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CXP86609

CXP86609

  • 厂商:

    SONY(索尼)

  • 封装:

  • 描述:

    CXP86609 - CMOS 8-bit Single Chip Microcomputer - Sony Corporation

  • 数据手册
  • 价格&库存
CXP86609 数据手册
CXP86609/86613/86617 CMOS 8-bit Single Chip Microcomputer Description The CXP86609/86613/86617 are the CMOS 8-bit single chip microcomputer integrating on a single chip an A/D converter, serial interface, timer/counter, time-base timer, I2C bus interface, PWM output, remote control reception circuit, watchdog timer, 32kHz timer/counter besides the basic configurations of 8-bit CPU, ROM, RAM, I/O ports. The CXP86609/86613/86617 also provide a sleep function that enables to lower the power consumption. 52 pin SDIP (Plastic) Features • A wide instruction set (213 instructions) which covers various types of data — 16-bit operation/multiplication and division/Boolean bit operation instructions • Minimum instruction cycle 250ns at 16MHz operation 122µs at 32kHz operation • Incorporated ROM 8K bytes (CXP86609) 12K bytes (CXP86613) 16K bytes (CXP86617) • Incorporated RAM 352 bytes • Peripheral functions — A/D converter 8 bits, 6 channels, successive approximation method (Conversion time of 3.25µs at 16MHz) — Serial interface 8-bit clock sync type, 1 channel — Timer 8-bit timer 8-bit timer/counter 19-bit time-base timer 32kHz timer/counter — I2C bus interface — PWM output 8 bits, 4 channels — Remote control reception circuit 8-bit pulse measurement counter, 6-stage FIFO — Watchdog timer • Interruption 11 factors, 11 vectors, multi-interruption possible • Standby mode Sleep • Package 52-pin plastic SDIP • Piggyback/evaluator CXP86490 64-pin ceramic PSDIP Structure Silicon gate CMOS IC Perchase of Sony's I2C components conveys a licence under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specifications as defined by Philips. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E97751-PS Block Diagram INT0 INT1 INT2 TEX TX EXTAL XTAL RST VDD VSS SPC700 CPU CORE 8 CLOCK GENERATOR /SYSTEM CONTROL RMC REMOCON FIFO PORT A AN0 to AN5 6 A/D CONVERTER PA0 to PA7 SI SO SCK 2 SERIAL INTERFACE UNIT INTERRUPT CONTROLLER PORT B ROM 8K/12K/16K BYTES 8 RAM 352 BYTES PB0 to PB7 8 BIT TIMER/ COUNTER 0 TO 8 BIT TIMER 1 2 PE0 to PE1 PORT D EC 8 PD0 to PD7 PORT F 2 I2C BUS INTERFACE UNIT 8 BIT PWM 4 SDA0 SDA1 SCL0 SCL1 ADJ PWM0 to PWM3 PORT G –2– PRESCALER/ TIME BASE TIMER WATCHDOG TIMER 32kHz TIMER/COUNTER PORT E 2 3 PE2 to PE3 PE4 to PE6 4 4 PF0 to PF3 PF4 to PF7 1 PG7 CXP86609/86613/86617 CXP86609/86613/86617 Pin Assignment (Top View) PD7/EC PD6/RMC PD5 PD4 PD3/SI PD2/SO PD1/SCK PD0/INT2 PA7 PA6 RST VSS XTAL EXTAL PA5/AN5 PA4/AN4 PA3/AN3 PA2/AN2 PA1/AN1 PA0/AN0 PB7 PB6 PB5 PB4 PB3 PG7/INT1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 PF0/PWM0 PF1/PWM1 PF2/PWM2 PF3/PWM3 PF4/SCL0 PF5/SCL1 PF6/SDA0 PF7/SDA1 PE0/TO/ADJ PE1 PE2/TEX/INT0 PE3/TX VSS VDD NC NC NC PE4 PE5 PE6 NC NC NC PB0 PB1 PB2 Note) 1. NC (Pins 30, 31, 32, 36 and 38) are left open. 2. Vss (Pins 12 and 40) are both connected to GND. 3. Pin 37 is the NC pin. However, connect