SST25VF032B-66-4I-S2F

32 Mbit SPI Serial Flash SST25VF032B SST25VF032B32Mb Serial Peripheral Interface (SPI) flash memory Data Sheet FEATURES: • Single Voltage Read and Write Operations – 2.7-3.6V • Serial Interface Architecture – SPI Compatible: Mode 0 and Mode 3 • High Speed Clock Frequency – 80 MHz Max • Superior Reliability – Endurance: 100,000 Cycles (typical) – Greater than 100 years Data Retention • Low Power Consumption: – Active Read Current: 10 mA (typical) – Standby Current: 5 µA (typical) • Flexible Erase Capability – Uniform 4 KByte sectors – Uniform 32 KByte overlay blocks – Uniform 64 KByte overlay blocks • Fast Erase and Byte-Program: – Chip-Erase Time: 35 ms (typical) – Sector-/Block-Erase Time: 18 ms (typical) – Byte-Program Time: 7 µs (typical) • Auto Address Increment (AAI) Word Programming – Decrease total chip programming time over Byte-Program operations • End-of-Write Detection – Software polling the BUSY bit in Status Register – Busy Status readout on SO pin • Hold Pin (HOLD#) – Suspends a serial sequence to the memory without deselecting the device • Write Protection (WP#) – Enables/Disables the Lock-Down function of the status register • Software Write Protection – Write protection through Block-Protection bits in status register • Temperature Range – Industrial: -40°C to +85°C • Packages Available – 8-lead SOIC (200 mils) – 8-contact WSON (5 X 6 mm) • All devices are RoHS compliant PRODUCT DESCRIPTION The SST 25 series Serial Flash family features a four-wire, SPI-compatible interface that allows for a low pin-count package which occupies less board space and ultimately lowers total system costs. SST25VF032B SPI serial flash memories are manufactured with SST’s proprietary, highperformance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST25VF032B devices significantly improve performance and reliability, while lowering power consumption. The devices write (Program or Erase) with a single power supply of 2.7-3.6V for SST25VF032B. The total energy consumed is a function of the applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash technology uses less current to program and has a shorter erase time, the total energy consumed during any Erase or Program operation is less than alternative flash memory technologies. The SST25VF032B device is offered in 8-lead SOIC (200 mils) and 8-contact WSON packages. See Figure 2 for pin assignments. © 2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 1 The SST logo and SuperFlash are registered Trademarks of Silicon Storage Technology, Inc. These specifications are subject to change without notice. 32 Mbit SPI Serial Flash SST25VF032B Data Sheet Address Buffers and Latches X - Decoder SuperFlash Memory Y - Decoder Control Logic I/O Buffers and Data Latches Serial Interface CE# SCK SI SO WP# HOLD# 1327 B1.0 Note: 1. In AAI mode, the SO pin can act as a RY/BY# pin when configured as a ready/busy status pin. See “End-ofWrite Detection” on page 11 for details FIGURE 1: Functional Block Diagram ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 2 32 Mbit SPI Serial Flash SST25VF032B Data Sheet PIN DESCRIPTION CE# SO WP# VSS 1 2 Top View 3 4 8 7 6 5 VDD HOLD# SCK SI CE# SO WP# VSS 1 8 VDD HOLD# SCK SI 2 7 Top View 3 6 4 5 1327 8-SOIC P1.0 1327 8-WSON P1.0 Notes: 1. In AAI mode, the SO pin can act as a RY/BY# pin when configured as a ready/busy status pin. See “End-ofWrite Detection” on page 11 for details. FIGURE 2: Pin Assignments for 8-Lead SOIC TABLE 1: Pin Description Symbol SCK Pin Name Serial Clock Functions To provide the timing of the serial interface. Commands, addresses, or input data are latched on the rising edge of the clock input, while output data is shifted out on the falling edge of the clock input. To transfer commands, addresses, or data serially into the device. Inputs are latched on the rising edge of the serial clock. To transfer data serially out of the device. Data is shifted out on the falling edge of the serial clock. Flash busy status pin in AAI mode if SO is configured as a hardware RY/BY# pin. The device is enabled by a high to low transition on CE#. CE# must remain low for the duration of any command sequence. The Write Protect (WP#) pin is used to enable/disable BPL bit in the status register. To temporarily stop serial communication with SPI flash memory without resetting the device. To provide power supply voltage: 2.7-3.6V