S1K

厂商：
SSC
封装：
描述：
S1K - Surface Mount Glass Passivated Rectifiers - Silicon Standard Corp.

数据手册：

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数据手册
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S1K 数据手册

S1A – S1M Surface Mount Glass Passivated Rectifiers FEATURES Reverse Voltage 50 to 1000 V Forward Current 1.0 A Plastic package has Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Low profile package Built-in strain relief, ideal for automated placement Glass passivated chip junction High temperature soldering: 250℃/10 seconds at terminals MECHANICAL DATA Case: JEDEC DO-214AC (SMA) molded plastic over glass passivated chip Terminals: Solder plated, solder-able per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Weight: 0.002 ounce, 0.064 gram Pb-free; RoHS-compliant 01/01/2007 Rev. 2.00 www.SiliconStandard.com 1 S1A – S1M MAXIMUM RATINGS (TA=25℃ unless otherwise specified) Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current (see fig.1) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load(JEDEC Method) TL =110℃ Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current @TA =25℃ at rated DC blocking voltage @TA=125℃ Typical reverse recovery time at IF =0.5A, IR=1.0A, Irr =0.25A Typical junction capacitance at 4.0V, 1MHz Typical thermal resistance (NOTE 1) Symbols S1A VRRM VRMS VDC IF(AV) IFSM 40.0 50 35 50 S1B 100 70 100 S1D 200 140 200 S1G 400 280 400 1.0 30.0 S1J 600 420 600 S1K 800 560 800 S1M 1000 700 1000 Units Volts Volts Volts Amp Amps VF IR 1.0 1.10 5.0 50 Volts uA trr CJ R RJL 75 27 1.0 12 85 30 -55 to +150 -55 to +150 uS pF ℃/W Operating junction temperature range Storage temperature range NOTE: 1. TJ TSTG ℃ ℃ Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas 01/01/2007 Rev. 2.00 www.SiliconStandard.com 2 S1A – S1M RATINGS AND CHARACTERISTIC CURVES A RATINGS AND CHARACTERISTIC CURVES A (VIN = +5V , CIN = 10µF, COUT = 10µF, TA = 25°C , unless otherwise specified.) 01/01/2007 Rev. 2.00 www.SiliconStandard.com 3 S1A – S1M Disclaimer Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 01/01/2007 Rev. 2.00 www.SiliconStandard.com 4

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S1K

1. 物料型号： - 型号系列：S1A – S1M

2. 器件简介： - 描述：表面贴装玻璃钝化整流器，适用于表面贴装应用，具有低轮廓封装、内置缓释、适合自动化放置、玻璃钝化芯片结构。

3. 引脚分配： - 封装：JEDEC DO-214AC (SMA)，塑封玻璃钝化芯片。 - 端子：焊锡镀层，符合MIL-STD-750方法2026的可焊性。 - 极性：色带表示阴极端。

4. 参数特性： - 反向电压：50至1000V。 - 正向电流：1.0A。 - 塑料封装符合UL94V-0可燃性分类。 - 高温焊接：250℃/10秒在端子处。

5. 功能详解： - 提供了详细的最大额定值，包括重复峰值反向电压、RMS电压、直流阻断电压、平均正向整流电流、单次峰值正向浪涌电流等。 - 正向电压降（VF）在1.0A时最大为1.10V。 - 最大直流反向电流在25℃时为1.0μA，在额定直流阻断电压下125℃时为5.0μA。 - 典型的反向恢复时间在IF=0.5A, IR=1.0A, Irr=0.25A时为1.0μs。 - 典型的结电容在4.0V, 1MHz时为12pF。 - 典型的热阻（从结到环境和从结到安装在PCB上的引脚）分别为75℃/W和85℃/W。

6. 应用信息： - 适用于需要表面贴装和高可靠性的整流应用。

7. 封装信息： - 封装类型：DO-214AC(SMA)。 - 尺寸：以英寸和毫米为单位提供。 - 重量：0.002盎司，0.064克。 - 无铅；符合RoHS标准。

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