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CXP86449

CXP86449

  • 厂商:

    SONY(索尼)

  • 封装:

  • 描述:

    CXP86449 - CMOS 8-bit Single Chip Microcomputer - Sony Corporation

  • 数据手册
  • 价格&库存
CXP86449 数据手册
CXP86213/86217, CXP86325/86333 CXP86441/86449/86461 CMOS 8-bit Single Chip Microcomputer Description The CXP86213/86217, CXP86325/86333, CXP86441/ 86449/86461 are the CMOS 8-bit single chip microcomputer integrating on a single chip an A/D converter, serial interface, timer/counter, time-base timer, on-screen display function, I2C bus interface, PWM output, remote control reception circuit, HSYNC counter, watchdog timer, 32kHz timer/counter besides the basic configurations of 8-bit CPU, ROM, RAM, I/O ports. The CXP86213/86217, CXP86325/86333, CXP86441/ 86449/86461 also provide a sleep function that enables to lower the power consumption. 52 pin SDIP (Plastic) Structure Features Silicon gate CMOS IC • A wide instruction set (213 instructions) which covers various types of data — 16-bit operation/multiplication and division/ Boolean bit operation instructions • Minimum instruction cycle 250ns at 16MHz operation (4.5 to 5.5V) 122µs at 32kHz operation (2.7 to 5.5V) • Incorporated ROM capacity 12K bytes (CXP86213) 24K bytes (CXP86325) 40K bytes(CXP86441) 16K bytes (CXP86217) 32K bytes (CXP86333) 48K bytes (CXP86449) 60K bytes (CXP86461) • Incorporated RAM capacity 352 bytes (CXP86213/86217) 704 bytes (CXP86325/86333) 1536 bytes (CXP86441/86449/86461) (Excludes VRAM for on-screen display and sprite RAM) • Peripheral functions — A/D converter 8 bits, 6 channels, successive approximation method (Conversion time of 3.25µs at 16MHz) — Serial interface 8-bit clock sync type, 1 channel — Timer 8-bit timer 8-bit timer/counter 19-bit time-base timer 32kHz timer/counter — On-screen display (OSD) function 12 × 16 dots, 128 character types (CXP86213/86217), 256 character types (CXP86325/86333), 384 character types (CXP86441/86449/86461) 15 character colors, 2 lines × 24 characters, frame background 8 colors/ half blanking, background on full screen 15 colors/ half blanking edging/ shadowing/ rounding for every line, background with shadow for every character (CXP86441/86449/86461), double scanning, sprite OSD (CXP86441/86449/86461), 12 × 16 dots, 1 screen, 8 colors for every dot — I2C bus interface — PWM output 8 bits, 6 channels 14 bits, 1 channel — Remote control reception circuit 8-bit pulse measurement counter, 6-stage FIFO — HSYNC counter 2 channels — Watchdog timer • Interruption 13 factors, 13 vectors, multi-interruption possible • Standby mode Sleep • Package 52-pin plastic SDIP • Piggyback/evaluator CXP86490 64-pin ceramic PSDIP (Supports custom font) Perchase of Sony's I2C components conveys a licence under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specifications as defined by Philips. