Standard Product Reference Sheet
ARGB1313HS-TR
Features
Package
Product features
3in1 Top Viewing type
Outer dimension 2.04 x 2.04 x 0.6mm ( L x W x H )
・Ultra-thin
・RGB tri-color emitting LED
・Lead–free soldering compatible
・RoHS compliant
Recommended Applications
Dot matrix Display, Cellular Phone, Home Appliances, Amusement Equipment,
Indicator, Illumination ,etc.
2014.4.23
Page : 1
Outline Dimensions
ARGB1313HS-TR
Unit
Weight
Tolerance
Pin connection／Inside circuit
：mm
：3.4mg
：±0.1
LED(2) Green
LED(3) Blue
LED(1)
Red
No.
PART NAME
MATERIALS
QTY.
：Anode
①
LED Die
AlGaInP,InGaN
3
：Cathode
②
Mold Resin
Silicone Resin
2
③
Substrate
Glass Fabrics
1
④
Electrode
Ag plating
1
Recommended Pad
Unit：mm
2014.4.23
Page : 2
ARGB1313HS-TR
Specifications
【 Product Overview 】
LED Die (1)
LED Die (2)
LED Die (3)
Material
AlGaInP
InGaN
InGaN
Emitting Color
RED
GREEN
BLUE
Lens Color
MILKY WHITE
【 Absolute Maximum Ratings 】
(Ta=25℃)
ITEM
SYMBOL
LED Die (1)
RED
LED Die (2)
GREEN
LED Die (3)
BLUE
UNITS
Power Dissipation
Pd
90
120
120
mW
Total Value of Power Dissipation
Pd
Forward Current (1 LED emitted)
IF
30
30
30
mA
IF
30
25
20
mA
IFRM
100
100
100
mA
0.750
0.750
0.750
mA/℃
0.750
0.625
0.500
mA/℃
Δ IFRM
2.5
2.5
2.5
Reverse Voltage
VR
5
5
5
Operating Temperature
Topr
－40 ～ ＋85
℃
Storage Temperature
Tstg
－40 ～ ＋100
℃
Forward Current
(2 or 3 LEDs emitted)
Repetitive Peak Forward Current
(1 LED emitted)
DC
Current Derate
(1 LED emitted)
Linearly
DC
(2 or 3 LEDs emitted)
Derate Linearly
Pulse
from 60℃
(1 LED emitted)
Notes
Δ IF
240 ※1
mW
※2
mA/℃ ※2
V
※1. All LEDs emitted , forward current should not exceed Max. Total Value of Power Dissipation.
Regarding Total Value of Power Dissipation when LED emit at 60℃ or more,
please refer to attached technical data.
※2. IFRM Conditions ： Pulse width ≦ 1ms, Duty ≦ 1/20
2014.4.23
Page : 3
ARGB1313HS-TR
Specifications
【 Electro-Optical Characteristics 】
LED Die (1) RED
(Ta=25℃)
ITEM
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS
Forward Voltage
VF
IF = 26mA
1.7
2.1
2.8
V
Reverse Current
IR
VR = 5V
－
－
50
μA
Luminous Intensity
IV
IF = 26mA
－
450
－
mcd
Dominant Wavelength
λd
IF = 26mA
－
622
－
nm
(Ta=25℃)
LED Die (2) GREEN
ITEM
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS
Forward Voltage
VF
IF = 22mA
2.7
3.2
3.8
V
Reverse Current
IR
VR = 5V
－
－
50
μA
Luminous Intensity
IV
IF = 22mA
－
850
－
mcd
Dominant Wavelength
λd
IF = 22mA
－
527
－
nm
LED Die (3) BLUE
(Ta=25℃)
ITEM
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS
Forward Voltage
VF
IF = 12mA
2.4
3.1
3.8
V
Reverse Current
IR
VR = 5V
－
－
50
μA
Luminous Intensity
IV
IF = 12mA
－
180
－
mcd
Dominant Wavelength
λd
IF = 12mA
－
473
－
nm
(Ta=25℃)
All LED emitted
ITEM
SYMBOL
Total Luminous Intensity
IV
x
Chromaticity Coordinates
y
2014.4.23
CONDITIONS
MIN.
TYP.
MAX.
