Product Guide
1204W Series Bi-Color Standard Type SMT LED
■ Features
■ Applications
• Bicolor package with 3225 (1210) footprint
• Inner lens design provides focused light beam
• Excellent for indicator backlighting and light
• pipe applications
• Mobile devices
• Computer / Telecommunications
• Industrial / Medical Instrumentation
• Audio visual equipment
■ Outline Dimensions
Unit: mm
Tolerances + 0.2
■ Electro-Optical Characteristics
Part No. Material
Emitted
Color
Lens
Color
Luminous
Intensity IV
MIN.
GaAIAs
Red (BR)
GaP
Yellow-Green (PY)
GaAIAs
Red (BR)
GaP
Green (PG)
GaAIAs
Red (BR)
GaP
Pure Green (BG)
BRPY1204W
BRPG1204W
BRBG1204W
AAPY1204W
GaAsP
Orange (AA)
GaP
Yellow-Green (PY)
Units
Water
Clear
TYP.
IF
(Ta=25°C)
Forward
Voltage V
Wavelength
Peak
λp
TYP.
Spectral Line
Dominant Half Width
λd
λ
∆λ
TYP.
TYP.
Reverse Viewing
Current IR Angle
F
IF
TYP.
MAX.
IF
MAX.
VR
(2 θ 1/2)
6.0 33.6 20
660
647
30
20
1.7
2.0
20
100
4
100°
6.0
20
570
572
30
20
2.1
2.5
20
100
4
80°
6.0 33.6 20
660
647
30
20
1.7
2.0
20
100
4
100°
3.0
20
560
567
30
20
2.1
2.5
20
100
4
80°
6.0 33.6 20
660
647
30
20
2.2
2.0
20
100
4
100°
0.9
5.0
6.0
555
605
570
558
606
572
30
30
30
20
20
20
2.1
2.2
2.1
2.5
2.5
2.5
20
20
20
100
100
100
4
4
4
80°
mA
µA
V
Deg.
24
12
4.8
9
12
mcd
20
20
20
mA
nm
mA
V
80°
80°
■ Absolute Maximum Ratings
(Ta=25°C)
YellowGreen
Red
Item
Red
Green
Pure
Green
Red
YellowGreen
Orange
Units
Symbol
BRPY
BRPG
BRBG
AAPY
Pd
75
75
75
75
mW
Forward Current
IF
30
30
30
30
mA
Peak Forward Current
IFM
70
70
70
70
mA
Reverse Voltage
VR
4
4
4
4
V
Power Dissipation
Operating Temperature
Topr
-30 to +85
°C
Storage Temperature
Tstg
-40 to +100
°C
∆IF
0.42 (DC) 0.93 (Pulse)
mA/°C
Derating*
* Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.
(0.2)
2+0.05
(φ 1.1)
Center
Hole
BRPY, BRPG, BRBG, AAPY
3.5 + 0.05
3.35
(2.8)
Quantity on tape:
2,500 pieces
per reel
(3.35)
4+0.1
φ 1.5+0.1
0
8+0.2
■ Operation Current Derating Chart (DC)
1.75 + 0.1
■ Taping Specifications
(1.7)
2+0.5
φ 21+0.8
4+0.1
Direction to pull
+1
φ 60 -0
φ 13+0.2
φ 13+0.2
9+0.3
11.4+1
+0
φ 180 3
■ Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
°C
Operation Heating
240
150
Pre-heating
~
LED Surface Temperature
■ Spatial Distribution
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
120
0
60 to 120 sec.
5 sec. max
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PG1204W-0301
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com
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