SLD323XT
1W High Power Laser Diode
Description The SLD323XT is a high power, gain-guided laser diode produced by MOCVD method∗1. Compared to the SLD300 Series, this laser diode has a high brightness output with a doubled optical density which can be achived by QW-SCH structure∗2. Fine adjustment of the oscillation wavelength is possible by controlling the temperature using the built-in TE cooler (Peltier element). ∗1 MOCVD: Metal Organic Chemical Vapor Deposition ∗2 QW-SCH: Quantum Well Separate Confinement Heterostructure Features • High power Recommended optical power output: Po = 1.0W • Low operating current: Iop = 1.4A (Po = 1.0W) • Flat package with built-in photo diode, TE cooler, and thermistor Applications • Solid state laser excitation • Medical use • Material processes • Measurement Structure AlGaAs quantum well structure laser diode Operating Lifetime MTTF 10,000H (effective value) at Po = 1.0W, Tth = 25°C Absolute Maximum Ratings (Tth = 25°C) • Optical power output Po • Reverse voltage VR LD PD • Operating temperature (Tth) Topr • Storage temperature Tstg Equivalent Circuit
TE Cooler N P
TH
LD
PD
1
2
3
4
5
6
7
8
Pin Configuration (Top View) No. 1 2 3 4 5 6 7 8 Function TE cooler (negative) Thermistor lead 1 Thermistor lead 2 Laser diode (anode) Laser diode (cathode) Photodiode (cathode) Photodiode (anode) TE cooler (positive)
1.1 2 15 –10 to +30 –40 to +85
W V V °C °C
Warranty This warranty period shall be 90 days after receipt of the product or 1,000 hours operation time whichever is shorter. Sony Quality Assurance Department shall analyze any product that fails during said warranty period, and if the analysis results show that the product failed due to material or manufacturing defects on the part of Sony, the product shall be replaced free of charge. Laser diodes naturally have differing lifetimes which follow a Weibull distribution. Special warranties are also available.
1
8
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E93208B02-PS
SLD323XT
Electrical and Optical Characteristics Item Threshold current Operating current Operating voltage Wavelength∗ Monitor current Radiation angle Perpendicular Parallel Positional accuracy Differential efficiency Thermistor resistance Position Angle Symbol Ith Iop Vop λp Imon θ⊥ θ// ∆X, ∆Y ∆φ⊥ ηD Rth PO = 1.0W PO = 1.0W PO = 1.0W PO = 1.0W VR = 10V PO = 1.0W Conditions
(Tth: Thermistor temperature, Tth = 25°C) Min. Typ. 0.3 1.4 2.1 790 0.3 20 4 1.5 30 9 Max. 0.5 2.0 3.0 840 6.0 40 17 ±100 ±3 PO = 1.0W Tth = 25°C 0.5 0.9 10 Unit A A V nm mA degree degree µm degree W/A kΩ
PO = 1.0W
∗ Wavelength Selection Classification Type SLD323XT-1 SLD323XT-2 SLD323XT-3 Type SLD323XT-21 SLD323XT-24 SLD323XT-25 Wavelength (nm) 795 ± 5 810 ± 10 830 ± 10 Wavelength (nm) 798 ± 3 807 ± 3 810 ± 3
Handling Precautions Eye protection against laser beams The optical output of laser diodes ranges from several mW to 3W. However the optical power density of the laser beam at the diode chip reaches 1MW/cm2. Unlike gas lasers, since laser diode beams are divergent, uncollimated laser diode beams are fairly safe at a laser diode. For observing laser beams, ALWAYS use safety goggles that block infrared rays. Usage of IR scopes, IR cameras and fluorescent plates is also recommended for monitoring laser beams safely.
