AM75DL9608HGB75IT

Am75DL9608HG Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu. Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and Fujitsu. Continuity of Specifications There is no change to this datasheet as a result of offering the device as a Spansion product. Any changes that have been made are the result of normal datasheet improvement and are noted in the document revision summary, where supported. Future routine revisions will occur when appropriate, and changes will be noted in a revision summary. Continuity of Ordering Part Numbers AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order these products, please use only the Ordering Part Numbers listed in this document. For More Information Please contact your local AMD or Fujitsu sales office for additional information about Spansion memory solutions. Publication Number 30772 Revision A Amendment +1 Issue Date November 17, 2003 THIS PAGE LEFT INTENTIONALLY BLANK. ADVANCE INFORMATION Am75DL9608HG Stacked Multi-Chip Package (MCP) Flash Memory and Pseudo SRAM 64 Megabit (4 M x 16-Bit) and 32 Megabit (2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories, and 8 Mbit (512 K x 16-Bit) Pseudo Static RAM DISTINCTIVE CHARACTERISTICS MCP Features ■ Power supply voltage of 2.7 to 3.3 volt ■ High performance — Flash access time as fast as 70 ns — Pseudo SRAM access time as fast as 55 ns — Access time as fast as 70 ns — Program time: 4 µs/word typical utilizing Accelerate function ■ Ultra low power consumption (typical values) — 2 mA active read current at 1 MHz — 10 mA active read current at 5 MHz — 200 nA in standby or automatic sleep mode ■ Package — 73-Ball FBGA ■ Minimum 1 million erase cycles guaranteed per sector ■ 20 year data retention at 125°C — Reliable operation for the life of the system ■ Operating Temperature — –40°C to +85°C SOFTWARE FEATURES ■ Supports Common Flash Memory Interface (CFI) ■ Program/Erase Suspend/Erase Resume — Suspends program/erase operations to allow programming/erasing in same bank Flash Memory Features (Am29DL640H/Am29DL320G) — Features apply to Am29DL640H and Am29DL320G independently. ARCHITECTURAL ADVANTAGES ■ Simultaneous Read/Write operations — Data can be continuously read from one bank while executing erase/program functions in another bank. — Zero latency between read and write operations ■ Data# Polling and Toggle Bits — Provides a software method of detecting the status of program or erase cycles HARDWARE FEATURES ■ Any combination of sectors can be erased ■ Ready/Busy# output (RY/BY#) — Hardware method for detecting program or erase cycle completion ■ Flexible Bank™ architecture — Read may occur in any of the three banks not being written or erased. — Four banks may be grouped by customer to achieve desired bank divisions. ■ Hardware reset pin (RESET#) — Hardware method of resetting the internal state machine to the read mode ■ Manufactured on 0.17 µm process technology (Am29DL320G), 0.13 µm process technology (Am29DL640H) ■ SecSi™ (Secured Silicon) Sector — Extra 256 byte sector on Am29DL640H — Extra 256 byte sector on Am29DL320G — Factory locked and identifiable: 16 bytes available for secure, random factory Electronic Serial Number; verifiable as factory locked through autoselect function. ExpressFlash option allows entire sector to be available for factory-secured data — Customer lockable: Sector is one-time programmable. Once sector is locked, data cannot be changed. ■ WP#/ACC input pin — Write protect (WP#) protects sectors 0, 1, 140, and 141 in Am29DL640H, and two outermost boot sectors in Am29DL320G — Acceleration (ACC) function accelerates program timing ■ Sector protection — Hardware method of locking a sector, either in-system or using programming equipment, to prevent any program or erase operation within that sector — Temporary Sector Unprotect allows changing data in protected sectors in-system ■ Zero Power Operation — Sophisticated power management circuits reduce power consumed during inactive periods to nearly zero. Pseudo SRAM Features ■ Power dissipation — Operating: 30 mA maximum — Standby: 60 µA maximum ■ Boot sectors — Top and bottom boot sectors in Am29DL640H — Top or bottom boot options in Am29DL320G ■ CE1s# and CE2s Chip Select ■ Power down features using CE1s# and CE2s ■ Data retention supply voltage: 2.7 to 3.3 volt ■ Byte data control: LB#s (DQ7–DQ0), UB#s (DQ15–DQ8) ■ Compatible with JEDEC standards — Pinout and software compatible with single-power-supply flash standard PERFORMANCE CHARACTERISTICS ■ High performance This document contains information on a product under development at Advanced Micro Devices. The information is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed product without notice. 11/18/03 Publication# 30772 Rev:A Amendment/+1 Issue Date: November 17, 2003 Refer to AMD’s Website (www.amd.com) for the latest information. ADVANCE INFORMATION GENERAL DESCRIPTION The Am75DL9608HG consists of two flash memory devices (one 64-Mbit Am29DL640H and one 32-Mbit Am29DL320G), and one 8 Mbit pseudo SRAM device. Bottom boot configuration is shown in the following table. Bank Bank 1 Bank 2 Bank 3 Bank 4 Megabits 4 Mb 12 Mb 12 Mb 4 Mb Sector Sizes Eight 32 Kword Twenty-four 32 Kword Twenty-four 32 Kword Eight 4 Kword, Seven 32 Kword Am29DL640H and Am29DL320G Features Am29DL640H is a 64 megabit, 3.0 volt-only flash memory device, organized as 4,194,304 words. The Am29DL320G is a 32 megabit, 3.0 volt-only flash memory device, organized as 2,097,152 words. Word mode data appears on DQ15–DQ0. The device is designed to be programmed in-system with the standard 3.0 volt VCC supply, and can also be programmed in standard EPROM programmers. The device is available with an access time of 70 or 85 ns and is offered in a 73-ball FBGA package. Standard control pins—chip enable (CE#fx), write enable (WE#), and output enable (OE#)—control normal read and write operations, and avoid bus contention issues. The device requires only a single 3.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. Available on Am29DL640H and Am29DL320G, the SecSi™ (Secured Silicon) Sector is an extra 256 byte sector capable of being permanently locked by AMD or customers. The Secure SectorSecSi Indicator Bit (DQ7) is permanently set to a 1 if the part is factory locked, and set to a 0 if customer lockable. This way, customer lockable parts can never be used to replace a factory locked part. Factory locked parts provide several options. The Secure SectorSecSi Sector may store a secure, random 16 byte ESN (Electronic Serial Number), customer code (programmed through AMD’s ExpressFlash service), or both. Customer Lockable parts may utilize the Secure SectorSecSi Sector as a one-time programmable area. The AMD DMS (Data Management Software) manages data programming, enables EEPROM emulation, and eases historical sector erase flash limitations. For more information on DMS or to obtain the software, contact AMD or an authorized representative. The device offers complete compatibility with the JEDEC single-power-supply Flash command set standard . Commands are written to the command register using standard microprocessor write timings. Reading data out of the device is similar to reading from other Flash or EPROM devices. The host system can detect whether a program or erase operation is complete by using the device status bits: RY/BY# pin, DQ7 (Data# Polling) and DQ6/DQ2 (toggle bits). After a program or erase cycle has been completed, the device automatically returns to the read mode. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from the factory. Hardware data protection m easures include a low V CC d etector that automatically inhibits write operations during power transitions. The hardware sector protection feature disables both program and erase operations in any combination of the sectors of memory. This can be achieved in-system or via programming equipment. The device offers two power-saving features. When addresses have been stable for a specified amount of time, the device enters the automatic sleep mode. The system can also place the device into the standby mode . Power consumption is greatly reduced in both modes. Simultaneous Read/Write Operations with Zero Latency The Simultaneous Read/Write architecture provides simultaneous operation b y dividing the memory space into four banks. Sector addresses are fixed, system software can be used to form user-defined bank groups. During an Erase/Program operation, any of the three non-busy banks may be read from. Note that only two banks can operate simultaneously. The device can improve overall system performance by allowing a host system to program or erase in one bank, then immediately and simultaneously read from the other bank, with zero latency. This releases the system from waiting for the completion of program or erase operations. The Am29DL640H can be organized as both a top and bottom boot sector configuration. Bank Bank 1 Bank 2 Bank 3 Bank 4 Megabits 8 Mb 24 Mb 24 Mb 8 Mb Sector Sizes Eight 4 Kword, Fifteen 32 Kword Forty-eight 32 Kword Forty-eight 32 Kword Eight 4 Kword, Fifteen 32 Kword The Am29DL320G can be organized as either a top or bottom boot sector configuration. Top boot configuration is shown in the following table. Bank Bank 1 Bank 2 Bank 3 Bank 4 Megabits 4 Mb 12 Mb 12 Mb 4 Mb Sector Sizes Eight 4 Kword, Seven 32 Kword Twenty-four 32 Kword Twenty-four 32 Kword Eight 32 Kword 2 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION TABLE OF CONTENTS Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6 MCP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 6 Flash Memory Block Diagram . . . . . . . . . . . . . . . 7 Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . 8 Special Package Handling Instructions .................................... 8 Ordering Information . . . . . . . . . . . . . . . . . . . . . . 10 MCP Device Bus Operations . . . . . . . . . . . . . . . . 10 Table 1. Device Bus Operations—Flash Word Mode .................... 11 Figure 5. Erase Operation.............................................................. 38 Erase Suspend/Erase Resume Commands ........................... 38 Table 22. Am29DL640H and Am29DL320G Command Definitions 39 Flash Write Operation Status . . . . . . . . . . . . . . . 40 DQ7: Data# Polling ................................................................. 40 Figure 6. Data# Polling Algorithm .................................................. 40 DQ6: Toggle Bit I .................................................................... 41 Figure 7. Toggle Bit Algorithm........................................................ 41 Flash Device Bus Operations . . . . . . . . . . . . . . . 12 Requirements for Reading Array Data ................................... 12 Writing Commands/Command Sequences ............................ 12 Simultaneous Read/Write Operations with Zero Latency ....... 12 Automatic Sleep Mode ........................................................... 13 RESET#: Hardware Reset Pin ............................................... 13 Output Disable Mode .............................................................. 13 Table 2. Am29DL640H Sector Architecture ....................................14 Table 3. Am29DL640H Bank Address ............................................17 Table 4. Am29DL640H SecSi™ Sector Addresses .......................17 Table 5. Am29DL320G Top Boot Sector Addresses .....................18 Table 6. Am29DL320G Top Boot SecSiTM Sector Addresses ........ 19 Table 7. Am29DL320G Bottom Boot Sector Addresses .................20 Table 8. Am29DL320G Bottom Boot SecSiTM Sector Addresses ... 21 Table 9. Am29DL640H Boot Sector/Sector Block Addresses for Protection/Unprotection ...........................................22 Table 10. Am29DL320G Top Boot Sector/Sector Block Addresses for Protection/Unprotection ..................................23 Table 11. Am29DL320G Bottom Boot Sector/Sector Block Addresses for Protection/Unprotection .............................................................23 DQ2: Toggle Bit II ................................................................... 42 Reading Toggle Bits DQ6/DQ2 ............................................... 42 DQ5: Exceeded Timing Limits ................................................ 42 DQ3: Sector Erase Timer ....................................................... 42 Table 23. Write Operation Status ................................................... 43 Absolute Maximum Ratings . . . . . . . . . . . . . . . . 44 Figure 8. Maximum Negative Overshoot Waveform ...................... 44 Figure 9. Maximum Positive Overshoot Waveform........................ 44 Flash DC Characteristics . . . . . . . . . . . . . . . . . . 45 CMOS Compatible ..................................................................... 45 Figure 10. ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents) ............................................................. 46 Figure 11. Typical ICC1 vs. Frequency ............................................ 46 Pseudo SRAM DC and Operating Characteristics . . . . . . . . . . . . . . . . . . 47 Figure 12. Standby Current ISB CMOS ......................................... 47 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Figure 13. Test Setup.................................................................... 48 Figure 14. Input Waveforms and Measurement Levels ................. 48 Write Protect (WP#) ................................................................ 24 Table 12. WP#/ACC Modes ............................................................24 Flash AC Characteristics . . . . . . . . . . . . . . . . . . 49 Pseudo SRAM CE#s Timing ...................................................... 49 Figure 15. Timing Diagram for Alternating Between Pseudo SRAM to Flash................................................... 49 Temporary Sector Unprotect .................................................. 24 Figure 1. Temporary Sector Unprotect Operation........................... 25 Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 26 Read-Only Operations .............................................................. 50 Figure 16. Read Operation Timings ............................................... 50 SecSi™ (Secured Silicon) Sector SectorFlash Memory Region ................................................. 27 Table 13. SecSi Sector Programming ................................................27 Figure 3. SecSi Sector Protect Verify.............................................. 28 Hardware Reset (RESET#) ....................................................... 51 Figure 17. Reset Timings ............................................................... 51 Erase and Program Operations ................................................. 52 Figure 18. Program Operation Timings.......................................... Figure 19. Accelerated Program Timing Diagram.......................... Figure 20. Chip/Sector Erase Operation Timings .......................... Figure 21. Back-to-back Read/Write Cycle Timings ...................... Figure 22. Data# Polling Timings (During Embedded Algorithms). Figure 23. Toggle Bit Timings (During Embedded Algorithms)...... Figure 24. DQ2 vs. DQ6................................................................. 53 53 54 55 55 56 56 Hardware Data Protection ...................................................... 28 Common Flash Memory Interface (CFI) . . . . . . . 28 Table 14. Am29DL640H CFI Query Identification String ................ 29 Table 15. Am29DL640H System Interface String ........................... 29 Table 16. Am29DL640H Device Geometry Definition..................... 30 Table 17. Am29DL640H Primary Vendor-Specific Extended Query .............................................................................. 31 Table 18. Am29DL320G CFI Query Identification String ................ 32 Table 19. Am29DL320G System Interface String ........................... 32 Table 20. Am29DL320G Device Geometry Definition..................... 33 Table 21. Am29DL320G Primary Vendor-Specific Extended Query .............................................................................. 34 Temporary Sector Unprotect ..................................................... 57 Figure 25. Temporary Sector Unprotect Timing Diagram .............. 57 Figure 26. Sector/Sector Block Protect and Unprotect Timing Diagram ............................................................. 58 Alternate CE#f Controlled Erase and Program Operations ....... 