CXP922P032
CMOS 16-bit Single Chip Microcomputer For the availability of this product, please contact the sales office.
Description The CXP922P032 is a CMOS 16-bit microcomputer integrating on a single chip an A/D converter, serial interface, timer, remote control receive circuit, PWM output circuit, and as well as basic configurations like a 16-bit CPU, PROM, RAM, and I/O port. This LSI also provides the sleep/stop functions that enable lower power consumption. The CXP922P032 is the PROM-incorporated version of the CXP922032 with built-in mask ROM. This provides the additional feature of being able to write directly into the program. Thus, it is most suitable for evaluation use during system development and for small-quantity production. 100 pin QFP (Plastic)
Features • An efficient instruction set as a controller — Direct addressing, numerous abbreviated forms, multiplication and division instructions • Instruction sets for C language and RTOS — Highly quadratic instruction system, general-purpose register of eight 16-bit × 16-bank configuration • Minimum instruction cycle 100ns/20MHz operation (3.0 to 5.5V) 167ns/12MHz operation (2.7 to 5.5V) • Incorporated PROM capacity 128K bytes • Incorporated RAM capacity 7680 bytes • Peripheral functions — A/D converter 8-bit 8 analog input, successive approximation system (Conversion time: 12.4µs at 20MHz) — Serial interface Asynchronous serial interface (Simple UART) 128-byte buffer RAM,3 channels — Timers 8-bit timer/counter, 2 channels (with timing output) 16-bit capture timer/counter (with timing output) 16-bit timer, 4 channels — Remote control receive circuit 8-bit pulse measurement counter, 8-stage FIFO — PWM output circuit 14-bit, 1 channel • Interruption 24 factors, 24 vectors, multi-interruption and priority selection possible • Standby mode Sleep/stop • Package 100-pin plastic QFP • Piggy/evaluation chip CXP922000 • Mask ROM CXP922032 Structure Silicon gate CMOS IC
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E99937-PS
Block Diagram
KS0 to KS6
NMI
AVSS
AVREF
AVDD
INT0 to INT4
EXTAL XTAL RST VDD VSS VPP
5 PORT A 8
7 PA0 to PA7
AN0 to AN7 2 SPC950 CPU CORE CLOCK GENERATOR/ SYSTEM CONTROLLER
8
A/D CONVERTER
RxD TxD
UART
8
PB0 to PB7
RMC
REMOCON
FIFO
PORT B
PWM
14-BIT PWM GENERATOR
SERIAL INTERFACE UNIT (CH0) PROM 128K BYTES RAM 7680 BYTES
BUFFER RAM
PORT C
8
PC0 to PC7
PORT E
SERIAL INTERFACE UNIT (CH1)
BUFFER RAM
INTERRUPT CONTROLLER
PORT D
8
PD0 to PD7
CS0 SI0 SO0 SCK0 CS1 SI1 SO1 SCK1 CS2 SI2 SO2 SCK2 EC0 2 4 PRESCALER/ TIME-BASE TIMER
8-BIT TIMER/COUNTER (CH0)
4CH 16-BIT TIMER
PORT G
TO0
8-BIT TIMER (CH1)
PORT F
CINT EC1 TO1
16-BIT CAPTURE TIMER/COUNTER (CH4)
PORT H
PORT I
PORT J
–2–
8
PE0 to PE7
SERIAL INTERFACE UNIT (CH2)
BUFFER RAM
6 2
PF0 to PF5 PF6, PF7
8
PG0 to PG7
8
PH0 to PH7
8
PI0 to PI7
7
PJ0 to PJ6
CXP922P032
CXP922P032
Pin Assignment (Top View) 100-pin QFP package
PJ6/KS6 PJ5/KS5 PJ4/KS4 PJ3/KS3 PJ2/KS2 PJ1/KS1 PJ0/KS0
PB1
PB0
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
VDD
VSS
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
VPP
PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 VSS PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PE0 PE1 PE2 PE3 PE4 PE5 PE6
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
PI7/RMC PI6/CINT PI5/EC1 PI4/EC0 PI3 PI2 PI1/RxD PI0/TxD PH7/SCK2 PH6/SO2 PH5/SI2 PH4/CS2 PH3/SCK1 PH2/SO1 PH1/SI1 PH0/CS1 VSS SCK0 SO0 SI0 CS0 PG7 PG6 PG5 PG4 AVDD AVREF AVSS PG3/AN7 PG2/AN6
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
VSS
VDD
PG0/AN4
PF0/INT0
PF1/INT1
PF2/INT2
PF3/INT3
PF4/INT4
Notes) 1. Do not make any connections to VPP (Pin 88). 2. VSS (Pins 15, 41, 64 and 90) must be connected to GND. 3. VDD (Pins 44 and 89) must be connected to VDD. –3–