it to VDD because it is the EXLC pin (input) for the piggyback/evaluator and OTP devices. –3– CXP86609/86613/86617 Pin Description Symbol PA0/AN0 to PA5/AN5 PA6 to PA7 I/O I/O/ Analog input I/O (Port A) 8-bit I/O port. I/O can be set in a unit of single bits. (8 pins) Description Analog inputs to A/D converter. (6 pins) PB0 to PB7 I/O (Port B) 8-bit I/O port. I/O can be set in a unit of single bits. (8 pins) External interruption request input. Active at the falling edge. (Port D) 8-bit I/O port. I/O can be set in a unit of single bits. Can drive 12mA sink current. (8 pins) Serial clock I/O. Serial data output. Serial data input. PD0/INT2 PD1/SCK PD2/SO PD3/SI PD4 to PD5 PD6/RMC PD7/EC PE0/TO/ADJ PE1 PE2/TEX/INT0 I/O/Input I/O/I/O I/O/Output I/O/Input I/O I/O/Input I/O/Input I/O/Output/ Output I/O Input/Input/ Input Input/Output Output (Port E) Bits 0 and 1 are I/O port; I/O can be set in a unit of single. Bits 2 and 3 are input port. Bits 4, 5 and 6 are output port. (7 pins) Remote control reception circuit input. External event input for timer/counter. Rectangular wave output for 8-bit timer/counter. 32kHz oscillation frequency dividing output. PE3/TX PE4 to PE6 Connects a crystal for External interruption request input. Active at 32kHz timer/counter the falling edge. clock oscillation. When used as an event counter, input to TEX pin and leave TX pin open. –4– CXP86609/86613/86617 Symbol PF0/PWM0 to PF3/PWM3 PF4/SCL0 to PF5/SCL1 I/O Output/Output (Port F) 8-bit output port and large current (12mA) N-channel open drain output. Lower 4 bits are medium voltage drive (12V); upper 4 bits are 5V drive. (8 pins) Description 8-bit PWM output. (4 pins) I2C bus interface transfer clock I/O. (2 pins) Output/I/O PF6/SDA0 to PF7/SDA1 Output/I/O I2C bus interface transfer data I/O. (2 pins) PG7/INT1 I/O/Input (Port G) 1-bit I/O port. I/O can be set in a unit of single bits. (1 pin) External interruption request input. Active at the falling edge. EXTAL XTAL RST NC VDD Vss Input Output Input Connects a crystal for system clock oscillation. When a clock is supplied externally, input to EXTAL pin and input a reversed phase clock to XTAL pin. System reset; active at Low level. No connected. Connect this pin to VDD under normal operation. Positive power supply. GND. Connect two Vss pins to GND. –5– CXP86609/86613/86617 Input/Output Circuit Formats for Pins Pin Port A Port A data Port A direction Circuit format After reset PA0/AN0 to PA5/AN5 Data bus RD (Port A) Port A function selection "0" after reset A/D converter "0" after reset IP Input protection circuit Hi-Z Input multiplexer 6 pins Port A Port A data PA6 PA7 Data bus RD (Port A) Port A direction "0" after reset Schmitt input Hi-Z IP 2 pins Port B Port G PB0 to PB7 PG7/INT1 Data bus RD (Ports B, G) Ports B, G data Ports B, G direction "0" after reset Schmitt input only for PG7 Hi-Z IP 9 pins INT1 –6– CXP86609/86613/86617 Pin Port D Circuit format After reset Port D data PD0/INT2 PD3/SI PD6/RMC PD7/EC Port D direction "0" after reset Schmitt input RD (Port D) INT2, SI, RMC, EC ∗ Large