ↓ → SO delay time CS ↓ → SO floating delay time CS high level width SCK cycle time SCK high and low level widths SI input setup time (against SCK ↑) SI input hold time (against SCK ↑) SCK ↓ → SO delay time Symbol Pin SCK0 (Ta = –10 to +75°C, VDD = 2.7 to 3.3V, Vss = 0V) Condition Chip select transfer mode (SCK = output mode) Chip select transfer mode (SCK = output mode) Chip select transfer mode Chip select transfer mode Chip select transfer mode Input mode SCK0 Output mode Input mode SCK0 Output mode SCK input mode SI0 SCK output mode SCK input mode SI0 SCK output mode SCK input mode SO0 SCK output mode Min. Max. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns 2tsys + 250 125 ns ns tDCSK tsys + 250 tsys + 200 tsys + 250 tsys + 200 tsys + 200 2tsys + 200 16000/fc tDCSKF SCK0 tDCSO SO0 tDCSOF SO0 tWHCS CS0 tKCY tKH tKL tSIK tKSI tKSO tsys + 100 8000/fc – 150 –tsys + 100 200 2tsys + 100 100 Note 1) tsys indicates three values according to the contents of the clock control register (address; 00FEH) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11") Note 2) CS, SCK, SI and SO means each pin of CS → CS0, SCK → SCK0, SI → SI0, and SO → SO0 respectively. Note 3) The load of SCK output mode and SO output delay time is 50pF. – 19 – CXP819P60M Fig. 4. Serial transfer timing (CH0) tWHCS CS0 0.8VDD 0.2VDD tKCY tDCSK tKL tKH tDCSKF 0.8VDD SCK0 0.2VDD 0.8VDD tSIK tKSI 0.8VDD SI0 Input data 0.2VDD tDCSO tKSO tDCSOF 0.8VDD SO0 Output data 0.2VDD – 20 – CXP819P60M Serial transfer (CH1) Item SCK1 cycle time SCK1 high and low level widths SI1 input setup time (against SCK1 ↑) SI1 input hold time (against SCK1 ↑) SCK1 ↓ → SO1 delay time Symbol Pin SCK1 (Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V) Condition Input mode Output mode Input mode SCK1 Output mode SCK1 input mode SI1 SCK1 output mode SCK1 input mode SI1 SCK1 output mode SCK1 input mode SO1 SCK1 output mode Min. 2tsys + 200 8000/fc Max. Unit ns ns ns ns ns ns ns ns tKCY tKH tKL tSIK tKSI tKSO tsys + 100 4000/fc – 100 100 200 tsys + 200 100 tsys + 200 100 ns ns Note 1) tsys indicates three values according to the contents of the clock control register (address; 00FEH) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11") Note 2) The load of SCK1 output mode and SO1 output delay time is 50pF + 1TTL. Serial transfer (CH1) Item SCK1 cycle time SCK1 high and low level widths SI1 input setup time (against SCK1 ↑) SI1 input hold time (against SCK1 ↑) SCK1 ↓ → SO1 delay time Symbol Pin SCK1 (Ta = –10 to +75°C, VDD = 2.7 to 3.3V, Vss = 0V) Condition Input mode Output mode Input mode SCK1 Output mode SCK1 input mode SCK1 output mode SCK1 input mode SI1 SCK1 output mode SCK1 input mode SO1 SCK1 output mode Min. 2tsys + 200 8000/fc Max. Unit ns ns ns ns ns ns ns ns tKCY tKH tKL tSIK tKSI