UNITS
－
1,350
－
mcd
－
0.300
－
－
－
0.320
－
－
RED : IF=26mA
GREEN : IF=22mA
BLUE : IF=12mA
Page : 4
ARGB1313HS-TR
Specifications
【Sorting Chart for Chromaticity Coordinates】
Chromaticity coordinates is sorted out into the following chart.
Rank
Left Down
Left Upper
Right Upper
Right Down
ｘ
ｙ
ｘ
ｙ
ｘ
y
ｘ
ｙ
Ａ
0.240
0.330
0.240
0.380
0.290
0.390
0.290
0.340
Ｂ
0.290
0.340
0.290
0.390
0.340
0.410
0.340
0.360
Ｃ
0.340
0.360
0.340
0.410
0.390
0.420
0.390
0.370
Ｄ
0.240
0.280
0.240
0.330
0.290
0.340
0.290
0.290
Ｅ
0.290
0.290
0.290
0.340
0.340
0.360
0.340
0.310
Ｆ
0.340
0.310
0.340
0.360
0.390
0.370
0.390
0.320
Ｇ
0.240
0.230
0.240
0.280
0.290
0.290
0.290
0.240
Ｈ
0.290
0.240
0.290
0.290
0.340
0.310
0.340
0.260
Ｊ
0.340
0.260
0.340
0.310
0.390
0.320
0.390
0.270
Notes
2014.4.23
Conditions
RED
(IF=26mA)
GREEN
(IF=22mA)
BLUE
(IF=12mA)
Above table of chromaticity coordinates bins are range of actual measuring value
at the production line of STANLEY ELECTRIC. (Tolerance : ±0.02)
Page : 5
Technical Data (LED Die 1: RED)
ARGB1313HS-TR
Wavelength vs. Relative Intensity
Conditions : IF = 20mA , Ta=25℃
1.2
1.1
1.0
0.9
Relative Intensity
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
430
480
530
580
Wavelength: (nm)
630
680
730
780
Spatial Distribution
Conditions : IF = 20mA, Ta = 25℃
0
x
100
-30
30
y
-60
-90
-100
100
60
50
-50
50
0
x direction
y direction
00
50
50
100
100
90
Relative Intensity : (%)
2014.4.23
Page : 6
Technical Data (LED Die 1: RED)
ARGB1313HS-TR
Ambient Temperature vs. Forward Voltage
Forward Voltage vs. Forward Current
Condition : IF = 20mA
Condition : Ta = 25℃
100
3.0
Forward Voltage : VF (V)
Forward Current: IF (mA)
2.8
10
2.6
2.4
2.2
2.0
1.8
1.6
1
1.4
1.0
1.5
2.0
2.5
3.0
-40
-20
0
20
40
60
80
100
Forward Voltage: VF (V)
Ambient Temperature : Ta (℃)
Forward Current vs. Relative Intensity
Ambient Temperature vs. Relative Intensity
Condition : IF = 20mA
Condition : Ta = 25℃
10.0
2.0
Relative Intensity
Relative Intensity
1.5
1.0
1.0
0.5
0.1
0.0
0
2014.4.23
10
20
30
Forward Current: IF (mA)
40
-40
-20
0
20
40
60
80
100
Ambient Temperature : Ta (℃)
Page : 7
Technical Data (LED Die 1: RED)
Duty Cycle vs. Maximum Forward Current
ARGB1313HS-TR
Ambient Temperature vs. Maximum Forward Current
Repetition Frequency : f ≧ 50Hz
120
Duty=5%
Maximum Forward Current : IF MAX. (mA)
Maximum Forward Current : IF MAX. (mA)
100
10
100
Duty=10%
80
Duty=20%
60
Duty=50%
40
DC
20
0
1
1
10
Duty: (%)
-40
100
Ambient Temperature vs. Power Dissipation
10
60
Ambient Temperature : Ta (℃)
110
Pulse Width vs. Maximum Tolerable Peak Current
Condition : Ta=25℃
10
80
IF peak Max./IF DC Max. (mA)
Power Dissipation : Pd (mW)
100
60
40
20
10kHz
0
100Hz
50Hz
1
-40
10
60
Ambient Temperature : Ta (℃)
2014.4.23
1kHz
110
1
10
100
1,000
10,000
100,000
Pulse Width : tw (μsec)
Page : 8
Technical Data (LED Die 2: GREEN)
ARGB1313HS-TR
Wavelength vs. Relative Intensity
Conditions : IF = 20mA , Ta=25℃
1.2
1.1
1.0
0.9
Relative Intensity
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
430
480
530
580
630
680
730
780
Wavelength: (nm)
Spatial Distribution
Conditions : Ta = 25℃, IF=20mA
100
x
0
30
-30
y
-60
-90
-100
100
2014.4.23
60
50
-50
50
0
x direction
y direction
90
0
0
Relative Intensity : (%)
50
50
100
100