59 Figure 27. Flash Alternate CE#f Controlled Write (Erase/Program) Operation Timings.......................................................................... 60 Flash Command Definitions . . . . . . . . . . . . . . . . 35 Reading Array Data ................................................................ 35 Reset Command ..................................................................... 35 Autoselect Command Sequence ............................................ 35 Enter SecSi™ Sector/Exit SecSi Sector Command Sequence .............................................................. 35 Program Command Sequence ............................................... 36 Figure 4. Program Operation .......................................................... 37 Pseudo SRAM AC Characteristics . . . . . . . . . . . 61 Power Up Time .......................................................................... 61 Read Cycle ................................................................................ 61 Figure 28. Pseudo SRAM Read Cycle—Address Controlled......... 61 Figure 29. Pseudo SRAM Read Cycle........................................... 62 Write Cycle ................................................................................ 63 Figure 30. Pseudo SRAM Write Cycle—WE# Control ................... 63 Figure 31. Pseudo SRAM Write Cycle—CE1#s Control ................ 64 Figure 32. Pseudo SRAM Write Cycle— UB#s and LB#s Control.................................................................. 65 Chip Erase Command Sequence ........................................... 37 Sector Erase Command Sequence ........................................ 37 November 17, 2003 Am75DL9608HG 3 ADVANCE INFORMATION Enter SecSi™ Sector/Exit SecSi Sector Command Sequence .............................................................. 35 Program Command Sequence ............................................... 36 Figure 4. Program Operation ......................................................... 37 Flash Erase And Programming Performance . . . 66 Latchup Characteristics . . . . . . . . . . . . . . . . . . . 66 BGA Package Capacitance . . . . . . . . . . . . . . . . 66 Flash Data Retention . . . . . . . . . . . . . . . . . . . . . 66 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 67 FTA073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm ................ 67 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 68 Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6 MCP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 6 Flash Memory Block Diagram . . . . . . . . . . . . . . . 7 Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . 8 Special Package Handling Instructions .................................... 8 Ordering Information . . . . . . . . . . . . . . . . . . . . . . 10 MCP Device Bus Operations . . . . . . . . . . . . . . . . 10 Table 1. Device Bus Operations—Flash Word Mode .................... 11 Chip Erase Command Sequence ........................................... 37 Sector Erase Command Sequence ........................................ 37 Figure 5. Erase Operation.............................................................. 38 Erase Suspend/Erase Resume Commands ........................... 38 Table 22. Am29DL640H and Am29DL320G Command Definitions 39 Flash Write Operation Status . . . . . . . . . . . . . . . 40 DQ7: Data# Polling ................................................................. 40 Figure 6. Data# Polling Algorithm .................................................. 40 DQ6: Toggle Bit I .................................................................... 41 Figure 7. Toggle Bit Algorithm........................................................ 41 Flash Device Bus Operations . . . . . . . . . . . . . . . 12 Requirements for Reading Array Data ................................... 12 Writing Commands/Command Sequences ............................ 12 Simultaneous Read/Write Operations with Zero Latency ....... 12 Automatic Sleep Mode ........................................................... 13 RESET#: Hardware Reset Pin ............................................... 13 Output Disable Mode .............................................................. 13 Table 2. Am29DL640H Sector Architecture ....................................14 Table 3. Am29DL640H Bank Address ............................................17 Table 4. Am29DL640H SecSi™ Sector Addresses .......................17 Table 5. Am29DL320G Top Boot Sector Addresses .....................18 Table 6. Am29DL320G Top Boot SecSiTM Sector Addresses ........ 19 Table 7. Am29DL320G Bottom Boot Sector Addresses .................20 Table 8. Am29DL320G Bottom Boot SecSiTM Sector Addresses ... 21 Table 9. Am29DL640H Boot Sector/Sector Block Addresses for Protection/Unprotection ...........................................22 Table 10. Am29DL320G Top Boot Sector/Sector Block Addresses for Protection/Unprotection ..................................23 Table 11. Am29DL320G Bottom Boot Sector/Sector Block Addresses for Protection/Unprotection .............................................................23 DQ2: Toggle Bit II ................................................................... 42 Reading Toggle Bits DQ6/DQ2 ............................................... 42 DQ5: Exceeded Timing Limits ................................................ 42 DQ3: Sector Erase Timer ....................................................... 42 Table 23. Write Operation Status ................................................... 43 Absolute Maximum Ratings . . . . . . . . . . . . . . . . 44 Figure 8. Maximum Negative Overshoot Waveform ...................... 44 Figure 9. Maximum Positive Overshoot Waveform........................ 44 Flash DC Characteristics . . . . . . . . . . . . . . . . . . 45 CMOS Compatible ..................................................................... 45 Figure 10. ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents) ............................................................. 46 Figure 11. Typical ICC1 vs. Frequency ............................................ 46 Pseudo SRAM DC and Operating Characteristics . . . . . . . . . . . . . . . . . . 47 Figure 12. Standby Current ISB CMOS ......................................... 47 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Figure 13. Test Setup.................................................................... 49 Figure 14. Input Waveforms and Measurement Levels ................. 49 Flash AC Characteristics . . . . . . . . . . . . . . . . . . 50 Pseudo SRAM CE#s Timing ...................................................... 50 Figure 15. Timing Diagram for Alternating Between Pseudo SRAM to Flash................................................... 50 Write Protect (WP#) ................................................................ 24 Table 12. WP#/ACC Modes ............................................................24 Temporary Sector Unprotect .................................................. 24 Figure 1. Temporary Sector Unprotect Operation........................... 25 Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 26 Read-Only Operations .............................................................. 51 Figure 16. Read Operation Timings ............................................... 51 Hardware Reset (RESET#) ....................................................... 52 Figure 17. Reset Timings ............................................................... 52 SecSi™ (Secured Silicon) Sector SectorFlash Memory Region ................................................. 27 Table 13. SecSi Sector Programming ................................................27 Figure 3. SecSi Sector Protect Verify.............................................. 28 Erase and Program Operations ................................................. 53 Figure 18. Program Operation Timings.......................................... Figure 19. Accelerated Program Timing Diagram.......................... Figure 20. Chip/Sector Erase Operation Timings .......................... Figure 21. Back-to-back Read/Write Cycle Timings ...................... Figure 22. Data# Polling Timings (During Embedded Algorithms). Figure 23. Toggle Bit Timings (During Embedded Algorithms)...... Figure 24. DQ2 vs. DQ6................................................................. 54 54 55 56 56 57 57 Hardware Data Protection ...................................................... 28 Common Flash Memory Interface (CFI) . . . . . . . 28 Table 14. Am29DL640H CFI Query Identification String ................ 29 Table 15. Am29DL640H System Interface String ........................... 29 Table 16. Am29DL640H Device Geometry Definition..................... 30 Table 17. Am29DL640H Primary Vendor-Specific Extended Query .............................................................................. 31 Table 18. Am29DL320G CFI Query Identification String ................ 32 Table 19. Am29DL320G System Interface String ........................... 32 Table 20. Am29DL320G Device Geometry Definition..................... 33 Table 21. Am29DL320G Primary Vendor-Specific Extended Query .............................................................................. 34 Temporary Sector Unprotect ..................................................... 58 Figure 25. Temporary Sector Unprotect Timing Diagram .............. 58 Figure 26. Sector/Sector Block Protect and Unprotect Timing Diagram ............................................................. 59 Alternate CE#f Controlled Erase and Program Operations ....... 60 Figure 27. Flash Alternate CE#f Controlled Write (Erase/Program) Operation Timings.......................................................................... 61 Flash Command Definitions . . . . . . . . . . . . . . . . 35 Reading Array Data ................................................................ 35 Reset Command ..................................................................... 35 Autoselect Command Sequence ............................................ 35 Pseudo SRAM AC Characteristics . . . . . . . . . . . 62 Power Up Time .......................................................................... 62 Read Cycle ................................................................................ 62 Figure 28. Pseudo SRAM Read Cycle—Address Controlled......... 62 4 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION Latchup Characteristics . . . . . . . . . . . . . . . . . . . 67 BGA Package Capacitance . . . . . . . . . . . . . . . . . 67 Flash Data Retention . . . . . . . . . . . . . . . . . . . . . . 67 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 68 FTA073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm ................ 68 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 69 Figure 29. Pseudo SRAM Read Cycle............................................ 63 Write Cycle ................................................................................ 64 Figure 30. Pseudo SRAM Write Cycle—WE# Control .................... 64 Figure 31. Pseudo SRAM Write Cycle—CE1#s Control ................. 65 Figure 32. Pseudo SRAM Write Cycle— UB#s and LB#s Control................................................................... 66 Flash Erase And Programming Performance . . . 67 November 17, 2003 Am75DL9608HG 5 ADVANCE INFORMATION PRODUCT SELECTOR GUIDE Part Number Speed Options Standard Voltage Range: VCC = 2.7–3.3 V Am75DL9608HG Flash Memory (Am29DL640H, Am29DL320G) 75 70 70 30 70 70 70 30 75 55 55 30 Pseudo SRAM 70 70 70 35 Max Access Time (ns) CE# Access (ns) OE# Access (ns) MCP BLOCK DIAGRAM VCCf A21 to A0 VSS RY/BY# CE#f1 64 MBit Flash Memory #1 DQ15 to DQ0 VCCf VSS A20 to A0 RY/BY# RESET# WP#/ACC CE#f2 32 MBit Flash Memory #2 VCCs VSS A18 to A0 LB#s UB#s WE# OE# CE1#s CE2s 8 MBit pseudo Static RAM DQ15 to DQ0 6 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION FLASH MEMORY BLOCK DIAGRAM VCC VSS OE# Mux A21*–A0 Bank 1 Address Bank 1 Y-gate X-Decoder A21*–A0 RY/BY# Bank 2 Address Bank 2 X-Decoder DQ15–DQ0 A21*–A0 RESET# WE# CE# WP#/ACC STATE CONTROL & COMMAND REGISTER Status DQ15–DQ0 DQ15–DQ0 Control DQ15–DQ0 Mux A21*–A0 X-Decoder Bank 3 Address Bank 3 Y-gate X-Decoder A21*–A0 Mux Bank 4 Address Bank 4 * Addresses for Am29DL640H are A21–A0. Address for Am29DL320G are A20–A0. November 17, 2003 Am75DL9608HG DQ15–DQ0 7 ADVANCE INFORMATION CONNECTION DIAGRAM 73-Ball FBGA Top View A1 NC A10 NC Flash only B1 NC B5 NC B6 NC B10 NC Pseudo SRAM only Shared C1 NC C3 A7 C4 D4 UB# C5 D5 E5 RY/BY# C6 D6 E6 A20 C7 A8 C8 A11 LB# WP#/ACC WE# D2 A3 D3 A6 D7 A19 D8 A12 D9 A15 RESET# CE2s E2 A2 E3 A5 E4 A18 E7 A9 E8 A13 E9 A21 F1 NC F2 A1 F3 A4 F4 A17 F7 A10 F8 A14 F9 CE#f2 F10 NC G1 NC G2 A0 G3 VSS G4 DQ1 G7 DQ6 G8 NC G9 A16 G10 NC H2 CE#f1 H3 OE# H4 DQ9 H5 DQ3 H6 DQ4 H7 DQ13 H8 DQ15 H9 NC J2 CE1#s J3 DQ0 J4 DQ10 J5 VCCf J6 VCCs J7 DQ12 J8 DQ7 J9 VSS K3 DQ8 K4 DQ2 K5 DQ11 K6 NC K7 DQ5 K8 DQ14 L1 NC L5 NC L6 NC L10 NC M1 NC M10 NC Special Package Handling Instructions Special handling is required for Flash Memory products in molded packages (BGA). The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. 8 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION PIN DESCRIPTION A18–A0 = 19 Address Inputs (Common) A21–A19, A-1 = 4 Address Inputs (Flash) DQ15–DQ0 CE#f1 CE#f2 CE#1s CE2s OE# WE# RY/BY# UB#s LB#s RESET# WP#/ACC VCCf = 16 Data Inputs/Outputs (Common) = Flash Chip Enable 1 (Am29DL640H) = Flash Chip Enable 2 (Am29DL320G) = Pseudo SRAM Chip Enable 1 = Pseudo SRAM Chip Enable 2 = Output Enable (Common) = Write Enable (Common) = Ready/Busy Output = Upper Byte Control (Pseudo SRAM) = Lower Byte Control (Pseudo SRAM) = Hardware Reset Pin, Active Low = Hardware Write Protect/ Acceleration Pin (Flash) = Flash 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply tolerances) = Pseudo SRAM Power Supply = Device Ground (Common) = Pin Not Connected Internally LOGIC SYMBOL 19 A18–A0 A21–A19 CE#f1 CE#f2 CE1#s CE2s OE# WE# WP#/ACC RESET# UB#s LB#s RY/BY# DQ15–DQ0 16 VCCs VSS NC November 17, 2003 Am75DL9608HG 9 ADVANCE INFORMATION ORDERING INFORMATION The order number (Valid Combination) is formed by the following: Am75DL960 8 HG T 75 I T TAPE AND REEL T = 7 inches S = 13 inches TEMPERATURE RANGE I = Industrial (–40°C to +85°C) SPEED OPTION 75 = 70 ns Flash + 55 ns pSRAM 70 = 70 ns Flash + 70 ns pSRAM (See page 5) BOOT SECTOR ARCHITECTURE T = Top Boot of Am29DL320G Flash B = Bottom Boot of Am29DL320G Flash PROCESS TECHNOLOGY H = 0.13 µm (Am29DL640H) G = 0.17 µm (Am29DL320G) PSEUDO SRAM DEVICE DENSITY 8 = 8 Mbits AMD DEVICE NUMBER/DESCRIPTION Am75DL9608HG Stacked Multi-Chip Package (MCP) Flash Memory and Pseudo SRAM Am29DL640H 64 Megabit (8/4 M x 16-Bit) and Am29DL320G 32 Megabit (4/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 8 Mbit (512 K x 16-Bit) Pseudo Static RAM Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations. Valid Combinations Order Number Am75DL9608HGT70I Am75DL9608HGB70I Am75DL9608HGT75I Am75DL9608HGB75I T, S Package Marking M750000000 M750000001 M750000002 M750000003 T, S MCP DEVICE BUS OPERATIONS This section describes the requirements and use of the device bus operations, which are initiated through the internal command register. The command register itself does not occupy any addressable memory location. The register is a latch used to store the commands, along with the address and data information needed to execute the command. The contents of the register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device. Tables 1-2 lists the device bus operations, the inputs and control levels they require, and the resulting output. The following subsections describe each of these operations in further detail. 10 Am75DL9608HG November 17, 2003 ADVANCE Table 1. Operation (Notes 1, 2) Read from Flash INFORMATION Device Bus Operations—Flash Word Mode Addr. LB#s UB#s RESET# WP#/ ACC (Note 4) L/H DQ7– DQ0 DOUT DIN High-Z DQ15– DQ8 DOUT DIN High-Z CE#f1 CE1#s CE2s CE#f2 OE# WE# (Note 8) (Note 8) (Note 7) L H X H X H X L H X H X L X L X L H X L X L X L X L H L H L L H AIN AIN X X X X SADD, A6 = L, A1 = H, A0 = L SADD, A6 = H, A1 = H, A0 = L X X X H Write to Flash L VCC ± 0.3 V L H L X X H VCC ± 0.3 V H (Note 4) Standby X H H X X H H X X L X X X X L X H Output Disable Flash Hardware Reset Sector Protect (Note 5) L/H High-Z High-Z X L L/H High-Z High-Z L X H X X VID L/H DIN X Sector Unprotect (Note 5) Temporary Sector Unprotect Read from Pseudo SRAM L X H X X X VID (Note 6) DIN X X X X X L X L L H L L H VID (Note 6) DIN DOUT High-Z DOUT DOUT High-Z DIN DIN High-Z H L H L H AIN H L L H X High-Z DOUT DIN Write to Pseudo SRAM H L H X L AIN H L H X High-Z DIN Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 9.0 ± 0.5 V, X = Don’t Care, SADD = Flash Sector Address, AIN = Address In, DIN = Data In, DOUT = Data Out Notes: 1. Other operations except for those indicated in this column are inhibited. 