VFHY1111C-3BX2D-TR

Standard Product Specifications VFHY1111C-3BX2D-TR Features Package 1608 (h=0.7mm) Type, diffused resin Product features ・Outer Dimension 1.6 x 0.8 x 0.7mm ( L x W x H ) ・Lead–free soldering compatible ・RoHS compliant ・Corresponds to JEDEC/IPC J-STD-020 MSL 3 ・As for this product, the part number listed in the catalog had been changed because of renewed narrower spec. (VFHY1111C-TR → VFHY1111C-3BX2D-TR) Recommended Applications ・Light source of indicator for Automotive, cluster meter, car audio and HVAC, etc. 2012.12.28 Page : 1 VFHY1111C-3BX2D-TR Outline Dimensions Unit Weight Tolerance SYMBOL PART NAME MATERIAL QTY. ① LED Die AlGaInP 1 ② Lens Epoxy Resin 1 ③ Substrate Glass Fabrics 1 ：mm ：1.40mg ：±0.1 Recommended Pad Unit：mm 2012.12.28 Page : 2 VFHY1111C-3BX2D-TR Specifications 【 Product Overview 】 Die Material AlGaInP Emitting Color Yellow Resin Color 【Emitting Area】 Milky White 【 ABSOLUTE MAXIMUM RATINGS 】 (Ta=25℃) ITEM SYMBOL MAXIMUM RATINGS UNITS Power Dissipation Pd 78 mW Continuous Forward Current IF 30 mA Repetitive Peak Forward Current 【Pulse Width 1ms, Duty 1/20】 IFRM 100 mA IFDerate Linearly【 from Ta=75℃ 】 Δ IF 1.00 mA/℃ IFRMDerate Linearly【 from Ta=75℃ 】 Δ IFRM 3.33 mA/℃ Reverse Voltage VR 5 V Operating Temperature Topr -40 ～ +100 ℃ Storage Temperature Tstg -40 ～ +105 ℃ Electrostatic Discharge Threshold　"HBM" ESD 1,000 V Note1 Soldering　Temperature "Reflow Soldering" Tsld 260 ℃ Note2 Note 1 ESD testing method : EIAJ4701/300(304) Human Body Model(HBM)　1.5kΩ ,100pF Note 2 Please refer to page 8, Soldering Conditions. 【 Thermal characteristics 】 (Ta=25℃) ITEMS SYMBOL TYP. MAX. UNITS Thermal resistance 【Junction－Ambient temp.】 Rth(j-a) 550 － ℃/W Thermal resistance 【Junction－solder point】 Rth(j-s) 350 － ℃/W Junction temp. Tj － 105 ℃ Note3 Note3 Rth(j-a) condition ・PCB：FR4（t=1.6mm) ・Pad size：16m㎡ 2012.12.28 Page : 3 VFHY1111C-3BX2D-TR Specifications 【 Electrical and Optical Characteristics 】 (Ta=25℃) ITEMS SYMBOL CONDITIONS MIN. TYP. MAX. UNITS Forward Voltage VF IF = 20mA - 1.9 2.4 V Reverse Current IR VR = 5V - - 10 μ A Luminous Intensity IV IF = 20mA 56 75 100 mcd V IF = 20mA - 300 - mlm Peak Wavelength λ p IF = 20mA - 592 - nm Dominant Wavelength λ d IF = 20mA 586 590 592 nm Spectral Line Half Width Δλ IF = 20mA - 15 - nm Half Intensity Angle 2θ 1/2 IF = 20mA - 140 - deg. φ Luminous Flux Note Above Luminous Intensity (IV) values and Dominant Wavelength (λ d) values are the setup value of the selection machine． 【Tolerance ： IV ±10%、λ d ±1nm】 【 Sorting For Luminous Intensity and Dominant Wavelength 】 LEDs shall be sorted out into the following ranks of Luminous Intensity and Dominant Wavelength. Luminous Intensity (Iv) Rank RANK IV (mcd) MIN. MAX. BX 56 68 BY 68 82 BZ 82 100 Dominant Wavelength (λ d) Rank CONDITIONS IF =20mA Ta=25℃ RANK λ d (nm) MIN. MAX. D 586 589 E 589 592 CONDITIONS IF =20mA Ta=25℃ Notes Above Luminous Intensity (IV) values and Dominant Wavelength (λd) values are the setup value of the selection machine. 