Page : 9
Technical Data (LED Die 2: GREEN)
ARGB1313HS-TR
Ambient Temperature vs. Forward Voltage
Forward Voltage vs. Forward Current
Condition : IF = 20mA
Condition : Ta = 25℃
100
4.0
Forward Voltage : VF (V)
Forward Current: IF (mA)
3.8
10
3.6
3.4
3.2
3.0
2.8
2.6
1
2.0
2.5
3.0
3.5
2.4
4.0
-40
-20
0
20
40
60
80
100
Forward Voltage: VF (V)
Ambient Temperature : Ta (℃)
Forward Current vs. Relative Intensity
Ambient Temperature vs. Relative Intensity
Condition : IF = 20mA
Condition : Ta = 25℃
10.0
2.0
Relative Intensity
Relative Intensity
1.5
1.0
1.0
0.5
0.1
0.0
0
2014.4.23
10
20
Forward Current: IF (mA)
30
40
-40
-20
0
20
40
60
80
100
Ambient Temperature : Ta (℃)
Page : 10
Technical Data (LED Die 2: GREEN)
Duty Cycle vs. Maximum Forward Current
ARGB1313HS-TR
Ambient Temperature vs. Maximum Forward Current
Repetition Frequency : f ≧ 50Hz
120
Duty=5%
Maximum Forward Current : IF MAX. (mA)
Maximum Forward Current : IF MAX. (mA)
100
10
1
100
Duty=10%
80
Duty=20%
60
Duty=50%
40
DC
20
0
1
10
Duty: (%)
100
Ambient Temperature vs. Power Dissipation
-40
-20
0
20
40
60
Ambient Temperature : Ta (℃)
80
100
Pulse Width vs. Maximum Tolerable Peak Current
Condition : Ta=25℃
10
140
100
IF peak Max./IF DC Max. (mA)
Power Dissipation : Pd (mW)
120
80
60
40
２
20
10kHz
100Hz
50Hz
1
0
-40
10
60
Ambient Temperature : Ta (℃)
2014.4.23
1kHz
110
1
10
100
1,000
10,000
100,000
Pulse Width : tw (μsec)
Page : 11
Technical Data (LED Die 3: BLUE)
ARGB1313HS-TR
Wavelength vs. Relative Intensity
Conditions : IF = 20mA , Ta=25℃
1.2
1.1
1.0
0.9
Relative Intensity
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
430
480
530
580
630
680
730
780
Wavelength: (nm)
Spatial Distribution
Condition: Ta = 25℃, IF=20mA
0
100
x
-30
30
y
-60
60
50
-90
90
0
-100
100
-50
50
x direction
y direction
00
5050
100
100
Relative Intensity : (%)
2014.4.23
Page : 12
Technical Data (LED Die 3: BLUE)
ARGB1313HS-TR
Ambient Temperature vs. Forward Voltage
Forward Voltage vs. Forward Current
Condition : IF = 20mA
Condition : Ta = 25℃
100
4.0
Forward Voltage : VF (V)
Forward Current: IF (mA)
3.8
10
3.6
3.4
3.2
3.0
2.8
2.6
2.4
1
2.0
2.5
3.0
3.5
-40
4.0
-20
0
20
40
60
80
100
Forward Voltage: VF (V)
Ambient Temperature : Ta (℃)
Forward Current vs. Relative Intensity
Ambient Temperature vs. Relative Intensity
Condition : IF = 20mA
Condition : Ta = 25℃
2.0
10.0
Relative Intensity
Relative Intensity
1.5
1.0
1.0
0.5
0.1
0.0
0
2014.4.23
10
20
Forward Current: IF (mA)
30
40
-40
-20
0
20
40
60
80
100
Ambient Temperature : Ta (℃)
Page : 13
Technical Data (LED Die 3: BLUE)
Duty Cycle vs. Maximum Forward Current
ARGB1313HS-TR
Ambient Temperature vs. Maximum Forward Current
Repetition Frequency : f ≧ 50Hz
120
Maximum Forward Current : IF MAX. (mA)
Maximum Forward Current : IF MAX. (mA)
100
10
Duty=5%
100
Duty=10%
80
Duty=20%
60
Duty=50%
40
DC
20
0
1
1
10
-40
100
-20
0
20
40
60
80
100
Duty: (%)
Ambient Temperature : Ta (℃)
Ambient Temperature vs. Power Dissipation
Pulse Width vs. Maximum Tolerable Peak Current
Condition : Ta=25℃
10
140
100
IF peak Max./IF DC Max. (mA)
Power Dissipation : Pd (mW)
120
80
60
40
２
20
10kHz
0
100Hz
50Hz
1
-40
10
60
Ambient Temperature : Ta (℃)
2014.4.23
1kHz
110
1
10
100
1,000
10,000
100,000
Pulse Width : tw (μsec)