PF7/TO1/PWM
PG1/AN5
PE7
PF5/NMI
AN0
AN1
AN2
XTAL
PF6/TO0
EXTAL
RST
AN3
CXP922P032
Pin Functions Symbol I/O Functions (Port A) 8-bit I/O port. I/O can be specified in 1-bit units. Pull-up resistor is present or not through program in 4-bit units. (8 pins) (Port B) 8-bit I/O port. I/O can be specified in 1-bit units. Pull-up resistor is present or not through program in 4-bit units. (8 pins) (Port C) 8-bit I/O port. I/O can be specified in 1-bit units. Pull-up resistor is present or not through program in 4-bit units. (8 pins) (Port D) 8-bit I/O port. I/O can be specified in 1-bit units. Pull-up resistor is present or not through program in 4-bit units. Can drive 12mA sink current (VDD = 4.5 to 5.5V). (8 pins) (Port E) 8-bit I/O port. I/O can be specified in 1-bit units. Pull-up resistor is present or not through program in 4-bit units. Can drive 12mA sink current (VDD = 4.5 to 5.5V). (8 pins) External interrupt inputs. (4 pins) Non-maskable interrupt input. 8-bit timer/counter output. 16-bit capture timer/ counter output. 14-bit PWM output.
PA0 to PA7
I/O
PB0 to PB7
I/O
PC0 to PC7
I/O
PD0 to PD7
I/O
PE0 to PE7
I/O
PF0/INT0 to PF4/INT4 PF5/NMI PF6/TO0 PF7/TO1/ PWM AN0 to AN3 PG0/AN4 to PG3/AN7 PG4 to PG7 CS0 SI0 SO0 SCK0
Input / Input
(Port F) 8-bit port. Input / Input Lower 6 bits are for input; Output / Output upper 2 bits are for output. Output / Output / (6 pins) Output Input
Analog input for A/D converter. (4 pins) (Port G) 8-bit I/O port. I/O can be specified in 1-bit units. Pull-up resistor is present or not through program in 4-bit units. (8 pins) Serial chip select (CH0) input. Serial data (CH0) input. Serial data (CH0) output. Serial clock (CH0) I/O. –4– Analog input for A/D converter. (4 pins)
I/O / Input
I/O Input Input Output I/O
CXP922P032
Symbol PH0/CS1 PH1/SI1 PH2/SO1 PH3/SCK1 PH4/CS2 PH5/SI2 PH6/SO2 PH7/SCK2 PI0/TxD PI1/RxD PI2 to PI3 PI4/EC0 PI5/EC1 PI6/CINT PI7/RMC
I/O I/O / Input I/O / Input I/O / Output I/O / I/O I/O / Input I/O / Input I/O / Output I/O / I/O I/O / Output I/O / Input I/O I/O / Input I/O / Input I/O / Input I/O / Input (Port I) 8-bit I/O port. I/O can be specified in 1-bit units. Pull-up resistor is present or not through program in 4-bit units. (8 pins) (Port H) 8-bit I/O port. I/O can be specified in 1-bit units. Pull-up resistor is present or not through program in 4-bit units. (8 pins)
Functions Serial chip select (CH1) input. Serial data (CH1) input. Serial data (CH1) output. Serial clock (CH1) I/O. Serial chip select (CH2) input. Serial data (CH2) input. Serial data (CH2) output. Serial clock (CH2) I/O. UART transmission data output. UART reception data input.
External event input for 8-bit timer/counter. External event input for 16-bit capture timer/ counter. External capture input for 16-bit capture timer/ counter. Remote control receive circuit input.
PJ0/KS0 to PJ6/KS6
I/O / Input
(Port J) 7-bit I/O port. I/O can be specified in 1-bit units. Standby release input function can be specified Pull-up resistor is present in 1-bit units. or not through (7 pins) program in lower 4-bit units and upper 3-bit units. (7 pins) Connects a crystal for system clock oscillation. (When the clock is supplied externally, input it to EXTAL and input an opposite phase clock to XTAL.) System reset. Active at "L" level. Positive power supply for A/D converter.
EXTAL XTAL RST AVDD AVREF AVSS VDD VSS VPP
Input
Input
Input
Reference voltage input for A/D converter. GND for A/D converter. Positive power supply. (Connect both VDD pins to positive power supply.) GND (Connect all four VSS pins to GND.) Positive power supply pin used for writing inorporated PROM. (Do not make any cunnection to NC.)