T1.0 1327 SI SO RY/BY# CE# WP# HOLD# VDD VSS Serial Data Input Serial Data Output Ready / Busy pin Chip Enable Write Protect Hold Power Supply Ground ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 3 32 Mbit SPI Serial Flash SST25VF032B Data Sheet MEMORY ORGANIZATION The SST25VF032B SuperFlash memory array is organized in uniform 4 KByte erasable sectors with 32 KByte overlay blocks and 64 KByte overlay erasable blocks. select the device, and data is accessed through the Serial Data Input (SI), Serial Data Output (SO), and Serial Clock (SCK). The SST25VF032B supports both Mode 0 (0,0) and Mode 3 (1,1) of SPI bus operations. The difference between the two modes, as shown in Figure 3, is the state of the SCK signal when the bus master is in Stand-by mode and no data is being transferred. The SCK signal is low for Mode 0 and SCK signal is high for Mode 3. For both modes, the Serial Data In (SI) is sampled at the rising edge of the SCK clock signal and the Serial Data Output (SO) is driven after the falling edge of the SCK clock signal. DEVICE OPERATION The SST25VF032B is accessed through the SPI (Serial Peripheral Interface) bus compatible protocol. The SPI bus consist of four control lines; Chip Enable (CE#) is used to CE# MODE 3 MODE 3 MODE 0 SCK SI SO MODE 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 MSB DON'T CARE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 MSB 1327 F04.0 HIGH IMPEDANCE FIGURE 3: SPI Protocol ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 4 32 Mbit SPI Serial Flash SST25VF032B Data Sheet Hold Operation The HOLD# pin is used to pause a serial sequence using the SPI flash memory, but without resetting the clocking sequence. To activate the HOLD# mode, CE# must be in active low state. The HOLD# mode begins when the SCK active low state coincides with the falling edge of the HOLD# signal. The HOLD mode ends when the HOLD# signal’s rising edge coincides with the SCK active low state. If the falling edge of the HOLD# signal does not coincide with the SCK active low state, then the device enters Hold mode when the SCK next reaches the active low state. Similarly, if the rising edge of the HOLD# signal does not coincide with the SCK active low state, then the device exits from Hold mode when the SCK next reaches the active low state. See Figure 4 for Hold Condition waveform. Once the device enters Hold mode, SO will be in highimpedance state while SI and SCK can be VIL or VIH. If CE# is driven high during a Hold condition, the device returns to Standby mode. As long as HOLD# signal is low, the memory remains in the Hold condition. To resume communication with the device, HOLD# must be driven active high, and CE# must be driven active low. See Figure 4 for Hold timing. SCK HOLD# Active Hold Active Hold Active 1327 F05.0 FIGURE 4: Hold Condition Waveform Write Protection SST25VF032B provides software Write protection. The Write Protect pin (WP#) enables or disables the lock-down function of the status register. The Block-Protection bits (BP3, BP2, BP1, BP0, and BPL) in the status register provide Write protection to the memory array and the status register. See Table 4 for the Block-Protection description. Write Protect Pin (WP#) The Write Protect (WP#) pin enables the lock-down function of the BPL bit (bit 7) in the status register. When WP# is driven low, the execution of the Write-Status-Register (WRSR) instruction is determined by the value of the BPL bit (see Table 2). When WP# is high, the lock-down function of the BPL bit is disabled. TABLE 2: Conditions to execute Write-StatusRegister (WRSR) Instruction WP# L L H BPL 1 0 X Execute WRSR Instruction Not Allowed Allowed Allowed T2.0 1327 ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 5 32 Mbit SPI Serial Flash SST25VF032B Data Sheet Status Register The software status register provides status on whether the flash memory array is available for any Read or Write operation, whether the device is Write enabled, and the state of the Memory Write protection. During an internal Erase or TABLE 3: Software Status Register Bit 0 1 2 3 4 5 6 Name BUSY WEL BP0 BP1 BP2 BP3 AAI Function 1 = Internal Write operation is in progress 0 = No internal Write operation is in progress 1 = Device is memory Write enabled 0 = Device is not memory Write enabled Indicate current level of block write protection (See Table 4) Indicate current level of block write protection (See Table 4) Indicate current level of block write protection (See Table 4) Indicate current level of block write protection (See Table 4) Auto Address Increment Programming status 1 = AAI programming mode 0 = Byte-Program mode 1 = BP3, BP2, BP1, BP0 are read-only bits 0 = BP3, BP2, BP1, BP0 are readable/writable Default at Power-up 0 0 1 1 1 0 0 Read/Write R R R/W R/W R/W R/W R Program operation, the status register may be read only to determine the completion of an operation in progress. Table 3 describes the function of each bit in the software status register. 