Page : 14
Technical Data (White)
ARGB1313HS-TR
Wavelength vs. Relative Intensity
Conditions : Ta=25℃, IF = RED : 26mA , GREEN : 22mA , BLUE : 12mA
1.2
1.1
1.0
0.9
Relative Intensity
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
430
480
530
580
630
680
730
780
Wavelength: (nm)
Spatial Distribution
Conditions : Ta=25℃, IF = RED : 26mA , GREEN : 22mA , BLUE : 12mA
100
x
0
-30
30
y
-60
-90
100
-100
60
50
50
-50
0
x direction
y direction
90
00
5050
100
100
Relative Intensity : (%)
2014.4.23
Page : 15
Technical Data (White)
ARGB1313HS-TR
Ambient Temp. vs. Total Value of Power Dissipation
Ambient Temperature vs. Maximum Forward Current
【RED : 3 LED Emitting】
280
60
50
Maximum Forward Current : IF MAX. (mA)
Power Dissipation : Pd. (mW)
240
200
160
120
80
40
0
-40
10
60
Ambient Temperature: (℃)
40
DC
30
20
10
0
110
-40
-20
20
40
60
80
100
Ambient Temperature : Ta (℃)
Ambient Temperature vs. Maximum Forward Current
Ambient Temperature vs. Maximum Forward Current
【GREEN : 3 LED Emitting】
【BLUE : 3 LED Emitting】
60
60
Maximum Forward Current : IF MAX. (mA)
Maximum Forward Current : IF MAX. (mA)
0
50
40
DC
30
20
10
0
50
40
30
DC
20
10
0
-40
-20
0
20
40
60
Ambient Temperature : Ta (℃)
2014.4.23
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature : Ta (℃)
Page : 16
Soldering conditions
ARGB1313HS-TR
(acc.to EIAJ-4701/300)
【Soldering Precaution】
1.
Heat stress during soldering will influence the reliability of LEDs, however that effect will vary with
heating method. Also, if components with different shapes need to be mounted together, it is
recommended to set the soldering pad temperature according to the component most vulnerable to
heat stress (ex. SMT LED). (Recommended Condition: Soldering Pad temp. > Package temp.)
2.
LED parts including the resin are not stable immediately after soldering ( when they are not at room
temperature), any mechanical stress may cause damage to the product. Please avoid such stress after
soldering, especially stacking of the boards which may cause the boards to warp and any other types
of friction with hard materials.).
3.
Recommended temperature profile for the Reflow soldering is listed as the temperature of the resin
surface. Temperature distribution varies on heating method, PCB material, other components in the
assembly, and mounting density .
Please do not repeat the heating process in Reflow process more than twice.
【Recommended Reflow Soldering Condition.】
Peak Temperature
(Soldering）
260℃ MAX.
+1.5～+5℃/s
-1.5～-5℃/s
230℃ MAX.
90～120sec MAX.
（ Pre-heating）
150℃～180℃
40sec MAX.
Note 1 Recommended temperature profile for the reflow soldering is listed as the temperature of the resin
surface. This should be the maximum temperature for soldering. Lowering the heating temperature and
decreasing heating time is very effective in achieving higher reliability.
Note 2 The reflow soldering process should be done up to twice(2 times Max). When second process is
performed, interval between first and second process should be as short as possible to prevent absorption
of moisture to resin of LED. The second soldering process should not be done until LEDs have returned to
room temperature (by nature-cooling) after first soldering process.