–5–
CXP922P032
I/O Circuit Format for Pins Pin Circuit format After a reset
PUL0 register "0" after a reset
∗
PA register Undefined after a reset
PA0 to PA7
PAD register "0" after a reset Internal data bus ∗ Pull-up transistor IP Input protection circuit
Hi-Z
RD
approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V)
PUL0 register "0" after a reset
∗
PB register Undefined after a reset
PB0 to PB7
PBD register "0" after a reset Internal data bus RD ∗ Pull-up transistor IP
Hi-Z
approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V)
PUL0 register "0" after a reset
∗
PC register Undefined after a reset
PC0 to PC7
PCD register "0" after a reset Internal data bus RD ∗ Pull-up transistor IP
Hi-Z
approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V)
–6–
CXP922P032
Pin
Circuit format
After a reset
PUL0 register "0" after a reset
∗1
PD register Undefined after a reset ∗2 IP
PD0 to PD7
PDD register "0" after a reset Internal data bus RD
Hi-Z
∗1 Pull-up transistor approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V) ∗2 Large current drive 12mA (VDD = 4.5 to 5.5V) 4.5mA (VDD = 3.0 to 3.6V)
PUL1 register "0" after a reset
∗1
PE register Undefined after a reset ∗2 IP
PE0 to PE7
PED register "0" after a reset Internal data bus RD
Hi-Z
∗1 Pull-up transistor approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V) ∗2 Large current drive 12mA (VDD = 4.5 to 5.5V) 4.5mA (VDD = 3.0 to 3.6V)
PF0/INT0 to PF4/INT4 PF5/NMI
INT0, INT1, INT2, INT3, INT4, NMI Internal data bus RD
IP CMOS Schmitt input
Hi-Z
–7–
CXP922P032
Pin
Circuit format
After a reset
TO0 PFSL register "0" after a reset
PF6/TO0
PF register "1" after a reset Internal data bus RD
"H" level
RD Internal data bus PF register "1" after a reset TO1 Internal reset signal
00 01 1x MPX ∗
PF7/TO1/ PWM
PWM
PFSL register (Bit 7) PFSL register (Bit 6) "00" after a reset TO1 output enable ∗ Pull-up transistor approximately 150kΩ (VDD = 4.5 to 5.5V) approximately 200kΩ (VDD = 3.0 to 3.6V)
"H" level ("H" level at ON resistance of pull-up transistor during a reset.)
AN0 to AN3
A/D converter Input multiplexer
IP
Hi-Z
–8–
CXP922P032
Pin
Circuit format
∗
After a reset
PUL1 register "0" after a reset PG register Undefined after a reset PGD register "0" after a reset IP
PG0/AN4 to PG3/AN7
PGSL register "0" after a reset Internal data bus RD A/D converter Input multiplexer ∗ Pull-up transistor
Hi-Z
approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V)
PUL1 register "0" after a reset
∗
PG register Undefined after a reset
PG4 to PG7
PGD register "0" after a reset Internal data bus RD ∗ Pull-up transistor IP
Hi-Z
approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V)
–9–
CXP922P032
Pin
Circuit format
After a reset
CS0 SI0
CS0 SI0 CMOS Schmitt input
IP
Hi-Z
SO0
SO0
SO0 output enable
Hi-Z
SCK0
SCK0
SCK0 output enable
IP
"H" level (Hi-Z during a reset)
SCK0 CMOS Schmitt input
PUL1 register "0" after a reset PH register Undefined after a reset
∗
PH0/CS1 PH1/SI1 PH4/CS2 PH5/SI2
PHD register "0" after a reset Internal data bus RD CS1, SI1, CS2, SI2
IP
Hi-Z
CMOS Schmitt input ∗ Pull-up transistor approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V)
– 10 –
CXP922P032
Pin
Circuit format
∗
After a reset
PUL1 register "0" after a reset SO1, SO2 SO1, SO2 output enable PHSL register
PH2/SO1 PH6/SO2
"0" after a reset PH register Undefined after a reset PHD register "0" after a reset Internal data bus RD IP
Hi-Z
∗ Pull-up transistor
approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V)
PUL1 register "0" after a reset SCK1, SCK2 SCK1, SCK2 output enable PHSL register "0" after a reset
∗
PH3/SCK1 PH7/SCK2
PH register Undefined after a reset PHD register "0" after a reset Internal data bus RD SCK1, SCK2 CMOS Schmitt input ∗ Pull-up transistor
IP
Hi-Z
approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V)
PUL2 register "0" after a reset TxD TxD output enable
∗
PI register
PI0/TxD
Undefined after a reset PID register "0" after a reset Internal data bus RD ∗ Pull-up transistor
IP
Hi-Z
approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V)
– 11 –
CXP922P032
Pin
Circuit format
After a reset
PUL2 register "0" after a reset PI register Undefined after a reset
∗
PI1/RxD PI4/EC0 PI5/EC1 PI6/CINT PI7/RMC
PID register "0" after a reset Internal data bus RD RxD, EC0, EC1, CINT, RMC
IP
Hi-Z
CMOS Schmitt input ∗ Pull-up transistor approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V)
PUL2 register "0" after a reset
∗
PI register Undefined after a reset
PI2 to PI3
PID register "0" after a reset Internal data bus RD ∗ Pull-up transistor IP
Hi-Z
approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V)
PUL2 register "0" after a reset PJ register Undefined after a reset
∗
PJ0/KS0 to PJ6/KS6
PJD register "0" after a reset Internal data bus RD Standby release
IP
Hi-Z
∗ Pull-up transistor
approximately 100kΩ (VDD = 4.5 to 5.5V) approximately 150kΩ (VDD = 3.0 to 3.6V)
– 12 –
CXP922P032
Pin
Circuit format
After a reset
EXTAL
IP
EXTAL XTAL
Oscillation stop control
XTAL
• Diagram shows circuit configuration during oscillation. • Feedback resistor is removed during stop mode, and XTAL is driven at "H" level.