7 BPL 0 R/W T3.0 1327 Busy The Busy bit determines whether there is an internal Erase or Program operation in progress. A ‘1’ for the Busy bit indicates the device is busy with an operation in progress. A ‘0’ indicates the device is ready for the next valid operation. Write Enable Latch (WEL) The Write-Enable-Latch bit indicates the status of the internal memory Write Enable Latch. If the Write-Enable-Latch bit is set to ‘1’, it indicates the device is Write enabled. If the bit is set to ‘0’ (reset), it indicates the device is not Write enabled and does not accept any memory Write (Program/ Erase) commands. The Write-Enable-Latch bit is automatically reset under the following conditions: • • • • Power-up Write-Disable (WRDI) instruction completion Byte-Program instruction completion Auto Address Increment (AAI) programming is completed or reached its highest unprotected memory address Sector-Erase instruction completion Block-Erase instruction completion Chip-Erase instruction completion Write-Status-Register instructions Auto Address Increment (AAI) The Auto Address Increment Programming-Status bit provides status on whether the device is in AAI programming mode or Byte-Program mode. The default at power up is Byte-Program mode. • • • • ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 6 32 Mbit SPI Serial Flash SST25VF032B Data Sheet Block Protection (BP3,BP2, BP1, BP0) The Block-Protection (BP3, BP2, BP1, BP0) bits define the size of the memory area, as shown in Table 4, to be software protected against any memory Write (Program or Erase) operation. The Write-Status-Register (WRSR) instruction is used to program the BP3, BP2, BP1 and BP0 bits as long as WP# is high or the Block-Protect-Lock (BPL) bit is 0. Chip-Erase can only be executed if BlockProtection bits are all 0. After power-up, BP3, BP2, BP1 and BP0 are set to the defaults specified in Table 4. Block Protection Lock-Down (BPL) WP# pin driven low (VIL), enables the Block-ProtectionLock-Down (BPL) bit. When BPL is set to 1, it prevents any further alteration of the BPL, BP3, BP2, BP1, and BP0 bits. When the WP# pin is driven high (VIH), the BPL bit has no effect and its value is “Don’t Care”. After power-up, the BPL bit is reset to 0. TABLE 4: Software Status Register Block Protection FOR SST25VF032B1 Status Register Bit2 Protection Level None Upper 1/64 Upper 1/32 Upper 1/16 Upper 1/8 Upper 1/4 Upper 1/2 All Blocks BP3 X X X X X X X X BP2 0 0 0 0 1 1 1 1 BP1 0 0 1 1 0 0 1 1 BP0 0 1 0 1 0 1 0 1 Protected Memory Address 32 Mbit None 3F0000H-3FFFFFH 3E0000H-3FFFFFH 3C0000H-3FFFFFH 380000H-3FFFFFH 300000H-3FFFFFH 200000H-3FFFFFH 000000H-3FFFFFH T4.0 1327 1. X = Don’t Care (RESERVED) default is “0 2. Default at power-up for BP2, BP1, and BP0 is ‘111’. (All Blocks Protected) ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 7 32 Mbit SPI Serial Flash SST25VF032B Data Sheet INSTRUCTIONS Instructions are used to read, write (Erase and Program), and configure the SST25VF032B. The instruction bus cycles are 8 bits each for commands (Op Code), data, and addresses. The Write-Enable (WREN) instruction must be executed prior any Byte-Program, Auto Address Increment (AAI) programming, Sector-Erase, Block-Erase, Write-Status-Register, or Chip-Erase instructions. The complete list of instructions is provided in Table 5. All instructions are synchronized off a high to low transition of CE#. Inputs will be accepted on the rising edge of SCK starting with the most significant bit. CE# must be driven TABLE 5: Device Operation Instructions Instruction Read High-Speed Read Description Read Memory Read Memory at higher speed Op Code Cycle1 0000 0011b (03H) 0000 1011b (0BH) 0010 0000b (20H) 0101 0010b (52H) 1101 1000b (D8H) 0110 0000b (60H) or 1100 0111b (C7H) 0000 0010b (02H) 1010 1101b (ADH) 0000 0101b (05H) 0000 