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E96X17B86 INT0 INT1 INT2 RMC REMOCON FIFO SI SO SCK 2 SERIAL INTERFACE UNIT INTERRUPT CONTROLLER PORT B ROM 12K/16K/24K/32K/ 40K/48K/60K BYTES RAM 352/704/1536 BYTES 8 PORT A 8 AN0 to AN5 6 A/D CONVERTER 6CH SPC700 CPU CORE TEX TX EXTAL XTAL RST MP VDD VSS CLOCK GENERATOR /SYSTEM CONTROL Block Diagram PA0 to PA7 PB0 to PB7 TO 8BIT TIMER 1 2 PE0 to PE1 PORT E XLC EXLC R G B I YS YM HSYNC VSYNC 2 PRESCALER/ TIME BASE TIMER WATCHDOG TIMER 32kHz TIMER/COUNTER PORT D EC 8BIT TIMER/ COUNTER 0 8 PD0 to PD7 PORT F 2 I2C BUS INTERFACE UNIT 8BIT PWM 6 14BIT PWM HS1 HSYNC COUNTER 1 ADJ SDA0 SDA1 SCL0 SCL1 PWM0 to PWM5 PWM PORT G –2– 2 3 PE2 to PE3 PE4 to PE6 ON SCREEN DISPLAY 8 PF0 to PF7 CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 HS0 HSYNC COUNTER 0 1 PG7 CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Pin Assignment (Top View) EC/PD7 RMC/PD6 HS1/PD5 HS0/PD4 SI/PD3 SO/PD2 SCK/PD1 INT2/PD0 HSYNC/PA7 VSYNC/PA6 RST VSS XTAL EXTAL PA5/AN5 PA4/AN4 PA3/AN3 PA2/AN2 PA1/AN1 PA0/AN0 PB7 PB6 PB5 PB4 PB3 INT1/PG7 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 PF0/PWM0 PF1/PWM1 PF2/PWM2 PF3/PWM3 PF4/SCL0 PF5/SCL1/PWM4 PF6/SDA0 PF7/SDA1/PWM5 PE0/TO/ADJ PE1/PWM PE2/TEX/INT0 PE3/TX VSS VDD NC EXLC XLC PE4/YM PE5/YS PE6/I B G R PB0 PB1 PB2 Note) 1. NC (Pin 38) is left open. 2. Vss (Pins 12 and 40) are both connected to GND. –3– CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Pin Description Symbol PA0/AN0 to PA5/AN5 PA6/VSYNC PA7/HSYNC PB0 to PB7 I/O I/O/ Analog input I/O/Input I/O/Input I/O (Port A) 8-bit I/O port. I/O can be set in a unit of single bits. (8 pins) Description Analog inputs to A/D converter. (6 pins) OSD display vertical sync signal input. OSD display horizontal sync signal input. (Port B) 8-bit I/O port. I/O can be set in a unit of single bits. (8 pins) External interruption request input. Active at the falling edge. (Port D) 8-bit I/O port. I/O can be set in a unit of single bits. Can drive 12mA synk current. (8 pins) Serial clock I/O. Serial data output. Serial data input. HSYNC counter (CH0) input. HSYNC counter (CH1) input. Remote control reception circuit input. External event input for timer/counter. Rectangular wave output 32kHz oscillation frequency dividing output. for 8-bit timer/counter. (Port E) Bits 0 and 1 are I/O port; I/O can be set in a unit of single. Bits 2 and 3 are input port. Bits 4, 5 and 6 are output port. (7 pins) 14-bit PWM output. External interruption Connects a crystal for request input. Active at 32kHz timer/counter the falling edge. clock oscillation. When used as an event counter, input to TEX pin and leave TX pin open. PD0/INT2 PD1/SCK PD2/SO PD3/SI PD4/HS0 PD5/HS1 PD6/RMC PD7/EC PE0/TO/ADJ PE1/PWM PE2/TEX/INT0 I/O/Input I/O/I/O I/O/Output I/O/Input I/O/Input I/O/Input I/O/Input I/O/Input I/O/Output/ Output I/O/Output Input/Input/ Input Input/Output Output/Output Output/Output Output/Output Output Output Output PE3/TX PE4/YM PE5/YS PE6/I B G R OSD display 6-bit output. (6 pins) –4– CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Symbol PF0/PWM0 to PF3/PWM3 PF4/SCL0 PF5/SCL1/ PWM4 PF6/SDA0 PF7/SDA1/ PWM5 PG7/INT1 EXTAL XTAL RST EXLC XLC NC VDD Vss I/O Output/Output Output/I/O Output/I/O/ Output Output/I/O Output/I/O/ Output I/O/Input Input Output Input Input Output (Port F) 8-bit output port. Open drain output of large current (12mA) and N channel. Lower 4 bits are medium drive voltage (12V); upper 4 bits are 5V drive. (8 pins) (Port