Oscillation
Mask option
∗ OP
RST
IP CMOS Schmitt input ∗ Pull-up transistor
"L" level (during a reset)
approximately 300kΩ (VDD = 4.5 to 5.5V) approximately 500kΩ (VDD = 3.0 to 3.6V)
– 13 –
CXP922P032
Absolute Maximum Ratings Item Symbol VDD VPP Supply voltage AVDD AVREF AVSS Input voltage Output voltage High level output current High level total output current VIN VOUT IOH ∑IOH IOL Low level output current IOLC Low level total output current Operating temperature Storage temperature Allowable power dissipation ∑IOL Topr Tstg PD 20 130 –20 to +75 –55 to +150 600 mA mA °C °C mW Rating –0.3 to +7.0 –0.3 to +13.0 AVSS to +7.0∗1 AVSS to +7.0 –0.3 to +0.3 –0.3 to +7.0∗2 –0.3 to +7.0∗2 –5 –50 15 Unit V V V V V V V mA mA mA
(VSS = 0V reference) Remarks
Unique to version with incorporated PROM
Output (value per pin) Total for all output pins All pins excluding large current output pins (value per pin) Large current output pins∗3 (value per pin) Total for all output pins
QFP-100P-L01
∗1 AVDD must be the same voltage. ∗2 VIN and VOUT must not exceed VDD + 0.3V. ∗3 The large current drive transistor is N-ch transistor of PD and PE. Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should be conducted under the recommended operating conditions. Exceeding these conditions may adversely affect the reliability of the LSI.
– 14 –
CXP922P032
Recommended Operating Conditions Item Symbol Min. 3.0 2.7 VDD Supply voltage 2.7 2.5 AVDD AVREF VIH High level input voltage VIHS VIHEX VIL Low level input voltage VILS VILEX Operating temperature Topr 2.7 2.7 0.7VDD 0.8VDD 0.8VDD 0.7VDD 0 0 0 –0.3 –0.3 –20 5.5 5.5 5.5 5.5 VDD VDD VDD VDD + 0.3 0.3VDD 0.2VDD 0.2VDD 0.3VDD 0.2VDD +75 V V V V V V V V V V V V V °C ∗2, ∗4 ∗2, ∗5 CMOS Schmitt input∗3 EXTAL ∗2, ∗4 ∗2, ∗5 CMOS Schmitt input∗3 EXTAL∗4 EXTAL∗5 Max. 5.5 5.5 Unit V V Remarks
(VSS = 0V reference)
fEX = 20MHz or less Guaranteed operation range for 2, 4 and 8 frequency fEX = 12MHz or less dividing clocks Guaranteed operation range for 1/16 frequency dividing clock or sleep mode Guaranteed data hold range during stop mode ∗1
∗1 AVDD and VDD must be the same voltage. ∗2 PA, PB, PC, PD, PE, PG, PH2, PH6, PI0, PI2, PI3, PJ for normal input port. ∗3 PF0 to PF5, PH0, PH1, PH3 to PH5, PH7, PI1, PI4 to PI7, CS0, SI0, SCK0, RST. ∗4 When the supply voltage (VDD) is within the range of 4.5 to 5.5V. ∗5 When the supply voltage (VDD) is within the range of 2.7 to 5.5V.