2014.4.23
Page : 17
Soldering conditions
ARGB1313HS-TR
4.
If soldering manually, Stanley recommends using a soldering iron equipped with temperature control.
During the actual soldering process, make sure that the soldering iron never touches the LED itself, and
avoid the LED's electrode heating temperature reaching above the heating temperature of the solder
pad. All repairs must be performed only once in the same spot, and please avoid reusing components.
5.
In soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron
reaches the appropriate temperature, before using. Also, please avoid applying any types of pressure to
the soldered components before the solder has been cooled and hardened, as it may deteriorate solder
performance and solder quality.
【Recommended Manual Soldering Condition.】
Temperature of Iron Tip
350℃MAX.
Soldering Duration, Time
3sec.Max.,1 time
6.
When using adhesive material for tentative fixatives, thermosetting resin or Ultraviolet radiation (UV)
setting resin with heat shall be recommended. 《The curing condition,
Temperature:150℃Max./Time:120sec.Max.》
7.
Flow soldering (dip soldering) is not recommended for this product.
8.
Isopropyl alcohol is recommended for cleaning. Some chemicals, including Freon substitute detergent
could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. Please
review the reference chart below for cleaning. If water is used to clean (including the final cleaning
process), please use pure water (not tap water), and completely dry the component before using.
2014.4.23
Chemical
Adaptability
Isopropyl Alcohol
○
Trichloroethylene
×
Chlorothene
×
Acetone
×
Thinner
×
Page : 18
Handling Precaution
ARGB1313HS-TR
【 For Electric Static Discharge ( ESD) 】
This kind of LED lamp is highly sensitive to surge voltage generated by the On/Off status change and
discharges of static electricity through frictions with synthetic materials, which may cause severe damage to
the die or undermine its reliability. Damaged products may experience conditions such as extremely high
reverse voltage, or a decrease of forward rise voltage, deteriorating its optical characteristic.
Stanley products are designed to withstand up to 1,000V under the EIAJ ED-4701/300 Test ♯304 (HBM),
and are packed with anti-static components. However, the following precautions and measures are vital in
ensuring product quality during shipment.
EIAJ ED-4701/300（304/HBM） Electrification model: C=100pF, R2=1.5KΩ
1. Electrification/Static Electricity protection
Stanley recommends the following precautions in order to avoid product (die) damage from static electricity ,
when an operator and other materials electrified by friction coming in contact with the product.
①Do not place electrified non-conductive materials near the LED product.
Avoid LED products from coming into contact with metallic materials.( Should the metallic material be
electrified , the sudden surge voltage will most likely damage the product.)
②Avoid a working process which may cause the LED product to rub against other materials.
③Install ground wires for any equipment, where they can be installed, with measures to avoid static
electricity surges.
④Prepare a ESD protective area by placing a Conductive Mattress (1MΩ MAX.) and Ionizer to remove
any static electricity.
⑤Operators should wear a protective wrist-strap.
⑥Operators should wear conductive work-clothes and shoes.
⑦To handle the products directly, Stanley recommends the use of ceramic, and not metallic, tweezers.
2. Working Environment
①A dry environment is more likely to cause static electricity. Although a dry environment is ideal for
storage state of LED products, Stanley recommends an environment with approximately 50%
humidity after the soldering process.
②Recommended static electricity level in the working environment is 150V, which is the same value as
Integrated Circuits (which are sensitive to static electricity).
2014.4.23
Page : 19
Handling Precaution
ARGB1313HS-TR
【 Other Precautions 】
1.
Stanley LED Lamps have semiconductor characteristics and are designed to ensure high reliability.
However, the performance may vary depending on usage conditions
2.
Absolute Maximum Ratings are set to prevent LED lamps from failing due to excess stress( temperature,
current, voltage, etc.). Usage conditions must not exceed the ratings for a moment, nor do reach one
item of absolute maximum ratings simultaneously.
3.
In order to ensure high reliability from LED Lamps, variable factors that arise in actual usage conditions
should be taken into account for designing. ( Derating of TYP., MAX Forward Voltage, etc.)
4.
Please insert Straight Protective Resistors into the circuit in order to stabilize LED operation and to
prevent the device from igniting due to excess current.
5.
Please avoid the stick of foreign material because molding resin in the products have adhesiveness. And
please don't touch lens portion.
6.