G) 1-bit I/O port. Description 8-bit PWM output. (4 pins) I2C bus interface transfer clock I/O. (2 pins) 8-bit PWM output. I2C bus interface transfer data I/O. (2 pins) 8-bit PWM output. External interruption request input. Active at the falling edge. Connects a crystal for system clock oscillation. When a clock is supplied externally, input to EXTAL pin and input a reversed phase clock to XTAL pin. System reset; active at Low level. OSD display clock oscillation I/O. Oscillation frequency is determined by the external L and C. No connected. Positive power supply. GND. Connect two Vss pins to GND. –5– CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Input/Output Circuit Formats for Pins Pin Port A Port A data Port A direction Circuit format When reset PA0/AN0 to PA5/AN5 “0” when reset IP RD (Port A) Port A function selection “0” when reset A/D converter Input multiplexer Input protection circuit Data bus Hi-Z 6 pins Port A Port A data Port A direction PA6/VSYNC PA7/HSYNC Data bus RD (Port A) HSYNC, VSYNC “0” when reset Schmitt input IP Hi-Z Input polarity “0” when reset 2 pins Port B Port G PB0 to PB7 PG7/INT1 Data bus RD (Ports B, G) Ports B, G data Ports B, G direction “0” when reset Hi-Z IP 9 pins Port F INT1 Schmitt input for PB0, PB1, PB2 and PG7 PWM0 to PWM3 PF0/PWM0 to PF3/PWM3 Port F function selection “0” when reset Port F data “1” when reset ∗ 12V drive voltage Large current 12mA ∗ Hi-Z 4 pins –6– CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Pin Port D Circuit format When reset Port D data PD0/INT2 PD3/SI PD4/HS0 PD5/HS1 PD6/RMC PD7/EC Port D direction “0” when reset Schmitt input RD (Port D) INT2, SI, HS0, HS1, RMC, EC ∗ Large current 12mA ∗ Hi-Z Data bus IP 6 pins Port D SCK, SO SIO output enable Port D data PD1/SCK PD2/SO Port D direction “0” when reset Data bus RD (Port D) Schmitt input only for PD1 ∗ Hi-Z IP 2 pins Port E SCK only ∗ Large current 12mA Internal reset signal Port E data “1” when reset TO ADJ16K∗1 ADJ2K∗1 00 01 10 11 MPX ∗2 PE0/TO/ADJ Port E function selection (Upper) Port E function selection (Lower) “00” when reset Port E direction “1” when reset Data bus ∗1 ADJ signals are frequency dividing outputs for 32kHz oscillation frequency IP adjustment. ADJ2K provides usage as buzzer output. ∗2 Pull-up resistors approx. 150kΩ High level (with the resistor of pull-up transistor ON when reset) 1 pin RD (Port E) –7– CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Pin Port E Circuit format When reset PWM Port E function selection “0” when reset Port E data PE1/PWM “1” when reset High level Port E direction “1” when reset IP Data bus 1 pin Port E RD (Port E) 32kHz oscillation circuit control “1” when reset Schmitt input INT0 Data bus PE2/TEX/INT0 PE3/TX PE2/ TEX/ INT0 IP IP RD (Port E) Data bus RD (Port E) Schmitt input Clock input Oscillation halted Port input 2 pins PE3/ TX Port E YM, YS, I Output polarity PE4/YM PE5/YS PE6/I “0” when reset Port E function selection “0” when reset Port E data Writing data to output polarity register and port data register brings output to active. Hi-Z 3 pins –8– CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Pin Port F SCL, SDA I2C bus enable Circuit format When reset ∗ PF4/SCL0 PF5/SCL1/PWM4 PF6/SDA0 PF7/SDA1/PWM5 PWM4, PWM5 Port F function selection “0” when reset Port F data “1” when reset SCL, SDA (I2C bus circuit) Schmitt input IP BUS SW Hi-Z 4 pins ∗ Large current 12mA To internal pins (SCL1 for SCL0) I 2C R, G, B R G B Output polarity “0” when reset Hi-Z Writing data to output polarity register brings output to active. 