– 15 –
CXP922P032
Electrical Characteristics DC Characteristics (VDD = 4.5 to 5.5V) Item High level output voltage Low level output voltage Symbol VOH Pins PA to PE, PF6, PF7, PG to PJ, SO0, SCK0 PA to PE, PF6, PF7, PG to PJ, SO0, SCK0 PD, PE IIHE IILE Input current IILR IIL EXTAL RST∗1 PA to PE∗2, PG to PJ∗2 Conditions VDD = 4.5V, IOH = –0.5mA VDD = 4.5V, IOH = –1.2mA VDD = 4.5V, IOL = 1.8mA VDD = 4.5V, IOL = 3.6mA VDD = 4.5V, IOL = 12.0mA VDD = 5.5V, VIH = 5.5V VDD = 5.5V, VIL = 0.4V VDD = 5.5V, VIL = 0.4V VDD = 5.5V, VIL = 0.4V VDD = 4.5V, VIH = 4.0V –2.78 0.5 –0.5 –1.5 (Topr = –20 to +75°C, VSS = 0V reference) Min. 4.0 3.5 0.4 0.6 1.5 40 –40 –400 –45 Typ. Max. Unit V V V V V µA µA µA µA µA
VOL
I/O leakage IIZ current
PA to PE∗2, PF0 to PF5, PF7, PG to PJ∗2, VDD = 5.5V, VI = 0, 5.5V AN0 to AN3, CS0, SI0, SO0, SCK0, RST∗1 VDD = 5 ± 0.5V, 20MHz crystal oscillation (C1 = C2 = 10pF) VDD, VSS VDD = 5 ± 0.5V, 20MHz crystal oscillation (C1 = C2 = 10pF), sleep mode VDD = 5.5V, stop mode PA to PE, PF0 to PF5, PG to PJ, AN0 to AN3, CS0, SI0, SCK0, EXTAL, RST 45
±10
µA
IDD∗4 Supply current∗3
75
mA
IDDS1 IDDS2
8
14 10
mA µA
Input capacitance
CIN
Clock 1MHz 0V for all pins excluding measured pins
10
20
pF
∗1 RST specifies the input current when pull-up resistor has been selected; the leakage current when no resistor has been selected. ∗2 PA to PE and PG to PJ specify the input current when pull-up resistor has been selected; the leakage current when no resistor has been selected. ∗3 When all output pins are open. ∗4 When the upper two bits (PCK1, PCK0) of the clock control register (CLC: 0002FEh) are set to "00" and the LSI is operated in high-speed mode (2 frequency dividing clock).
– 16 –
CXP922P032
DC Characteristics (VDD = 3.0 to 3.6V) Item High level output voltage Low level output voltage Symbol VOH Pins PA to PE, PF6, PF7, PG to PJ, SO0, SCK0 PA to PE, PF6, PF7, PG to PJ, SO0, SCK0 PD, PE IIHE IILE Input current IILR IIL EXTAL RST∗1 PA to PE∗2, PG to PJ∗2 Conditions VDD = 3.0V, IOH = –0.15mA VDD = 3.0V, IOH = –0.5mA VDD = 3.0V, IOL = 1.2mA VDD = 3.0V, IOL = 1.6mA VDD = 3.0V, IOL = 5.0mA VDD = 3.6V, VIH = 3.6V VDD = 3.6V, VIL = 0.3V VDD = 3.6V, VIL = 0.3V VDD = 3.6V, VIL = 0.3V VDD = 3.0V, VIH = 2.7V
(Topr = –20 to +75°C, VSS = 0V reference) Min. 2.7 2.3 0.3 0.5 1.0 0.3 –0.3 –0.7 20 –20 –200 –30 –1.0 Typ. Max. Unit V V V V V µA µA µA µA µA
VOL
I/O leakage IIZ current
PA to PE∗2, PF0 to PF5, PF7, PG to PJ∗2, VDD = 3.6V, VI = 0, 3.6V AN0 to AN3, CS0, SI0, SO0, SCK0, RST∗1 VDD = 3.3 ± 0.3V, 20MHz crystal oscillation (C1 = C2 = 10pF) VDD, VSS VDD = 3.3 ± 0.3V, 20MHz crystal oscillation (C1 = C2 = 10pF), sleep mode VDD = 3.6V, stop mode PA to PE, PF0 to PF5, PG to PJ, AN0 to AN3, CS0, SI0, SCK0, EXTAL, RST 25
±10
µA
IDD∗4 Supply current∗3
45
mA
IDDS1 IDDS2
4.5
8 10
mA µA
Input CIN capacitance
Clock 1MHz 0V for all pins excluding measured pins
10
20
pF
∗1 RST specifies the input current when pull-up resistor has been selected; the leakage current when no resistor has been selected. ∗2 PA to PE and PG to PJ specify the input current when pull-up resistor has been selected; the leakage current when no resistor has been selected. ∗3 When all output pins are open. ∗4 When the upper two bits (PCK1, PCK0) of the clock control register (CLC: 0002FEh) are set to "00" and the LSI is operated in high-speed mode (2 frequency dividing clock).
