CXP88220

CXP88216/88220/88224 CMOS 8-bit Single Chip Microcomputer Description The CXP88216/88220/88224 is a CMOS 8-bit microcomputer which consists of A/D converter, serial interface, timer/counter, time base timer, vector interruption, high precision timing pattern generation circuits, PWM generator, PWM for tuner, VISS/VASS circuit, 32kHz timer/event counter, remote control receiving circuit, FDP controller/driver, VCR vertical sync separation circuit and the measuring circuit which measure signals of capstan FG and drum FG/PG and other servo systems, as well as basic configurations like 8-bit CPU, ROM, RAM and I/O port. They are integrated into a single chip. Also, CXP88216/88220/88224 provides sleep/stop function which enables to lower power consumption and ultra-low speed instruction mode in 32kHz operation. 100 pin QFP (Plastic) Structure Silicon gate CMOS IC Features • A wide instruction set (213 instructions) which cover various types of data — 16-bit arithmetic instruction/multiplication and division instructions/boolean bit operation instruction • Minimum instruction cycle During operation 250ns/16MHz, During operation 122µs/32kHz • Incorporated ROM capacity 16Kbytes (CXP88216), 20Kbytes (CXP88220), 24Kbytes (CXP88224) • Incorporated RAM capacity 880bytes • Peripheral function — A/D converter 8-bit, 8-channel, successive approximation system (Conversion time: 20.0µs/16MHz) — Serial I/O with auto transfer mode Incorporated 8-stage FIFO for data (1 to 8 bytes auto transfer) — Timer 8-bit timer/counter, 2-channel, 19-bit time base timer — High precision timing pattern generation circuit PPG 8 pins 32-stage programmable circuit, RTG 5 pins 2-channel — PWM/DA gate output 12-bit, 2-channel (Repetitive frequency 62.5kHz/16MHz) — Servo input control Capstan FG, Drum FG/PG, CTL input — VSYNC separator — FRC capture unit Incorporated 26-bit and 8-stage FIFO — PWM output for tuner 14-bit — VISS/VASS circuit Pulse duty auto detection circuit — 32kHz timer/event counter 32kHz oscillation circuit, ultra-low speed instruction mode — Remote control receiving circuit 8-bit pulse measuring counter, 6-stage FIFO — FDP controller/driver Max.148 segments can be displayed Hardware key scanning function (Max.16 × 3 key matrix available) — Tri-state output PPG 1 pin, RTG 1 pin, output 8 pins — Pseudo HSYNC output function — High speed head switching circuit • Interruption 22 factors, 15 vectors, multi-interruption possible • Standby mode SLEEP/STOP • Package 100-pin plastic QFP • Piggyback/evaluation chip CXP88100 Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E94626-PS PI4/INT1/NMI TX TEX XTAL EXTAL Block Diagram AN0 to AN3 PF0/AN4 to PF7/AN11 PORT A 8 2 SPC700 CPU CORE 4 PORT B A/D CONVERTERCONVERTER CLOCK GENERATOR/ SYSTEM CONTROL 8 NMI PE0/INT0 PE1/INT2 PI4/CS0 PI7/SI0 PI6/SO0 PI5/SCK0 FIFO SERIAL INTERFACE UNIT (CH0) PF6/SI1 PF5/SO1 PF4/SCK1 2 ROM 16k/20k/24k BYTES RAM 880 BYTES PORT C INTERRUPT CONTROLLER SERIAL INTERFACE UNIT (CH1) PE1/EC0 8 BIT TIMER/COUNTER 0 AVREF AVDD AVss Vss VDD MP RST 4 PA0 to PA7 PB0 to PB7 8 PC0 to PC7 8 PD0 to PD7 PORT D EC SELECT PI3/TO/DD0 8 BIT TIMER/COUNTER1 PG4/SYNC0/EC2 PG5/SYNC1 2 2 V SYNC SEPARATOR 2 PORT E PE0 to PE1 6 4 