3 pins Oscillation control EXLC XLC EXLC IP IP OSD display clock Oscillation halted XLC 2 pins EXTAL XTAL EXTAL IP • Diagram shows the circuit composition during oscillation. • Feedback resistor is removed during stop mode. (This device does not enter the stop mode.) Oscillation 2 pins XTAL Pull-up resistor RST Mask option OP Schmitt input Low level 1 pin –9– CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Absolute Maximum Ratings Item Supply voltage Input voltage Output voltage Medium drive output voltage High level output current High level total output current Symbol VDD VIN VOUT VOUTP IOH ∑IOH IOL Low level output current IOLC Low level total output current Operating temperature Storage temperature Allowable power dissipation ∑IOL Topr Tstg PD 20 130 –20 to +75 –55 to +150 375 mA mA °C °C mW 52-pin SDIP Ratings –0.3 to +7.0 –0.3 to +7.0∗1 –0.3 to +7.0∗1 –0.3 to +15.0 –5 –50 15 Unit V V V V mA mA mA (Vss = 0V reference) Remarks Total of all output pins Ports excluding large current output (value per pin) Large current output ports (value per pin∗2) Total of all output pins ∗1 VIN and VOUT should not exceed VDD + 0.3V. ∗2 The large current output port is Port D (PD) and Port F (PF). Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should be conducted under the recommended operating conditions. Exceeding those conditions may adversely affect the reliability of the LSI. Recommended Operating Conditions Item Symbol Min. 4.5 VDD 3.5 2.7 — VIH High level input voltage VIHS VIHEX VIL Low level input voltage VILS VILEX Operating temperature Topr ∗1 ∗2 ∗3 ∗4 ∗5 0.7VDD 0.8VDD Max. 5.5 5.5 5.5 — VDD VDD Unit V V V V V V V V V V °C (Vss = 0V reference) Remarks Guaranteed operation range for 1/2 and 1/4 frequency dividing modes Guaranteed operation range for 1/16 frequency dividing mode or sleep mode Guaranteed operation range for TEX mode Guaranteed data hold range for stop mode∗5 ∗1 ∗2 EXTAL pin∗3, TEX pin∗4 ∗1 ∗2 EXTAL pin∗3, TEX pin∗4 Supply voltage VDD – 0.4 VDD + 0.3 0 0 –0.3 –20 0.3VDD 0.2VDD 0.4 +75 PA1 to 5, PB3 to 7, PD2, PE0, PE1, PE3, SCL0 to 1, SDA0 to 1 pins VSYNC, HSYNC, INT2, SCK, SI, HS0, HS1, RMC, EC, INT0, INT1, RST, PB0, PB1, PB2 pins Specifies only during external clock input. Specifies only during external event count input. This device does not enter the stop mode. – 10 – CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Electrical Characteristics DC characteristics Item High level output voltage Symbol Pins PA, PB, PD, PE0 to PE1, PE4 to PE6, PG7, R, G, B (Ta = –20 to +75°C, Vss = 0V reference) Conditions VDD = 4.5V, IOH = –0.5mA VDD = 4.5V, IOH = –1.2mA Min. 4.0 3.5 0.4 0.6 1.5 0.4 0.6 0.5 –0.5 0.1 –0.1 –1.5 40 –40 10 –10 –400 ±10 50 10 120 Typ. Max. Unit V V V V V V V µA µA µA µA µA µA µA µA Ω VOH PA, PB, PD, PE0 