Laser diode
Lens Optical material
Safety goggles for protection from laser beam
IR fluorescent plate
AP C ATC
Optical boad
Optical power output control device temperature control device
–2–
SLD323XT
Example of Representative Characteristics
Optical power output vs. Forward current characteristics
1500
Optical power output vs. Monitor current characteristics
Tth = 25°C
Po – Optical power output [mW]
Po – Optical power output [mW]
1200
Tth = 0°C Tth = –10°C
Tth = 25°C Tth = 30°C
1000
Tth = 15°C Tth = 0°C Tth = –10°C Tth = 30°C
900
600
500
300
0
400
800
1200
1600
2000
0
0 Imon – Monitor current [mA]
1.5
IF – Forward current [mA]
Threshold current vs. Temperature characteristics
1000
Power dependence of far field pattern (Parallel to junction)
Tth = 25°C
Ith – Threshold current [mA]
500
Radiation intensity (optional scale)
PO = 1000mW PO = 800mW PO = 600mW PO = 400mW PO = 200mW
100 –10
0
10
20
30
–90
–60
–30
0
30
60
90
Tth – Thermistor temperature [°C]
Angle [degree]
Power dependence of far field pattern (Perpendicular to junction)
Tth = 25°C Radiation intensity (optional scale)
Tempareture dependence of far field pattern (Parallel to junction)
PO = 1000mW Radiation intensity (optional scale)
PO = 1000mW PO = 800mW PO = 600mW PO = 400mW PO = 200mW
Tth = 25°C Tth = 10°C Tth = –5°C
–90
–60
–30
0
30
60
90
–90
–60
–30
0
30
60
90
Angle [degree]
Angle [degree]
–3–
SLD323XT
Temperature dependence of far field pattern (Perpendicular to junction)
PO = 1000mW Radiation intensity (optional scale) 820
Dependence of wavelength
Po = 1000mW
λp – Wavelength [nm] Tth = 25°C Tth = 10°C Tth = –5°C –60 –30 0 30 60 90
810
800
–90
790 –10
0
10
20
30
Angle [degree]
Tth – Thermistor temperature [°C]
Thermistor characteristics Differential efficiency vs. Temperature characteristics
50 ηD – Differential efficiency [mW/mA] 1.0 Rth – Thermistor resistance [kΩ] –10 0 10 20 30 Tth – Thermistor temperature [°C]
10
0.5
5
0
1 –10 0 10 20 30 40 50 60 70 Tth – Thermistor temperature [°C]
TE cooler characteristics
TE cooler characteristics 1
10 Tc = 33°C 10
TE cooler characteristics 2
IT = 2.5A
Tth = 25°C
∆T VS V
Q – Absorbed heat [W] Q – Absorbed heat [W]
VT – Pin voltage [V]
2.0A
5
5 4
5
1.5A
5
4
1.5A
1.0A
3 2
1.0A
∆T
VS
3 2 1 0
0.5A
0. 5A
2.0A
2. 5A
0.5A
1 0 0
0.
1.
1.
5A
0A
5A
Q
2.0A
2. 5A
0
0
50
100
50
100
∆T – Temperature difference [°C] ∆T: Tc – Tth Tth: Thermistor temperature Tc: Case temperature
∆T – Temperature difference [°C]
–4–
VT – Pin voltage [V]
∆T VS VT
IT = 2.5A
2.0A
∆T
VS
5A 1.
Q
1.
0A
SLD323XT
Power dependence of spectrum
1.0
Tth = 25°C Po = 400mW
1.0
Tth = 25°C Po = 600mW
0.8 Relative rediant intensity Relative rediant intensity 802 804 806 808 810
0.8
0.6
0.6
0.4
0.4
0.2
0.2
802
804
806
808
810
Wavelength [nm]
Wavelength [nm]
1.0
Tth = 25°C Po = 800mW
1.0
Tth = 25°C Po = 1000mW
0.8 Relative rediant intensity Relative rediant intensity 802 804 806 808 810
0.8
0.6
0.6
0.4
0.4
0.2
0.2
802
804
806
808
810
Wavelength [nm]
Wavelength [nm]
–5–
SLD323XT
Temperature dependence of spectrum (Po = 1000mW)
1.0
Tth = –10°C
1.0
Tth = 0°C
0.8 Relative radiant intensity Relative radiant intensity 795 800 805 810 815 820
0.8
0.6
0.6
0.4
0.4
0.2
0.2
790
790
795
800
805
810
815
820
Wavelength [nm]
Wavelength [nm]
1.0
Tth = 25°C
1.0
Tth = 30°C
0.8 Relative radiant intensity Relative radiant intensity 795 800 805 810 815 820
0.8
0.6
0.6
0.4
0.4
0.2
0.2
790
790
795
800
805
810
815
820
Wavelength [nm]
Wavelength [nm]
–6–
SLD323XT
Package Outline
Unit: mm
M – 273(LO – 10)
+ 0.05 4 – Ø3.0 0 33.0 ± 0.05
14.0
Ø5.0 Window Glass
15.0 ± 0.05
* 7.5 ± 0.1
4 – R1.2 ± 0.3
8 – Ø0.6 2.54
38.0 ± 0.5
0.65MAX
LD Chip
19.0 28.0 ± 0.5
+ 2.0 8.0 – 1.0
Reference Plane
28.0 ± 0.5 7.5 ± 0.2 11.35 ± 0.1
10.4
*16.5 ± 0.1
*Distance between pilot hole and emittng area
PACKAGE STRUCTURE
SONY CODE EIAJ CODE JEDEC CODE M-273(LO-10) PACKAGE WEIGHT 43g
–7–
3.0
Sony Corporation
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