Please check the actual performance in the assembly because the Specification Sheets are described for
LED device only.
7.
Please refrain from looking directly at the light source of LED at high output, as it may harm your vision.
8.
The products are designed to operate without failure in recommended usage conditions. However,
please take the necessary precautions to prevent fire, injury, and other damages should any malfunction
or failure arise.
9.
The products are manufactured to be used for ordinary electronic equipment. Please contact our sales
staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of
the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport
equipment, medical applications, nuclear reactor control systems and so on).
10. When there is a process of supersonic wave welding etc. after mounting the product, there is a
possibility of affecting on the reliability of junction part in package (junction part of die bonding and wire
bonding). Please make sure there is no problem before using.
11. The formal specification sheets shall be valid only by exchange of documents signed by both parties
2014.4.23
Page : 20
Handling Precautions
ARGB1313HS-TR
【 Handling Precautions for Product Mounting 】
＜Recommendation＞
1. Load : Less
than 10N
※ Please adjust the load, the pick up point, the nozzle diameter etc. before mounting,
because LED might get destroyed due to overload and improper shape of nozzle.
Please set up vacuum breaker or air blower to make sure that product being put down on
soldering pad after it being picked up by nozzle.
※ No stress should be put on lens not only by nozzle but also other instruments, tools, parts, etc..
2014.4.23
Page : 21
Packaging Specifications
ARGB1313HS-TR
This product is baked (moisture removal) before packaging, and is shipped in moisture-proof packaging (as
shown below) to minimize moisture absorption during transportation and storage. However, with regard to
storing the products, Stanley recommends the use of dry-box under the following conditions is
recommended. Moisture-proof bag as the packaging is made of anti-static material but packaging box is not.
【Recommended Storage Condition / Products Warranty Period 】
Temperature
+5～30℃
Humidity
Under 70%
In the case of the package unopened , 6 months under 【 Recommended Storage Condition 】.
Please avoid rapid transition from low temp. condition to high temp. condition
and storage in corroding and dusty environment.
【Time elapsed after Package Opening.】
The package should not be opened until immediately prior to its use, and please keep the time frame
between package opening and soldering which is 【maximum 72h】.
If the device needs to be soldered twice, both soldering operations must be completed within the 72h.
If any components should remain unused, please reseal the package and store them under the conditions
described in the 【 Recommended Storage Condition 】 above.
This product must be required to perform baking process (moisture removal) for
at 24h( MIN.). – 72h(MAX.) at 60±5 degrees Celsius if following conditions apply.
1. In the case of silica gel (blue) which indicates the moisture level within the package,
changes or loses its blue color.
2. In the case of time passes for 72h after the package is opened once.
Baking process should be performed after LED having been taken out of the package.
Baking may be performed in the tape-reel form , however if it is performed with the reel stacked over one
another, it may cause deformation of the reels and taping materials and later obstruct mounting. Please
handle only once it has returned to room temperature. Provided that, baking process shall be 2 times MAX.
※ The electrodes of this LED has been Ag plated.
Therefore, keep LED away from corrosivity gas or Ag plating will be deteriorated.
It causes quality problem (solderability, optical characteristics deterioration).
When store this product, use airtight container.
2014.4.23
Page : 22
Packaging Specifications
ARGB1313HS-TR
【 Moisture-proof Packaging Specification 】
Fastener for re-storage
after opening bag.
Customer's opening position.
A
Product Label
Heat Sealing position (after product being put in)
Desiccant with indicator for
moisture level is enclosed.
1
NO.
PART NAME
MATERIALS
REMARKS
①
Moisture-proof bag
with Aluminum layer
PET+Al+PE
with ESD
protection
【 Flow Chart-package
Opening
to Mounting
】
Flow chart：Package
Opening
to Mounting
Stored under recommended condition
Moisture-proof package first time opening
Allowable leaving time exceeded (*)
Yes
No
Discoloration of silica gel
Yes
No
Baking LED under recommended condition
Product Mounting
Allowable leaving time means the
maximum allowable leaving time after
opening package, which depends on
each LED type.
The allowable leaving time should be
calculated form the first opening of
package to the time when soldering
process is finished.
When judging if the allowable leaving
time has exceeded or not, please subtract
the soldering time. The allowable leaving
time after reopening should be calculated
form the first opening of package, or from
the time when baking process is finished.
