SS8026T23TB

SS8026 1.8V 1A Positive Voltage Regulator Features Output current in excess of 1A Output voltage accuracy +2.5%/-2% Quiescent current typically 480µA Internal short-circuit current-limit Internal over-temperature protection General Description The SS8026 positive 1.8V voltage regulator features the ability to source 1A of output current. The typical quiescent current is 0.48mA. Familiar regulator features such as over-temperature and over-current protection circuits are provided to prevent it from being damaged by abnormal operating conditions. Applications PC motherboard ADSL/Cable Modem Set -Top Box LAN switch/Hub Broadband/Router Ordering Information SS8026XXXXX Packing Type Pin Option Package Type PACKAGE TYPE T2 : SOT-89 T3 : TO 220 T4 : TO 252 T5 : TO-263 T6 : SOT-223 PIN OPTION 1 1 : V OUT 2 : V OUT 3 : GND 4 : GND 5 : V IN 6 : V IN 2 GND V IN V OUT V IN GND V OUT 3 V IN GND V IN V OUT V OUT GND PACKING TR : Tape & Reel TB : Tubes Typical Application [Note 4] : Type of COUT IO VIN C1 1µ F Pin Configuration SS8026 IQ VOUT C OUT 10µF Top View Top View Top View 1 2 3 1 2 3 1 2 3 TO-220 TO-252 and TO-263 SOT-223 and SOT-89 Rev.2.02 12/06/2003 www.SiliconStandard.com 1 of 12 SS8026 Absolute Maximum Ratings (Note 1) Input Voltage………………...................................................................……………………..…..…7V Power Dissipation Internally Limited….................................................................... (Note 2) Maximum Junction Temperature….......................................................……………............…..150°C Storage Temperature Rang…........................................................................................-65°C ≤ TJ ≤+150°C Lead Temperature, Time for Wave Soldering SOT 223 Package……………….…….......................................................................………..260°C, 4s Continuous Power Dissipation (TA = +25°C) SOT 89 (1) ……………………......................................................................………………..….…0.5W SOT 223(1) ……………...................................................................………...……………….…....0.8W TO 252(1) ……………………….................................................................................................................………………………………………………….1.0W Note (1): See Recommended Minimum Footprint Operating Conditions (Note 1) Input Voltage……………………........................................................................……………..2.7V~6.5V Temperature Range…………..........................................................................................…0°C ≤ T J ≤125°C Electrical Characteristics VIN =3.3V, IO = 1A, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3] PARAMETER CONDITIONS MIN TYP MAX Output Voltage Line Regulation Load Regulation Output Impedance Quiescent Current Ripple Rejection Dropout Voltage 10mA < IO < 1A 3V < V IN < 6.5V, IO = 10mA 10mA < IO < 1A 200mA DC and 100mA AC, fo = 120Hz V IN = 3.3V f i = 120Hz,V ripple =1V P -P , Io = 100mA IO = 0A IO = 100mA IO = 500mA IO = 1A V IN = 3V(SOT 223) Output Current Continuous Test, TA = 25°C, TJ 150°C, V OUT within ±2% V IN = 3.3V(SOT 223) V IN = 3.3V(SOT 89) Short Circuit Current Over Temperature Minimum footprint (0.0625 square inch) Mounted on 0.53 square inch pcb area Mounted on 0.16 square inch pcb area 1.764 1.800 3 30 80 480 53 880 895 950 1160 660 1 0.5 1.6 150 1.845 30 50 UNITS V mV mV mΩ µA dB mV mA A A A °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient te mperature is Tjmax-TA / θJA. If this dissipation is exceeded, tthe die temperature will rise above 150°C and the IC will go into thermal shutdown. For the SS8026 in SOT 89 package, θJA is 250°C/W. For the SS8026 in SOT 223 package, θJA is 156°C/W; in TO 252 package, θJA is 125°C/W. (See recommend minimum footprint). The safe operation in SOT 89, SOT 223, TO 252 package, can be seen in “Typical Performance Characteristics” (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperatures as close to ambient as p ossible. Note4: The output capacitor should be a tantalum or aluminum type. Rev.2.02 12/06/2003 www.SiliconStandard.com 2 of 12 SS8026 Definitions Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value. Dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation under which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. Rev.2.02 12/06/2003 www.SiliconStandard.com 3 of 12 SS8026 Typical Performance Characteristics (V IN= +3.3V, CIN=1µF, COUT=10µF, TA=25°C, unless otherwise noted.) Output Voltage vs. Load Current 1.900 1.880 1600 1400 Dropout Voltage vs. Load Current Dropout Voltage (mV) 0 100 200 300 400 500 600 700 800 900 1000 1.860 Ootput Voltage (V) 1200 1000 800 600 400 200 0 0 100 200 300 400 500 600 700 800 900 1000 1.840 1.820 1.800 1.780 1.760 1.740 1.720 1.700 Load Current (mA) Load Current (mA) Ground Current vs. Load Current 2.00 1.80 1.60 Line Transient Ground Current (mA) 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Line Transient Rev.2.02 12/06/2003 www.SiliconStandard.com 4 of 12 SS8026 Typical Performance Characteristics Load Transient (continued) Load Transient Load Transient Load Transient Rev.2.02 12/06/2003 www.SiliconStandard.com 5 of 12 SS8026 Safe Operating Area of SOT 223 1200 1100 1000 Maximum Power Dissipation of SOT 223 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 1oz Copper on SOT-223 Package Mounted on recommended mimimum footprint (R cA =156°C/W) £J T A =25°C,Still Air 1oz Copper on SOT-223 Package Mounted on recommended mimimum footprint (R£ cA =156°C/W) J Output Current (mA) 900 800 700 600 500 400 300 200 100 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 TA=25¢ J TA=55¢ J TA=85¢ J TA =25°C,Still Air Power Dissipation (W) 0.1 0.0 25 35 45 55 65 75 85 95 105 115 125 Input-Output Voltage Differential VIN-VOUT (V) Amibent Temperature TA (°C) Note: V IN(max)