current 12mA ∗ Hi-Z Data bus IP 4 pins Port D SCK, SO SIO output enable Port D data PD1/SCK PD2/SO Port D direction "0" after reset Schmitt input only for PD1 RD (Port D) ∗ Hi-Z IP Data bus 2 pins Port D SCK only ∗ Large current 12mA Port D data Port D direction "0" after reset Schmitt input RD (Port D) ∗ PD4 PD5 Data bus Hi-Z IP 2 pins ∗ Large current 12mA –7– CXP86609/86613/86617 Pin Port E Circuit format Internal reset signal Port E data "1" after reset TO ∗1 ADJ16K ∗1 ADJ2K 00 01 10 11 MPX ∗2 After reset PE0/TO/ADJ Port E function selection (upper) Port E function selection (lower) "00" after reset Port E direction "1" after reset Data bus ∗1 ADJ signals are frequency dividing outputs for 32kHz oscillation frequency IP adjustment. ADJ2K provides usage as buzzer output. ∗2 Pull-up transistor approx. 150kΩ High level (with the resistor of pull-up transistor ON when reset) 1 pin Port E RD (Port E) Port E data "1" after reset PE1 Port E direction "1" after reset IP Data bus RD (Port E) High level 1 pin Port E 32kHz oscillation circuit control "1" after reset Schmitt input INT0 Data bus PE2/TEX/INT0 PE3/TX PE2/ TEX/ INT0 IP IP RD (Port E) Data bus RD (Port E) Schmitt input Clock input Oscillation stop Port input 2 pins PE3/ TX –8– CXP86609/86613/86617 Pin Port E PE4 PE5 PE6 Circuit format After reset Port E data Output becomes active from high impedance by data writing to port register. RD (Port E) Hi-Z Data bus 3 pins Port F PWM0 to PWM3 PF0/PWM0 to PF3/PWM3 Port F function selection "0" after reset Port F data "1" after reset Data bus ∗ 12V drive Large current 12mA ∗ Hi-Z 4 pins Port F RD (Port F) SCL, SDA I2C output enable ∗ PF4/SCL0 PF5/SCL1 PF6/SDA0 PF7/SDA1 Port F data "1" after reset Schmitt input SCL, SDA (I2C circuit) IP BUS SW Hi-Z 4 pins ∗ Large current 12mA To internal I2C pins (SCL1 for SCL0) EXTAL XTAL EXTAL IP • Diagram shows the circuit composition during oscillation. • Feedback resistor is removed during stop. (This device does not enter the stop mode.) Oscillation 2 pins XTAL Pull-up resistor RST Mask option OP Schmitt input Low level (when reset) 1 pin –9– CXP86609/86613/86617 Absolute Maximum Ratings Item Supply voltage Input voltage Output voltage Symbol VDD VIN VOUT Ratings –0.3 to +7.0 –0.3 to +7.0∗1 –0.3 to +7.0∗1 –0.3 to +15.0 –5 –50 15 20 130 –20 to +75 –55 to +150 375 Unit V V V V mA mA mA mA mA °C °C mW SDIP-52P-01 Total of all output pins (Vss = 0V reference) Remarks Medium drive output voltage VOUTP High level output current High level total output current Low level output current Low level total output current Operating temperature Storage temperature Allowable power dissipation IOH ∑IOH IOL IOLC ∑IOL Topr Tstg PD Ports excluding large current output (value per pin) Large current output ports (value per pin∗2) Total of all output pins ∗1 VIN and VOUT should not exceed VDD + 0.3V. ∗2 The large current output port is Port D (PD) and Port F (PF). Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should be conducted under the recommended operating conditions. Exceeding those conditions may adversely affect the reliability of the LSI. Recommended Operating Conditions Item Symbol Min. 4.5 Supply voltage VDD 3.5 2.7 — VIH High level input voltage VIHS VIHEX VIL Low level input voltage VILS VILEX Operating temperature ∗1 ∗2 ∗3 ∗4 ∗5 Topr 0.7VDD 0.8VDD Max. 5.5 5.5 5.5 — VDD VDD Unit V V V V V V V V V V °C (Vss = 0V reference) Remarks Guaranteed operation range for 1/2 and 1/4 frequency dividing clocks Guaranteed operation range for 1/16 frequency dividing clock or sleep mode Guaranteed operation range for TEX Guaranteed data hold range for stop∗1 ∗2 ∗3 EXTAL pin∗4, TEX pin∗5 ∗2 ∗3 EXTAL pin∗4, TEX pin∗5 VDD – 0.4 VDD + 0.3 0 0 –0.3 –20 0.3VDD 0.2VDD 0.4 +75 This device does not enter the stop mode. PA0 to PA5, PB0 to PB7, PD2, PE0, PE1, PE3, SCL0, SCL1, SDA0, SDA1 pins PA6, PA7, INT2, SCK, SI, PD4, PD5, RMC, EC, INT0, INT1, RST pins Specifies only during external clock input. Specifies only during external event count input. – 10 – CXP86609/86613/86617 Electrical Characteristics DC characteristics Item High level output voltage Symbol VOH Pins PA, PB, PD, PE0 to PE1, PE4 to PE6, PG7 (Ta = –20 to +75°C, Vss = 0V reference) Conditions VDD = 4.5V, IOH = –0.5mA VDD = 4.5V, IOH = –1.2mA Min. 4.0 3.5 0.4 0.6 1.5 0.4 0.6 0.5 –0.5 0.1 –0.1 –1.5 40 –40 10 –10 –400 ±10 50 10 120 Typ. Max. Unit V V V V V V V µA µA µA µA µA µA µA µA Ω PA, PB, PD, VDD = 4.5V, IOL = 1.8mA PE0 to PE1, PE4 to PE6, VDD = 4.5V, IOL = 3.6mA PF0 to PF3, PG7 Low level output voltage VOL PD, PF PF4 to PF7 (SCL0, SCL1, SDA0, SDA1) IIHE IILE Input current IIHT IILT IILR I/O leakage current IIZ EXTAL VDD = 4.5V, IOL = 12.0mA VDD = 4.5V, IOL = 3.0mA VDD = 4.5V, IOL = 4.0mA VDD = 5.5V, VIH = 5.5V VDD = 5.5V, VIL = 0.4V VDD = 5.5V, VIH = 5.5V VDD = 5.5V, VIL = 0.4V VDD = 5.5V, VI = 0, 5.5V VDD = 5.5V, VOH = 12.0V VDD = 5.5V, VOH = 5.5V VDD = 4.5V VSCL0 = VSCL1 = 2.25V VSDA0 = VSDA1 = 2.25V 1/2 frequency dividing clock operation IDD1 VDD = 5.5V, 16MHz crystal oscillation (C1 = C2 = 15pF) VDD = 3.3V, 32MHz crystal oscillation (C1 = C2 = 47pF) Sleep mode IDDS1 VDD VDD = 5.5V, 16MHz crystal oscillation (C1 = C2 = 15pF) VDD = 3.3V, 32MHz crystal oscillation (C1 = C2 = 47pF) Stop mode∗3 VDD = 5.5V, termination of 16MHz and 32MHz oscillation – 11 – — 1.2 18 TEX RST∗1 PA, PB, PD, PE, PG7, RST∗1 PF0 to PF3 PF4 to PF7 SCL0: SCL1 SDA0: SDA1 Open drain I/O ILOH leakage current (in N-ch Tr off state) I2C bus switch connection impedance RBS (in output Tr off state) 28 mA IDD2 30 80 µA Supply current∗2 2.1 mA IDDS2 12 35 µA IDDS3 — — µA CXP86609/86613/86617 Item Input capacitance Symbol CIN Pins Conditions Min. Typ. 10 Max. 20 Unit pF PA, PB, PD, Clock 1MHz PE0 to PE3, PF4 to PF7, 0V for no measured pins PG7, EXTAL, TEX, RST ∗1 For RST pin, specifies the input current when pull-up resistor is selected, and specifies the leakage current when non-resistor is selected. ∗2 When all output pins are left open. ∗3 This device does not enter the stop mode. – 12 – CXP86609/86613/86617 AC Characteristics (1) Clock timing Item System clock frequency System clock input pulse width Symbol fC Pins XTAL