0001b (01H) 0000 0110b (06H) 0000 0100b (04H) 1001 0000b (90H) or 1010 1011b (ABH) 1001 1111b (9FH) Address Cycle(s)2 3 3 3 3 3 0 3 3 0 0 0 0 0 3 0 0 0 Dummy Data Maximum Cycle(s) Cycle(s) Frequency 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 to ∞ 1 to ∞ 0 0 0 0 1 2 to ∞ 1 to ∞ 0 1 0 0 1 to ∞ 3 to ∞ 0 0 25 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz T5.0 1327 low before an instruction is entered and must be driven high after the last bit of the instruction has been shifted in (except for Read, Read-ID, and Read-Status-Register instructions). Any low to high transition on CE#, before receiving the last bit of an instruction bus cycle, will terminate the instruction in progress and return the device to standby mode. Instruction commands (Op Code), addresses, and data are all input from the most significant bit (MSB) first. 4 KByte Sector-Erase3 Erase 4 KByte of memory array 32 KByte Block-Erase4 Erase 32KByte block of memory array 64 KByte Block-Erase5 Erase 64 KByte block of memory array Chip-Erase Byte-Program AAI-Word-Program6 RDSR7 EWSR WRSR WREN WRDI RDID8 JEDEC-ID EBSY DBSY Erase Full Memory Array To Program One Data Byte Auto Address Increment Programming Read-Status-Register Write-Status-Register Write-Enable Write-Disable Read-ID JEDEC ID read Enable-Write-Status-Register 0101 0000b (50H) Enable SO as an output RY/BY# 0111 0000b (70H) status during AAI programming Disable SO as an output RY/BY# 1000 0000b (80H) status during AAI programming 1. 2. 3. 4. 5. 6. One bus cycle is eight clock periods. Address bits above the most significant bit can be either VIL or VIH. 4KByte Sector Erase addresses: use AMS-A12, remaining addresses are don’t care but must be set either at VIL or VIH. 32KByte Block Erase addresses: use AMS-A15, remaining addresses are don’t care but must be set either at VIL or VIH. 64KByte Block Erase addresses: use AMS-A16, remaining addresses are don’t care but must be set either at VIL or VIH. To continue programming to the next sequential address location, enter the 8-bit command, ADH, followed by 2 bytes of data to be programmed. Data Byte 0 will be programmed into the initial address [A23-A1] with A0=0, Data Byte 1 will be programmed into the initial address [A23-A1] with A0 = 1. 7. The Read-Status-Register is continuous with ongoing clock cycles until terminated by a low to high transition on CE#. 8. Manufacturer’s ID is read with A0 = 0, and Device ID is read with A0 = 1. All other address bits are 00H. The Manufacturer’s ID and device ID output stream is continuous until terminated by a low-to-high transition on CE#. ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 8 32 Mbit SPI Serial Flash SST25VF032B Data Sheet Read (25 MHz) The Read instruction, 03H, supports up to 25 MHz Read. The device outputs the data starting from the specified address location. The data output stream is continuous through all addresses until terminated by a low to high transition on CE#. The internal address pointer will automatically increment until the highest memory address is reached. Once the highest memory address is reached, the address pointer will automatically increment to the beginning (wrap-around) of the address space. For example, once the data from address location 3FFFFFH has been read, the next output will be from address location 000000H. The Read instruction is initiated by executing an 8-bit command, 03H, followed by address bits [A23-A0]. CE# must remain active low for the duration of the Read cycle. See Figure 5 for the Read sequence. CE# MODE 3 012345678 15 16 23 24 31 32 39 40 47 48 55 56 63 64 70 SCK MODE 0 SI MSB SO 03 ADD. MSB HIGH IMPEDANCE ADD. ADD. N DOUT MSB 1327 F06.0 N+1 DOUT N+2 DOUT N+3 DOUT N+4 DOUT FIGURE 5: Read Sequence High-Speed-Read (80 MHz) The High-Speed-Read instruction supporting up to 80 MHz Read is initiated by executing an 8-bit command, 0BH, followed by address bits [A23-A0] and a dummy byte. CE# must remain active low for the duration of the High-SpeedRead cycle. See Figure 6 for the High-Speed-Read sequence. Following a dummy cycle, the High-Speed-Read instruction outputs the data starting from the specified address location. The data output stream is continuous through all addresses until terminated by a low to high transition on CE#. The internal address pointer will automatically increment until the highest memory address is reached. Once the highest