PORT F PG6/EXI0 PG7/EXI1 PE2 to PE7 PF0 to PF3 –2– SERVO INPUT CONTROL 3 FIFO FRC CAPTURE UNIT FIFO 2 2 PROGRAMABLE PATTERN GENERATOR RAM REALTIME PULSE GENERATOR CH0 8 5 CH 1 8 4 CAPSTAN DRUM PRESCALER/ TIME BASE TIMER 4 PF4 to PF7 PG0/CFG PG1/DFG PG2/DPG PG3/PBCTL/EC1 CTL PORT G PI1/RMC REMOCON INPUT 32kHz TIMER/COUNTER 8 PG0 to PG7 VISS/VASS PORT H 3 PH0 to PH2 PI2/PWM 14 BIT PWM GENERATOR 7 PI0 to PI7 RAM PORT I 12 BIT PWM GENERATOR CH0 PE2/PWM0 PE4/DAA0 PE6/DAB0 PE3/PWM1 PE5/DAA0 PE7/DAB1 12 BIT PWM GENERATOR CH1 FDP CONTROLLER /DRIVER PA0/HGO PSEUDO HSYNC GENERATOR 8 8 S0 to S7 T8/S15 to T15/S8 T0 to T7 VFDP CXP88216/88220/88224 PPO0 to PPO7 RTO3 to RTO7 CXP88216/88220/88224 Pin Configuration (Top View) PI3/T0/DDO/ADJ PI4/INT1/NMI/CS0 PH0/KR0 PH1/KR1 PH2/KR2 PB1 PB2 PB3 PB4 PB5 PB6 PB7 VSS NC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 PB0 PC7/RTO7 PC6/RTO6 PC5/RTO5 PC4/RTO4 PC3/RTO3 PC2 PC1 PC0 PA7/PPO7 (HAMP) PA6/PPO6 (ROTA) PA5/PPO5 (RF-PLS) PA4/PPO4 PA3/PPO3 PA2/PPO2 PA1/PPO1 PA0/PPO0/HGO PF7 PF6/SI1 PF5/SO1 PF4/SCK1 PF3/AN7 PF2/AN6 PF1/AN5 PF0/AN4 AN3 AN2 AVREF AVSS AVDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 PI6/SO0 PI7/SI0 VFDP PD0/S0 PD1/S1 PD2/S2 PD3/S3 PD4/S4 PD5/S5 PD6/S6 PD7/S7 T15/S8 T14/S9 T13/S10 T12/S11 T11/S12 T10/S13 T9/S14 T8/S15 T7 T6 T5 T4 T3 T2 T1 T0 PE0/INT0 (ENV-DET) PE1/EC0/INT2 PE2/PWM0 TX TEX VDD PI1/RMC PI2/PWM Note) 1. NC (Pin 90) is always connected to VDD. 2. Vss (Pins 41 and 88) are both connected to GND. PG4/SYNC0/EC2 PG3/PBCTL/EC1 PG5/SYNC1 –3– PE3/PWM1 PE7/DAB1 PE6/DAB0 PE5/DAA1 PE4/DAA0 PG7/EXI1 PG6/EXI0 PG2/DPG PG1/DFG PG0/CFG EXTAL XTAL RST AN1 AN0 VSS MP PI5/SCK0 CXP88216/88220/88224 Pin Description Symbol PA0/PPO0 /HGO PA1/PPO1 PA2/PPO2 PA3/PPO3 PA4/PPO4 PA5/PPO5 PA6/PPO6 PA7/PPO7 PB0 to PB7 PC0 to PC2 PC3/PPO3 to PC7/PPO15 T0 to T7 T8/S15 to T15/S8 PD0/S0 to PD7/S7 PE0/INT0 Output Output Output/ Real time output 8-bit output port. Tri-state can be controlled. (8 pins) (Port C) 8-bit I/O port. Enable to specify I/O by bit unit. Data is gated with RTO content by OR-gate and they are output. (8 pins) Output/ Real time output I/O/ Real time output I/O Output/Real time output/Output (Port A) 8-bit I/O port. Enable to specify I/O by bit unit. Data is gated with PPO content by OR-gate and they are output. (8 pins) Description Pseudo HSYNC output pin. Programable pattern generator (PPG) output. Functions as high precision realtime pulse output port. (8 pins) Head switching output pins. Real-time pulse generator (RTG) output. Functions as high precision real-time pulse output port. (5 pins) Output Output/Output FDP timing signal output pin. Output pins for FDP timing signal and segment signal. (Port D) 8-bit output port. (8 pins) Output/Output FDP segment signal output pin. Trigger pulse Input pin to request input pin for head external interruption. switching output. Active when falling edge. Input/Input PE1/EC0/ INT2 PE2/PWM0 PE3/PWM1 PE4/DAA0 PE5/DAA1 PE6/DAB0 PE7/DAB1 AN0 to AN3 PF0/AN0 to PF3/AN3 PF4/SCK1 PF5/SO1 PF6/SI1 PF7 Input/Input/Input Output/Output Output/Output Output/Output Output/Output Output/Output Output/Output Input Input/Input I/O/I/O I/O/Output I/O/Input I/O (Port E) 8-bit port. Lower 