to VDD = 4.5V, IOL = 1.8mA PE1, PE4 to PE6, PF0 to PF3, PG7, R, G, B VDD = 4.5V, IOL = 3.6mA Low level output voltage VOL PD, PF PF4 to PF7 (SCL0, SCL1, SDA0, SDA1) IIHE IILE Input current IIHT IILT IILR I/O leakage current Open drain I/O leakage current (in N-ch Tr off state) I2C bus switch connection impedance (in output Tr off state) IIZ EXTAL VDD = 4.5V, IOL = 12.0mA VDD = 4.5V, IOL = 3.0mA VDD = 4.5V, IOL = 4.0mA VDD = 5.5V, VIH = 5.5V VDD = 5.5V, VIL = 0.4V VDD = 5.5V, VIH = 5.5V VDD = 5.5V, VIL = 0.4V VDD = 5.5V, VI = 0, 5.5V VDD = 5.5V, VOH = 12.0V VDD = 5.5V, VOH = 5.5V VDD = 4.5V VSCL0 = VSCL1 = 2.25V VSDA0 = VSDA1 = 2.25V 1/2 frequency dividing mode IDD1 VDD = 5.5V, 16MHz crystal oscillation (C1 = C2 = 15pF) VDD = 3.3V, 32MHz crystal oscillation (C1 = C2 = 47pF) SLEEP mode Supply current∗2 IDDS1 VDD VDD = 5.5V, 16MHz crystal oscillation (C1 = C2 = 15pF) VDD = 3.3V, 32MHz crystal oscillation (C1 = C2 = 47pF) STOP mode∗3 VDD = 5.5V, termination of 16MHz and 32MHz oscillation — 1.2 18 TEX RST∗1 PA, PB, PD, PE, R, G, B, RST∗1 PF0 to PF3 ILOH PF4 to PF7 RBS SCL0: SCL1 SDA0: SDA1 28 mA IDD2 30 80 µA 2.1 mA IDDS2 12 35 µA IDDS3 — — µA – 11 – CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Item Symbol Pins Conditions Min. Typ. Max. Unit Input capacitance CIN PA, PB, PD, PE0 to Clock 1MHz PE3, R, G, B, PF4 to 0V other than the PF7,EXTAL, TEX, measured pins EXLC, RST 10 20 pF ∗1 For RST pin, specifies the input current when pull-up resistance is selected, and specifies the leakage current when non-resistor is selected. ∗2 When all output pins are left open. Specifies only when the OSD oscillation is halted. ∗3 This device does not enter the stop mode. – 12 – CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 AC Characteristics (1) Clock timing Item System clock frequency System clock input pulse width System clock input rise and fall times Event count input clock pulse width Event count input clock rise and fall times System clock frequency Event count input clock pulse width Event count input clock rise and fall times Symbol fC Pins XTAL EXTAL EXTAL EXTAL EC EC TEX TX TEX TEX (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Conditions Fig. 1, Fig. 2 Fig. 1, Fig. 2 External clock drive Fig. 1, Fig. 2 External clock drive Fig. 3 Fig. 3 VDD = 2.7 to 5.5V Fig. 2 (32kHz clock applied conditions) Fig. 3 Fig. 3 10 20 4tsys∗1 20 Min. 8 28 200 Typ. Max 16 Unit MHz ns ns ns ms tXL, tXH tCR, tCF tEH, tEL tER, tEF fC 32.768 kHz tTL, tTH tTR, tTF µs ms ∗1 tsys indicates three values according to the contents of the clock control register (CLC: 00FEh) upper 2 bits (CPU clock selection). tsys (ns) = 2000/fc (Upper 2 bits = “00”), 4000/fc (Upper 2 bits = “01”), 16000/fc (Upper 2 bits = “11”) Fig. 1. Clock timing 1/fc VDD – 0.4V EXTAL 0.4V tXH tCF tXL tCR Fig.2. Clock applied conditions Crystal oscillation Ceramic oscillation External clock 32kHz clock applied condition Crystal oscillation EXTAL C1 XTAL C2 EXTAL XTAL TEX TX 74HC04 C1 C2 Fig. 3. Event count clock timing TEX EC 0.8VDD 0.2VDD tEH tTH tEF tTF tEL tTL tER tTR – 13 – CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 (2) Serial transfer Item SCK cycle time