– 17 –
CXP922P032
AC Characteristics (1) Clock timing Item Main clock base oscillation frequency Main clock base oscillation input pulse width Main clock base oscillation input rise time, fall time Symbol fEX Pins XTAL EXTAL EXTAL EXTAL (Topr = –20 to +75°C, VDD = 2.7 to 5.5V, VSS = 0V reference) Conditions VDD = 3.0 to 5.5V Fig.1, Fig.2 Min. 1 1 Typ. Max. 20 12 Unit MHz
tXL, tXH tXR, tXF
Fig.1, Fig.2 VDD = 3.0 to 5.5V 23 External clock drive 37.5 Fig.1, Fig.2 External clock drive 100
ns ns
Note) tsys indicates the four values below according to the upper two bits (PCK1,PCK0) of the clock control register (CLC: 0002FEh). tsys [ns] = 2/fEX (PCK1, PCK0 = 00), 4/fEX (PCK1, PCK0 = 01), 8/fEX (PCK1, PCK0 = 10), 16/fEX (PCK1, PCK0 = 11)
1/fEX
EXTAL
0.7VDD 0.3VDD ( VDD = 4.5 to 5.5 V ) 0.2VDD ( VDD = 2.7 to 5.5 V ) tXH tXF tXL tXR
Fig.1. Clock timing
Oscillator connection example of main oscillation circuit
Connection example of external clock
EXTAL
XTAL
EXTAL
XTAL
74HC04 C1 C2
Fig.2. Oscillator connection and clock applied conditions
– 18 –
CXP922P032
(2) Event count input Item Event count input clock pulse width Symbol Pins EC0, EC1
(Topr = –20 to +75°C, VDD = 2.7 to 5.5V, VSS = 0V reference) Conditions Fig.3 Min. Max. Unit ns
tEH, tEL
tsys + 100
EC0 EC1
0.8VDD 0.2VDD
tEH
tEL
Fig.3. Event count input timing
(3) Interruption and reset input Item Symbol Pins
(Topr = –20 to +75°C, VDD = 2.7 to 5.5V, VSS = 0V reference) Conditions Min. Max. Unit ns µs
External interruption high, low level width
tIH, tIL
Main mode NMI INT0 to INT4 Sleep mode KS0 to KS6 Stop mode φ INT0, INT1, INT4 Noise filter selected PS4 PS6
tsys + 100
1 2tsys + 100 32/fEX + 100 128/fEX + 100 3tsys + 200
ns
Reset input low level width
tRST
RST
Fig.5
ns
tIH 0.8VDD NMI INT0 to INT7 KS0 to KS6
tIL
0.2VDD
Fig.4. Interruption input timing
tRST
RST 0.2VDD
Fig.5. Reset input timing
– 19 –
CXP922P032
(4) A/D converter characteristics (Topr = –20 to +75°C, VDD = AVDD = 4.5 to 5.5V, AVREF = 4.0 to AVDD, VSS = AVSS = 0V reference) Item Resolution Linearity error Absolute error Conversion time Sampling time Reference input voltage Analog input voltage AVREF current IREFS VDD = AVDD = AVREF = 5.0V Symbol Pins Conditions Min. Typ. Max. 8 ±2 ±3 31/fADC∗ 10/fADC∗ AVREF AN0 to AN7 Main mode AVREF Sleep mode Stop mode AVDD – 0.5 0 0.6 1.0 10 Unit Bits LSB LSB µs µs V V mA µA
tCONV tSAMP
VREF VIAN IREF
(Topr = –20 to +75°C, VDD = AVDD = 3.0 to 3.6V, AVREF = 2.7 to AVDD, VSS = AVSS = 0V reference) Item Resolution Linearity error Absolute error Conversion time Sampling time Reference input voltage Analog input voltage AVREF current IREFS VDD = AVDD = AVREF = 3.3V Symbol Pins Conditions Min. Typ. Max. 8 ±2 ±3 31/fADC∗ 10/fADC∗ AVREF AN0 to AN7 Main mode AVREF Sleep mode Stop mode AVDD – 0.3 0 0.4 0.7 10 Unit Bits LSB LSB µs µs V V mA µA
tCONV tSAMP
VREF VIAN IREF
– 20 –
CXP922P032
∗ fADC indicates the below values due to the contents of Bit 6 (CKS) of the A/D control register (ADC: 000131h). When PS3 is selected, fADC = fEX/8 When PS4 is selected, fADC = fEX/16 However, when PS3 is selected, fEX is 12MHz or less.