tKSO tsys + 100 4000/fc – 150 100 200 SI1 tsys + 200 100 tsys + 250 125 ns ns Note 1) tsys indicates three values according to the contents of the clock control register (address; 00FEH) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11") Note 2) The load of SCK1 output mode and SO1 output delay time is 50pF. – 21 – CXP819P60M Fig. 5. Serial transfer CH1 timing tKCY tKL tKH SCK1 0.8VDD 0.2VDD tSIK tKSI 0.8VDD SI1 Input data 0.2VDD tKSO 0.8VDD SO1 0.2VDD Output data (3) General purpose prescaler Item External clock input frequency External clock input pulse width External clock input rise and fall times Symbol fPCK Pin PCK PCK PCK (Ta = –10 to +75°C, VDD = 2.7 to 5.5V, Vss = 0V) Condition Min. Typ. Max. 12 33 200 Unit MHz ns ns tWH, tWL tR, tF Fig. 6. General purpose prescaler timing 1/fPCK tWH tF 0.8VDD PCK 0.5VDD 0.2VDD tWL tR – 22 – CXP819P60M (4) A/D converter characteristics Item Resolution Linearity error Absolute error Conversion time Sampling time Symbol (Ta = –10 to +75°C, VDD = AVDD = 4.5 to 5.5V, AVREF = 4.0 to AVDD, Vss = AVSS = 0V) Pins Conditions Ta = 25°C VDD = AVDD = AVREF = 5.0V VSS = AVSS = 0V Min. Typ. Max. 8 ±1 ±2 160/fADC∗ 12/fADC∗ AVREF AN0 to AN11 Operating mode AVREF SLEEP mode STOP mode 32kHz operating mode VDD = AVDD = 4.5 to 5.5V AVDD – 0.5 0 0.6 1.0 10 AVDD Unit Bits LSB LSB µs µs V V mA µA tCONV tSAMP VIAN IREF Reference input voltage VREF Analog input voltage AVREF current IREFS (Ta = –10 to +75°C, VDD = AVDD = 2.7 to 3.3V, AVREF = 2.7 to AVDD, Vss = AVSS = 0V) Item Resolution Linearity error Absolute error Conversion time Sampling time Ta = 25°C VDD = AVDD = AVREF = 3.0V VSS = AVSS = 0V Symbol Pins Conditions Min. Typ. Max. 8 ±1 ±2 160/fADC∗ 12/fADC∗ AVREF AN0 to AN11 Operating mode AVREF SLEEP mode STOP mode 32kHz operating mode VDD = AVDD = 2.7 to 3.3V AVDD – 0.3 0 0.3 0.7 10 AVDD Unit Bits LSB LSB µs µs V V mA µA tCONV tSAMP VIAN IREF Reference input voltage VREF Analog input voltage AVREF current IREFS Fig. 7. Definitions of A/D converter terms FFH FEH Digital conversion value ∗ The value of fADC is as follows by selecting ADC Linearity error 01H 00H VZT Analog input VFT operation clock (MSC: Address 01FFH bit 0). When PS2 is selected, fADC = fc/2 When PS1 is selected, fADC = fc – 23 – CXP819P60M (5) Interruption, reset input Item Symbol (Ta = –10 to +75°C, VDD = 2.7 to 5.5V, Vss = 0V) Pins INT0 INT1 INT2 NMI PJ0 to PJ7 RST Conditions Min. Max. Unit External interruption high and low level widths tIH tIL tRSL 1 µs Reset input low level width 32/fc µs Fig. 8. Interruption input timing INT0 INT1 INT2 NMI PJ0 to PJ7 (During standby release input) (Falling edge) tIH tIL 0.8VDD 0.2VDD Fig. 9. Reset input timing tRSL RST 0.2VDD (6) Others Item EXI input high and low level widths Note) Symbol Pins EXI0 EXI1 (Ta = –10 to +75°C, VDD = 2.7 to 5.5V, Vss = 0V) Conditions Min. Max. Unit ns tEIH tEIL tsys = 2000/fc tFRC × 8 + 200 + tsys tsys indicates three values according to the contents of the clock control register (address; 00FEH) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11") tFRC = 1000/fc [ns] Fig. 10. Other timings tEIH tEIL EXI0 EXI1 0.8VDD 0.2VDD – 24 – CXP819P60M Supplement Fig. 11. Recommended oscillation circuit (i) (ii) EXTAL XTAL Rd TEX TX Rd C1 C2 C1 C2 Manufacturer Model fc (MHz) 8.00 C1 (pF) 10 C2 (pF) 10 Rd (Ω) Circuit example RIVER ELETEC CO., LTD. 10.00 HC-49/U03 12.00 16.00 8.00 HC-49/U (-S) 10.00 12.00 16.00 P3 32.768kHz 16 (12) 16 (12) 12 12 30 16 (12) 16 (12) 12 12 18 5 5 0 (i) 0 (i) KINSEKI LTD. 470K (ii) Products List Option item Package ROM capacity Pull-up resistor for reset pin Mask product 100-pin plastic QFP/LQFP 52K bytes/60K bytes Existent/Non-existent CXP819P60MQ-4100-pin plastic QFP PROM 60K bytes Existent CXP819P60MR-4100-pin plastic LQFP PROM 60K bytes Existent – 25 – CXP819P60M Characteristics Curve IDD vs. VDD (fc = 16MHz, Ta = 25°C, Typical) 1/2 dividing mode 1/4 dividing mode 1/16 dividing mode 32kHz mode (instruction) SLEEP mode 1.0 0.5 40 IDD vs. fc (VDD = 5V, Ta = 25°C, Typical) 20.0 10.0 IDD – Supply current [mA] 5.0 30 1/2 dividing mode IDD – Supply current [mA] 20 1/4 dividing mode 0.1 (100µA) 0.05 (50µA) 32kHz SLEEP mode 10 1/16 dividing mode 0.01 (10µA) 3 4 5 6 0 5 10 fc – System clock [MHz] SLEEP mode 16 VDD – Supply voltage [V] IDD vs. VDD (fc = 12MHz, Ta = 25°C, Typical) 40 1/2 dividing mode 20.0 10.0 5.0 1/4 dividing mode 1/16 dividing mode 30 SLEEP mode 1.0 0.5 IDD vs. fc (VDD = 3.0V, Ta = 25°C, Typical) IDD – Supply current [mA] IDD – Supply current [mA] 20 0.1 (100µA) 0.05 (50µA) 10 1/2 dividing mode 1/4 dividing mode 0.01 (10µA) 3 4 5 6 01 1/16 dividing mode SLEEP mode VDD – Supply voltage [V] 5 10 12 fc – System clock [MHz] 15 – 26 – CXP819P60M Package Outline Unit : mm 100PIN QFP (PLASTIC) 23.9 ± 0.4 + 0.4 20.0 – 0.1 80 51 + 0.1 0.15 – 0.05 81 50 + 0.4 14.0 – 0.1 17.9 ± 0.4 15.8 ± 0.4 A 100 31 1 0.65 + 0.15 0.3 – 0.1 30 0.13 M + 0.35 2.75 – 0.15 + 0.2 0.1 – 0.05 0.15 DETAIL A 0.8 ± 0.2 0° to 10° (16.3) PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE QFP-100P-L01 QFP100-P-1420 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 1.7g 100PIN LQFP (PLASTIC) 16.0 ± 0.2 ∗ 75 76 14.0 ± 0.1 51 50 100 1 0.5 + 0.08 0.18 – 0.03 25 26 (0.22) 0.13 M + 0.2 1.5 – 0.1 + 0.05 0.127 – 0.02 0.1 0.1 ± 0.1 0° to 10° DETAIL A 0.5 ± 0.2 NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING 42 ALLOY 0.8g LEAD TREATMENT LEAD MATERIAL PACKAGE MASS SONY CODE EIAJ CODE JEDEC CODE LQFP-100P-L01 LQFP100-P-1414 – 27 – 0.5 ± 0.2 A (15.0)
CXP819P60M 价格&库存

很抱歉,暂时无法提供与“CXP819P60M”相匹配的价格&库存,您可以联系我们找货

免费人工找货