SCK High and Low level width SI input setup time (for SCK ↑) SI hold time (for SCK ↑) SCK ↓ → SO delay time Symbol Pins SCK (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Conditions Input mode Output mode SCK SCK input mode SCK output mode SI SCK input mode SCK output mode SI SCK input mode SCK output mode SO SCK input mode SCK output mode Min. 1000 8000/fc 400 4000/fc – 50 100 200 200 100 200 100 Max. Unit ns ns ns ns ns ns ns ns ns ns tKCY tKH tKL tSIK tKSI tKSO Note) The load of SCK output mode and SO output delay time is 50pF + 1TTL. Fig. 4. Serial transfer timing tKCY tKL tKH 0.8VDD SCK 0.2VDD tSIK tKSI 0.8VDD SI Input data 0.2VDD tKSO 0.8VDD SO 0.2VDD Output data – 14 – CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 (3) A/D converter Item Resolution Linearity error Zero transition voltage Full-scale transition voltage Conversion time Sampling time Analog input voltage VZT∗1 VFT∗2 Symbol Pins (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Conditions Min. Typ. Max. 8 ±3 Ta = 25°C VDD = 5.0V Vss = 0V –10 4910 26/fADC∗3 6/fADC∗3 AN0 to AN5 0 VDD 10 4970 70 5030 Unit Bits LSB mV mV µs µs V tCONV tSAMP VIAN Fig. 5. Definitions of A/D converter terms FFh FEh Digital conversion value Linearity error ∗1 VZT: Value at which the digital conversion value changes from 00h to 01h and vice versa. ∗2 VFT: Value at which the digital conversion value changes from FEh to FFh and vice versa. ∗3 fADC indicates the below values due to the contents of bit 6 (CKS) of the A/D control register (ADC: 00F6h): fADC = fc (CKS = “0”), fc/2 (CKS = “1”) 01h 00h VZT Analog input VFT – 15 – CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 (4) Interruption, reset input (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Item External interruption High, Low level width Reset input Low level width Symbol Pins INT0 INT1 INT2 RST Conditions Min. 1 32/fc Max. Unit µs µs tIH tIL tRSL Fig. 6. Interruption input timing tIH INT0 INT1 INT2 (falling edge) tIL 0.8VDD 0.2VDD Fig. 7. RST input timing tRSL RST 0.2VDD – 16 – CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 (5) I2C bus timing Item SCL clock frequency Bus-free time before starting transfer Hold time for starting transfer Clock Low level width Clock High level width Setup time for repeated transfers Data hold time Data setup time SDA, SCL rise time SDA, SCL fall time Setup time for transfer completion Symbol fSLC (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Pins SCL SDA, SCL SDA, SCL SCL SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL 4.7 Conditions Min. 0 4.7 4.0 4.7 4.0 4.7 0∗1 250 1 300 Max. 100 Unit kHz µs µs µs µs µs µs ns µs ns µs tBUF tHD; STA tLOW tHIGH tSU; STA tHD; DAT tSU; DAT tR tF tSU; STO ∗1 The data hold time should be 300ns or more because the SCL rise time (300ns Max.) is not included in it. Fig. 8. I2C bus transfer timing SDA tBUF tR tF tHD; STA SCL tHD; STA tSU; STA P S tLOW tHD; DAT tHIGH tSU; DAT St tSU; STO P Fig. 9. I2C bus device recommended circuit I2C bus device RS SDA0 (or SDA1) SCL0 (or SCL1) RS RS I2C bus device R S RP RP • A pull-up resistor (Rp) must be connected to SDA0 (or SDA1) and SCL0 (or SCL1). • The SDA0 (or SDA1) and