FFh FEh Digital conversion value
(100h) FFh FEh Digital conversion value
Linearity error
Absolute error 01h 00h Absolute error Analog input VREF
01h 00h
VZT∗1 Analog input
VFT∗2
∗1 VZT: Value at which the digital conversion value changes from 00h to 01h and vice versa. ∗2 VFT: Value at which the digital conversion value changes from FEh to FFh and vice versa.
Fig.6. Definition of A/D converter terms
– 21 –
CXP922P032
(5) Serial transfer (CH0, CH1, CH2) Item CS ↓ → SCK delay time CS ↑ → SCK float delay time CS ↓ → SO delay time CS ↑ → SO float delay time Symbol Pins SCK0 SCK1 SCK2 SCK0
(Topr = –20 to +75°C, VDD = 4.5 to 5.5V, VSS = 0V reference) Conditions External start transfer mode (SCK = output mode) External start transfer mode (SCK = output mode) Min. Max. 1.5tsys + 100 Unit ns
tDCSK
tDCSKF SCK1
SCK2 SO0 SO1 SO2 SO0
1.5tsys + 100
ns
tDCSO
External start transfer mode
1.5tsys + 100
ns
tDCSOF SO1
SO2 CS0 CS1 CS2 SCK0 SCK1 SCK2 SCK0 SCK1 SCK2 SI0 SI1 SI2 SI0 SI1 SI2 SO0 SO1 SO2 SCK0 SCK1 SCK2
External start transfer mode
1.5tsys + 100
ns
CS high level width
tWHCS
External start transfer mode Input mode Output mode Input mode Output mode SCK input mode SCK output mode SCK input mode SCK output mode SCK input mode SCK output mode SCK input mode SCK output mode
tsys + 100
2tsys + 150 8/fEX
ns ns ns ns ns ns ns ns ns
SCK cycle time
tKCY tKH tKL tSIK
SCK high, low pulse width SI input data setup time (for SCK ↑) SI input data hold time (for SCK ↑) SCK ↓ → SO delay time
tsys + 60
4/fEX – 25 50 100
tKSI
tsys + 100
50
tKSO
tsys + 100
50 3tsys + 100 8/fEX
ns ns ns ns
Minimum interval time
tINT
Note) The load condition for the SCK output mode and SO output delay time is 50pF+1TTL.
– 22 –
CXP922P032
(Topr = –20 to +75°C, VDD = 3.0 to 3.6V, VSS = 0V reference) Item CS ↓ → SCK delay time CS ↑ → SCK float delay time CS ↓ → SO delay time CS ↑ → SO float delay time Symbol Pins SCK0 SCK1 SCK2 SCK0 Conditions External start transfer mode (SCK = output mode) External start transfer mode (SCK = output mode) Min. Max. 1.5tsys + 200 Unit ns
tDCSK
tDCSKF SCK1
SCK2 SO0 SO1 SO2 SO0
1.5tsys + 200
ns
tDCSO
External start transfer mode
1.5tsys + 200
ns
tDCSOF SO1
SO2 CS0 CS1 CS2 SCK0 SCK1 SCK2 SCK0 SCK1 SCK2 SI0 SI1 SI2 SI0 SI1 SI2 SO0 SO1 SO2 SCK0 SCK1 SCK2
External start transfer mode
1.5tsys + 200
ns
CS high level width
tWHCS
External start transfer mode Input mode Output mode Input mode Output mode SCK input mode SCK output mode SCK input mode SCK output mode SCK input mode SCK output mode SCK input mode SCK output mode
tsys + 200
2tsys + 200 8/fEX
ns ns ns ns ns ns ns ns ns
SCK cycle time
tKCY tKH tKL tSIK
SCK high, low pulse width SI input data setup time (for SCK ↑) SI input data hold time (for SCK ↑) SCK ↓ → SO delay time
tsys + 80
4/fEX – 50 80 150
tKSI
tsys + 120
70
tKSO
tsys + 200
80 3tsys + 150 8/fEX
ns ns ns ns
Minimum interval time
tINT
Note) The load condition for the SCK output mode and SO output delay time is 50pF.