2. Do not apply CE#fx = VIL, CE1#s = VIL and CE2s = VIH at the same time. 3. Don’t care or open LB#s or UB#s. 4. If WP#/ACC = VIL, the boot sectors will be protected. If WP#/ACC = VIH the boot sectors protection will be removed. If WP#/ACC = VACC (9V), the program time will be reduced by 40%. 5. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector/Sector Block Protection and Unprotection” section. 6. If WP#/ACC = VIL, the two outermost boot sectors remain protected. If WP#/ACC = VIH, the two outermost boot sector protection depends on whether they were last protected or unprotected using the method described in “Sector/Sector Block Protection and Unprotection”. If WP#/ACC = VHH, all sectors will be unprotected. 7. Only one flash device should be accessed at a time. For Am29DL640H flash access, CE#f1 = VIL, CE#f2 = VIH. For Am29DL320G flash access, CE#f1 = VIH, CE#f2 = ViL. 8. CE#1s= VIL, CE2s= VIH, CE#f1=VIH and CE#f2=VIH when accessing pseudo SRAM. November 17, 2003 Am75DL9608HG 11 ADVANCE INFORMATION FLASH DEVICE BUS OPERATIONS Requirements for Reading Array Data To read array data from the outputs, the system must drive the CE#f and OE# pins to VIL. CE#f is the power control and selects the device. OE# is the output control and gates array data to the output pins. WE# should remain at VIH. The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This ensures that no spurious alteration of the memory content occurs during the power transition. No command is necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses on the device address inputs produce valid data on the device data outputs. Each bank remains enabled for read access until the command register contents are altered. Refer to the AC Read-Only Operations table for timing specifications and to Figure 14 for the timing diagram. ICC1 in the DC Characteristics table represents the active current specification for reading array data. provided by the WP#/ACC pin. This function is primarily intended to allow faster manufacturing throughput at the factory. If the system asserts VHH on this pin, the device automatically enters the aforementioned Unlock Bypass mode, temporarily unprotects any protected sectors, and uses the higher voltage on the pin to reduce the time required for program operations. The system would use a two-cycle program command sequence as required by the Unlock Bypass mode. Removing VHH from the WP#/ACC pin returns the device to normal operation. Note that VHH must not be asserted on WP#/ACC for operations other than accelerated programming, or device damage may result. In addition, the WP#/ACC pin must not be left floating or unconnected; inconsistent behavior of the device may result. See “Write Protect (WP#)” on page 23 for related information. Autoselect Functions If the system writes the autoselect command sequence, the device enters the autoselect mode. The system can then read autoselect codes from the internal register (which is separate from the memory array) on DQ15–DQ0. Standard read cycle timings apply in this mode. Refer to the Sector/Sector Block Protection and Unprotection and Autoselect Command Sequence sections for more information. Writing Commands/Command Sequences To write a command or command sequence (which includes programming data to the device and erasing sectors of memory), the system must drive WE# and CE#f to VIL, and OE# to VIH. The device features an Unlock Bypass mode to facilitate faster programming. Once a bank enters the Unlock Bypass mode, only two write cycles are required to program a word or byte, instead of four. The “Byte/Word Program Command Sequence” section has details on programming data to the device using both standard and Unlock Bypass command sequences. An erase operation can erase one sector, multiple sectors, or the entire device. Table 2 indicates the address space that each sector occupies. Similarly, a “sector address” is the address bits required to uniquely select a sector. The “Flash Command Definitions” section has details on erasing a sector or the entire chip, or suspending/resuming the erase operation. The device address space is divided into four banks. A “bank address” is the address bits required to uniquely select a bank. ICC2 in the DC Characteristics table represents the active current specification for the write mode. The Flash AC Characteristics section contains timing specification tables and timing diagrams for write operations. Accelerated Program Operation The device offers accelerated program operations through the ACC function. This is one of two functions Simultaneous Read/Write Operations with Zero Latency This device is capable of reading data from one bank of memory while programming or erasing in the other bank of memory. An erase operation may also be suspended to read from or program to another location within the same bank (except the sector being erased). Figure 19 shows how read and write cycles may be initiated for simultaneous operation with zero latency. ICC6f and ICC7f in the table represent the current specifications for read-while-program and read-while-erase, respectively. Standby Mode When the system is not reading or writing to the device, it can place the device in the standby mode. In this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, independent of the OE# input. The device enters the CMOS standby mode when the CE#f and RESET# pins are both held at VCC ± 0.3 V. (Note that this is a more restricted voltage range than V IH .) If CE#f and RESET# are held at V IH , but not within VCC ± 0.3 V, the device will be in the standby mode, but the standby current will be greater. The de- 12 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION ready to accept another command sequence, to ensure data integrity. Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS±0.3 V, the device draws CMOS standby current (I CC4 f). If RESET# is held at VIL but not within VSS±0.3 V, the standby current will be greater. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash memory, enabling the system to read the boot-up firmware from the Flash memory. If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a “0” (busy) until the internal reset operation is complete, which requires a time of tREADY (during Embedded Algorithms). The system can thus monitor RY/BY# to determine whether the reset operation is complete. If RESET# is asserted when a program or erase operation is not executing (RY/BY# pin is “1”), the reset operation is completed within a time of tREADY ( not during Embedded Algorithms). The system can read data tRH a fter the RESET# pin returns to VIH. Refer to the Flash AC Characteristics tables for RESET# parameters and to Figure 15 for the timing diagram. vice requires standard access time (tCE) for read access when the device is in either of these standby modes, before it is ready to read data. If the device is deselected during erasure or programming, the device draws active current until the operation is completed. ICC3f in the table represents the standby current specification. Automatic Sleep Mode The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables this mode when addresses remain stable for t ACC + 30 ns. The automatic sleep mode is independent of the CE#f, WE#, and OE# control signals. Standard address access timings provide new data when addresses are changed. While in sleep mode, output data is latched and always available to the system. ICC5f in the table represents the automatic sleep mode current specification. RESET#: Hardware Reset Pin The RESET# pin provides a hardware method of resetting the device to reading array data. When the RESET# pin is driven low for at least a period of tRP, the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET# pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is Output Disable Mode When the OE# input is at VIH, output from the device is disabled. The output pins are placed in the high impedance state. November 17, 2003 Am75DL9608HG 13 ADVANCE Table 2. Bank Sector SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7 SA8 SA9 SA10 Bank 1 SA11 SA12 SA13 SA14 SA15 SA16 SA17 SA18 SA19 SA20 SA21 SA22 INFORMATION Am29DL640H Sector Architecture Sector Size (Kbytes/Kwords) 8/4 8/4 8/4 8/4 8/4 8/4 8/4 8/4 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 (x16) Address Range 00000h–00FFFh 01000h–01FFFh 02000h–02FFFh 03000h–03FFFh 04000h–04FFFh 05000h–05FFFh 06000h–06FFFh 07000h–07FFFh 08000h–0FFFFh 10000h–17FFFh 18000h–1FFFFh 20000h–27FFFh 28000h–2FFFFh 30000h–37FFFh 38000h–3FFFFh 40000h–47FFFh 48000h–4FFFFh 50000h–57FFFh 58000h–5FFFFh 60000h–67FFFh 68000h–6FFFFh 70000h–77FFFh 78000h–7FFFFh Sector Address A21–A12 0000000000 0000000001 0000000010 0000000011 0000000100 0000000101 0000000110 0000000111 0000001xxx 0000010xxx 0000011xxx 0000100xxx 0000101xxx 0000110xxx 0000111xxx 0001000xxx 0001001xxx 0001010xxx 0001011xxx 0001100xxx 0001101xxx 0001101xxx 0001111xxx 14 Am75DL9608HG November 17, 2003 ADVANCE Table 2. Bank Sector SA23 SA24 SA25 SA26 SA27 SA28 SA29 SA30 SA31 SA32 SA33 SA34 SA35 SA36 SA37 SA38 SA39 SA40 SA41 SA42 SA43 SA44 SA45 Bank 2 SA46 SA47 SA48 SA49 SA50 SA51 SA52 SA53 SA54 SA55 SA56 SA57 SA58 SA59 SA60 SA61 SA62 SA63 SA64 SA65 SA66 SA67 SA68 SA69 SA70 INFORMATION Am29DL640H Sector Architecture (Continued) Sector Address A21–A12 0010000xxx 0010001xxx 0010010xxx 0010011xxx 0010100xxx 0010101xxx 0010110xxx 0010111xxx 0011000xxx 0011001xxx 0011010xxx 0011011xxx 0011000xxx 0011101xxx 0011110xxx 0011111xxx 0100000xxx 0100001xxx 0100010xxx 0101011xxx 0100100xxx 0100101xxx 0100110xxx 0100111xxx 0101000xxx 0101001xxx 0101010xxx 0101011xxx 0101100xxx 0101101xxx 0101110xxx 0101111xxx 0110000xxx 0110001xxx 0110010xxx 0110011xxx 0100100xxx 0110101xxx 0110110xxx 0110111xxx 0111000xxx 0111001xxx 0111010xxx 0111011xxx 0111100xxx 0111101xxx 0111110xxx 0111111xxx Sector Size (Kbytes/Kwords) 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 (x16) Address Range 80000h–87FFFh 88000h–8FFFFh 90000h–97FFFh 98000h–9FFFFh A0000h–A7FFFh A8000h–AFFFFh B0000h–B7FFFh B8000h–BFFFFh C0000h–C7FFFh C8000h–CFFFFh D0000h–D7FFFh D8000h–DFFFFh E0000h–E7FFFh E8000h–EFFFFh F0000h–F7FFFh F8000h–FFFFFh F9000h–107FFFh 108000h–10FFFFh 110000h–117FFFh 118000h–11FFFFh 120000h–127FFFh 128000h–12FFFFh 130000h–137FFFh 138000h–13FFFFh 140000h–147FFFh 148000h–14FFFFh 150000h–157FFFh 158000h–15FFFFh 160000h–167FFFh 168000h–16FFFFh 170000h–177FFFh 178000h–17FFFFh 180000h–187FFFh 188000h–18FFFFh 190000h–197FFFh 198000h–19FFFFh 1A0000h–1A7FFFh 1A8000h–1AFFFFh 1B0000h–1B7FFFh 1B8000h–1BFFFFh 1C0000h–1C7FFFh 1C8000h–1CFFFFh 1D0000h–1D7FFFh 1D8000h–1DFFFFh 1E0000h–1E7FFFh 1E8000h–1EFFFFh 1F0000h–1F7FFFh 1F8000h–1FFFFFh November 17, 2003 Am75DL9608HG 15 ADVANCE Table 2. Bank Sector SA71 SA72 SA73 SA74 SA75 SA76 SA77 SA78 SA79 SA80 SA81 SA82 SA83 SA84 SA85 SA86 SA87 SA88 SA89 SA90 SA91 SA92 SA93 Bank 3 SA94 SA95 SA96 SA97 SA98 SA99 SA100 SA101 SA102 SA103 SA104 SA105 SA106 SA107 SA108 SA109 SA110 SA111 SA112 SA113 SA114 SA115 SA116 SA117 SA118 INFORMATION Am29DL640H Sector Architecture (Continued) Sector Address A21–A12 1000000xxx 1000001xxx 1000010xxx 1000011xxx 1000100xxx 1000101xxx 1000110xxx 1000111xxx 1001000xxx 1001001xxx 1001010xxx 1001011xxx 1001100xxx 1001101xxx 1001110xxx 1001111xxx 1010000xxx 1010001xxx 1010010xxx 1010011xxx 1010100xxx 1010101xxx 1010110xxx 1010111xxx 1011000xxx 1011001xxx 1011010xxx 1011011xxx 1011100xxx 1011101xxx 1011110xxx 1011111xxx 1100000xxx 1100001xxx 1100010xxx 1100011xxx 1100100xxx 1100101xxx 1100110xxx 1100111xxx 1101000xxx 1101001xxx 1101010xxx 1101011xxx 1101100xxx 1101101xxx 1101110xxx 1101111xxx Sector Size (Kbytes/Kwords) 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 (x16) Address Range 200000h–207FFFh 208000h–20FFFFh 210000h–217FFFh 218000h–21FFFFh 220000h–227FFFh 228000h–22FFFFh 230000h–237FFFh 238000h–23FFFFh 240000h–247FFFh 248000h–24FFFFh 250000h–257FFFh 258000h–25FFFFh 260000h–267FFFh 268000h–26FFFFh 270000h–277FFFh 278000h–27FFFFh 280000h–28FFFFh 288000h–28FFFFh 290000h–297FFFh 298000h–29FFFFh 2A0000h–2A7FFFh 2A8000h–2AFFFFh 2B0000h–2B7FFFh 2B8000h–2BFFFFh 2C0000h–2C7FFFh 2C8000h–2CFFFFh 2D0000h–2D7FFFh 2D8000h–2DFFFFh 2E0000h–2E7FFFh 2E8000h–2EFFFFh 2F0000h–2FFFFFh 2F8000h–2FFFFFh 300000h–307FFFh 308000h–30FFFFh 310000h–317FFFh 318000h–31FFFFh 320000h–327FFFh 328000h–32FFFFh 330000h–337FFFh 338000h–33FFFFh 340000h–347FFFh 348000h–34FFFFh 350000h–357FFFh 358000h–35FFFFh 360000h–367FFFh 368000h–36FFFFh 370000h–377FFFh 378000h–37FFFFh 16 Am75DL9608HG November 17, 2003 ADVANCE Table 2. Bank Sector SA119 SA120 SA121 SA122 SA123 SA124 SA125 SA126 SA127 SA128 SA129 Bank 4 SA130 SA131 SA132 SA133 SA134 SA135 SA136 SA137 SA138 SA139 SA140 SA141 INFORMATION Am29DL640H Sector Architecture (Continued) Sector Address A21–A12 1110000xxx 1110001xxx 1110010xxx 1110011xxx 1110100xxx 1110101xxx 1110110xxx 1110111xxx 1111000xxx 1111001xxx 1111010xxx 1111011xxx 1111100xxx 1111101xxx 1111110xxx 1111111000 1111111001 1111111010 1111111011 1111111100 1111111101 1111111110 1111111111 Sector Size (Kbytes/Kwords) 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 8/4 8/4 8/4 8/4 8/4 8/4 8/4 8/4 (x16) Address Range 380000h–387FFFh 388000h–38FFFFh 390000h–397FFFh 398000h–39FFFFh 3A0000h–3A7FFFh 3A8000h–3AFFFFh 3B0000h–3B7FFFh 3B8000h–3BFFFFh 3C0000h–3C7FFFh 3C8000h–3CFFFFh 3D0000h–3D7FFFh 3D8000h–3DFFFFh 3E0000h–3E7FFFh 3E8000h–3EFFFFh 3F0000h–3F7FFFh 3F8000h–3F8FFFh 3F9000h–3F9FFFh 3FA000h–3FAFFFh 3FB000h–3FBFFFh 3FC000h–3FCFFFh 3FD000h–3FDFFFh 3FE000h–3FEFFFh 3FF000h–3FFFFFh Note: The address range is A21:A0 Table 3. Bank 1 2 3 4 Am29DL640H Bank Address A21–A19 000 001, 010, 011 100, 101, 110 111 Table 4. Device Am29DL640H Am29DL640H SecSi™ Sector Addresses Sector Size 256 bytes (x16) Address Range 00000h–0007Fh November 17, 2003 Am75DL9608HG 17 ADVANCE Table 5. Sector SA0 SA1 SA2 Bank 4 SA3 SA4 SA5 SA6 SA7 SA8 SA9 SA10 SA11 SA12 SA13 SA14 SA15 SA16 SA17 SA18 Bank 3 SA19 SA20 SA21 SA22 SA23 SA24 SA25 SA26 SA27 SA28 SA29 SA30 SA31 SA32 SA33 SA34 SA35 SA36 SA37 SA38 Bank 2 INFORMATION Am29DL320G Top Boot Sector Addresses Sector Size (Kbytes/Kwords) 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 (x16) Address Range 000000h–07FFFh 008000h–0FFFFh 010000h–17FFFh 018000h–01FFFFh 020000h–027FFFh 028000h–02FFFFh 030000h–037FFFh 038000h–03FFFFh 040000h–047FFFh 048000h–04FFFFh 050000h–057FFFh 058000h–05FFFFh 060000h–067FFFh 068000h–06FFFFh 070000h–077FFFh 078000h–07FFFFh 080000h–087FFFh 088000h–08FFFFh 090000h–097FFFh 098000h–09FFFFh 0A0000h–0A7FFFh 0A8000h–0AFFFFh 0B0000h–0B7FFFh 0B8000h–0BFFFFh 0C0000h–0C7FFFh 0C8000h–0CFFFFh 0D0000h–0D7FFFh 0D8000h–0DFFFFh 0E0000h–0E7FFFh 0E8000h–0EFFFFh 0F0000h–0F7FFFh 0F8000h–0FFFFFh 100000h–107FFFh 108000h–10FFFFh 110000h–117FFFh 118000h–11FFFFh 120000h–127FFFh 128000h–12FFFFh 130000h–137FFFh 138000h–13FFFFh 140000h–147FFFh 148000h–14FFFFh 150000h–157FFFh 158000h–15FFFFh 160000h–167FFFh 168000h–16FFFFh 170000h–177FFFh 178000h–17FFFFh Sector Address A20–A12 000000xxx 000001xxx 000010xxx 000011xxx 000100xxx 000101xxx 000110xxx 000111xxx 001000xxx 001001xxx 001010xxx 001011xxx 001100xxx 001101xxx 001110xxx 001111xxx 010000xxx 010001xxx 010010xxx 010011xxx 010100xxx 010101xxx 010110xxx 010111xxx 011000xxx 011001xxx 011010xxx 011011xxx 011100xxx 011101xxx 011110xxx 011111xxx 100000xxx 100001xxx 100010xxx 100011xxx 100100xxx 100101xxx 100110xxx 100111xxx 101000xxx 101001xxx 101010xxx 101011xxx 101100xxx 101101xxx 101110xxx 101111xxx SA39 SA40 SA41 SA42 SA43 SA44 SA45 SA46 SA47 18 Am75DL9608HG November 17, 2003 ADVANCE Table 5. Sector SA48 Bank 2 (continued) SA49 SA50 SA51 SA52 SA53 SA54 SA55 SA56 SA57 SA58 SA59 SA60 SA61 Bank 1 SA62 SA63 SA64 SA65 SA66 SA67 SA68 SA69 SA70 INFORMATION Am29DL320G Top Boot Sector Addresses (Continued) Sector Address A20–A12 110000xxx 110001xxx 110010xxx 110011xxx 110100xxx 110101xxx 110110xxx 110111xxx 111000xxx 111001xxx 111010xxx 111011xxx 111100xxx 111101xxx 111110xxx 111111000 111111001 111111010 111111011 111111100 111111101 111111110 111111111 Sector Size (Kbytes/Kwords) 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 8/4 8/4 8/4 8/4 8/4 8/4 8/4 8/4 (x16) Address Range 180000h–187FFFh 188000h–18FFFFh 190000h–197FFFh 198000h–19FFFFh 1A0000h–1A7FFFh 1A8000h–1AFFFFh 1B0000h–1B7FFFh 1B8000h–1BFFFFh 1C0000h–1C7FFFh 1C8000h–1CFFFFh 1D0000h–1D7FFFh 