EXTAL EXTAL EXTAL EC EC TEX TX TEX TEX (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Conditions Fig. 1, Fig. 2 Fig. 1, Fig. 2 External clock drive Fig. 1, Fig. 2 External clock drive Fig. 3 Fig. 3 VDD = 2.7 to 5.5V Fig. 2 (32kHz clock applied conditions) Fig. 3 Fig. 3 10 20 4tsys∗1 20 Min. 8 28 200 Typ. Max. 16 Unit MHz ns ns ns ms tXL, tXH System clock input rise and fall tCR, times tCF Event count input clock pulse tEH, width tEL Event count input clock rise and tER, fall times tEF System clock frequency Event count input clock input pulse width fC 32.768 kHz tTL, tTH Event count input clock rise and tTR, fall times tTF µs ms ∗1 Indicates three values according to the contents of the clock control register (CLC: 00 FEh) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11") 1/fc VDD – 0.4V EXTAL 0.4V tXH Crystal oscillation Ceramic oscillation tCF tXL tCR Fig. 1. Clock timing External clock 32kHz clock applied condition Crystal oscillation EXTAL C1 XTAL C2 EXTAL XTAL TEX TX 74HC04 C1 C2 Fig.2. Clock applied conditions TEX EC 0.8VDD 0.2VDD tEH tTH tEF tTF tEL tTL tER tTR Fig. 3. Event count clock timing – 13 – CXP86609/86613/86617 (2) Serial transfer Item SCK cycle time SCK High and Low level width SI input setup time (for SCK ↑) SI hold time (for SCK ↑) SCK ↓ → SO delay time Symbol Pins SCK (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Conditions Input mode Output mode SCK SCK input mode SCK output mode SI SCK input mode SCK output mode SI SCK input mode SCK output mode SO SCK input mode SCK output mode Min. 1000 8000/fc 400 4000/fc – 50 100 200 200 100 200 100 Max. Unit ns ns ns ns ns ns ns ns ns ns tKCY tKH tKL tSIK tKSI tKSO Note) The load of SCK output mode and SO output delay time is 50 pF + 1TTL. tKCY tKL tKH 0.8VDD SCK 0.2VDD tSIK tKSI 0.8VDD SI Input data 0.2VDD tKSO 0.8VDD SO 0.2VDD Output data Fig. 4. Serial transfer timing – 14 – CXP86609/86613/86617 (3) A/D converter characteristics Item Resolution Linearity error Zero transition voltage Full-scale transition voltage Conversion time Sampling time Analog input voltage VZT∗1 VFT∗2 Symbol Pins (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Conditions Min. Typ. Max. 8 ±3 Ta = 25°C VDD = 5.0V Vss = 0V –10 4910 26/fADC∗3 6/fADC∗3 10 4970 70 5030 Unit Bits LSB mV mV µs µs VDD V tCONV tSAMP VIAN AN0 to AN5 0 FFh FEh Digital conversion value ∗1 VZT: Value at which the digital conversion value changes from 00h to 01h and vice versa. ∗2 VFT: Value at which the digital conversion value changes from FEh to FFh and vice versa. ∗3 fADC indicates the below values due to the contents of bit 6 (CKS) of the A/D control register (ADC: 00F6h): Linearity error fADC = fc (CKS = "0"), fc/2 (CKS = "1") 01h 00h VZT Analog input VFT Fig. 5. Definitions of A/D converter terms – 15 – CXP86609/86613/86617 (4) Interruption, reset input Item External interruption High, Low level width Reset input Low level width (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Symbol Pins INT0 INT1 INT2 RST Conditions Min. 1 32/fc Max. Unit µs µs tIH tIL tRSL tIH INT0 INT1 INT2 (falling