2 bits are input pins and upper 6 bits are output pins. (8 pins) External event input pin for timer/counter. PWM output pins. (2 pins) Input pin to request external interruption. Active when falling edge. DA gate pulse output pins. (2 pins) Analog input pins to A/D converter. (8 pins) (Port F) Serial clock (CH1) I/O pin. 8-bit I/O port. Enable to specify I/O by bit unit. Serial data (CH1) output pin. (8 pins) Serial data (CH1) input pin. –4– CXP88216/88220/88224 Symbol PG0/CFG PG1/DFG PG2/DPG PG3/ PBCTL/EC1 PG4/ SYNC0/EC2 PG5/SYNC1 PG6/EXI0 PG7/EXI1 PH0/KR0 to PH2/KR2 PI1/RMC PI2/PWM PI3/TO/ DDO/ADJ PI4/INT1/ NMI/CS0 PI5/SCK0 PI6/SO0 PI7/SI0 EXTAL XTAL TEX TX RST MP VFDP AVDD AVREF AVss VDD Vss Input I/O Input/Input Input/Input Input/Input Input/Input/Input (Port G) 8-bit input port. (8 pins) Description Capstan FG input pin. Drum FG input pin. Drum PG input pin. Playback CTL input pin. External event input pin for timer/counter. External event input pin for timer/counter. Input/Input/Input Input/Input Input/Input Input/Input Composite sync signal input pins. External input pins for FRC capture unit. (Port H) 3-bit I/O port. (3 pins) I/O/Input Key return input signal for key scanning at FDP segment signal. Remote control receiving circuit input pin. 14-bit PWM output pin. I/O/Input I/O/Input I/O/Output/Output/ Output I/O/Input/ Input/Input I/O/Input I/O/Output I/O/Input Input Output Input Output Input Input (Port I) 8-bit I/O port. Enable to specify I/O by bit unit. (8 pins) Timer/counter, CTL duty detection, 32kHz oscillation adjustment output pin. Input pin to request external interruption, non-maskable interruption and for serial chip select (CH0). Active when falling edge. Serial clock (CH1) I/O pin. Serial data (CH1) output pin. Serial data (CH1) input pin. Connecting pin of crystal oscillator for system clock. When supplying the external clock, input the external clock to EXTAL pin and input opposite phase clock to XTAL pin. Connecting pin of crystal oscillator for 32kHz timer clock. When used as event counter, input to TEX pin and leave TX pin open. (Feedback resistor is not removed.) System reset pin of active "L" level. Microprocessor mode input pin. Always connect to GND. FDP voltage supply pin when specifying internal resistor by mask option. Positive power supply pin of A/D converter. Reference voltage input pin of A/D converter. GND pin of A/D converter. Positive power supply pin. GND pin. Connect both Vss pins to GND. –5– CXP88216/88220/88224 Input/Output Circuit Formats for Pins Pin Port A HSEL HOUT PPO0 Circuit format When reset MPX PA0/PPO0/HGO PA0 Hi-Z Data bus RD (Port A) HSEL HOUTE MPX 1 pin Output becomes active from high impedance by data writing to port register. PPO1 PPG control status register bit 0 Tri-state control selection PPO1 PA1/PPO1 PA0 PA1 direction (Every bit) Data bus IP Input protection circuit Hi-Z 1 pin Port A RD (Port A) PPO data PA2/PPO2 to PA4/PPO4 Port A data IP (Every bit) Data bus Input protection circuit Hi-Z Port A direction 3 pins Port A RD (Port A) PPO data PA5/PPO5 to PA7/PPO7 Data bus Port A data Hi-Z RD (Port A) 3 pins Output becomes active from high impedance by data writing to port register. –6– CXP88216/88220/88224 