1D8000h–1DFFFFh 1E0000h–1E7FFFh 1E8000h–1EFFFFh 1F0000h–1F7FFFh 1F8000h–1F8FFFh 1F9000h–1F9FFFh 1FA000h–1FAFFFh 1FB000h–1FBFFFh 1FC000h–1FCFFFh 1FD000h–1FDFFFh 1FE000h–1FEFFFh 1FF000h–1FFFFFh Note: The address range is A20:A0. Table 6. Device Am29DL320GT Am29DL320G Top Boot SecSi Sector Addresses TM Sector Address A20–A12 111111xxx Sector Size (Bytes/Words) 256/128 (x16) Address Range 1FF000h–1FF07Fh November 17, 2003 Am75DL9608HG 19 ADVANCE Table 7. Sector SA0 SA1 SA2 SA3 SA4 SA5 Bank 1 SA6 SA7 SA8 SA9 SA10 SA11 SA12 SA13 SA14 SA15 SA16 SA17 SA18 SA19 SA20 SA21 SA22 SA23 SA24 SA25 Bank 2 SA26 SA27 SA28 SA29 SA30 SA31 SA32 SA33 SA34 SA35 SA36 SA37 SA38 SA39 SA40 SA41 Bank 3 INFORMATION Am29DL320G Bottom Boot Sector Addresses Sector Size (Kbytes/Kwords) 8/4 8/4 8/4 8/4 8/4 8/4 8/4 8/4 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 (x16) Address Range 000000h–000FFFh 001000h–001FFFh 002000h–002FFFh 003000h–003FFFh 004000h–004FFFh 005000h–005FFFh 006000h–006FFFh 007000h–007FFFh 008000h–00FFFFh 010000h–017FFFh 018000h–01FFFFh 020000h–027FFFh 028000h–02FFFFh 030000h–037FFFh 038000h–03FFFFh 040000h–047FFFh 048000h–04FFFFh 050000h–057FFFh 058000h–05FFFFh 060000h–067FFFh 068000h–06FFFFh 070000h–077FFFh 078000h–07FFFFh 080000h–087FFFh 088000h–08FFFFh 090000h–097FFFh 098000h–09FFFFh 0A0000h–0A7FFFh 0A8000h–0AFFFFh 0B0000h–0B7FFFh 0B8000h–0BFFFFh 0C0000h–0C7FFFh 0C8000h–0CFFFFh 0D0000h–0D7FFFh 0D8000h–0DFFFFh 0E0000h–0E7FFFh 0E8000h–0EFFFFh 0F0000h–0F7FFFh 0F8000h–0FFFFFh 100000h–107FFFh 108000h–10FFFFh 110000h–117FFFh 118000h–11FFFFh 120000h–127FFFh 128000h–12FFFFh 130000h–137FFFh 138000h–13FFFFh 140000h–147FFFh Sector Address A20–A12 000000000 000000001 000000010 000000011 000000100 000000101 000000110 000000111 000001xxx 000010xxx 000011xxx 000100xxx 000101xxx 000110xxx 000111xxx 001000xxx 001001xxx 001010xxx 001011xxx 001100xxx 001101xxx 001110xxx 001111xxx 010000xxx 010001xxx 010010xxx 010011xxx 010100xxx 010101xxx 010110xxx 010111xxx 011000xxx 011001xxx 011010xxx 011011xxx 011100xxx 011101xxx 011110xxx 011111xxx 100000xxx 100001xxx 100010xxx 100011xxx 100100xxx 100101xxx 100110xxx 100111xxx 101000xxx SA42 SA43 SA44 SA45 SA46 SA47 20 Am75DL9608HG November 17, 2003 ADVANCE Table 7. Sector SA48 SA49 SA50 SA51 Bank 3 (continued) SA52 SA53 SA54 SA55 SA56 SA57 SA58 SA59 SA60 SA61 SA62 SA63 SA64 SA65 Bank 4 SA66 SA67 SA68 SA69 SA70 INFORMATION Am29DL320G Bottom Boot Sector Addresses (Continued) Sector Address A20–A12 101001xxx 101010xxx 101011xxx 101100xxx 101101xxx 101110xxx 101111xxx 111000xxx 110001xxx 110010xxx 110011xxx 110100xxx 110101xxx 110110xxx 110111xxx 111000xxx 111001xxx 111010xxx 111011xxx 111100xxx 111101xxx 111110xxx 111111xxx Sector Size (Kbytes/Kwords) 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 64/32 (x16) Address Range 148000h–14FFFFh 150000h–157FFFh 158000h–15FFFFh 160000h–167FFFh 168000h–16FFFFh 170000h–177FFFh 178000h–17FFFFh 180000h–187FFFh 188000h–18FFFFh 190000h–197FFFh 198000h–19FFFFh 1A0000h–1A7FFFh 1A8000h–1AFFFFh 1B0000h–1B7FFFh 1B8000h–1BFFFFh 1C0000h–1C7FFFh 1C8000h–1CFFFFh 1D0000h–1D7FFFh 1D8000h–1DFFFFh 1E0000h–1E7FFFh 1E8000h–1EFFFFh 1F0000h–1F7FFFh 1F8000h–1FFFFFh Note: The address range is A20:A0 Table 8. Device Am29DL320GB Am29DL320G Bottom Boot SecSi Sector Addresses TM Sector Address A20–A12 000000xxx Sector Size (Bytes/Words) 256/128 (x16) Address Range 00000h–00007Fh November 17, 2003 Am75DL9608HG 21 ADVANCE INFORMATION Sector/ Sector Block Size 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 192 (3x64) Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes Sector/Sector Block Protection and Unprotection (Note: For the following discussion, the term “sector” applies to both sectors and sector blocks. A sector block consists of two or more adjacent sectors that are protected or unprotected at the same time (see Table 9). The hardware sector protection feature disables both program and erase operations in any sector. The hardware sector unprotection feature re-enables both program and erase operations in previously protected sectors. Sector protection/unprotection can be implemented via two methods. Table 9. Am29DL640H Boot Sector/Sector Block Addresses for Protection/Unprotection Sector SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7 SA8–SA10 SA11–SA14 SA15–SA18 SA19–SA22 SA23–SA26 SA27-SA30 SA31-SA34 SA35-SA38 A21–A12 0000000000 0000000001 0000000010 0000000011 0000000100 0000000101 0000000110 0000000111 0000001XXX, 0000010XXX, 0000011XXX, 00001XXXXX 00010XXXXX 00011XXXXX 00100XXXXX 00101XXXXX 00110XXXXX 00111XXXXX Sector/ Sector Block Size 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 192 (3x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes Sector SA39-SA42 SA43-SA46 SA47-SA50 SA51-SA54 SA55–SA58 SA59–SA62 SA63–SA66 SA67–SA70 SA71–SA74 SA75–SA78 SA79–SA82 SA83–SA86 SA87–SA90 SA91–SA94 SA95–SA98 SA99–SA102 SA103–SA106 SA107–SA110 SA111–SA114 SA115–SA118 SA119–SA122 SA123–SA126 SA127–SA130 SA131–SA133 SA134 SA135 SA136 SA137 SA138 SA139 SA140 SA141 A21–A12 01000XXXXX 01001XXXXX 01010XXXXX 01011XXXXX 01100XXXXX 01101XXXXX 01110XXXXX 01111XXXXX 10000XXXXX 10001XXXXX 10010XXXXX 10011XXXXX 10100XXXXX 10101XXXXX 10110XXXXX 10111XXXXX 11000XXXXX 11001XXXXX 11010XXXXX 11011XXXXX 11100XXXXX 11101XXXXX 11110XXXXX 1111100XXX, 1111101XXX, 1111110XXX 1111111000 1111111001 1111111010 1111111011 1111111100 1111111101 1111111110 1111111111 22 Am75DL9608HG November 17, 2003 ADVANCE Table 10. Am29DL320G Top Boot Sector/Sector Block Addresses for Protection/Unprotection Sector SA0 SA1-SA3 SA4-SA7 SA8-SA11 SA12-SA15 SA16-SA19 SA20-SA23 SA24-SA27 SA28-SA31 SA32-SA35 SA36-SA39 SA40-SA43 SA44-SA47 SA48-SA51 SA52-SA55 SA56-SA59 SA60-SA62 SA63 SA64 SA65 SA66 SA67 SA68 SA69 SA70 A20–A12 000000XXX 000001XXX, 000010XXX 000011XXX 0001XXXXX 0010XXXXX 0011XXXXX 0100XXXXX 0101XXXXX 0110XXXXX 0111XXXXX 1000XXXXX 1001XXXXX 1010XXXXX 1011XXXXX 1100XXXXX 1101XXXXX 1110XXXXX 111100XXX, 111101XXX, 111110XXX 111111000 111111001 111111010 111111011 111111100 111111101 111111110 111111111 Sector/ Sector Block Size 64 Kbytes 192 (3x64) Kbytes INFORMATION Table 11. Am29DL320G Bottom Boot Sector/Sector Block Addresses for Protection/Unprotection Sector SA70 SA69-SA67 A20–A12 111111XXX 111110XXX, 111101XXX, 111100XXX 1110XXXXX 1101XXXXX 1100XXXXX 1011XXXXX 1010XXXXX 1001XXXXX 1000XXXXX 0111XXXXX 0110XXXXX 0101XXXXX 0100XXXXX 0011XXXXX 0010XXXXX 0001XXXXX 000011XXX, 000010XXX, 000001XXX 000000111 000000110 000000101 000000100 000000011 000000010 000000001 000000000 Sector/Sector Block Size 64 Kbytes 192 (3x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 192 (3x64) Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 256 (4x64) Kbytes 192 (3x64) Kbytes SA10-SA8 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes 8 Kbytes SA7 SA6 SA5 SA4 SA3 SA2 SA1 SA0 SA66-SA63 SA62-SA59 SA58-SA55 SA54-SA51 SA50-SA47 SA46-SA43 SA42-SA39 SA38-SA35 SA34-SA31 SA30-SA27 SA26-SA23 SA22–SA19 SA18-SA15 SA14-SA11 November 17, 2003 Am75DL9608HG 23 ADVANCE INFORMATION Note that the WP#/ACC pin must not be left floating or unconnected; inconsistent behavior of the device may result. Table 12. WP# Input Voltage Sector protection/unprotection requires VID on the RESET# pin only, and can be implemented either in-system or via programming equipment. Figure 2 shows the algorithms and Figure 24 shows the timing diagram. For sector unprotect, all unprotected sectors must first be protected prior to the first sector unprotect write cycle. Note that the sector unprotect algorithm unprotects all sectors in parallel. All previously protected sectors must be individually re-protected. To change data in protected sectors efficiently, the temporary sector unprotect function is available. See “Temporary Sector Unprotect”. The device is shipped with all sectors unprotected. AMD offers the option of programming and protecting sectors at its factory prior to shipping the device through AMD’s ExpressFlash™ Service. Contact an AMD representative for details. It is possible to determine whether a sector is protected or unprotected. See the Sector/Sector Block Protection and Unprotection section for details. WP#/ACC Modes Am29DL640H Disables programming and erasing in SA0, SA1, SA140, and SA141 Enables programming and erasing in SA0, SA1, SA140, and SA141 Am29DL320G Disables programming and erasing in SA0 and SA1 or SA69 and SA70 Enables programming and erasing in SA0 and SA1 or SA60 and SA70 VIL VIH VHH Enables accelerated programming (ACC). See “Accelerated Program Operation” on page 11. Temporary Sector Unprotect (Note: For the following discussion, the term “sector” applies to both sectors and sector blocks. A sector block consists of two or more adjacent sectors that are protected or unprotected at the same time (see Table 9). This feature allows temporary unprotection of previously protected sectors to change data in-system. The Sector Unprotect mode is activated by setting the RESET# pin to VID. During this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. Once VID is removed from the RESET# pin, all the previously protected sectors are protected again. Figure 1 shows the algorithm, and Figure 23 shows the timing diagrams, for this feature. If the WP#/ACC pin is at VIL while the Am29DL640H is enabled, sectors 0, 1, 140, and 141 of that device will remain protected during the Temporary sector Unprotect mode. Similarly, If the WP#/ACC pin is at VIL while the Am29DL320G is enabled, the two outermost boot sectors (SA0 and 1 on bottom boot devices or SA69 and 70 on top boot devices) of that device will remain protected during the Temporary sector Unprotect mode. Write Protect (WP#) The Write Protect function provides a hardware method of protecting without using VID. This function is one of two provided by the WP#/ACC pin. If the system asserts VIL o n the WP#/ACC pin while the Am29DL640H is enabled (CE#f1), the device disables program and erase functions in sectors 0, 1, 140, and 141, independently of whether those sectors were protected or unprotected using the method described in “Sector/Sector Block Protection and Unprotection”. Similarly, the two outermost boot sectors (SA0 and 1 on bottom boot devices or SA69 and 70 on top boot devices) on the Am29DL320G are protected when VIL i s asserted on the WP#/ACC pin while the Am29DL320G is enabled (CE#f2). If the system asserts VIH on the WP#/ACC pin, the device reverts to whether the aforementioned sectors were last set to be protected or unprotected. That is, sector protection or unprotection for these sectors depends on whether they were last protected or unprotected using the method described in “Sector/Sector Block Protection and Unprotection”. 24 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION START RESET# = VID (Note 1) Perform Erase or Program Operations RESET# = VIH Temporary Sector Unprotect Completed (Note 2) Notes: 1. All protected sectors unprotected (If WP#/ACC = VIL, the following sectors will remain protected: sectors 0, 1, 140, and 141 (Am29DL640H), sectors 0 and 1 (Am29DL320GB), or sectors 69 and 70 (Am29DL320GT). 2. All previously protected sectors are protected once again. Figure 1. Temporary Sector Unprotect Operation November 17, 2003 Am75DL9608HG 25 ADVANCE INFORMATION START PLSCNT = 1 RESET# = VID Wait 1 µs Protect all sectors: The indicated portion of the sector protect algorithm must be performed for all unprotected sectors prior to issuing the first sector unprotect address START PLSCNT = 1 RESET# = VID Wait 1 µs Temporary Sector Unprotect Mode No First Write Cycle = 60h? Yes Set up sector address Sector Protect: Write 60h to sector address with A6 = 0, A1 = 1, A0 = 0 Wait 150 µs Verify Sector Protect: Write 40h to sector address with A6 = 0, A1 = 1, A0 = 0 Read from sector address with A6 = 0, A1 = 1, A0 = 0 No No First Write Cycle = 60h? Yes All sectors protected? Yes Set up first sector address Sector Unprotect: Write 60h to sector address with A6 = 1, A1 = 1, A0 = 0 Temporary Sector Unprotect Mode Increment PLSCNT Reset PLSCNT = 1 Wait 15 ms Verify Sector Unprotect: Write 40h to sector address with A6 = 1, A1 = 1, A0 = 0 No No PLSCNT = 25? Yes Data = 01h? Increment PLSCNT Yes No Yes No Read from sector address with A6 = 1, A1 = 1, A0 = 0 Set up next sector address Device failed Protect another sector? No Remove VID from RESET# PLSCNT = 1000? Yes Data = 00h? Yes Device failed Write reset command Last sector verified? Yes No Sector Protect Algorithm Sector Protect complete Sector Unprotect Algorithm Remove VID from RESET# Write reset command Sector Unprotect complete Figure 2. In-System Sector Protect/Unprotect Algorithms 26 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION Table 13. SecSi Sector Programming Device Data Random number 8-byte secure ESN 16-byte secure ESN 16-byte secure ESN Word Mode 000000h– 000007h 000008h– 00000Fh 000000h– 000007h 1FF000h– 1FF007Fh Byte Mode 000000h– 00000Fh 000010h– 000020h 000000h– 00000Fh 3FE000h– 3FE0FFh SecSi™ (Secured Silicon) Sector SectorFlash Memory Region The SecSi (Secured Silicon) Sector feature provides a Flash memory region that enables permanent part identification through an Electronic Serial Number (ESN). The SecSi Sector is 256 bytes in length, and uses a SecSi Sector Indicator Bit (DQ7) to indicate whether or not the SecSi Sector is locked when shipped from the factory. This bit is permanently set at the factory and cannot be changed, which prevents cloning of a factory locked part. This ensures the security of the ESN once the product is shipped to the field. AMD offers the device with the SecSi Sector either fac t or y l ocke d or c u s t om e r l o ckabl e. T he fac tory-locked version is always protected when shipped from the factory, and has the SecSi (Secured Silicon) Sector Indicator Bit permanently set to a “1.” The customer-lockable version is shipped with the SecSi Sector unprotected, allowing customers to utilize the that sector in any manner they choose. The customer-lockable version has the SecSi (Secured Silicon) Sector Indicator Bit permanently set to a “0.” Thus, the SecSi Sector Indicator Bit prevents customer-lockable devices from being used to replace devices that are factory locked. The system accesses the SecSi Sector Secure Sector through a command sequence (see “Enter SecSi™ Sector/Exit SecSi Sector Command Sequence”). After the system has written the Enter SecSi Sector command sequence, it may read the SecSi Sector by using the addresses normally occupied by the boot sectors. This mode of operation continues until the system issues the Exit SecSi Sector command sequence, or until power is removed from the device. Note that the ACC function and unlock bypass modes are not available when the SecSi Sector is enabled. On power-up, or following a hardware reset, the device reverts to sending commands to the first 256 bytes of Sector 0. Factory Locked: SecSi Sector Programmed and Protected At the Factory In a factory locked device, the SecSi Sector is protected when the device is shipped from the factory. The SecSi Sector cannot be modified in any way. The device is preprogrammed with both a random number and secure ESNs. See Table 13 for address location details. Am29DL640H Am29DL320GB (Bottom boot) Am29DL320GT (Top boot) The device is available preprogrammed with one of the following: ■ Random number and secure ESNs only ■ Customer code through the ExpressFlash service ■ Random number, secure ESNs, and customer code through the ExpressFlash service. Customers may opt to have their code programmed by AMD through the AMD ExpressFlash service. AMD programs the customer’s code, with or without the random ESN. The devices are then shipped from AMD’s factory with the SecSi Sector permanently locked. Contact an AMD representative for details on using AMD’s ExpressFlash service. Customer Lockable: SecSi Sector NOT Programmed or Protected At the Factory If the security feature is not required, the SecSi Sector can be treated as an additional Flash memory space. The SecSi Sector can be read any number of times, but can be programmed and locked only once. Note that the accelerated programming (ACC) and unlock bypass functions are not available when programming the SecSi Sector. The SecSi Sector area can be protected using one of the following procedures: ■ Write the three-cycle Enter SecSi Sector Region command sequence, and then follow the in-system sector protect algorithm as shown in Figure 2, except that RESET# may be at either VIH or VID. This allows in-system protection of the SecSi Sector Region without raising any device pin to a high voltage. Note that this method is only