SSM4226M/GM
DUAL N-CHANNEL ENHANCEMENT-MODE POWER MOSFET
Low on-resistance Simple drive requirement High VGS rating
D2 D1 D1
D2
BVDSS R DS(ON)
G2 S2
30V 18mΩ 8.2A
ID
SO-8
S1
G1
Description
D1
D2
Advanced Power MOSFETs from Silicon Standard provide the designer with the best combination of fast switching, ruggedized device design, ultra low on-resistance and cost-effectiveness.
G1 S1
G2 S2
This device is available with Pb-free lead finish (second-level interconnect) as SSM4226GM.
Absolute Maximum Ratings
Symbol VDS VGS ID @ TA=25°C ID @ TA=70°C IDM PD @ TA=25°C TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current
1 3 3
Rating 30 ± 20 8.2 6.7 30 2 0.016 -55 to 150 -55 to 150
Units V V A A A W W/°C °C °C
Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range
Thermal Data
Symbol Rthj-a Parameter Thermal Resistance Junction-ambient
3
Value Max. 62.5
Unit °C/W
8/06/2004 Rev.1.02
www.SiliconStandard.com
1 of 4
SSM4226M/GM
Electrical Characteristics @ Tj=25oC (unless otherwise specified)
Symbol BVDSS Parameter Drain-Source Breakdown Voltage Test Conditions VGS=0V, ID=250uA Min. 30 1 Typ. 0.03 15 20 5 12 12 8 31 12 320 230 Max. Units 18 28 3 1 25 ±100 30 V V/°C mΩ mΩ V S uA uA nA nC nC nC ns ns ns ns pF pF pF
∆ B VDSS/∆ Tj
RDS(ON)
Breakdown Voltage Temperature Coefficient Reference to 25°C, ID=1mA
Static Drain-Source On-Resistance 2
VGS=10V, ID=6A VGS=4.5V, ID=4A
VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss
Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=70 C)
o o
VDS=VGS, ID=250uA VDS=10V, ID=6A VDS=30V, VGS=0V VDS=24V ,VGS=0V VGS= ± 20V ID=8A VDS=24V VGS=4.5V VDS=15V ID=1A RG=3.3Ω ,VGS=10V RD=15Ω VGS=0V VDS=25V f=1.0MHz
Gate-Source Leakage Total Gate Charge
2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
2
1450 2320
Source-Drain Diode
Symbol VSD Parameter Forward On Voltage
2
Test Conditions IS=1.7A, VGS=0V IS=8A, VGS=0V, dI/dt=100A/µs
Min. -
Typ. 27 18
Max. Units 1.2 V ns nC
trr
Qrr
Reverse Recovery Time Reverse Recovery Charge
Notes:
1.Pulse width limited by Max. junction temperature. 2.Pulse width
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