Unused-product remained
Yes
Return to moisture-proof package and seal
No
Finished
Reopen the moisture-proof package
2014.4.23
Page : 23
Packaging Specifications
ARGB1313HS-TR
【 Packing box 】
(RoHS・ELV Compliant)
Box Type
Outline dimension
L × W × H (mm)
Capacity of the box
Type A
280 × 265 × 45 (mm)
3 reels
Type B
310 × 235 × 265 (mm)
15 reels
Type C
440 × 310 × 265 (mm)
30 reels
The above measure is all the reference value.
The box is selected out of the above table by shipping quantity.
B
②
Type A
Type B,C
Material / box ： Cardoard C5BF
2014.4.23
Material / box ： Cardoard K5BF
Partition ： Cardoard K5BF
SYM.
PART NAME
MATELRIAL
REMARKS
②
Packing Box
Corrugated
Cardboard
without ESD
protection
Page : 24
Packaging Specifications
ARGB1313HS-TR
( acc.to JIS-X0503(Code-39))
【Label Specification】
A
Product Label
A. Parts number
B. Bar-code for parts number
C. Parts code (In-house identification code for each parts number)
D. Packed parts quantity
E. Bar-Code for packed parts quantity
F. Lot number & Rank
(refer to Lot Number Notational System for details)
G. Bar-Code for Lot number & Rank
B
Opto Device Label
A. Customer Name
B. Parts Type
C. Parts Code
D. Parts Number
E. Packed Parts Quantity
F. Carton Number
G. Shipping Date
H. Bar-Code for In-house identification Number
Bar-code font : acc.to Code-39(JIX0503)
2014.4.23
Page : 25
Taping and Reel Specifications
ARGB1313HS-TR
(acc.to JIS-C0806）
【Appearance】
Note
"-TR" means Cathode Side of LEDs should be placed on the sprocket-hole side.
Items
Specifications
Remarks
Cover-tape
Cover-tape shall be longer
than 300mm without carrier-tape
The end of cover-tape shall be
held with adhesive tape.
Carrier-tape
Empty pocket shall be more than
25pieces.
Please refer to the above figure
for Taping & reel orientation.
Empty pocket shall be more than
40pieces.
The end of taping shall be
inserted into a slit of the hub.
Leader area
Trailer area
2014.4.23
Page : 26
Taping and Reel Specifications
ARGB1313HS-TR
(acc.to JIS-C0806-03）
【Qty. per Reel】
4,000 parts/reel （Note1)
Note1 Minimum Qty. per reel might be 500 parts when getting less than 4,000 parts. In such case,
parts of 500-unit-qty. shall be packed in a reel and the qty. shall be identified on the label.
【 Mechanical strength】
Cover-tape adhesive strength shall be 0.1～1.0N
( An angle between carrier-tape and cover-tape shall be170 deg. )
Both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at
a radius of 15mm.
【Others】
Reversed-orientation, Up-side down placing, side placing and out of spec. parts mix shall not be held.
Max qty. of empty pocket per reel shall be defined as follows.
2014.4.23
Qty./reel
Max. qty. of empty pocket
Remark
500
1
-
1,000
1
-
1,500
1
2,000
2
No continuance
2,500
2
No continuance
3,000
3
No continuance
3,500
3
No continuance
4,000
4
No continuance
-
Page : 27
Taping and Reel Specifications
ARGB1313HS-TR
Unit
:mm
(acc.to JIS-C0806）
【Taping Dimensions】
②
①
Center hole
Center hole
【Reel Dimensions】
2014.4.23
③
NO.
PART NAME
REMARKS
①
Carrier-tape
Anti-Static Grade
②
Cover-tape
Conductive Grade
③
Carrier-real
Anti-Static Grade
Page : 28
Lot Number Notational System
①
②
③
④
⑤
ARGB1313HS-TR
⑥
⑦
⑧
⑨
① - 1digit ： Production Location (Mark identify alphabet)
② - 1digit ： Production Year (Last digit of Production Year 2009→9,2010→0,2011→1,･･･)
③ - 2digit ： Production Month (Jan. to Sep. , should be 01,02,03,･････)
④ - 2digit ： Production Date
⑤ - 3digit ： Serial Number
⑥ - 2digit ： Tape and Reel following Number
⑦ - 2digit ： Luminous Intensity Rank.
(If luminous intensity rank is 1 digit, "-" shall be dashed on the place for the second digit.