applicable to the SecSi Sector. ■ To verify the protect/unprotect status of the SecSi Sector, follow the algorithm shown in Figure 3. Once the SecSi Sector is locked and verified, the system must write the Exit SecSi Sector Region command sequence to return to reading and writing the remainder of the array. The SecSi Sector lock must be used with caution since, once locked, there is no procedure available for unlocking the SecSi Sector area and none of the bits in the SecSi Sector memory space can be modified in any way. November 17, 2003 Am75DL9608HG 27 ADVANCE INFORMATION Logical Inhibit Write cycles are inhibited by holding any one of OE# = VIL, CE#f = VIH or WE# = VIH. To initiate a write cycle, CE#f and WE# must be a logical zero while OE# is a logical one. Power-Up Write Inhibit If WE# = CE#f = VIL and OE# = VIH during power up, the device does not accept commands on the rising edge of WE#. The internal state machine is automatically reset to the read mode on power-up. START RESET# = VIH or VID Wait 1 µs Write 60h to any address If data = 00h, SecSi Sector is unprotected. If data = 01h, SecSi Sector is protected. Remove VIH or VID from RESET# Write 40h to SecSi Sector address with A6 = 0, A1 = 1, A0 = 0 Read from SecSi Sector address with A6 = 0, A1 = 1, A0 = 0 COMMON FLASH MEMORY INTERFACE (CFI) The Common Flash Interface (CFI) specification outlines device and host system software interrogation handshake, which allows specific vendor-specified software algorithms to be used for entire families of devices. Software support can then be device-independent, JEDEC ID-independent, and forward- and backward-compatible for the specified flash device families. Flash vendors can standardize their existing interfaces for long-term compatibility. This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address 55h in word mode (or address AAh in byte mode), any time the device is ready to read array data. The system can read CFI information at the addresses given in Tables 14–17. To terminate reading CFI data, the system must write the reset command.The CFI Query mode is not accessible when the device is executing an Embedded Program or embedded Erase algorithm. The system can also write the CFI query command when the device is in the autoselect mode. The device enters the CFI query mode, and the system can read CFI data at the addresses given in Tables 14–17. The system must write the reset command to return the device to reading array data. For further information, please refer to the CFI Specification and CFI Publication 100, available via the World Wide Web at http://www.amd.com/flash/cfi. Alternatively, contact an AMD representative for copies of these documents. Write reset command SecSi Sector Protect Verify complete Figure 3. SecSi Sector Protect Verify Hardware Data Protection The command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent writes (refer to Table 22 for command definitions). In addition, the following hardware data protection measures prevent accidental erasure or programming, which might otherwise be caused by spurious system level signals during V CC power-up and power-down transitions, or from system noise. Low VCC Write Inhibit When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC power-up and power-down. The command register and all internal program/erase circuits are disabled, and the device resets to the read mode. Subsequent writes are ignored until VCC is greater than VLKO. The system must provide the proper signals to the control pins to prevent unintentional writes when V CC i s greater than VLKO. Write Pulse “Glitch” Protection Noise pulses of less than 5 ns (typical) on OE#, CE#f or WE# do not initiate a write cycle. 28 Am75DL9608HG November 17, 2003 ADVANCE Table 14. Addresses (Word Mode) 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah Addresses (Byte Mode) 20h 22h 24h 26h 28h 2Ah 2Ch 2Eh 30h 32h 34h INFORMATION Am29DL640H CFI Query Identification String Data 0051h 0052h 0059h 0002h 0000h 0040h 0000h 0000h 0000h 0000h 0000h Description Query Unique ASCII string “QRY” Primary OEM Command Set Address for Primary Extended Table Alternate OEM Command Set (00h = none exists) Address for Alternate OEM Extended Table (00h = none exists) Table 15. Addresses (Word Mode) 1Bh 1Ch 1Dh 1Eh 1Fh 20h 21h 22h 23h 24h 25h 26h Addresses (Byte Mode) 36h 38h 3Ah 3Ch 3Eh 40h 42h 44h 46h 48h 4Ah 4Ch Am29DL640H System Interface String Description VCC Min. (write/erase) D7–D4: volt, D3–D0: 100 millivolt VCC Max. (write/erase) D7–D4: volt, D3–D0: 100 millivolt VPP Min. voltage (00h = no VPP pin present) VPP Max. voltage (00h = no VPP pin present) Typical timeout per single byte/word write 2N µs Typical timeout for Min. size buffer write 2N µs (00h = not supported) Typical timeout per individual block erase 2N ms Typical timeout for full chip erase 2N ms (00h = not supported) Max. timeout for byte/word write 2N times typical Max. timeout for buffer write 2N times typical Max. timeout per individual block erase 2N times typical Max. timeout for full chip erase 2N times typical (00h = not supported) Data 0027h 0036h 0000h 0000h 0003h 0000h 0009h 0000h 0005h 0000h 0004h 0000h November 17, 2003 Am75DL9608HG 29 ADVANCE Table 16. Addresses (Word Mode) 27h 28h 29h 2Ah 2Bh 2Ch 2Dh 2Eh 2Fh 30h 31h 32h 33h 34h 35h 36h 37h 38h 39h 3Ah 3Bh 3Ch Addresses (Byte Mode) 4Eh 50h 52h 54h 56h 58h 5Ah 5Ch 5Eh 60h 62h 64h 66h 68h 6Ah 6Ch 6Eh 70h 72h 74h 76h 78h INFORMATION Am29DL640H Device Geometry Definition Data Description Device Size = 2 byte Flash Device Interface description (refer to CFI publication 100) Max. number of byte in multi-byte write = 2N (00h = not supported) Number of Erase Block Regions within device Erase Block Region 1 Information (refer to the CFI specification or CFI publication 100) N 0017h 0002h 0000h 0000h 0000h 0003h 0007h 0000h 0020h 0000h 007Dh 0000h 0000h 0001h 0007h 0000h 0020h 0000h 0000h 0000h 0000h 0000h Erase Block Region 2 Information (refer to the CFI specification or CFI publication 100) Erase Block Region 3 Information (refer to the CFI specification or CFI publication 100) Erase Block Region 4 Information (refer to the CFI specification or CFI publication 100) 30 Am75DL9608HG November 17, 2003 ADVANCE Table 17. Addresses (Word Mode) 40h 41h 42h 43h 44h 45h Addresses (Byte Mode) 80h 82h 84h 86h 88h 8Ah INFORMATION Am29DL640H Primary Vendor-Specific Extended Query Description Query-unique ASCII string “PRI” Major version number, ASCII (reflects modifications to the silicon) Minor version number, ASCII (reflects modifications to the CFI table) Address Sensitive Unlock (Bits 1-0) 0 = Required, 1 = Not Required Silicon Revision Number (Bits 7-2) Data 0050h 0052h 0049h 0031h 0033h 0004h 46h 47h 48h 8Ch 8Eh 90h 0002h 0001h 0001h Erase Suspend 0 = Not Supported, 1 = To Read Only, 2 = To Read & Write Sector Protect 0 = Not Supported, X = Number of sectors in per group Sector Temporary Unprotect 00 = Not Supported, 01 = Supported Sector Protect/Unprotect scheme 01 =29F040 mode, 02 = 29F016 mode, 03 = 29F400, 04 = 29LV800 mode Simultaneous Operation 00 = Not Supported, X = Number of Sectors (excluding Bank 1) Burst Mode Type 00 = Not Supported, 01 = Supported Page Mode Type 00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page ACC (Acceleration) Supply Minimum 00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV ACC (Acceleration) Supply Maximum 00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV Top/Bottom Boot Sector Flag 49h 92h 0004h 4Ah 4Bh 4Ch 4Dh 94h 96h 98h 9Ah 0077h 0000h 0000h 0085h 4Eh 9Ch 0095h 4Fh 9Eh 0001h 00h = Uniform device, 01h = 8 x 8 Kbyte Sectors, Top And Bottom Boot with Write Protect, 02h = Bottom Boot Device, 03h = Top Boot Device, 04h = Both Top and Bottom Program Suspend 0 = Not supported, 1 = Supported Bank Organization 00 = Data at 4Ah is zero, X = Number of Banks Bank 1 Region Information X = Number of Sectors in Bank 1 Bank 2 Region Information X = Number of Sectors in Bank 2 Bank 3 Region Information X = Number of Sectors in Bank 3 50h A0h 0001h 57h AEh 0004h 58h B0h 0017h 59h B2h 0030h 5Ah B4h 0030h November 17, 2003 Am75DL9608HG 31 ADVANCE Addresses (Word Mode) 5Bh Addresses (Byte Mode) B6h INFORMATION Data 0017h Bank 4 Region Information Description X = Number of Sectors in Bank 4 Table 18. Addresses (Word Mode) 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah Addresses (Byte Mode) 20h 22h 24h 26h 28h 2Ah 2Ch 2Eh 30h 32h 34h Am29DL320G CFI Query Identification String Data 0051h 0052h 0059h 0002h 0000h 0040h 0000h 0000h 0000h 0000h 0000h Description Query Unique ASCII string “QRY” Primary OEM Command Set Address for Primary Extended Table Alternate OEM Command Set (00h = none exists) Address for Alternate OEM Extended Table (00h = none exists) Table 19. Addresses (Word Mode) 1Bh 1Ch 1Dh 1Eh 1Fh 20h 21h 22h 23h 24h 25h 26h Addresses (Byte Mode) 36h 38h 3Ah 3Ch 3Eh 40h 42h 44h 46h 48h 4Ah 4Ch Am29DL320G System Interface String Description VCC Min. (write/erase) D7–D4: volt, D3–D0: 100 millivolt VCC Max. (write/erase) D7–D4: volt, D3–D0: 100 millivolt VPP Min. voltage (00h = no VPP pin present) VPP Max. voltage (00h = no VPP pin present) Typical timeout per single byte/word write 2N µs Typical timeout for Min. size buffer write 2N µs (00h = not supported) Typical timeout per individual block erase 2N ms Typical timeout for full chip erase 2N ms (00h = not supported) Max. timeout for byte/word write 2N times typical Max. timeout for buffer write 2N times typical Max. timeout per individual block erase 2N times typical Max. timeout for full chip erase 2N times typical (00h = not supported) Data 0027h 0036h 0000h 0000h 0004h 0000h 000Ah 0000h 0005h 0000h 0004h 0000h 32 Am75DL9608HG November 17, 2003 ADVANCE Table 20. Addresses (Word Mode) 27h 28h 29h 2Ah 2Bh 2Ch 2Dh 2Eh 2Fh 30h 31h 32h 33h 34h 35h 36h 37h 38h 39h 3Ah 3Bh 3Ch Addresses (Byte Mode) 4Eh 50h 52h 54h 56h 58h 5Ah 5Ch 5Eh 60h 62h 64h 66h 68h 6Ah 6Ch 6Eh 70h 72h 74h 76h 78h INFORMATION Am29DL320G Device Geometry Definition Data Description Device Size = 2 byte Flash Device Interface description (refer to CFI publication 100) Max. number of bytes in multi-byte write = 2N (00h = not supported) Number of Erase Block Regions within device Erase Block Region 1 Information (refer to the CFI specification or CFI publication 100) N 0016h 0002h 0000h 0000h 0000h 0002h 0007h 0000h 0020h 0000h 003Eh 0000h 0000h 0001h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h Erase Block Region 2 Information Erase Block Region 3 Information Erase Block Region 4 Information November 17, 2003 Am75DL9608HG 33 ADVANCE Table 21. Addresses (Word Mode) 40h 41h 42h 43h 44h 45h 46h 47h 48h 49h 4Ah 4Bh 4Ch 4Dh Addresses (Byte Mode) 80h 82h 84h 86h 88h 8Ah 8Ch 8Eh 90h 92h 94h 96h 98h 9Ah INFORMATION Am29DL320G Primary Vendor-Specific Extended Query Description Query-unique ASCII string “PRI” Major version number, ASCII Minor version number, ASCII Silicon Revision Number 00h = 0.23 µm, 01h = 0.17 µm Erase Suspend 0 = Not Supported, 1 = To Read Only, 2 = To Read & Write Sector Protect 0 = Not Supported, X = Number of sectors in per group Sector Temporary Unprotect 00 = Not Supported, 01 = Supported Sector Protect/Unprotect scheme 04 = 29LV800 mode Simultaneous Operation Number of Sectors (excluding Bank 1) Burst Mode Type 00 = Not Supported, 01 = Supported Page Mode Type 00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page ACC (Acceleration) Supply Minimum 00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV ACC (Acceleration) Supply Maximum 00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV Top/Bottom Boot Sector Flag 02h = Bottom Boot Device, 03h = Top Boot Device Data 0050h 0052h 0049h 0031h 0033h 0001h 0002h 0001h 0001h 0004h 0038h 0000h 0000h 0085h 4Eh 9Ch 0095h 4Fh 9Eh 000Xh 34 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION FLASH COMMAND DEFINITIONS Writing specific address and data commands or sequences into the command register initiates device operations. Table 22 defines the valid register command sequences. Writing incorrect address and data values or writing them in the improper sequence may place the device in an unknown state. A reset command is then required to return the device to reading array data. All addresses are latched on the falling edge of WE# or CE#f, whichever happens later. All data is latched on the rising edge of WE# or CE#f, whichever happens first. Refer to the Flash AC Characteristics section for timing diagrams. The reset command may be written between the sequence cycles in a program command sequence before programming begins. This resets the bank to which the system was writing to the read mode. If the program command sequence is written to a bank that is in the Erase Suspend mode, writing the reset co m m an d re tur ns th a t ba nk to the e ra s e- s us pend-read mode. Once programming begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in an autoselect command sequence. Once in the autoselect mode, the reset command must be written to return to the read mode. If a bank entered the autoselect mode while in the Erase Suspend mode, writing the reset command returns that bank to the erase-suspend-read mode. If DQ5 goes high during a program or erase operation, writing the reset command returns the banks to the read mode (or erase-suspend-read mode if that bank was in Erase Suspend). Reading Array Data The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. Each bank is ready to read array data after completing an Embedded Program or Embedded Erase algorithm. After the device accepts an Erase Suspend command, the corresponding ban k enters the erase-suspend-read mode, after which the system can read data from any non-erase-suspended sector within the same bank. The system can read array data using the standard read timing, except that if it reads at an address within erase-suspended sectors, the device outputs status data. After completing a programming operation in the Erase Suspend mode, the system may once again read array data with the same exception. See the Erase Suspend/Erase Resume Commands section for more information. The system must issue the reset command to return a bank to the read (or erase-suspend-read) mode if DQ5 goes high during an active program or erase operation, or if the bank is in the autoselect mode. See the next section, Reset Command, for more information. See also Requirements for Reading Array Data in the section for more information. The Read-Only Operations table provides the read parameters, and Figure 14 shows the timing diagram. Autoselect Command Sequence The autoselect command sequence allows the host system to access the manufacturer and device codes, and determine whether or not a sector is protected. The autoselect command sequence may be written to an address within a bank that is either in the read or erase-suspend-read mode. The autoselect command may not be written while the device is actively programming or erasing in the other bank. The autoselect command sequence is initiated by first writing two unlock cycles. This is followed by a third write cycle that contains the bank address and the autoselect command. The bank then enters the autoselect mode. The system may read any number of autoselect codes without reinitiating the command sequence. Table 22 shows the address and data requirements. To determine sector protection information, the system must write to the appropriate bank address (BA) and sector address (SADD). Table 2 shows the address range and bank number associated with each sector. The system must write the reset command to return to the read mode (or erase-suspend-read mode if the bank was previously in Erase Suspend). Reset Command Writing the reset command resets the banks to the read or erase-suspend-read mode. Address bits are don’t cares for this command. The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This resets the bank to which the system was writing to the read mode. Once erasure begins, however, the device ignores reset commands until the operation is complete. Enter SecSi™ Sector/Exit SecSi Sector Command Sequence The SecSi Sector region provides a secured data area containing a random, sixteen-byte electronic serial number (ESN). The system can access the SecSi Sector region by issuing the three-cycle Enter SecSi November 17, 2003 Am75DL9608HG 35 ADVANCE INFORMATION DQ6 status bits to indicate the operation was successful. However, a succeeding read will show that the data is still “0.” Only erase operations can convert a “0” to a “1.” Unlock Bypass Command Sequence The unlock