Pin Port B Port B data Circuit format When reset PB0 to PB7 Data bus RD (Port B) Port B tri-state control Hi-Z 8 pins Port C PC0 to PC2 Port C data Input protection IP circuit (Every bit) Data bus Hi-Z Port C direction 3 pins Port C RD (Port C) RTO3 Input protection circuit IP (Every bit) Data bus PC3/RTO3 PC3 PC3 direction Hi-Z 1 pin Data bus RD (Port C) RD (Port C) RTO4 RTG interruption control register bit 7 Tri-state control selection RTO4 PC3/RTO4 PC4 PC4 direction (Every bit) Data bus RD (Port C) Data bus IP Input protection circuit Hi-Z 1 pin RD (Port C) –7– CXP88216/88220/88224 Pin Port C RTO data Circuit format When reset PC5/RTO5 to PC7/RTO7 Port C data Port C direction (Every bit) Data bus IP Input protection circuit Hi-Z 3 pins RD (Port C) Port D Segment output data High voltage drive transistor PD0/S0 to PD7/S7 Output selection control signal ("0" when reset) Port D data OP Mask option Hi-Z Data bus Pull-down resistor RD (Port D) VFDP 8 pins High voltage drive transistor Timing output data Output selection control signal ("0" when reset) OP Mask option T0 to T7 Hi-Z Pull-down resistor 8 pins VFDP Timing output data High voltage drive transistor T8/S15 to T15/S8 Output selection control signal ("0" when reset) Segment output data OP Mask option Hi-Z Pull-down resistor VFDP 8 pins –8– CXP88216/88220/88224 Pin Port E PE0/INT0 PE1/EC0/INT2 2 pins Port E Circuit format Schmitt input IP When reset Hi-Z Data bus RD (Port E) Port E function select PE2/PWM0 PE3/PWM1 PE4/DAA0 PE5/DAA1 DA gate output or PWM output MPX Hi-Z Port E data Data bus 4 pins RD (Port E) Hi-Z control Port E Port E function select PE6/DAB0 PE7/DAB1 DA gate output MPX High level Port E data Data bus 2 pins Port F PF0/AN4 to PF3/AN7 4 pins Port F Hi-Z control RD (Port E) Input multiplexer IP To A/D converter Hi-Z Port F function select RD (Port F) SCK1 output enable From serial interface MPX Port F data Data bus PF4/SCK1 IP Port F direction Hi-Z Data bus 2 pins RD (Port F) To serial interface Schmitt input –9– CXP88216/88220/88224 Pin Port F Circuit format Port F output selection When reset From serial interface MPX PF5/SO1 Port F data Hi-Z Port F direction IP Data bus RD (Port F) 1 pin To serial interface Port F Port F data PF6/SI1 Data bus Port F direction Hi-Z IP RD (Port F) Schmitt input 1 pin Port F To serial interface Port F data PF7 Data bus Port F direction Hi-Z IP RD (Port F) 1 pin PG0/CFG PG1/DFG PG2/DPG PG3/PBCTL/ EC1 PG4/SYNC0/ EC2 PG5/SYNC1 PG6/EXI0 PG7/EXI1 8 pins Port G To serial interface Schmitt input IP Data bus RD (Port G) Note) For PG4/SYNC and PG5/SYNC1, CMOS schmitt input or TTL schmitt input can be selected with the mask option. Hi-Z – 10 – CXP88216/88220/88224 Pin Port I Port I function select Circuit format When reset PI2/PWM PI3/TO/ DDO/ADJ PI2: From 14-bit PWM, timer/counter PI3: From CTL duty detection circuit, 32kHz timer Port I data Port I direction MPX Hi-Z IP Data bus 2 pins Port I RD (Port I) Port I data PI1/RMC PI4/INT1/ NMI/CS0 PI7/SI0 Port I direction IP Hi-Z Data bus RD (Port I) PI1: To remote control circuit PI4: To interruption circuit PI3: To serial CH0 3 pins Port I Port I function select From serial CH0 Port I data Port I direction