– 23 –
CXP922P032 tWHCS
CS0 CS1 CS2 0.2VDD
0.8VDD
tKCY tDCSK tKL tKH tDCSKF
0.8VDD SCK0 SCK1 SCK2 0.2VDD
tSIK
tKSI
0.8VDD SI0 SI1 SI2 Input data 0.2VDD
tDCSO
tKSO
tDCSOF
0.8VDD SO0 SO1 SO2 Output data 0.2VDD
tINT
SCK0 SCK1 SCK2
0.8VDD
Fig.7. Serial transfer CH0, CH1, CH2 timing – 24 –
CXP922P032
(6) Remote control reception Item Remote control receive high, low level width Symbol Pins
(Topr = –20 to +75°C, VDD = 2.7 to 5.5V, VSS = 0V reference) Conditions PS5 selected Main mode Sleep mode Min. 128/fEX + 100 256/fEX + 100 ns Max. Unit
tRMC
RMC
PS6 selected
PS8 selected 1024/fEX + 100
0.8VDD RMC 0.2VDD
tRMC
tRMC
Fig.8. Remote control signal input timing
– 25 –
CXP922P032
Appendix
(i) Main oscillation circuit
(ii) Main oscillation circuit
EXTAL
XTAL Rd
EXTAL
XTAL Rd
C1
C2 C1 C2
Fig.9. Recommended oscillation circuit Manufacturer Model CSA4.00MG CSA8.00MTZ093 CSA10.0MTZ093 CSA12.0MTZ093 CST4.00MGW∗ CST8.00MTW093∗ CST10.0MTW093∗ CST12.0MTW093∗ CSA16.00MXZ040 CST16.00MXW0C1∗ CSA20.00MXZ040 CST20.00MXW0H1∗ fEX (MHz) 4 8 10 12 4 8 10 12 16 16 20 20 4 8 10 12 16 20 4 8 10 12 16 20 4 8 10 12 16 20 C1 (pF) C2 (pF) Rd (Ω) Circuit example Remarks
(i) 30 30 0 (ii)
MURATA MFG CO., LTD.
5
5
0
(i) (ii) (i) (ii)
VDD = 4.0 to 5.5V
RIVER ELETEC HC-49/U03 CO., LTD.
27 15 10 10 8 6 22
27 15 10 10 8 6 22
560 330 330 180 0 0 2.2k
(i)
CL = 18.5pF CL = 13.0pF CL = 10.5pF CL = 10.5pF CL = 10.0pF CL = 8.5pF CL = 16pF VDD = 3.0 to 5.5V
KINSEKI LTD.
HC49/U-S
(i) 10 10 0
CL = 12pF VDD = 3.5 to 5.5V
38 (±20%) 0 20 (±20%) 0 20 (±20%) 0 TDK (ii) Corporation 20 (±20%) 0 10 (±20%) 0 VDD = 3.5 to 5.5V 10 (±20%) 0 ∗ Indicates types with on-chip grounding capacitor (C1, C2). CCR∗∗∗ : Surface mounted type ceramic oscillator. CL : Load capacitor Mask option table Item Reset pin pull-up resistor Non-existent – 26 – Content Existent
CCR4.0MC3∗ CCR8.0MC5∗ CCR10.0MC5∗ CCR12.0MC5∗ CCR16.0MC6∗ CCR20.0MC6∗
38 (±20%) 20 (±20%) 20 (±20%) 20 (±20%) 10 (±20%) 10 (±20%)
CXP922P032
Characteristics Curve
(fEX = 20MHz, Topr = 25°C, Typical) 50 40 30 25 20 15 10 8 6 5 4 3 2 3 4 5 VDD – Supply voltage [V] 6 4 frequency dividing mode 8 frequency dividing mode 16 frequency dividing mode 2 frequency dividing mode
IDD vs. VDD
IDD – Supply current [mA]
Sleep mode
(VDD = 5V, Topr= 25°C, Typical) 46 44 42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 0 fEX 2 frequency dividing mode
IDD vs. fEX
IDD – Supply current [mA]
4 frequency dividing mode
8 frequency dividing mode 16 frequency dividing mode Sleep mode
15 20 5 10 – Main clock base oscillation frequency [MHz]
– 27 –
CXP922P032
Package Outline
Unit: mm
100PIN QFP (PLASTIC)
23.9 ± 0.4 + 0.4 20.0 – 0.1 80 51 + 0.1 0.15 – 0.05
81
50
+ 0.4 14.0 – 0.1 17.9 ± 0.4
15.8 ± 0.4
A 100 31
1
0.65
+ 0.15 0.3 – 0.1
30 0.13 M + 0.35 2.75 – 0.15
+ 0.2 0.1 – 0.05
0.15
DETAIL A
0.8 ± 0.2
0° to 10°
(16.3)
PACKAGE STRUCTURE
PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE QFP-100P-L01 QFP100-P-1420 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 1.7g
– 28 –