bypass feature allows the system to program bytes or words to a bank faster than using the standard program command sequence. The unlock bypass command sequence is initiated by first writing two unlock cycles. This is followed by a third write cycle containing the unlock bypass command, 20h. That bank then enters the unlock bypass mode. A two-cycle unlock bypass program command sequence is all that is required to program in this mode. The first cycle in this sequence contains the unlock bypass program command, A0h; the second cycle contains the program address and data. Additional data is programmed in the same manner. This mode dispenses with the initial two unlock cycles required in the standard program command sequence, resulting in faster total programming time. Table 22 shows the requirements for the command sequence. During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset commands are valid. To exit the unlock bypass mode, the system must issue the two-cycle unlock bypass reset command sequence (See Table 12). The device offers accelerated program operations through the WP#/ACC pin. When the system asserts VHH on the WP#/ACC pin, the device automatically enters the Unlock Bypass mode. The system may then write the two-cycle Unlock Bypass program command sequence. The device uses the higher voltage on the WP#/ACC pin to accelerate the operation. Note that the WP#/ACC pin must not be at V HH a ny operation other than accelerated programming, or device damage may result. In addition, the WP#/ACC pin must not be left floating or unconnected; inconsistent behavior of the device may result. Figure 3 illustrates the algorithm for the program operation. Refer to the Erase and Program Operations table in the AC Characteristics section for parameters, and Figure 16 for timing diagrams. Sector command sequence. The device continues to access the SecSi Sector region until the system issues the four-cycle Exit SecSi Sector command sequence. The Exit SecSi Sector command sequence returns the device to normal operation. The SecSi Sector is not accessible when the device is executing an Embedded Program or embedded Erase algorithm. Table 22 shows the address and data requirements for both command sequences. Note that the ACC function and unlock bypass modes are not available when the SecSi sector is enabled. See also “SecSi™ (Secured Silicon) Sector SectorFlash Memory Region” for further information. Program Command Sequence Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock write cycles, followed by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further controls or timings. The device automatically provides internally generated program pulses and verifies the programmed cell margin. Table 22 shows the address and data requirements for the byte program command sequence. Note that the SecSi Sector, autoselect, and CFI functions are unavailable when a program operation is in progress. When the Embedded Program algorithm is complete, that bank then returns to the read mode and addresses are no longer latched. The system can determine the status of the program operation by using DQ7, DQ6, or RY/BY#. Refer to the Flash Write Operation Status section for information on these status bits. Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a hardware reset immediately terminates the program operation. The program command sequence should be reinitiated once that bank has returned to the read mode, to ensure data integrity. Programming is allowed in any sequence and across sector boundaries. A b it cannot be programmed from “0” back to a “1.” A ttempting to do so may cause that bank to set DQ5 = 1, or cause the DQ7 and 36 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION Any commands written during the chip erase operation are ignored. However, note that a hardware reset immediately terminates the erase operation. If that occurs, the chip erase command sequence should be reinitiated once that bank has returned to reading array data, to ensure data integrity. Figure 4 illustrates the algorithm for the erase operation. Refer to the Erase and Program Operations tables in the AC Characteristics section for parameters, and Figure 18 section for timing diagrams. START Write Program Command Sequence Embedded Program algorithm in progress Data Poll from System Sector Erase Command Sequence Sector erase is a six bus cycle operation. The sector erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock cycles are written, and are then followed by the address of the sector to be erased, and the sector erase command. Table 22 shows the address and data requirements for the sector erase comm a n d s e q u e n c e. N o te t h a t t h e S e cS i S e ct o r, autoselect, and CFI functions are unavailable when a erase operation is in progress. The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm automatically programs and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. After the command sequence is written, a sector erase time-out of 80 µs occurs. During the time-out period, additional sector addresses and sector erase commands may be written. Loading the sector erase buffer may be done in any sequence, and the number of sectors may be from one sector to all sectors. The time between these additional cycles must be less than 80 µs, otherwise erasure may begin. Any sector erase address and command following the exceeded time-out may or may not be accepted. It is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. The interrupts can be re-enabled after the last Sector Erase command is written. Any command other than Sector Erase or Erase Suspend during the time-out period resets that bank to the read mode. The system must rewrite the command sequence and any additional addresses and commands. The system can monitor DQ3 to determine if the sector erase timer has timed out (See the section on DQ3: Sector Erase Timer.). The time-out begins from the rising edge of the final WE# pulse in the command sequence. When the Embedded Erase algorithm is complete, the bank returns to reading array data and addresses are no longer latched. Note that while the Embedded Erase operation is in progress, the system can read Verify Data? No Yes No Increment Address Last Address? Yes Programming Completed Note: See Table 22 for program command sequence. Figure 4. Program Operation Chip Erase Command Sequence Chip erase is a six bus cycle operation. The chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the Embedded Erase algorithm. The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. Table 22 shows the address and data requirements for the chip erase command sequence. Note that the SecSi Sector, autoselect, and CFI functions are unavailable when a erase operation is in progress. When the Embedded Erase algorithm is complete, that bank returns to the read mode and addresses are no longer latched. The system can determine the status of the erase operation by using DQ7, DQ6, DQ2, or RY/BY#. Refer to the Flash Write Operation Status section for information on these status bits. November 17, 2003 Am75DL9608HG 37 ADVANCE INFORMATION data from the non-erasing bank. The system can determine the status of the erase operation by reading DQ7, DQ6, DQ2, or RY/BY# in the erasing bank. Refer to the Flash Write Operation Status section for information on these status bits. Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands are ignored. However, note that a hardware reset immediately terminates the erase operation. If that occurs, the sector erase command sequence should be reinitiated once that bank has returned to reading array data, to ensure data integrity. Figure 4 illustrates the algorithm for the erase operation. Refer to the Erase and Program Operations tables in the AC Characteristics section for parameters, and Figure 18 section for timing diagrams. Erase Suspend/Erase Resume Commands The Erase Suspend command, B0h, allows the system to interrupt a sector erase operation and then read data from, or program data to, any sector not selected for erasure. The bank address is required when writing this command. This command is valid only during the sector erase operation, including the 80 µs time-out period during the sector erase command sequence. The Erase Suspend command is ignored if written during the chip erase operation or Embedded Program algorithm. When the Erase Suspend command is written during the sector erase operation, the device requires a maximum of 20 µs to suspend the erase operation. However, when the Erase Suspend command is written during the sector erase time-out, the device immediately terminates the time-out period and suspends the erase operation. Addresses are “don’t-cares” when writing the Erase suspend command. After the erase operation has been suspended, the bank enters the erase-suspend-read mode. The system can read data from or program data to any sector not selected for erasure. (The device “erase suspends” all sectors selected for erasure.) Reading at any address within erase-suspended sectors produces status information on DQ7–DQ0. The system can use DQ7, or DQ6 and DQ2 together, to determine if a sector is actively erasing or is erase-suspended. Refer to the Flash Write Operation Status section for information on these status bits. After an erase-suspended program operation is complete, the bank returns to the erase-suspend-read mode. The system can determine the status of the program operation using the DQ7 or DQ6 status bits, just as in the standard Byte Program operation. Refer to the Flash Write Operation Status section for more information. In the erase-suspend-read mode, the system can also issue the autoselect command sequence. The device allows reading autoselect codes even at addresses within erasing sectors, since the codes are not stored in the memory array. When the device exits the autoselect mode, the device reverts to the Erase Suspend mode, and is ready for another valid operation. Refer to the Sector/Sector Block Protection and Unprotection and Autoselect Command Sequence sections for details. To resume the sector erase operation, the system must write the Erase Resume command (address bits are don’t care). The bank address of the erase-suspended bank is required when writing this command. Further writes of the Resume command are ignored. Another Erase Suspend command can be written after the chip has resumed erasing. START Write Erase Command Sequence (Notes 1, 2) Data Poll to Erasing Bank from System Embedded Erase algorithm in progress No Data = FFh? Yes Erasure Completed Notes: 1. See Table 22 for erase command sequence. 2. See the section on DQ3 for information on the sector erase timer. Figure 5. Erase Operation 38 Am75DL9608HG November 17, 2003 ADVANCE Table 22. Command Sequence (Note 1) Read (Note 6) Reset (Note 7) Autoselect (Note 8) Manufacturer ID Device ID (Note 9) SecSi Sector Factory Protect (Note 10) Sector/Sector Block Protect Verify (Note 11) Word Word Word Word Word Word Word Word Cycles INFORMATION Am29DL640H and Am29DL320G Command Definitions First Addr Data RA RD XXX F0 555 555 555 555 555 555 555 555 XXX XXX 555 555 BA BA 55 AA AA AA AA AA AA AA AA A0 90 AA AA B0 30 98 Second Addr Data Bus Cycles (Notes 2–5) Third Fourth Addr Data Addr Data Fifth Addr Data Sixth Addr Data 1 1 4 6 4 4 3 4 4 3 2 2 6 6 1 1 1 2AA 2AA 2AA 2AA 2AA 2AA 2AA 2AA PA XXX 2AA 2AA 55 55 55 55 55 55 55 55 PD 00 55 55 (BA)555 (BA)555 (BA)555 (BA)555 555 555 555 555 90 90 90 90 88 90 A0 20 (BA)X00 (BA)X01 01 7E (BA)X0E 02/0A (BA)X0F 00/01 (BA)X03 80/00 (SADD) 00/01 X02 Enter SecSi Sector Region Exit SecSi Sector Region Program Unlock Bypass XXX PA 00 PD Unlock Bypass Program (Note 12) Unlock Bypass Reset (Note 13) Chip Erase Word Sector Erase Word Erase Suspend (Note 14) Erase Resume (Note 15) CFI Query (Note 16) Word 555 555 80 80 555 555 AA AA 2AA 2AA 55 55 555 SADD 10 30 Legend: X = Don’t care RA = Address of the memory location to be read. RD = Data read from location RA during read operation. PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the WE# or CE#f pulse, whichever happens later. PD = Data to be programmed at location PA. Data latches on the rising edge of WE# or CE#f pulse, whichever happens first. SADD = Address of the sector to be verified (in autoselect mode) or erased. Address bits A21–A12 uniquely select any sector. Refer to Table 2 for information on sector addresses. BA = Address of the bank that is being switched to autoselect mode, is in bypass mode, or is being erased. Address bits A21–A19 select a bank. Refer to Table 3 for information on sector addresses. Notes: 1. See Tables 1 to 2 for description of bus operations. 2. All values are in hexadecimal. 3. Except for the read cycle and the fourth cycle of the autoselect command sequence, all bus cycles are write cycles. 4. Data bits DQ15–DQ8 are don’t care in command sequences, except for RD and PD. 5. Unless otherwise noted, address bits A21–A12 are don’t cares for unlock and command cycles, unless SADD or PA is required. 6. No unlock or command cycles required when bank is reading array data. 7. The Reset command is required to return to the read mode (or to the erase-suspend-read mode if previously in Erase Suspend) when a bank is in the autoselect mode, or if DQ5 goes high (while the bank is providing status information). 8. The fourth cycle of the autoselect command sequence is a read cycle. The system must provide the bank address to obtain the manufacturer ID, device ID, or SecSi Sector factory protect information. Data bits DQ15–DQ8 are don’t care. See the Autoselect Command Sequence section for more information. 9. The device ID must be read across the fourth, fifth, and sixth cycles. At address x0E, the data is 02h for Am29DL640H and 0Ah for Am29DL320G. At address x0F, the data is 01h for 10. 11. 12. 13. 14. 15. 16. Am29DL640H and Am29DL320G (top boot) and 00h for Am29DL320G (bottom boot). For Am29DL640H, the data is 80h for factory locked, 40h for customer locked and 00h for not locked. For Am29DL320G, they are 81H and 01h respectively. The data is 00h for an unprotected sector/sector block and 01h for a protected sector/sector block. The Unlock Bypass command is required prior to the Unlock Bypass Program command. The Unlock Bypass Reset command is required to return to the read mode when the bank is in the unlock bypass mode. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode. The Erase Suspend command is valid only during a sector erase operation, and requires the bank address. The Erase Resume command is valid only during the Erase Suspend mode, and requires the bank address. Command is valid when device is ready to read array data or when device is in autoselect mode. November 17, 2003 Am75DL9608HG 39 ADVANCE INFORMATION FLASH WRITE OPERATION STATUS The device provides several bits to determine the status of a program or erase operation: DQ2, DQ3, DQ5, DQ6, and DQ7. Table 23 and the following subsections describe the function of these bits. DQ7 and DQ6 each offer a method for determining whether a program or erase operation is complete or in progress. The device also provides a hardware-based output signal, RY/BY#, to determine whether an Embedded Program or Erase operation is in progress or has been completed. pleted the program or erase operation and DQ7 has valid data, the data outputs on DQ15–DQ0 may be still invalid. Valid data on DQ15–DQ0 (or DQ7–DQ0 for byte mode) will appear on successive read cycles. Table 23 shows the outputs for Data# Polling on DQ7. Figure 5 shows the Data# Polling algorithm. Figure 20 in the Flash AC Characteristics section shows the Data# Polling timing diagram. DQ7: Data# Polling The Data# Polling bit, DQ7, indicates to the host system whether an Embedded Program or Erase algorithm is in progress or completed, or whether a bank is in Erase Suspend. Data# Polling is valid after the rising edge of the final WE# pulse in the command sequence. During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum programmed to DQ7. This DQ7 status also applies to programming during Erase Suspend. When the Embedded Program algorithm is complete, the device outputs the datum programmed to DQ7. The system must provide the program address to read valid status information on DQ7. If a program address falls within a protected sector, Data# Polling on DQ7 is active for approximately 1 µs, then that bank returns to the read mode. During the Embedded Erase algorithm, Data# Polling produces a “0” on DQ7. When the Embedded Erase algorithm is complete, or if the bank enters the Erase Suspend mode, Data# Polling produces a “1” on DQ7. The system must provide an address within any of the sectors selected for erasure to read valid status information on DQ7. After an erase command sequence is written, if all sectors selected for erasing are protected, Data# Polling on DQ7 is active for approximately 100 µs, then the bank returns to the read mode. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. However, if the system reads DQ7 at an address within a protected sector, the status may not be valid. When the system detects DQ7 has changed from the complement to true data, it can read valid data at DQ15–DQ0 (or DQ7–DQ0 for byte mode) on the following read cycles. Just prior to the completion of an Embedded Program or Erase operation, DQ7 may change asynchronously with DQ15–DQ8 (DQ7–DQ0 in byte mode) while Output Enable (OE#) is asserted low. That is, the device may change from providing status information to valid data on DQ7. Depending on when the system samples the DQ7 output, it may read the status or valid data. Even if the device has comSTART Read DQ7–DQ0 Addr = VA DQ7 = Data? Yes No No DQ5 = 1? Yes Read DQ7–DQ0 Addr = VA DQ7 = Data? Yes No FAIL PASS Notes: 1. VA = Valid address for programming. During a sector erase operation, a valid address is any sector address within the sector being erased. During chip erase, a valid address is any non-protected sector address. 2. DQ7 should be rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5. Figure 6. Data# Polling Algorithm 40 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION DQ6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program algorithm is complete. Table 23 shows the outputs for Toggle Bit I on DQ6. Figure 6 shows the toggle bit algorithm. Figure 21 in the “Flash AC Characteristics” section shows the toggle bit timing diagrams. Figure 22 shows the differences between DQ2 and DQ6 in graphical form. See also the subsection on DQ2: Toggle Bit II. RY/BY#: Ready/Busy# The RY/BY# is a dedicated, open-drain output pin which indicates whether an Embedded Algorithm is in progress or complete. The RY/BY# status is valid after the rising edge of the final WE# pulse in the command sequence. Since RY/BY# is an open-drain output, several RY/BY# pins can be tied together in parallel with a pull-up resistor to VCC. If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the Erase Suspend mode.) If the output is high (Ready), the device is in the read mode, the standby mode, or one of the banks is in the erase-suspend-read mode. Table 23 shows the outputs for RY/BY#. START DQ6: Toggle Bit I Toggle Bit I on DQ6 indicates whether an Embedded Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final WE# pulse in the command sequence (prior to the program or erase operation), and during the sector erase time-out. During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause DQ6 to toggle. The system may use either OE# or CE#f to control the read cycles. When the operation is complete, DQ6 stops toggling. After an erase command sequence is written, if all sectors selected for erasing are protected, DQ6 toggles for approximately 100 µs, then returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is erase-suspended. When the device is actively erasing (that is, the Embedded Erase algorithm is in progress), DQ6 toggles. When the device enters the Erase Suspend mode, DQ6 stops toggling. However, the system must also use DQ2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use DQ7 (see the subsection on DQ7: Data# Polling). If a program address falls within a protected sector, DQ6 toggles for approximately 1 µs after the program command sequence is written, then returns to reading array data. Read Byte (DQ7–DQ0) Address =VA Read Byte (DQ7–DQ0) Address =VA Toggle Bit = Toggle? Yes No No DQ5 = 1? Yes Read Byte Twice (DQ7–DQ0) Address = VA Toggle Bit = Toggle? No Yes Program/Erase Operation Not Complete, Write Reset Command Program/Erase Operation Complete Note: The system should recheck the toggle bit even if DQ5 = “1” because the toggle bit may stop toggling as DQ5 changes to “1.” See the subsections on DQ6 and DQ2 for more information. Figure 7. Toggle Bit Algorithm November 17, 2003 Am75DL9608HG 41 ADVANCE INFORMATION not gone high. The system may continue to monitor the toggle bit and DQ5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation (top of Figure 6). DQ2: Toggle Bit II The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing (that is, the Embedded Erase algorithm is in progress), or whether that sector is erase-suspended. Toggle Bit II is valid after the rising edge of the final WE# pulse in the command sequence. DQ2 toggles when the system reads at addresses within those sectors that have been selected for erasure. (The system may use either OE# or CE#f to control the read cycles.) But DQ2 cannot distinguish whether the sector is actively erasing or is erase-suspended. DQ6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sector and mode information. Refer to Table 23 to compare outputs for DQ2 and DQ6. Figure 6 shows the toggle bit algorithm in flowchart form, and the section “DQ2: Toggle Bit II” explains the algorithm. See also the DQ6: Toggle Bit I subsection. Figure 21 shows the toggle bit timing diagram. Figure 22 shows the differences between DQ2 and DQ6 in graphical form. DQ5: Exceeded Timing Limits DQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under these conditions DQ5 produces a “1,” indicating that the program or erase cycle was not successfully completed. The device may output a “1” on DQ5 if the system tries to program a “1” to a location that was previously programmed to “0.” O nly an erase operation can change a “0” back to a “1.” Under this condition, the device halts the operation, and when the timing limit has been exceeded, DQ5 produces a “1.” Under both these conditions, the system must write the reset command to return to the read mode (or to the erase-suspend-read mode if a bank was previously in the erase-suspend-program mode). DQ3: Sector Erase Timer After writing a sector erase command sequence, the system may read DQ3 to determine whether or not erasure has begun. (The sector erase timer does not apply to the chip erase command.) If additional sectors are selected for erasure, the entire time-out also applies after each additional sector erase command. When the time-out period is complete, DQ3 switches from a “0” to a “1.” If the time between additional sector erase commands from the system can be assumed to be less than 50 µs, the system need not monitor DQ3. See also the Sector Erase Command Sequence section. After the sector erase command is written, the system should read the status of DQ7 (Data# Polling) or DQ6 (Toggle Bit I) to ensure that the device has accepted the command sequence, and then read DQ3. If DQ3 is “1,” the Embedded Erase algorithm has begun; all further commands (except Erase Suspend) are ignored until the erase operation is complete. If DQ3 is “0,” the device will accept additional sector erase commands. To ensure the command has been accepted, the system software should check the status of DQ3 prior to and following each subsequent sector erase command. If DQ3 is high on the second status check, the last command might not have been accepted. Table 23 shows the status of DQ3 relative to the other status bits. Reading Toggle Bits DQ6/DQ2 Refer to Figure 6 for the following discussion. Whenever the system initially begins reading toggle bit status, it must read DQ15–DQ0 (or DQ7–DQ0 for byte mode) at least twice in a row to determine whether a toggle bit is toggling. Typically, the system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has completed the program or erase operation. The system can read array data on DQ15–DQ0 (or DQ7–DQ0 for byte mode) on the following read cycle. However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of DQ5 is high (see the section on DQ5). If it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as DQ5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. If it is still toggling, the device did not completed the operation successfully, and the system must write the reset command to return to reading array data. The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has 42 Am75DL9608HG November 17, 2003 ADVANCE Table 23. Status Embedded Program Algorithm Embedded Erase Algorithm Erase Erase-Suspend- Suspended Sector Read Non-Erase Suspended Sector Erase-Suspend-Program INFORMATION Write Operation Status Standard Mode Erase Suspend Mode DQ7 (Note 2) DQ7# 0 1 Data DQ7# DQ6 Toggle Toggle No toggle Data Toggle DQ5 (Note 1) 0 0 0 Data 0 DQ3 N/A 1 N/A Data N/A DQ2 (Note 2) No toggle Toggle Toggle Data N/A RY/BY# 0 0 1 1 0 Notes: 1. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. Refer to the section on DQ5 for more information. 2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details. 3. When reading write operation status bits, the system must always provide the bank address where the Embedded Algorithm is in progress. The device outputs array data if the system addresses a non-busy bank. November 17, 2003 Am75DL9608HG 43 ADVANCE INFORMATION ABSOLUTE MAXIMUM RATINGS Storage Temperature Plastic Packages . . . . . . . . . . . . . . . –55°C to +125°C Ambient Temperature with Power Applied. . . . . . . . . . . . . . . –40°C to +85°C Voltage with Respect to Ground VCC (Note 1) . . . . . . . . . . . . . . . . .–0.5 V to +4.0 V RESET# (Note 2) . . . . . . . . . . . .–0.5 V to +12.5 V WP#/ACC . . . . . . . . . . . . . . . . . . –0.5 V to +10.5 V All other pins (Note 1) . . . . . . –0.5 V to VCC +0.5 V Output Short Circuit Current (Note 3) . . . . . . 200 mA Notes: 1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, input or I/O pins may overshoot V SS t o –2.0 V for periods of up to 20 ns. Maximum DC voltage on input or I/O pins is VCC +0.5 V. See Figure 7. During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns. See Figure 8. 2. Minimum DC input voltage on pins RESET#, and WP# /ACC is –0 .5 V. D ur ing volt age trans itions, WP#/ACC, and RESET# may overshoot VSS to –2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC input voltage on pin RESET# is +12.5 V which may overshoot to +14.0 V for periods up to 20 ns. Maximum DC input voltage on WP#/ACC is +9.5 V which may overshoot to +12.0 V for periods up to 20 ns. 3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. +0.8 V –0.5 V –2.0 V 20 ns 20 ns 20 ns Figure 8. Maximum Negative Overshoot Waveform 20 ns VCC +2.0 V VCC +0.5 V 2.0 V 20 ns 20 ns Figure 9. Maximum Positive Overshoot Waveform OPERATING RANGES Industrial (I) Devices Ambient Temperature (TA) . . . . . . . . . –40°C to +85°C VCCf/VCCs Supply Voltages VCCf/VCCs for standard voltage range . . 2.7 V to 3.3 V Operating ranges define those limits between which the functionality of the device is guaranteed. 44 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION FLASH DC CHARACTERISTICS CMOS Compatible Parameter Symbol ILI ILIT ILO ILR ILIA ICC1f ICC2f ICC3f ICC4f ICC5f ICC6f ICC7f Parameter Description Input Load Current RESET# Input Load Current Output Leakage Current Reset Leakage Current ACC Input Leakage Current Flash VCC Active Read Current (Notes 1, 2) Test Conditions VIN = VSS to VCC, VCC = VCC max VCC = VCC max; RESET# = 12.5 V VOUT = VSS to VCC, VCC = VCC max VCC = VCC max; RESET# = 12.5 V VCC = VCC max, WP#/ACC = VACC max CE#f = VIL, OE# = VIH, Word Mode 5 MHz 1 MHz 10 2 15 0.2 0.2 0.2 21 21 Min Typ Max ±1.0 35 ±1.0 35 35 16 4 30 10 10 10 45 45 Unit µA µA µA µA µA mA mA µA µA µA mA mA Flash VCC Active Write Current (Notes 2, 3) CE#f = VIL, OE# = VIH, WE# = VIL Flash VCC Standby Current (Note 2) Flash VCC Reset Current (Note 2) Flash VCC Current Automatic Sleep Mode (Notes 2, 4) Flash VCC Active Read-While-Program Current (Notes 1, 2) Flash VCC Active Read-While-Erase Current (Notes 1, 2) Flash VCC Active Program-While-Erase-Suspended Current (Notes 2, 5) Input Low Voltage Input High Voltage Voltage for WP#/ACC Program Acceleration and Sector Protection/Unprotection Voltage for Sector Protection, Autoselect and Temporary Sector Unprotect Output Low Voltage IOL = 2.0 mA, VCCf = VCCs = VCC min IOH = –2.0 mA, VCCf = VCCs = VCC min IOH = –100 µA, VCC = VCC min Flash Low VCC Lock-Out Voltage (Note 5) 0.85 x VCC VCC–0.4 2.0 VCCf = VCC max, CE#f, RESET#, WP#/ACC = VCCf ± 0.3 V VCCf = VCC max, RESET# = VSS ± 0.3 V, WP#/ACC = VCCf ± 0.3 V VCCf = VCC max, VIH = VCC ± 0.3 V; VIL = VSS ± 0.3 V CE#f = VIL, OE# = VIH CE#f = VIL, OE# = VIH ICC8f VIL VIH VHH CE#f = VIL, OE#f = VIH –0.2 2.4 8.5 17 35 0.8 VCC + 0.2 9.5 mA V V V VID VOL VOH1 VOH2 VLKO 11.5 12.5 0.45 V V Output High Voltage V 2.5 V Notes: 1. The ICC current listed is typically less than 2 mA/MHz, with OE# at VIH. 2. Maximum ICC specifications are tested with VCC = VCCmax. 3. ICC active while Embedded Erase or Embedded Program is in progress. 4. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns. Typical sleep mode current is 200 nA. 5. Not 100% tested. 6. 2 Flash stack together → double the current limit from 5 →10 µA November 17, 2003 Am75DL9608HG 45 ADVANCE INFORMATION FLASH DC CHARACTERISTICS Zero-Power Flash 25 Supply Current in mA 20 15 10 5 0 0 500 1000 1500 2000 Time in ns 2500 3000 3500 4000 Note: Addresses are switching at 1 MHz Figure 10. ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents) 12 3.3 V 10 2.7 V 8 Supply Current in mA 6 4 2 0 1 Note: T = 25 °C 2 3 Frequency in MHz Figure 11. Typical ICC1 vs. Frequency 4 5 7. 46 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION PSEUDO SRAM DC AND OPERATING CHARACTERISTICS Parameter Symbol ILI ILO Parameter Description Input Leakage Current Output Leakage Current Test Conditions VIN = VSS to VCC CE1#s = VIH, CE2s = VIL or OE# = VIH or WE# = VIL, VIO= VSS to VCC Cycle time = 1 µs, 100% duty, IIO = 0 mA, CE1#s ≤ 0.2 V, CE2 ≥ VCC – 0.2 V, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V Cycle time = Min., IIO = 0 mA, 100% duty, CE1#s = VIL, CE2s = VIH, VIN = VIL = or VIH –0.2 (Note 3) 2.2 IOL = 2.0 mA IOH = –1.0 mA CE1#s = VIH, CE2 = VIL, Other inputs = VIH or VIL CE1#s=VIH, CE2= VIL: Other inputs = VIH or VIL: tA = 85°C, VCC = 3.0 V CE1#s=VIH, CE2= VIL: Other inputs = VIH or VIL: tA = 85°C, VCC = 3.3 V 2.2 0.3 Min –1.0 –1.0 Typ Max 1.0 1.0 Unit µA µA ICC1s Average Operating Current 3 5 mA ICC2s Average Operating Current 12 25 mA VIL VIH VOL VOH ISB Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Standby Current (TTL) 0.4 VCC+0.2 (Note 2) 0.4 V V V V mA ISB1 Standby Current (CMOS) 60 µA ISB2 Standby Current (CMOS) 85 µA Notes: 1. TA= –40° to 85°C, otherwise specified. 2. 3. 4. 5. Overshoot: VCC+1.0V if pulse width ≤ 20 ns. Undershoot: –1.0V if pulse width ≤ 20 ns. Overshoot and undershoot are sampled, not 100% tested. Stable power supply required 200 µs before device operation. 55 ISB CMOS (µA) 50 45 40 2.7 2.8 2.9 VCC Figure 12. Notes: 1. At 70°, for reference only 2. Not 100% tested Standby Current ISB CMOS 3. Sample Size of 5 November 17, 2003 Am75DL9608HG 47 ADVANCE INFORMATION TEST CONDITIONS Table 24. 3.3 V 2.7 kΩ Test Condition Output Load Output Load Capacitance, CL (including jig capacitance) CL 6.2 kΩ Input Rise and Fall Times Input Pulse Levels Input timing measurement reference levels Output timing measurement reference levels Test Specifications All Speed Options 1 TTL gate 30 5 0.0–3.0 1.5 1.5 pF ns V V V Unit Device Under Test Note: Diodes are IN3064 or equivalent Figure 13. Test Setup KEY TO SWITCHING WAVEFORMS WAVEFORM INPUTS Steady Changing from H to L Changing from L to H Don’t Care, Any Change Permitted Does Not Apply Changing, State Unknown Center Line is High Impedance State (High Z) OUTPUTS KS000010-PAL 3.0 V 0.0 V Input 1.5 V Measurement Level 1.5 V Output Figure 14. Input Waveforms and Measurement Levels 48 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION FLASH AC CHARACTERISTICS Pseudo SRAM CE#s Timing Parameter Test Setup JEDEC — Std tCCR Description CE#s Recover Time — Min 0 ns All Speeds Unit CE#f tCCR CE1#s tCCR tCCR CE2s tCCR Figure 15. Timing Diagram for Alternating Between Pseudo SRAM to Flash November 17, 2003 Am75DL9608HG 49 ADVANCE INFORMATION FLASH AC CHARACTERISTICS Read-Only Operations Parameter JEDEC tAVAV tAVQV tELQV tGLQV tEHQZ tGHQZ tAXQX Std. tRC tACC tCE tOE tDF tDF tOH Description Read Cycle Time (Note 1) Address to Output Delay Chip Enable to Output Delay Output Enable to Output Delay Chip Enable to Output High Z (Notes 1, 3) Output Enable to Output High Z (Notes 1, 3) Output Hold Time From Addresses, CE#f or OE#, Whichever Occurs First Read tOEH Output Enable Hold Time (Note 1) Toggle and Data# Polling CE#f, OE# = VIL OE# = VIL Test Setup Min Max Max Max Max Max Min Min Min All Speed Options 70 70 70 30 16 16 0 0 10 Unit ns ns ns ns ns ns ns ns ns Notes: 1. Not 100% tested. 