MPX Note) P15 is schmitt input RD (Port I) To SI0 Schmitt input PI5/SCK0 PI6/SO0 MPX Hi-Z IP Data bus 2 pins Port H Port H data PH0/KR0 to PH2/KR2 Data bus Port H direction Hi-Z IP RD (Port H) 3 pins Key input signal – 11 – CXP88216/88220/88224 Pin Circuit format When reset EXTAL XTAL EXTAL IP • Shows the circuit composition during oscillation. • Feedback resistor is removed during stop. Hi-Z 2 pins XTAL • Shows the circuit composition during oscillation. TEX TX TEX IP • Feedback resistor is removed during 32kHz oscillation circuit stop by software. At this time TEX pin outputs "L" level and TX pin outputs "H" level. Oscillation 2 pins TX RST Mask option OP Pull-up resistor Schmitt input 1 pin IP Hi-Z or Pull up MP IP CPU mode Hi-Z 1 pin – 12 – CXP88216/88220/88224 Absolute Maximum Ratings Item Symbol VDD Supply voltage AVDD AVSS Input voltage Output voltage Display output voltage VIN VOUT VOD IOH High level output current IODH1 IODH2 High level total output current Low level output current ∑IOH ∑IODH IOL Rating –0.3 to +7.0 AVss to +7.0∗1 –0.3 to +0.3 –0.3 to +7.0∗2 –0.3 to +7.0∗2 VDD – 40 to VDD + 0.3 –5 –15 –35 –50 –100 15 130 –20 to +75 –55 to +150 600 Unit V V V V V V mA mA mA mA mA mA mA °C °C mW Total for all outputs Remarks (Vss = 0V) As P-channel transistor is open drain, VDD is reference. All pins excluding display outputs (value per pin)∗3 Display outputs S0 to S7 (value per pin) Display outputs T0 to T7, and T8/S15 to T15/S8 (value per pin) Total for all pins excluding display outputs Total for all display outputs Low level total output current ∑IOL Operating temperature Storage temperature Allowable power dissipation Topr Tstg PD ∗1 AVDD and VDD should be set to a same voltage. ∗2 VIN and VOUT should not exceed VDD + 0.3V. ∗3 It specifies output current of general-purpose I/O port. Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should better take place under the recommended operating conditions. Exceeding those conditions may adversely affect the reliability of the LSI. – 13 – CXP88216/88220/88224 Recommended Operating Conditions Item Symbol Min. 4.5 3.5 2.7 2.5 Analog power supply AVDD VIH High level input voltage VIHS VIHTS VIHEX VIL Low level input voltage VILS VILTS VILEX Operating temperature Topr 4.5 0.7VDD 0.8VDD 2.2 VDD – 0.4 0 0 0 –0.3 –20 Max. 5.5 5.5 5.5 5.5 5.5 VDD VDD VDD VDD + 0.3 0.3VDD 0.2VDD 0.8 0.4 +75 V V V V V V V V V °C Unit Remarks (Vss = 0V) Guaranteed range during high speed mode (1/2 dividing clock) operation V Guaranteed range during low speed mode (1/16 dividing clock) operation Guaranteed operation range by TEX clock Guaranteed data hold operation range during STOP ∗1 ∗2 CMOS schmitt input∗3 TTL schmitt input∗4 EXTAL pin∗5 TEX pin∗6 ∗2 CMOS schmitt input∗3 TTL schmitt input∗4 EXTAL pin∗5 TEX pin∗6 Supply voltage VDD ∗1 AVDD and VDD should be set to a same voltage. ∗2 Normal input port (each pin of PA1 to PA4, PC, PF0 to PF3, PF5, PF7, PH, PI2, PI3 and PI6), MP pin ∗3 Each pin of RST, PE0/INT0, PE1/EC0/INT2, PF4/SCK1, PF6/SI1, PI1/RMC, PI4/CS0/NMI/INT1, PI5/SCK0, PI7/SI1 and PG (For PG4 and PG5, when CMOS schmitt input is selected with mask option) ∗4 Each pin of PG4 and PG5 (When TTL schmitt input is selected with