If there is no l identified intensity rank, "- -" is used to indicate.)
⑧ - 2digit ： Chromaticity Rank
(If chromaticity rank is 1 digit, "-" shall be dashed on the place for the second digit.
If there is no identified intensity rank, "- -" is used to indicate.)
⑨ - 1digit ： Option Rank (Stanley normally print "-" to indicate)
2014.4.23
Page : 29
Correspondence to ELV ・ RoHS instruction
ARGB1313HS-TR
This product is in compliance with RoHS・ELV.
Prohibition substance and it's criteria value of RoHS・ELV are as follows.
・ELV instruction ………. Refer to following (1)～(4).
・RoHS instruction …… Refer to following (1)～(6).
2014.4.23
Substance Group Name
Criteria Value
(1)
Lead and its compounds
1,000ppm Max
(2)
Cadmium and its compounds
100ppm Max
(3)
Mercury and its compounds
1,000ppm Max
(4)
Hexavalent chromium
(5)
PBB
(6)
PBDE
1,000ppm Max
1,000ppm Max
1,000ppm Max
Page : 30
Reliability Test
ARGB1313HS-TR
Reliability Testing Result
Test Item
Applicable Standard
Test Condition
Duration
Failure
Operating Life
EIAJ ED-4701 /100(101)
Ta=25℃ IF = Maximum Rated Current
1,000h
0 / 20
High Temperature
Operating Life
EIAJ ED-4701 /100(101)
1,000h
0 / 20
Low Temperature
Operating Life
EIAJ ED-4701/100(101)
Ta = 40℃ IF = Maximum Rated Current
1,000h
0 / 20
Wet High Temperature
Operating Life
EIAJ ED-4701/100(102)
Ta = 60℃ Rh = 90% IF = Maximum Rated Current
1,000h
0 / 20
Thermal Shock
EIAJ ED-4701/100(105)
Ta = Tstg max. ～ Tstg min.
(each 15min)
200cycle
s
0 / 20
Resistance to Reflow
Soldering
EIAJ ED-4701/300(301)
Moisture Soak ： 30℃ 70% 72h
Preheating ： 150～180℃ 90～ 120sec
Soldering ： 260℃ MAX.
2 times
0 / 20
Electrostatic Discharge
(ESD)
EIAJ ED-4701/300(304)
once
each
polarity
0 / 10
Ta=85℃ IF = Maximum Rated Current
C=100pF R2=1.5kΩ ±1,000V
※1
※2
※1 Maximum Rated Current at Maximum Rated Operating Temperature
※2 Reference Test
Failure Criteria
Item
Symbol
Conditions
Failure Criteria
Luminous Intensity
IV
IF=5mA
Testing Min. Value ＜ Standard Min. Value × 0.5
Forward Voltage
VF
IF=5mA
Testing Max. Value ≧ Standard Max. Value × 1.2
Reverse Current
IR
VR=5V
Testing Max. Value ≧ Standard Max. Value × 2.5
Cosmetic appearance
-
-
Notable Discoloration, Deformation and Cracking
2014.4.23
Page : 31
ARGB1313HS-TR
Special Notice to Customers Using the Products and
Technical Information Shown in This Data Sheet
1) The technical information shown in the data sheets are limited to the typical characteristics and circuit
examples of the referenced products. It does not constitute the warranting of industrial property nor the
granting of any license.
2) For the purpose of product improvement, the specifications, characteristics and technical data described in
the data sheets are subject to change without prior notice. Therefore it is recommended that the most
updated specifications be used in your design.
3) When using the products described in the data sheets, please adhere to the maximum ratings for operating
voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any
damage which may occur if these specifications are exceeded.
4) The products that have been described to this catalog are manufactured so that they will be used for the
electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home
appliance and measuring instrument).
The application of aircrafts, space borne application, transportation equipment, medical equipment and
nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong
operation might influence the life or the human body. Please consult us beforehand if you plan to use our
product for the usages of aircrafts, space borne application, transportation equipment, medical equipment
and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV
machine, home appliance and measuring instrument.
5) In order to export the products or technologies described in this data sheet which are under the
“Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the
Japanese government.
6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley
Electric Co., Ltd.
7) The most updated edition of this data sheet can be obtained from the address below:
http://www.stanley-components.com/en/
2014.4.23
Page : 32
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