2. See Figure 11 and Table 24 for test specifications 3. Measurements performed by placing a 50Ω termination on the data pin with a bias of VCC/2. The time from OE# high to the data bus driven to VCC/2 is taken as tDF . tRC Addresses CE#f tRH tRH OE# tOEH WE# HIGH Z Outputs RESET# RY/BY# Output Valid tCE tOH HIGH Z tOE tDF Addresses Stable tACC 0V Figure 16. Read Operation Timings 50 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION FLASH AC CHARACTERISTICS Hardware Reset (RESET#) Parameter JEDEC Std tReady tReady tRP tRH tRPD tRB Description RESET# Pin Low (During Embedded Algorithms) to Read Mode (See Note) RESET# Pin Low (NOT During Embedded Algorithms) to Read Mode (See Note) RESET# Pulse Width Reset High Time Before Read (See Note) RESET# Low to Standby Mode RY/BY# Recovery Time Max Max Min Min Min Min All Speed Options 20 500 500 50 20 0 Unit µs ns ns ns µs ns Note: Not 100% tested. RY/BY# CE#f, OE# tRH RESET# tRP tReady Reset Timings NOT during Embedded Algorithms Reset Timings during Embedded Algorithms tReady RY/BY# tRB CE#f, OE# RESET# tRP Figure 17. Reset Timings November 17, 2003 Am75DL9608HG 51 ADVANCE INFORMATION FLASH AC CHARACTERISTICS Erase and Program Operations Parameter JEDEC tAVAV tAVWL Std tWC tAS tASO tWLAX tAH Description Write Cycle Time (Note 1) Address Setup Time Address Setup Time to OE# low during toggle bit polling Am29DL640H Address Hold Time Am29DL320G Address Hold Time From CE#f or OE# high during toggle bit polling Am29DL640H tDVWH tWHDX tDS tDH tOEPH tGHWL tWLEL tELWL tEHWH tWHEH tWLWH tWHDL tGHWL tWS tCS tWH tCH tWP tWPH tSR/W tWHWH1 tWHWH1 tWHWH2 tWHWH1 tWHWH1 tWHWH2 tVCS tRB tBUSY Data Setup Time Am29DL320G Data Hold Time Output Enable High during toggle bit polling Read Recovery Time Before Write (OE# High to WE# Low) WE# Setup Time (CE#f to WE#) CE#f Setup Time WE# Hold Time (CE#f to WE#) CE#f Hold Time Write Pulse Width Write Pulse Width High Latency Between Read and Write Operations Programming Operation (Note 2) Accelerated Programming Operation, Word or Byte (Note 2) Sector Erase Operation (Note 2) VCC Setup Time (Note 1) Write Recovery Time from RY/BY# Program/Erase Valid to RY/BY# Delay Min Min Min Min Min Min Min Min Min Min Typ Typ Typ Min Min Max Min 35 0 20 0 0 0 0 0 30 30 0 7 4 0.4 50 0 90 ns ns ns ns ns ns ns ns ns ns µs µs sec µs ns ns Min Min 45 0 40 ns ns Min Min Min All Speed Options 70 0 15 40 ns Unit ns ns ns tAHT Notes: 1. Not 100% tested. 2. See the “Flash Erase And Programming Performance” section for more information. 52 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION FLASH AC CHARACTERISTICS Program Command Sequence (last two cycles) tWC Addresses 555h tAS PA tAH CE#f tGHWL OE# tWP WE# tCS tDS Data tDH PD tBUSY RY/BY# Status DOUT tRB tWPH tWHWH1 PA PA Read Status Data (last two cycles) tCH A0h VCCf tVCS Notes: 1. PA = program address, PD = program data, DOUT is the true data at the program address. 2. Illustration shows device in word mode. Figure 18. Program Operation Timings VHH WP#/ACC VIL or VIH tVHH tVHH VIL or VIH Figure 19. Accelerated Program Timing Diagram November 17, 2003 Am75DL9608HG 53 ADVANCE INFORMATION FLASH AC CHARACTERISTICS Erase Command Sequence (last two cycles) tWC Addresses 2AAh tAS SADD 555h for chip erase Read Status Data VA tAH VA CE#f tGHWL OE# tWP WE# tCS tDS tDH Data 55h 30h 10 for Chip Erase In Progress Complete tCH tWPH tWHWH2 tBUSY RY/BY# tVCS VCCf tRB Notes: 1. SADD = sector address (for Sector Erase), VA = Valid Address for reading status data (see “Flash Write Operation Status”. 2. These waveforms are for the word mode. Figure 20. Chip/Sector Erase Operation Timings 54 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION FLASH AC CHARACTERISTICS tWC Addresses Valid PA tRC Valid RA tWC Valid PA tWC Valid PA tAH tACC CE#f tCPH tCE tOE tCP OE# tOEH tWP WE# tWPH tDS tDH Data Valid In tGHWL tDF tOH Valid Out Valid In Valid In tSR/W WE# Controlled Write Cycle Read Cycle CE#f Controlled Write Cycles Figure 21. Back-to-back Read/Write Cycle Timings tRC Addresses VA tACC tCE CE#f tCH OE# tOEH WE# tOH DQ7 High Z VA VA tOE tDF Complement Complement True Valid Data High Z DQ6–DQ0 tBUSY RY/BY# Status Data Status Data True Valid Data Note: VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle. Figure 22. Data# Polling Timings (During Embedded Algorithms) November 17, 2003 Am75DL9608HG 55 ADVANCE INFORMATION FLASH AC CHARACTERISTICS tAHT Addresses tAHT tASO CE#f tOEH WE# tOEPH OE# tDH DQ6/DQ2 Valid Data Valid Status tAS tCEPH tOE Valid Status Valid Status Valid Data (first read) RY/BY# (second read) (stops toggling) Note: VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status read cycle, and array data read cycle. Figure 23. Toggle Bit Timings (During Embedded Algorithms) Enter Embedded Erasing WE# Erase Suspend Erase Enter Erase Suspend Program Erase Suspend Program Erase Resume Erase Suspend Read Erase Erase Complete Erase Suspend Read DQ6 DQ2 Note: DQ2 toggles only when read at an address within an erase-suspended sector. The system may use OE# or CE#f to toggle DQ2 and DQ6. Figure 24. DQ2 vs. DQ6 56 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION FLASH AC CHARACTERISTICS Temporary Sector Unprotect Parameter JEDEC Std tVIDR tVHH tRSP tRRB Description VID Rise and Fall Time (See Note) VHH Rise and Fall Time (See Note) RESET# Setup Time for Temporary Sector Unprotect RESET# Hold Time from RY/BY# High for Temporary Sector Unprotect Min Min Min Min All Speed Options 500 250 4 4 Unit ns ns µs µs Note: Not 100% tested. VID RESET# VSS, VIL, or VIH tVIDR Program or Erase Command Sequence CE#f tVIDR VID VSS, VIL, or VIH WE# tRSP RY/BY# tRRB Figure 25. Temporary Sector Unprotect Timing Diagram November 17, 2003 Am75DL9608HG 57 ADVANCE INFORMATION FLASH AC CHARACTERISTICS VID VIH RESET# SADD, A6, A1, A0 Valid* Sector/Sector Block Protect or Unprotect Valid* Verify 40h Sector/Sector Block Protect: 150 µs, Sector/Sector Block Unprotect: 15 ms Valid* Data 60h 60h Status 1 µs CE#f WE# OE# * For sector protect, A6 = 0, A1 = 1, A0 = 0. For sector unprotect, A6 = 1, A1 = 1, A0 = 0, SADD = Sector Address. Figure 26. Sector/Sector Block Protect and Unprotect Timing Diagram 58 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION FLASH AC CHARACTERISTICS Alternate CE#f Controlled Erase and Program Operations Parameter JEDEC tAVAV tAVWL tELAX tDVEH tEHDX tGHEL tWLEL tEHWH tELEH tEHEL tWHWH1 tWHWH1 tWHWH2 Std tWC tAS tAH tDS tDH tGHEL tWS tWH tCP tCPH tWHWH1 tWHWH1 tWHWH2 Description Write Cycle Time (Note 1) Address Setup Time Address Hold Time Data Setup Time Data Hold Time Read Recovery Time Before Write (OE# High to WE# Low) WE# Setup Time WE# Hold Time CE#f Pulse Width CE#f Pulse Width High Programming Operation (Note 2) Accelerated Programming Operation, Word or Byte (Note 2) Sector Erase Operation (Note 2) Min Min Min Min Min Min Min Min Min Min Typ Typ Typ All Speed Options 70 0 40 40 0 0 0 0 40 30 7 4 0.4 Unit ns ns ns ns ns ns ns ns ns ns µs µs sec Notes: 1. Not 100% tested. 2. See the “Flash Erase And Programming Performance” section for more information. November 17, 2003 Am75DL9608HG 59 ADVANCE INFORMATION FLASH AC CHARACTERISTICS 555 for program 2AA for erase PA for program SADD for sector erase 555 for chip erase Data# Polling PA Addresses tWC tWH WE# tGHEL OE# tCP CE#f tWS tCPH tDS tDH Data tRH A0 for program 55 for erase PD for program 30 for sector erase 10 for chip erase tAS tAH tWHWH1 or 2 tBUSY DQ7# DOUT RESET# RY/BY# Notes: 1. Figure indicates last two bus cycles of a program or erase operation. 2. PA = program address, SADD = sector address, PD = program data. 3. DQ7# is the complement of the data written to the device. DOUT is the data written to the device. 4. Waveforms are for the word mode. Figure 27. Flash Alternate CE#f Controlled Write (Erase/Program) Operation Timings 60 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION PSEUDO SRAM AC CHARACTERISTICS Power Up Time When powering up the SRAM, maintain VCCs for 100 µs minimum with CE#1s at VIH. Read Cycle Parameter Symbol tRC tAA tCO1, tCO2 tOE tBA tLZ1, tLZ2 tBLZ tOLZ tHZ1, tHZ2 tBHZ tOHZ tOH Speed Description 55 Read Cycle Time Address Access Time Chip Enable to Output Output Enable Access Time LB#s, UB#s to Access Time Chip Enable (CE1#s Low and CE2s High) to Low-Z Output UB#, LB# Enable to Low-Z Output Output Enable to Low-Z Output Chip Disable to High-Z Output UB#s, LB#s Disable to High-Z Output Output Disable to High-Z Output Output Data Hold from Address Change Min Max Max Max Max Min Min Min Max Max Max Min 20 20 20 10 55 55 55 30 55 5 5 5 25 25 25 70 70 70 70 35 70 ns ns ns ns ns ns ns ns ns ns ns ns Unit tRC Address tOH Data Out Previous Data Valid tAA Data Valid Notes: 1. CE1#s = OE# = VIL, CE2s = WE# = VIH, UB#s and/or LB#s = VIL 2. Do not access device with cycle timing shorter than tRC for continuous periods < 10 µs. Figure 28. Pseudo SRAM Read Cycle—Address Controlled November 17, 2003 Am75DL9608HG 61 ADVANCE INFORMATION PSEUDO SRAM AC CHARACTERISTICS Read Cycle tRC Address tAA tCO1 tOH CE#1s CE2s tCO2 tOE tOLZ tBLZ Data Valid tHZ OE# tLZ tOHZ Data Out High-Z Notes: 1. WE# = VIH. 2. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage levels. 3. At any given temperature and voltage condition, tHZ (Max.) is less than tLZ (Min.) both for a given device and from device to device interconnection. 4. Do not access device with cycle timing shorter than tRC for continuous periods < 10 µs. Figure 29. Pseudo SRAM Read Cycle 62 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION PSEUDO SRAM AC CHARACTERISTICS Write Cycle Parameter Symbol tWC tCw tAS tAW tBW tWP tWR tWHZ tDW tDH tOW Speed Description 55 Write Cycle Time Chip Enable to End of Write Address Setup Time Address Valid to End of Write UB#s, LB#s to End of Write Write Pulse Time Write Recovery Time Write to Output High-Z Max Data to Write Time Overlap Data Hold from Write Time End Write to Output Low-Z Min Min Min 25 40 0 5 ns ns ns Min Min Min Min Min Min Min Min 45 45 45 0 0 ns 55 45 0 55 55 55 70 70 55 ns ns ns ns ns ns ns Unit tWC Address tCW (See Note 1) tAW CE2s tCW (See Note 1) tWP (See Note 4) tAS (See Note 3) High-Z tWHZ Data Out Data Undefined tDW Data Valid tWR CE1#s WE# tDH High-Z tOW Data In Notes: 1. WE# controlled. 2. tCW is measured from CE1#s going low to the end of write. 3. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CE1#s or WE# going high. 4. tAS is measured from the address valid to the beginning of write. 5. A write occurs during the overlap (tWP) of low CE#1 and low WE#. A write begins when CE1#s goes low and WE# goes low when asserting UB#s or LB#s for a single byte operation or simultaneously asserting UB#s and LB#s for a double byte operation. A write ends at the earliest transition when CE1#s goes high and WE# goes high. The tWP is measured from the beginning of write to the end of write. Figure 30. Pseudo SRAM Write Cycle—WE# Control November 17, 2003 Am75DL9608HG 63 ADVANCE INFORMATION PSEUDO SRAM AC CHARACTERISTICS tWC Address tAS (See Note 2 ) tCW (See Note 3) CE1#s tAW CE2s tBW tWP (See Note 5) WE# tDW Data In tDH tWR (See Note 4) UB#s, LB#s Data Valid Data Out High-Z High-Z Notes: 1. CE1#s controlled. 2. tCW is measured from CE1#s going low to the end of write. 3. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CE1#s or WE# going high. 4. tAS is measured from the address valid to the beginning of write. 5. A write occurs during the overlap (tWP) of low CE1#s and low WE#. A write begins when CE1#s goes low and WE# goes low when asserting UB#s or LB#s for a single byte operation or simultaneously asserting UB#s and LB#s for a double byte operation. A write ends at the earliest transition when CE1#s goes high and WE# goes high. The tWP is measured from the beginning of write to the end of write. Figure 31. Pseudo SRAM Write Cycle—CE1#s Control 64 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION PSEUDO SRAM AC CHARACTERISTICS tWC Address tCW (See Note 2) tAW CE2s UB#s, LB#s tCW (See Note 2) tBW tAS (See Note 4) tWP (See Note 5) tDW Data In tDH tWR (See Note 3) CE1#s WE# Data Valid Data Out High-Z High-Z Notes: 1. UB#s and LB#s controlled. 2. tCW is measured from CE1#s going low to the end of write. 3. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CE1#s or WE# going high. 4. tAS is measured from the address valid to the beginning of write. 5. A write occurs during the overlap (tWP) of low CE#1s and low WE#. A write begins when CE1#s goes low and WE# goes low when asserting UB#s or LB#s for a single byte operation or simultaneously asserting UB#s and LB#s for a double byte operation. A write ends at the earliest transition when CE1#s goes high and WE# goes high. The tWP is measured from the beginning of write to the end of write. Figure 32. Pseudo SRAM Write Cycle— UB#s and LB#s Control November 17, 2003 Am75DL9608HG 65 ADVANCE INFORMATION FLASH ERASE AND PROGRAMMING PERFORMANCE Parameter Sector Erase Time Am29DL640H Chip Erase Time Am29DL320G Accelerated Word Program Time Word Program Time Chip Program Time (Note 3) Am29DL640H Am29DL320G 28 4 7 28 14 120 210 84 sec 42 µs µs Excludes system level overhead (Note 5) Typ (Note 1) 0.4 56 sec Max (Note 2) 5 Unit sec Comments Excludes 00h programming prior to erasure (Note 4) Notes: 1. Typical program and erase times assume the following conditions: 25°C, 3.0 V VCC, 1,000,000 cycles. Additionally, programming typicals assume checkerboard pattern. 2. Under worst case conditions of 90°C, VCC = 2.7 V, 1,000,000 cycles. 3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the maximum program times listed. 4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure. 5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table 22 for further information on command definitions. 6. The device has a minimum erase and program cycle endurance of 1,000,000 cycles. LATCHUP CHARACTERISTICS Description Input voltage with respect to VSS on all pins except I/O pins (including A9, OE#, and RESET#) Input voltage with respect to VSS on all I/O pins VCC Current Min –1.0 V –1.0 V –100 mA Max 12.5 V VCC + 1.0 V +100 mA Note: Includes all pins except VCC. Test conditions: VCC = 3.0 V, one pin at a time. BGA PACKAGE CAPACITANCE Parameter Symbol CIN COUT CIN2 CIN3 Parameter Description Input Capacitance Output Capacitance Control Pin Capacitance WP#/ACC Pin Capacitance Test Setup VIN = 0 VOUT = 0 VIN = 0 VIN = 0 Typ 11 12 14 17 Max 14 16 16 20 Unit pF pF pF pF Notes: 1. Sampled, not 100% tested. 2. Test conditions TA = 25°C, f = 1.0 MHz. FLASH DATA RETENTION Parameter Description Minimum Pattern Data Retention Time Test Conditions 150°C 125°C Min 10 20 Unit Years Years 66 Am75DL9608HG November 17, 2003 ADVANCE INFORMATION PHYSICAL DIMENSIONS FTA073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm D 0.15 C (2X) A D1 eD 10 9 8 7 SE 7 E1 E eE 6 5 4 3 2 1 INDEX MARK PIN A1 CORNER 10 M L K J H G F E D CB A B 7 TOP VIEW 0.15 C (2X) SD PIN A1 CORNER BOTTOM VIEW 0.20 C A A2 A1 6 C 0.08 C SIDE VIEW b CAB C 73X 0.15 M 0.08 M NOTES: PACKAGE JEDEC FTA 073 N/A 11.60 mm x 8.00 mm PACKAGE MIN. NOM. MAX. --0.25 1.00 ------11.60 BSC. 8.00 BSC. 8.80 BSC. 7.20 BSC. 12 10 73 0.30 0.35 0.80 BSC 0.80 BSC 0.40 BSC A2,A3,A4,A5,A6,A7,A8,A9 B2,B3,B4,B7,B8,B9,C2,C9,C10 D1,D10,E1,E10,F5,F6,G5,G6 H1,H10,J1,J10,K1,K2,K9,K10 L2,L3,L4,L7,L8,L9 M2,M3,M4,M5,M6,M7,M8,M9 0.40 1.40 --1.11 PROFILE BALL HEIGHT BODY THICKNESS BODY SIZE BODY SIZE MATRIX FOOTPRINT MATRIX FOOTPRINT MATRIX SIZE D DIRECTION MATRIX SIZE E DIRECTION BALL COUNT BALL DIAMETER BALL PITCH BALL PITCH SOLDER BALL PLACEMENT DEPOPULATED SOLDER BALL 9. 8. 6 7 NOTE 1. 2. 3. 4. 5. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. ALL DIMENSIONS ARE IN MILLIMETERS. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010. e REPRESENTS THE SOLDER BALL GRID PITCH. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME. DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. N/A SYMBOL A A1 A2 D E D1 E1 MD ME n Ob eE eD SD/SE 10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTION OR OTHER MEANS. 3159\38.14b November 17, 2003 Am75DL9608HG 67 ADVANCE INFORMATION REVISION SUMMARY Revision A (October 6, 2003) Initial release. Revision A+1 (November 17, 2003) CMOS Compatible Changed the test condition for the VOL to IOL = 2.0 mA. Trademarks Copyright © 2003 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies. 68 Am75DL9608HG November 17, 2003