mask option) ∗5 It specifies only when the external clock is input. ∗6 It specifies only when the external event is input. – 14 – CXP88216/88220/88224 DC Characteristics Item Symbol Pin PA to PC, PE PF4 to PF7, PH, PI1 to PI7, RST∗1 (VOL only) S0 to S7 Display output current IOH S8/T15 to S15/T8, T0 to T7 S0 to S7, S8/T15 to S15/T8, T0 to T7 S0 to S7, S8/T15 to S15/T8, T0 to T7 EXTAL VDD = 4.5V, VOH = VDD – 2.5V Condition VDD = 4.5V, IOH = –0.5mA VDD = 4.5V, IOH = –1.2mA VDD = 4.5V, IOL = 1.8mA VDD = 4.5V, IOL = 3.6mA (Ta = –20 to +75°C, Vss = 0V) Min. 4.0 3.5 0.4 0.6 –8 –20 Typ. Max. Unit V V V V mA mA High level VOH output voltage Low level VOL output voltage Open drain output leakage current (P-CH ILOL Tr OFF in Pull-down resistor∗3 RL VDD = 5.5V, VOL = VDD – 35V VFDP = VDD – 35V –20 µA VDD = 5V, VOD – VFDP = 30V VDD = 5.5V, VIH = 5.5V 60 100 270 kΩ IIHE Input current 0.5 –0.5 0.1 –0.1 –1.5 40 –40 10 –10 –400 µA µA µA µA µA VDD = 5.5V, VIL = 0.4V VDD = 5.5V, VIH = 5.5V IILE IILR TEX RST∗2 VDD = 5.5V, VIL = 0.4V I/O leakage current IIZ PA to PC, PE to PI, AN1 to AN3, VDD = 5.5V, VI = 0, 5.5V MP, RST∗2 16MHz crystal oscillation (C1 = C2 = 15pF), VDD = 5V ± 10%∗5 16MHz crystal oscillation (C1 = C2 = 15pF), VDD = 5V ± 10%, SLEEP mode VDD, Vss 32kHz crystal oscillation (C1 = C2 = 47pF), VDD = 3V ± 10% 32kHz crystal oscillation (C1 = C2 = 47pF), VDD = 3V ± 10%, SLEEP mode VDD = 5.5V, STOP mode (32kHz, 16MHz oscillation stop) Other than S0 to S15, T0 to T7, Clock 1MHz PA0, PA5 to PA7 0V other than the measured pins PE2 to PE7 PB, VDD, Vss AVDD, AVss 23 1.2 38 7 ±10 µA IDD1 IDDS1 Supply current∗4 IDD2 IDDS2 IDDS3 45 8 100 30 10 mA mA µA µA µA Input capacity CIN 10 20 pF – 15 – CXP88216/88220/88224 ∗1 RST pin is specified when evaluation mode is in use. ∗2 RST pin specifies the input current when the pull-up resistor is selected, and specifies leakage current when non-resistor is selected. ∗3 When built-in pull-down resistor is selected with mask option. ∗4 When entire output pins are open. ∗5 When setting upper 2 bits (CPU clock selection) of clock control register CLC (address: 0002FEH) to "00" and operating in high speed mode (1/2 dividing clock). AC Characteristics (1) Clock timing Item System clock frequency System clock input pulse width System clock input rise and fall times Event count clock input pulse width Event count clock input rise and fall times System clock frequency Event count clock input pulse width Event count clock input rise and fall times Symbol fC Pin XTAL EXTAL XTAL EXTAL XTAL EXTAL (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V) Condition Fig. 1, Fig. 2 Fig. 1, Fig. 2 External clock drive Fig. 1, Fig. 2 External clock drive Min. 1 28 200 Typ. Max. 16 Unit MHz ns ns ns 20 ms tXL, tXH tCR, tCF tEH, tEL tER, tEF fC EC0, EC1, Fig. 3 EC2 EC0, EC1, Fig. 3 EC2 TEX TX TEX TEX VDD = 2.7 to 5.5V Fig. 2 (32kHz clock applying condition) Fig. 3 Fig. 3 tsys + 200∗ 32.768 kHz tTL, tTH tTR, tTF 10 20 µs ms ∗ tsys indicates three values according to the contents of the clock control register (address; 00FEH) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11") Fig. 1. Clock timing 1/fc EXTAL XTAL VDD – 0.4V 0.4V tXH tCF tXL tCR Fig. 2. Clock