SCL0 (or SCL1) series resistance (Rs) can be used to reduce the spike noise caused by CRT flashover. – 17 – CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 (6) OSD timing Item OSD clock frequency HSYNC pulse width VSYNC pulse width HSYNC afterwrite rise and fall times VSYNC beforewrite rise and fall times fosc [max] ≤ fc × 1.9 ∗2 H indicates 1HSYNC period. Fig. 10. OSD timing (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Symbol fOSC Pins EXLC XLC HSYNC VSYNC HSYNC VSYNC Conditions Fig. 11 Fig. 10 Fig. 10 Fig. 10 Fig. 10 Min. 4 2 1 200 1.0 Max 28∗1 Unit MHz µs H∗2 ns µs tHWD tVWD tHCG tVCG ∗1 The maximum value of fosc is specified with the following equation. tHWD tHCG HSYNC For OSD I/O polarity register (OPOL: 01FEh) bit 7 at “0” 0.8VDD 0.2VDD tVCG tVWD 0.8VDD VSYNC For OSD I/O polarity register (OPOL: 01FEh) bit 6 at “0” 0.2VDD Fig. 11. LC oscillation circuit connection EXLC XLC R∗1 L C1 C2 ∗1 The series resistor for XLC is used to reduce the frequency of occurrence of the undesired radiation. – 18 – CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Appendix Fig. 12. Recommended oscillation circuit (i) Main clock (ii) Main clock (iii) Sub clock EXTAL XTAL Rd EXTAL XTAL Rd C1 TEX TX Rd C2 C1 C2 C1 C2 Manufacture Model CSA10.0MTZ CSA12.0MTZ fc (MHz) 10.0 12.0 16.0 10.0 12.0 16.0 8.0 C1 (pF) 30 5 30 5 18 12 10 10 5 OPEN 30 C2 (pF) 30 5 30 5 18 12 10 10 5 OPEN 33 Rd (Ω) Circuit example (i) 0∗1 (ii) MURATA MFG CO., LTD CSA16.00MXZ040 CST10.0MTW∗ CST12.0MTW∗ CST16.00MXW0C1∗ RIVER ELETEC CO., LTD. HC-49/U03 12.0 16.0 8.0 330∗1 (i) 0∗1 HC-49/U (-S) KINSEKI LTD. P3 12.0 16.0 32.768kHz 120k (iii) ∗ Models with an asterisk have the built-in ground capacitance (C1, C2). ∗1 The series resistor for XTAL can reduce the effect of the noise caused by the electrostatic discharge. Mask Option Table Item Reset pin pull-up resistor Non-existent Content Existent – 19 – CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Fig. 13. Characteristic curves IDD vs. VDD (fc = 16MHz, Ta = 25°C, Typical) 100 IDD vs. fc (VDD = 5V, Ta = 25°C, Typical) 1/2 dividing mode 10 1/4 dividing mode 15 1/2 dividing mode 1/16 dividing mode IDD – Supply current [mA] 1 Sleep mode IDD – Supply current [mA] 10 1/4 dividing mode 0.1 32kHz Operation mode 32kHz Sleep mode 0.01 5 1/16 dividing mode Sleep mode 0 1 2 3 4 5 6 7 0 5 10 fc – System clock [MHz] 15 VDD – Supply voltage [V] Parameter curve for OSD oscillation L vs. C (theoretically calculated value) 100 10 L – Inductance [µH] 16MHz 1 20MHz 24MHz 28MHz 30MHz fOSC = 0.1 1 C = C1//C2 2π √ LC 0.01 0 10 20 30 40 50 60 70 80 90 100 C1, C2 – Capacitance [pF] – 20 – CXP86213/86217, CXP86325/86333, CXP86441/86449/86461 Package Outline Unit: mm 52PIN SDIP (PLASTIC) + 0.4 47.0 – 0.1 52 27 + 0.3 13.5 – 0.1 + 0.1 .05 0.25 – 0 26 1.778 1 15.24 0° to 15° 0.5 ± 0.1 + 0.1 0.9 – 0.05 PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SDIP-52P-01 SDIP052-P-0600 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER/PALLADIUM PLATING COPPER ALLOY 5.6g NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame). – 21 – 2.8 MIN 0.51 MIN 5.0 MIN
CXP86449 价格&库存

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