PS1105WA

PS1105WA Features Package Dome Lenz Type, Water clear epoxy Surface Mount Phototransistor/Dome Lenz Type Product features ・Outer Dimension 3.2 x 1.6 x 1.85mm ( L x W x H ) ・Photo Current : 8.0mA TYP. (VCE=5V,Ee=5mW/cm2) ・High Sensitivity ・Narrow Distribution ・Lead–free soldering compatible ・RoHS compliant Peak Sensitivity Wavelength Half Intensity Angle Die materials Rank grouping parameter Assembly method Soldering methods 880nm 45 deg. Si Sorted by photo current per rank taping Auto pick & place machine (Auto Mounter) Reflow soldering, and manual soldering ※Please refer to Soldering Conditions about soldering. Taping and reel ESD 2,000pcs per reel in a 8mm width tape. (Standard) Reel diameter:φ180mm 2kV (HBM) Recommended Applications Car Audio, Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications 2009.3.24 Page 1 PS1105WA Surface Mount Phototransistor/Flat Lenz Type Abs olute Maximum R atings Ite m Colle ctor Dissipa tion Colle ctor-E mitte r Volta g e E mitte r-Colle ctor Volta g e Colle ctor Curre nt Ope ra ting T e mpe ra ture S tora g e Te mpe ra ture S ymbol Abs olute Max imum Ratings (Ta=25℃) Unit mW V V mA ℃ ℃ Pc V CE O V E CO Ic T opr T s tg 75 30 5 20 -30～ +85 -40～ +90 E lectro- Optical Characteris tics Ite m S ymbol Cha ra cte ristics Min. P hoto Curre nt V CE =5V, E e =5mW/cm 2 ※1 (Ta=25℃) Conditions Unit mA mA mA 1.6 8 19 Ic T YP . Ma x . Re sponse T ime V C E =10V, Ic=2mA, R L =100Ω V CE O=10V V C E =5V V C E =5V tr/tf T YP . 8/9 μs Da rk Curre nt P e a k S e nsitivity Wa ve le ng th S pa tia l Ha lf Width IC E O λp ⊿θ Ma x . T YP . T YP . 0.1 880 45 μA nm de g. ※ 1 Color te mpe ra ture is 2,856K. E mploys a sta nda rd tungste n la mp. 2009.3.24 Page 2 PS1105WA Surface Mount Phototransistor/Flat Lenz Type Photo Current Rank Ic(mA) R ank MIN. A B C D E 1.6 2.8 4.8 8.4 14.4 MAX . 3.2 5.6 9.6 16.8 19.0 V CE = 5V E e = 5mW/cm 2 (Ta=25℃) Condition ※Please contact our sales staff concerning rank designation. 2009.3.24 Page 3 PS1105WA Surface Mount Phototransistor/Flat Lenz Type Technical Data Wavelength vs. Relative Sensitivity Condition : Ta = 25℃, Vce = 0V Spatial Distribution Example Condition : Ta = 25℃ Relative Sensitivity (%) Wavelength [nm] Relative Photo Current (%) Irradiance vs. Relative Photo Current Condition : Ta = 25℃, Vce = 5V Collector-Emitter Voltage vs. Photo Current Condition : Ta = 25℃ Relative Photo Current Ic Irradiance Ee(mW/cm2) It is based on Ee=5mW/cm2. Employs a standard tungsten lamp of 2,856K. Photo Current Ic (mA) Collector-Emitter Voltage VCE(V) Employs a standard tungsten lamp of 2,856K. 2009.3.24 Page 4 PS1105WA Surface Mount Phototransistor/Flat Lenz Type Technical Data Response Time Measuring Circuit Ambient Temperature vs. Relative Photo Current Condition : VCE=10V, Ic=2mA, Ta=25℃ Response Time (μs) Load Resistance : RL(Ω) Ambient Temperature vs. Collector Dissipation Ambient Temperature vs. Dark Current Condition : VCEO = 10V Collector Dissipation : Pc(mW) Ambient Temperature : Ta(℃) Dark Current : ICEO(μA) Ambient Temperature : Ta(℃) 2009.3.24 Page 5 PS1105WA Surface Mount Phototransistor/Flat Lenz Type Technical Data Ambient Temperature vs. Relative Photo Current Condition : VCE = 5V Relative Photo Current Ambient Temperature : Ta(℃) 2009.3.24 Page 6 PS1105WA Surface Mount Phototransistor/Flat Lenz Type Package Dimensions (Unit: mm) Weight: (7.80)mg Recommended Soldering Pattern (Unit: mm) Taping Specification Quantity: 2,000pcs/ reel (standard) (Unit: mm) 2009.3.24 Page 7 PS1105WA Surface Mount Phototransistor/Flat Lenz Type Reflow Soldering Conditions 1) The above profile temperature gives the maximum temperature of the device resin surface. Please set the temperature so as to avoid exceeding this range. 2) Total times of reflow soldering process shall be no more than 2 times. When the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the device from absorbing moisture. 3) Temperature fluctuation to the device during the pre-heating process shall be minimized. Manual Soldering Conditions Iron tip temp. Soldering time and frequency 350 ℃ 3s 1 time (MAX.) (30 W Max.) (MAX.) (MAX.) 2009.3.24 Page 8 PS1105WA Surface Mount Phototransistor/Flat Lenz Type Reliability Testing Result Reliability Testing Result Room Temp. Operating Life Applicable Standard EIAJ ED4701/100(101) Testing Conditions Ta = 25℃, Pc = Maxium Rated Power Dissipation (Pretreatment) Individual standard (Reflow Soldering) Pre-heating 150℃～180 ℃ 1 20s Operating Heating 230℃ Min. Peak temperature 260℃ Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) Ta = 60±2 ℃, RH = 90±5% Ta = Maximum Rated Storage Temperature Ta = Minimum Rated Storage Temperature 98.1m/s ( 10G), 100 ～ 2 KHz sweep for 20min., XYZ each direction 2 Duration 1,000 h Failure 0/16 Resistance to Soldering Heat EIAJ ED4701/300(301) Twice 0/16 Temperature Cycling Wet High Temp. Storage Life High Temp. Storage Life Low Temp. Storage Life Vibration, Variable Frequency EIAJ ED4701/100(105) EIAJ ED4701/100(103) EIAJ ED4701/200(201) EIAJ ED4701/200(202) EIAJ ED4701/400(403) 5 cycles 0/16 1,000 h 1,000 h 1,000 h 2h 0/16 0/16 0/16 0/16 Failure Criteria Items Symbols Conditions EE Value of each product Irradiance of Photo Current VCE Value of each product Collector-emitter Voltage of Photo Current VCEO Value of each product Collector-emitter Voltage of Dark Current - Failure criteria Photo Current IC Testing Max. Value ≧Initial Value x 1.3 Testing Min. Value ≦ Initial Value x 0.7 Dark Current Cosmetic Appearance ICEO - Testing Max. Value ≧ Spec. Max. Value x 1.2 Occurrence of notable decoloration, deformation and cracking 2009.3.24 Page 9 PS1105WA Surface Mount Phototransistor/Flat Lenz Type Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2009.3.24 Page 10