edge) tIL 0.8VDD 0.2VDD Fig. 6. Interruption input timing tRSL RST 0.2VDD Fig. 7. RST input timing – 16 – CXP86609/86613/86617 (5) I2C bus timing Item SCL clock frequency Bus-free time before starting transfer Hold time for starting transfer Clock Low level width Clock High level width Setup time for repeated transfers Data hold time Data setup time SDA, SCL rise time SDA, SCL fall time Setup time for transfer completion (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Symbol fSLC Pins SCL SDA, SCL SDA, SCL SCL SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL 4.7 Conditions Min. 0 4.7 4.0 4.7 4.0 4.7 0∗1 250 1 300 Max. 100 Unit kHz µs µs µs µs µs µs ns µs ns µs tBUF tHD; STA tLOW tHIGH tSU; STA tHD; DAT tSU; DAT tR tF tSU; STO ∗1 The data hold time should be 300ns or more because the SCL rise time (300ns Max.) is not included in it. SDA tBUF tR tF tHD; STA SCL tHD; STA tSU; STA P S tLOW tHD; DAT tHIGH tSU; DAT St tSU; STO P Fig. 8. I2C bus transfer timing I2C device RS SDA0 (or SDA1) SCL0 (or SCL1) RS RS I2C device R S RP RP Fig. 9. I2C device recommended circuit • A pull-up resistor (Rp) must be connected to SDA0 (or SDA1) and SCL0 (or SCL1). • The SDA0 (or SDA1) and SCL0 (or SCL1) series resistance (Rs = 300Ω or less) can be used to reduce the spike noise caused by CRT flashover. – 17 – CXP86609/86613/86617 Appendix (i) Main clock (ii) Main clock (iii) Sub clock EXTAL XTAL Rd EXTAL XTAL Rd C1 TEX TX Rd C2 C1 C2 C1 C2 Fig. 10. Recommended oscillation circuit Manufacture Model CSA10.0MTZ CSA12.0MTZ fc (MHz) 10.0 12.0 16.0 10.0 12.0 16.0 8.0 12.0 16.0 8.0 C1 (pF) 30 5 30 5 18 12 10 10 5 Open 30 C2 (pF) 30 Rd (Ω) Circuit example (i) 5 30 5 18 12 10 10 5 Open 33 120k (iii) 0 ∗1 330 ∗1 (i) 0 ∗1 (ii) MURATA MFG CO., LTD. CSA16.00MXZ040 CST10.0MTW∗ CST12.0MTW∗ CST16.00MXW0C1∗ RIVER ELETEC HC-49/U03 CORPORATION HC-49/U (-S) KINSEKI LTD. P3 12.0 16.0 32.768kHz ∗Models with an asterisk have the built-in ground capacitance (C1, C2). ∗1 The series resistor for XTAL can reduce the effect of the noise caused by the electrostatic discharge. Mask Option Table Item Reset pin pull-up resistor Non-existent Content Existent – 18 – CXP86609/86613/86617 IDD vs. VDD (fc = 16MHz, Ta = 25°C, Typical) 100 IDD vs. fc (VDD = 5V, Ta = 25°C, Typical) 1/2 dividing mode 10 1/4 dividing mode 15 1/2 dividing mode 1/16 dividing mode IDD – Supply current [mA] 1 Sleep mode IDD – Supply current [mA] 10 1/4 dividing mode 0.1 32kHz operation mode 32kHz sleep mode 0.01 5 1/16 dividing mode Sleep mode 1 2 3 4 5 6 7 0 0 5 10 fc – System clock [MHz] 15 VDD – Supply voltage [V] Fig. 11. Characteristic curves – 19 – CXP86609/86613/86617 Package Outline Unit: mm 52PIN SDIP (PLASTIC) + 0.4 47.0 – 0.1 52 27 + 0.3 13.5 – 0.1 + 0.1 .05 0.25 – 0 26 1.778 1 15.24 0° to 15° 0.5 ± 0.1 + 0.1 0.9 – 0.05 PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SDIP-52P-01 SDIP052-P-0600 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER/PALLADIUM PLATING COPPER ALLOY 5.6g – 20 – 2.8 MIN 0.51 MIN 5.0 MIN
CXP86609 价格&库存

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