memory address is reached, the address pointer will automatically increment to the beginning (wraparound) of the address space. For example, once the data from address location 3FFFFFH has been read, the next output will be from address location 000000H. CE# MODE 3 SCK MODE 0 012345678 15 16 23 24 31 32 39 40 47 48 55 56 63 64 71 72 78 SI 0B ADD. HIGH IMPEDANCE ADD. ADD. X N DOUT MSB N+1 DOUT N+2 DOUT N+3 DOUT N+4 DOUT 1327 F07.1 SO FIGURE 6: High-Speed-Read Sequence ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 9 32 Mbit SPI Serial Flash SST25VF032B Data Sheet Byte-Program The Byte-Program instruction programs the bits in the selected byte to the desired data. The selected byte must be in the erased state (FFH) when initiating a Program operation. A Byte-Program instruction applied to a protected memory area will be ignored. Prior to any Write operation, the Write-Enable (WREN) instruction must be executed. CE# must remain active low for the duration of the Byte-Program instruction. The ByteProgram instruction is initiated by executing an 8-bit command, 02H, followed by address bits [A23-A0]. Following the address, the data is input in order from MSB (bit 7) to LSB (bit 0). CE# must be driven high before the instruction is executed. The user may poll the Busy bit in the software status register or wait TBP for the completion of the internal self-timed Byte-Program operation. See Figure 7 for the Byte-Program sequence. CE# MODE 3 012345 678 15 16 23 24 31 32 39 SCK MODE 0 SI 02 ADD. ADD. ADD. DIN MSB LSB SO HIGH IMPEDANCE 1327 F08.0 FIGURE 7: Byte-Program Sequence ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 10 32 Mbit SPI Serial Flash SST25VF032B Data Sheet Auto Address Increment (AAI) Word-Program The AAI program instruction allows multiple bytes of data to be programmed without re-issuing the next sequential address location. This feature decreases total programming time when multiple bytes or entire memory array is to be programmed. An AAI Word program instruction pointing to a protected memory area will be ignored. The selected address range must be in the erased state (FFH) when initiating an AAI Word Program operation. While within AAI Word Programming sequence, the only valid instructions are AAI Word (ADH), RDSR (05H), or WRDI (04H). Users have three options to determine the completion of each AAI Word program cycle: hardware detection by reading the Serial Output, software detection by polling the BUSY bit in the software status register or wait TBP. Refer to EndOf-Write Detection section for details. Prior to any write operation, the Write-Enable (WREN) instruction must be executed. The AAI Word Program instruction is initiated by executing an 8-bit command, ADH, followed by address bits [A23-A0]. Following the addresses, two bytes of data is input sequentially, each one from MSB (Bit 7) to LSB (Bit 0). The first byte of data (D0) will be programmed into the initial address [A23-A1] with A0 = 0, the second byte of Data (D1) will be programmed into the initial address [A23-A1] with A0 = 1. CE# must be driven high before the AAI Word Program instruction is executed. The user must check the BUSY status before entering the next valid command. Once the device indicates it is no longer busy, data for the next two sequential addresses may be programmed and so on. When the last desired byte had been entered, check the busy status using the hardware method or the RDSR instruction and execute the Write-Disable (WRDI) instruction, 04H, to terminate AAI. Check the busy status after WRDI to determine if the device is ready for any command. See Figures 10 and 11 for AAI Word programming sequence. There is no wrap mode during AAI programming; once the highest unprotected memory address is reached, the device will exit AAI operation and reset the Write-EnableLatch bit (WEL = 0) and the AAI bit (AAI = 0). End-of-Write Detection There are three methods to determine completion of a program cycle during AAI Word programming: hardware detection by reading the Serial Output, software detection by polling the BUSY bit in the Software Status Register or wait TBP. The hardware end-of-write detection method is described in the section below. Hardware End-of-Write Detection The hardware end-of-write detection method eliminates the overhead of polling the Busy bit in the Software Status Register during an AAI Word program