MB8S

MB2S thru MB10S Surface Mount Bridge Rectifiers PRODUCT SUMMARY Miniature Glass Passivated Single-Phase Reverse Voltage 200 to 1000 Volts FEATURES Plastic package has Underwriters Laboratory Flammability Classification 94V-0 Glass passivated chip junctions High surge overload rating: 35A peak Saves space on printed circuit boards High temperature soldering guaranteed: 260oC/10 seconds MECANICAL DATA Case: Molded plastic body over passivated junctions Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Mounting Position: Any Weight: 0.078 oz., 0.22 g Package outline dimensions in inches (millimeters) Pb-free; RoHS-compliant 12/23/2007 Rev.1.00 www.SiliconStandard.com 1 MB2S thru MB10S MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25 C unless otherwise noted) Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward output rectified current (see Fig.1) on glass-epoxy P.C.B. on aluminum substrate Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) Rating for fusing (t < 8.3ms) Maximum instantaneous forward voltage drop per leg at 0.4A Maximum DC reverse current at rated DC blocking voltage per leg Typical thermal resistance per leg Typical junction capacitance per leg at 4.0V, 1.0MHz Operating junction and storage temperature range TA = 25oC TA = 125oC Symbols VRRM VRMS VDC IF(AV) IFSM I2t VF IR RθJA RθJA RθJL CJ TJ, TSTG MB2S 200 140 200 MB4S 400 280 400 MB6S 600 420 600 0.5 0.8 (1) (2) o MB8S 800 560 800 MB10S 1000 700 1000 Units Volts Volts Volts Amp Amps A 2 se c Volt uA o 35.0 5.0 1.0 5.0 100 85 70 20 (1) (2) (1) C/W pF o 13 -55 to +150 C Notes: 1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads 2. On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad 12/23/2007 Rev.1.00 www.SiliconStandard.com 2 MB2S thru MB10S RATINGS AND CHARACTERISTIC CURVES (TA=25 C unless otherwise noted) o Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 12/23/2007 Rev.1.00 www.SiliconStandard.com 3