applying condition Crystal oscillation Ceramic oscillation External clock 32kHz clock applying condition Crystal oscillation EXTAL XTAL EXTAL XTAL TEX TX C1 C2 74HC04 C1 C2 – 16 – CXP88216/88220/88224 Fig. 3. Event count clock timing TEX EC0 EC1 EC2 tEH tTH tEF tTF tEL tTL tER tTR 0.8VDD 0.2VDD (2) Serial transfer (CH0) Item CS0 ↓ → SCK0 delay time CS0 ↑ → SCK0 floating delay time CS0 ↓ → SO0 delay time CS0 ↑ → SO0 floating delay time CS0 high level width SCK0 cycle time SCK0 high and low level widths SI0 input set-up time (against SCK0 ↑) SI0 input hold time (against SCK0 ↑) SCK0 ↓ → SO0 delay time Symbol Pin SCK0 (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V) Condition Chip select transfer mode (SCK0 = output mode) Chip select transfer mode (SCK0 = output mode) Chip select transfer mode Chip select transfer mode Chip select transfer mode Input mode SCK0 Output mode Input mode SCK0 Output mode SCK0 input mode SI0 SCK0 output mode SCK0 input mode SI0 SCK0 output mode SCK0 input mode SO0 SCK0 output mode tsys + 200 2tsys + 200 16000/fc Min. Max. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns tDCSK tsys + 200 tsys + 200 tsys + 200 tsys + 200 tDCSKF SCK0 tDCSO SO0 tDCSOF SO0 tWHCS CS0 tKCY tKH tKL tSIK tKSI tKSO tsys+100 8000/fc – 50 100 200 tsys + 200 100 tsys + 200 100 ns ns Note 1) tsys indicates three values according to the contents of the clock control register (address; 00FEH) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11") Note 2) The load of SCK0 output mode and SO0 output delay time is 50pF + 1TTL. – 17 – CXP88216/88220/88224 Fig. 4. Serial transfer CH0 timing tWHCS 0.8VDD CS0 0.2VDD tKCY tDCSK tKL tKH tDCSKF 0.8VDD SCK0 0.2VDD 0.8VDD tSIK tKSI 0.8VDD SI0 Input data 0.2VDD tDCSO tKSO tDCSOF 0.8VDD SO0 Output data 0.2VDD – 18 – CXP88216/88220/88224 Serial transfer (CH1) Item SCK1 cycle time SCK1 high and low level widths SI1 input set-up time (against SCK1 ↑) SI1 input hold time (against SCK1 ↑) SCK1 ↓ → SO1 delay time Symbol Pin SCK1 (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V) Condition Input mode Output mode SCK1 Input mode Output mode SI1 SCK1 input mode SCK1 output mode SI1 SCK1 input mode SCK1output mode SO1 SCK1 input mode SCK1 output mode Min. 1000 16000/fc 400 8000/fc – 50 100 200 200 100 200 100 Max. Unit ns ns ns ns ns ns ns ns ns ns tKCY tKH tKL tSIK tKSI tKSO Note) The load of SCK1 output mode and SO1 output delay time is 50pF + 1TTL. Fig. 5. Serial transfer CH1 timing tKCY tKL tKH 0.8VDD SCK1 0.2VDD tSIK tKSI 0.8VDD SI1 Input data 0.2VDD tKSO 0.8VDD SO1 0.2VDD Output data – 19 – CXP88216/88220/88224 (3) A/D converter characteristics Item Resolution Linearity error Absolute error Conversion time Sampling time Reference input voltage Analog input voltage Symbol (Ta = –20 to +75°C, VDD = AVDD = 4.5 to 5.5V, AVREF = 4.0 to AVDD, Vss = AVss = Pin Condition Only for A/D converter operation Ta = 25°C VDD = AVDD = AVREF = 5.0V Min. Typ. Max. 8 ±1 ±2 Unit Bits LSB LSB µs µs tCONV tSAMP VREF VIAN AVREF AN0 to AN7 Operation mode AVREF = 4.0 to 5.5V 160/fADC 12/fADC VDD = AVDD = 4.5 to 5.5V AVDD – 0.5 0 0.6 AVDD AVREF 1.0 V V mA AVREF current IREF AVREF SLEEP mode STOP mode 32kHz operation mode 10 µA Fig. 6. Definitions