BG1112H-TR

Product Guide 1112H Series Thin Type SMT LED ■ Features ■ Applications • Meets industry standards for 2012 (0806) footprint • 2.0mm (L) x 1.25mm (W) x 0.8mm (H) • 1112H is 50% thinner than the W series. • Membrane switch panels • Backlighting • Cellular telephones ■ Outline Dimensions PCB Warpage direction Unit: mm Tolerances + 0.1 ■ Electro-Optical Characteristics Type No. Material Emitted Color Lens Color (Ta=25°C) Luminous Intensity IV MIN. TYP. Forward Voltage V Wavelength IF Peak λp TYP. Spectral Line Dominant Half Width λd λ ∆λ TYP. TYP. F IF TYP MAX. Reverse Viewing Current IR Angle IF MAX. VR BR1112H GaAIAs Red 7.0 11.7 20 660 647 30 20 1.7 2.3 20 100 4 AA1112H GaAsP Orange 2.2 3.7 20 605 606 30 20 2.2 2.8 20 100 4 AY1112H GaAsP Yellow PY1112H GaP Yellow-Green PG1112H GaP BG1112H GaP 2.2 3.7 20 580 590 30 20 2.2 2.8 20 100 4 7.0 11.7 20 570 572 30 20 2.1 2.8 20 100 4 Green 3.8 6.4 20 560 567 30 20 2.1 2.8 20 100 4 Pure Green 1.6 2.7 20 555 558 30 20 2.1 2.8 20 100 4 mA V mA µA V Units Milky White mcd mA nm (2 θ 1/2) 150° 160° Deg. ■ Absolute Maximum Ratings Red (Ta=25°C) Orange Yellow Item Yellow Green Green Pure Green Units Symbol BR AA AY PY PG BG Pd 57.5 70 70 70 70 70 mW Forward Current IF 25 25 25 25 25 25 mA Peak Forward Current IFM 60 60 60 60 60 60 mA Reverse Voltage VR 4 4 4 4 4 4 V Power Dissipation Operating Temperature Topr -30 to +85 °C Storage Temperature Tstg -40 to +100 °C ∆IF 0.36 (DC) 0.86 (Pulse) mA/°C Derating* * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. ■ Taping Specifications 4+0.1 1.75+0.1 ■ Operation Current Derating Chart (DC) φ 1.5 +0.1 0 (1.45) Quantity on tape: 4000 pieces per reel (φ 0.5) 2+0.05 2+0.5 (1) φ 21+0.8 4+0.1 φ 13+0.2 +1 φ 60 -0 φ 13+0.2 Center Hole BR, AA, AY, PY, PG, BG (2.25) 3.5+0.05 8+0.2 (0.2) Direction to pull 9+0.3 11.4+1 +0 φ 180 3 ■ Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. • Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max. • Reflow Soldering: °C Operation Heating 240 150 Pre-heating ~ LED Surface Temperature ■ Spatial Distribution Temperature rise: 5°C/sec. Cooling: —5°C/sec. 120 0 60 to 120 sec. 5 sec. max 2. Cleaning: • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PG1112H-0301 Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555 Website: www.stanley-electric.com