operation. The 8-bit command, 70H, configures the Serial Output (SO) pin to indicate Flash Busy status during AAI Word programming, as shown in Figure 8. The 8-bit command, 70H, must be executed prior to executing an AAI Word-Program instruction. Once an internal programming operation begins, asserting CE# will immediately drive the status of the internal flash status on the SO pin. A ‘0’ indicates the device is busy and a ‘1’ indicates the device is ready for the next instruction. De-asserting CE# will return the SO pin to tristate. The 8-bit command, 80H, prevents the Serial Output (SO) pin from outputting Busy status during AAI-Word-program operation and re-configures SO as an output pin. The device can only accept the 80H command when the device is not in AAI mode. Once SO is an output pin, in AAI mode the device can accept both RDSR instruction for polling and Software Status Register data outputs through the SO pin. This is shown in Figure 9. CE# MODE 3 01234567 SCK MODE 0 SI MSB 70 HIGH IMPEDANCE 1327 F09.0 SO FIGURE 8: Enable SO as Hardware RY/BY# during AAI Programming CE# MODE 3 01234567 SCK MODE 0 SI MSB 80 HIGH IMPEDANCE 1327 F10.0 SO FIGURE 9: Disable SO as Hardware RY/BY# during AAI Programming ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 11 32 Mbit SPI Serial Flash SST25VF032B Data Sheet CE# 0 78 15 16 23 24 31 32 39 40 47 0 78 15 16 23 0 78 15 16 23 0 7 0 78 15 MODE 3 SCK SI MODE 0 AD A A A D0 D1 AD D2 D3 AD Dn-1 Last 2 Data Bytes Dn WRDI WDRI to exit AAI Mode RDSR Load AAI command, Address, 2 bytes data SO Check for Flash Busy Status to load next valid1 command DOUT Wait TBP or poll Software Status register to load any command Note: 1. Valid commands during AAI programming: AAI command or WRDI command 2. User must configure the SO pin to output Flash Busy status during AAI programming 1327 AAI.HW.0 FIGURE 10: Auto Address Increment (AAI) Word-Program Sequence with Hardware End-of-Write Detection Wait TBP or poll Software Status register to load next valid1 command CE# 0 78 15 16 23 24 31 32 39 40 47 0 78 15 16 23 0 78 15 16 23 0 7 0 78 15 MODE 3 SCK SI MODE 0 AD A A A D0 D1 AD D2 D3 AD Dn-1 Last 2 Data Bytes Dn WRDI WDRI to exit AAI Mode RDSR Load AAI command, Address, 2 bytes data SO Note: 1. Valid commands during AAI programming: AAI command or WRDI command DOUT Wait TBP or poll Software Status register to load any command 1327 AAI.SW.0 FIGURE 11: Auto Address Increment (AAI) Word-Program Sequence with Software End-of-Write Detection ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 12 32 Mbit SPI Serial Flash SST25VF032B Data Sheet Sector-Erase The Sector-Erase instruction clears all bits in the selected 4 KByte sector to FFH. A Sector-Erase instruction applied to a protected memory area will be ignored. Prior to any Write operation, the Write-Enable (WREN) instruction must be executed. CE# must remain active low for the duration of any command sequence. The Sector-Erase instruction is initiated by executing an 8-bit command, 20H, followed by address bits [A23-A0]. Address bits [AMS-A12] (AMS = Most Significant address) are used to determine the sector address (SAX), remaining address bits can be VIL or VIH. CE# must be driven high before the instruction is executed. Poll the Busy bit in the software status register or wait TSE for the completion of the internal self-timed Sector-Erase cycle. See Figure 12 for the Sector-Erase sequence. CE# MODE 3 012345 678 15 16 23 24 31 SCK MODE 0 SI 20 ADD. ADD. ADD. SO HIGH IMPEDANCE 1327 F13.0 FIGURE 12: Sector-Erase Sequence ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 13 32 Mbit SPI Serial Flash SST25VF032B Data Sheet 32-KByte and 64-KByte Block-Erase The 32-KByte Block-Erase instruction clears all bits in the selected 32 KByte block to FFH. A Block-Erase instruction applied to a protected memory area will be ignored. The 64-KByte Block-Erase instruction clears all bits in the selected 64 KByte block to FFH. A Block-Erase instruction applied to a protected memory area will be ignored. Prior to any Write operation, the Write-Enable (WREN) instruction must be executed. CE# must remain active low for the duration of any command sequence. The 32-Kbyte BlockErase instruction is initiated by executing an 8-bit command, 52H, followed by address bits [A23-A0]. Address bits [AMS-A15] (AMS = Most Significant Address) are used to determine block address (BAX), remaining