of A/D converter terms FFH FEH Digital conversion value ∗ The value of fADC is as follows by selecting ADC operation clock (MSC: Address 01FEH bit 0). When PS2 is selected, fADC = fc/2 When PS1 is selected, fADC = fc Linearity error 01H 00H VZT Analog input VFT – 20 – CXP88216/88220/88224 (4) Interruption, reset input Item External interruption high and low level widths Reset input low level width (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V) Symbol Pin INT0 INT1 INT2 NMI RST Condition Min. Max. Unit tIH tIL tRSL 1 µs 32/fc µs Fig. 7. Interruption input timing tIH INT0 INT1 INT2 NMI (Falling edge) tIL 0.8VDD 0.2VDD Fig. 8. Reset input timing tRSL RST 0.2VDD (5) Others Item CFG input high and low level widths DFG input high and low level widths DPG minimum pulse width DPG minimum removal time PBCTL input high and low level widths EXI input high and low level widths Symbol Pin CFG DFG DPG DPG PBCTL EXI0 EXI1 (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V) Condition Min. Max. Unit ns ns ns ns ns ns tCFH tCFL tDFH tDFL tDPW trem tCTH tCTL tEIH tEIL tFRC × 24 + 200 tFRC × 16 + 200 tFRC × 8 + 200 tFRC × 16 + 200 tsys = 2000/fc tsys = 2000/fc tFRC × 8 + tsys + 200 tFRC × 8 + tsys + 200 Note 1) tsys indicates three values according to the contents of the clock control register (address; 00FEH) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11") Note 2) tFRC = 1000/fc (ns) – 21 – CXP88216/88220/88224 Fig.9. Other timings tCFH tCFL 0.8VDD CFG 0.2VDD tDFH tDFL 0.8VDD DFG 0.2VDD trem tDPW trem 0.8VDD DPG tCTH tCTL 0.8VDD PBCTL 0.2VDD tEIH tEIL EXI0 EXI1 0.8VDD 0.2VDD – 22 – CXP88216/88220/88224 Supplement Fig.10. Recommended oscillation circuit (i) (ii) EXTAL XTAL Rd TEX TX Rd C1 C2 C1 C2 Manufacturer Model fc (MHz) 8.00 C1 (pF) 10 C2 (pF) 10 Rd (Ω) Circuit example RIVER ELETEC CO., LTD. HC-49/U03 10.00 12.00 16.00 8.00 16 (12) 16 (12) 12 12 30 16 (12) 16 (12) 12 12 18 15 15 0 (i) 0 (i) 0 0 470k (ii) HC-49/U (-S) KINSEKI LTD. 10.00 12.00 16.00 P3 32.768kHz Mask option table Item Reset pin pull-up resistor High voltage drive output port pull-down resistor Input circuit format∗ Non-existent Non-existent CMOS schmitt Content Existent Existent TTL schmitt ∗ In PG4/SYNC0/EC2 pin and PG5/SYNC1 pin, the input circuit format can be selected every pin. – 23 – CXP88216/88220/88224 Characteristics Curve IDD vs. VDD (fc = 16MHz, Ta = 25°C, Typical) 20.0 10.0 1/2 dividing mode 1/4 dividing mode 1/16 dividing mode 20 IDD vs. fc (VDD = 5V, Ta = 25°C, Typical) 1/2 dividing mode IDD – Supply current [mA] 5.0 SLEEP mode 1.0 0.5 32kHz mode (Instruction) 32kHz SLEEP mode IDD – Supply current [mA] 15 1/4 dividing mode 10 0.1 (100µA) 0.05 (50µA) 5 0.01 (10µA) 2 3 4 5 6 7 0 5 10 fc – System clock [MHz] 1/16 dividing mode SLEEP mode 16 VDD – Supply voltage [V] – 24 – CXP88216/88220/88224 Package Outline Unit: mm 100PIN QFP (PLASTIC) + 0.1 0.15 – 0.05 23.9 ± 0.4 + 0.4 20.0 – 0.1 + 0.4 14.0 – 0.01 17.9 ± 0.4 15.8 ± 0.4 A 0.65 ±0.12 M + 0.35 2.75 – 0.15 0.15 0° to 15° DETAIL A 0.8 ± 0.2 (16.3) PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE QFP-100P-L01 ∗QFP100-P-1420-A LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER PLATING COPPER / 42 ALLOY 1.4g – 25 –