S1J

S1A – S1M Surface Mount Glass Passivated Rectifiers FEATURES Reverse Voltage 50 to 1000 V Forward Current 1.0 A Plastic package has Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Low profile package Built-in strain relief, ideal for automated placement Glass passivated chip junction High temperature soldering: 250℃/10 seconds at terminals MECHANICAL DATA Case: JEDEC DO-214AC (SMA) molded plastic over glass passivated chip Terminals: Solder plated, solder-able per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Weight: 0.002 ounce, 0.064 gram Pb-free; RoHS-compliant 01/01/2007 Rev. 2.00 www.SiliconStandard.com 1 S1A – S1M MAXIMUM RATINGS (TA=25℃ unless otherwise specified) Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current (see fig.1) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load(JEDEC Method) TL =110℃ Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current @TA =25℃ at rated DC blocking voltage @TA=125℃ Typical reverse recovery time at IF =0.5A, IR=1.0A, Irr =0.25A Typical junction capacitance at 4.0V, 1MHz Typical thermal resistance (NOTE 1) Symbols S1A VRRM VRMS VDC IF(AV) IFSM 40.0 50 35 50 S1B 100 70 100 S1D 200 140 200 S1G 400 280 400 1.0 30.0 S1J 600 420 600 S1K 800 560 800 S1M 1000 700 1000 Units Volts Volts Volts Amp Amps VF IR 1.0 1.10 5.0 50 Volts uA trr CJ R RJL 75 27 1.0 12 85 30 -55 to +150 -55 to +150 uS pF ℃/W Operating junction temperature range Storage temperature range NOTE: 1. TJ TSTG ℃ ℃ Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas 01/01/2007 Rev. 2.00 www.SiliconStandard.com 2 S1A – S1M RATINGS AND CHARACTERISTIC CURVES A RATINGS AND CHARACTERISTIC CURVES A (VIN = +5V , CIN = 10µF, COUT = 10µF, TA = 25°C , unless otherwise specified.) 01/01/2007 Rev. 2.00 www.SiliconStandard.com 3 S1A – S1M Disclaimer Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 01/01/2007 Rev. 2.00 www.SiliconStandard.com 4