address bits can be VIL or VIH. CE# must be driven high before the instruction is executed. The 64-Kbyte Block-Erase instruction is initiated by executing an 8-bit command D8H, followed by address bits [A23-A0]. Address bits [AMS-A16] are used to determine block address (BAX), remaining address bits can be VIL or VIH. CE# must be driven high before the instruction is executed. Poll the Busy bit in the software status register or wait TBE for the completion of the internal self-timed 32KByte Block-Erase or 64-KByte Block-Erase cycles. See Figure 13 for the 32-KByte Block-Erase sequence and Figure 14 for the 64-KByte Block-Erase sequence. CE# MODE 3 012345678 15 16 23 24 31 SCK MODE 0 SI MSB 52 ADDR MSB ADDR ADDR SO HIGH IMPEDANCE 1327 32KBklEr.0 FIGURE 13: 32-KByte Block-Erase Sequence CE# MODE 3 012345678 15 16 23 24 31 SCK MODE 0 SI MSB D8 ADDR MSB ADDR ADDR SO HIGH IMPEDANCE 1327 63KBlkEr.0 FIGURE 14: 64-KByte Block-Erase Sequence ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 14 32 Mbit SPI Serial Flash SST25VF032B Data Sheet Chip-Erase The Chip-Erase instruction clears all bits in the device to FFH. A Chip-Erase instruction will be ignored if any of the memory area is protected. Prior to any Write operation, the Write-Enable (WREN) instruction must be executed. CE# must remain active low for the duration of the Chip-Erase instruction sequence. Initiate the Chip-Erase instruction by executing an 8-bit command, 60H or C7H. CE# must be driven high before the instruction is executed. Poll the Busy bit in the software status register or wait TCE for the completion of the internal self-timed Chip-Erase cycle. See Figure 15 for the Chip-Erase sequence. CE# MODE 3 01234567 SCK MODE 0 SI MSB 60 or C7 HIGH IMPEDANCE 1327 F16.0 SO FIGURE 15: Chip-Erase Sequence Read-Status-Register (RDSR) The Read-Status-Register (RDSR) instruction allows reading of the status register. The status register may be read at any time even during a Write (Program/Erase) operation. When a Write operation is in progress, the Busy bit may be checked before sending any new commands to assure that the new commands are properly received by the device. CE# must be driven low before the RDSR instruction is entered and remain low until the status data is read. ReadStatus-Register is continuous with ongoing clock cycles until it is terminated by a low to high transition of the CE#. See Figure 16 for the RDSR instruction sequence. CE# MODE 3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 SCK SI MODE 0 05 MSB SO HIGH IMPEDANCE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 MSB Status Register Out 1327 F17.0 FIGURE 16: Read-Status-Register (RDSR) Sequence ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 15 32 Mbit SPI Serial Flash SST25VF032B Data Sheet Write-Enable (WREN) The Write-Enable (WREN) instruction sets the WriteEnable-Latch bit in the Status Register to ‘1’ allowing Write operations to occur. The WREN instruction must be executed prior to any Write (Program/Erase) operation. The WREN instruction may also be used to allow execution of the Write-Status-Register (WRSR) instruction; however, the Write-Enable-Latch bit in the Status Register will be cleared upon the rising edge CE# of the WRSR instruction. CE# must be driven high before the WREN instruction is executed. CE# MODE 3 01234567 SCK MODE 0 SI MSB 06 HIGH IMPEDANCE 1327 F18.0 SO FIGURE 17: Write Enable (WREN) Sequence Write-Disable (WRDI) The Write-Disable (WRDI) instruction resets the WriteEnable-Latch bit and AAI bit to ‘0,’ therefore, preventing any new Write operations. The WRDI instruction will not terminate any programming operation in progress. Any program operation in progress may continue up to TBP after executing the WRDI instruction. CE# must be driven high before the WRDI instruction is executed. CE# MODE 3 01234567 SCK MODE 0 SI MSB 04 HIGH IMPEDANCE 1327 F19.0 SO FIGURE 18: Write Disable (WRDI) Sequence Enable-Write-Status-Register (EWSR) The Enable-Write-Status-Register (EWSR) instruction arms the Write-Status-Register (WRSR) instruction and opens the status register for alteration. The Write-StatusRegister instruction must be executed immediately after the execution of the Enable-Write-Status-Register instruction. This two-step instruction sequence of the EWSR instruction followed by the WRSR instruction works like software data protection (SDP) command structure which prevents any accidental alteration of the status register values. CE# ©2009 Silicon Storage Technology, Inc. must be driven low before the EWSR instruction is entered and must be driven high before the EWSR instruction is executed. S71327-03-000 05/09 16 32 Mbit SPI Serial Flash SST25VF032B Data Sheet Write-Status-Register (WRSR) The Write-Status-Register instruction writes new values to the BP3, BP2, BP1, BP0, and BPL bits of the status register. CE# must be driven low before the command sequence of the WRSR instruction is entered and driven high before the WRSR instruction is executed. See Figure 19 for EWSR or WREN and WRSR instruction sequences. Executing the Write-Status-Register instruction will be ignored when WP# is low and BPL bit is set to ‘1’. When the WP# is low, the BPL bit can only be set from ‘0’ to ‘1’ to lock-down the status register, but cannot be reset from ‘1’ to ‘0’. When WP# is high, the lock-down function of the BPL bit is disabled and the BPL, BP0, and BP1 and BP2 bits in the status register can all be changed. As long as BPL bit is set to ‘0’ or WP# pin is driven high (VIH) prior to the low-tohigh transition of the CE# pin at the end of the WRSR instruction, the bits in the status register can all be altered by the WRSR instruction. In this case, a single WRSR instruction can set the BPL bit to ‘1’ to lock down the status register as well as altering the BP0, BP1, and BP2 bits at the same time. See Table 2 for a summary description of WP# and BPL functions. CE# MODE 3 01234567 MODE 3 MODE 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCK MODE 0 SI MSB SO 50 or 06 MSB 01 HIGH IMPEDANCE STATUS REGISTER IN 76543210 MSB 1327 F20.0 FIGURE 19: Enable-Write-Status-Register (EWSR) or Write-Enable (WREN) and Write-Status-Register (WRSR) Sequence ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 17 32 Mbit SPI Serial Flash SST25VF032B Data Sheet Read-ID (RDID) The Read-ID instruction (RDID) identifies the device as SST25VF032B and manufacturer as SST. The device information can be read from executing an 8-bit command, 90H or ABH, followed by address bits [A23-A0]. Following the Read-ID instruction, the manufacturer’s ID is located in address 00000H and the device ID is located in address 00001H. Once the device is in Read-ID mode, the manufacturer’s and device ID output data toggles between address 00000H and 00001H until terminated by a low to high transition on CE#. Refer to Tables 6 and 7 for device identification data. CE# MODE 3 012345678 15 16 23 24 31 32 39 40 47 48 55 56 63 SCK MODE 0 SI MSB 90 or AB 00 00 ADD1 MSB SO HIGH IMPEDANCE MSB BF Device ID BF Device ID HIGH IMPEDANCE Note: The manufacturer's and device ID output stream is continuous until terminated by a low to high transition on CE#. 1. 00H will output the manfacturer's ID first and 01H will output device ID first before toggling between the two. 1327 F21.0 FIGURE 20: Read-ID Sequence TABLE 6: Product Identification Address Manufacturer’s ID Device ID SST25VF032B 00001H 4AH T6.0 1327 Data BFH 00000H ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 18 32 Mbit SPI Serial Flash SST25VF032B Data Sheet JEDEC Read-ID The JEDEC Read-ID instruction identifies the device as SST25VF032B and the manufacturer as SST. The device information can be read from executing the 8-bit command, 9FH. Following the JEDEC Read-ID instruction, the 8-bit manufacturer’s ID, BFH, is output from the device. After that, a 24-bit device ID is shifted out on the SO pin. Byte 1, BFH, identifies the manufacturer as SST. Byte 2, 25H, identifies the memory type as SPI Serial Flash. Byte 3, 4AH, identifies the device as SST25VF032B. The instruction sequence is shown in Figure 21. The JEDEC Read ID instruction is terminated by a low to high transition on CE# at any time during data output. CE# MODE 3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 SCK MODE 0 SI HIGH IMPEDANCE 9F SO BF MSB MSB 25 4A 1327 F22.0 FIGURE 21: JEDEC Read-ID Sequence TABLE 7: JEDEC Read-ID Data Manufacturer’s ID Byte1 BFH Byte 2 25H Device ID Memory Type Memory Capacity Byte 3 4AH T7.0 1327 ©2009 Silicon Storage Technology, Inc. S71327-03-000 05/09 19 32 Mbit SPI Serial Flash SST25VF032B Data Sheet ELECTRICAL SPECIFICATIONS Absolute Maximum Stress Ratings Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability. Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V Transient Voltage (