【Tolerance : IV…±10%, λd…±1nm】 2012.12.28 Page : 4 Technical Data VFHY1111C-3BX2D-TR Relative Intensity vs. Wavelength Conditions : Ta = 25℃, IF = 20mA 1.2 1.1 Relative Intensity 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 480 580 680 780 Wavelength : (nm) Spatial Distribution Example Conditions: Ta = 25℃, IF=20mA 10 0 100 10 X-direction Y-direction 20 20 90 30 x 80 40 y 30 ―― ｘ Direction - - - ｙ Direction 40 70 50 50 60 60 60 50 40 70 70 30 20 80 80 10 0 90 -100 -80 -60 -40 -20 90 0 20 40 60 80 100 Relative radiant intensity : (%) 2012.12.28 Page : 5 VFHY1111C-3BX2D-TR Technical Data Ambient temp. vs Forward Voltage Forward Voltage vs. Forward Current Condition : IF = 2 to 30mA Condition : Ta= -20℃～85℃ 100 2.2 2.0 -20℃ 85℃ Forward Voltage VF(V) Forward Current IF(mA) 2.1 60℃ 25℃ 0℃ 10 1.9 IF=30mA IF=20mA 1.8 IF=10mA IF=5mA IF=2mA 1.7 1.6 1.5 -40 -20 1 1.6 1.7 1.8 1.9 2.0 0 20 40 60 80 100 120 2.1 Ambient temp.:Ta (℃) Forward Voltage: VF(V) Forward Current vs. Relative Intensity Ambient temp. vs Relative Intensity Condition : Ta = 25℃ Condition : IF = 20mA 10.0 1.4 1.0 Relative Intensity Relative Intensity 1.2 0.8 CI 0.6 1.0 0.4 0.2 0.1 0.0 0 5 10 15 20 Forward Current : IF(mA) 2012.12.28 25 30 -40 -20 0 20 40 60 80 100 Ambient temp.:Ta (℃) Page : 6 VFHY1111C-3BX2D-TR Forward Current vs. Dominant Wavelength Ambient Temperature vs. Dominant Wavelength Condition: Ta = 25℃ Condition: IF = 20mA 592 596 591 594 Dominant Wavelength : λd (nm) Dominant Wavelength : λd (nm) Technical Data 590 589 588 587 592 590 588 586 584 586 0 5 10 15 20 25 582 30 -40 -20 0 20 40 60 80 100 Ambient Temperature: Ta (℃) Forward Current: IF (mA) CI Ambient Temperature vs. Max. Forward Current Repetition Frequency: f ≧ 50Hz Duty=5% 80 Duty=10% 60 Duty=20% Duty=50% 40 Condition: Ta = 25℃ Maximum Forward Current : IFMAX. (mA) Maximum Forward Current : IFMAX. (mA) 120 100 Duty Cycle vs. Max. Forward Current Pulse width: tw≦1ms DC 20 0 100 10 1 -40 -20 0 20 40 60 Ambient Temperature: Ta (℃) 2012.12.28 80 100 1 10 100 Duty cycle: (%) Page : 7 Soldering condition VFHY1111C-3BX2D-TR 【Soldering Precaution】 (acc.to EIAJ-4701/300) 1. Heat stress during soldering will influence the reliability of LEDs, however that effect will vary on heating method. Also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount LED). 2. LED parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. Please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials. 3. Recommended temperature profile for the Reflow soldering is listed as the temperature of the resin surface. Temperature distribution varies on heating method, PCB material, other components in the assembly, and mounting density. Please do not repeat the heating process in Reflow process more than twice. 【Recommended Reflow Soldering Condition】 Peak Temperature (Soldering） 260℃ MAX. +1.5～+5℃/s -1.5～-5℃/s 230℃ MAX. 90~120sec MAX. （ Pre-heating） 150℃～180℃ 40sec MAX. Note 1 Recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. This should be the maximum temperature for soldering. Lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability. Note 2 The reflow soldering process should be done up to twice(2 times Max). When second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of LED. The second soldering process should not be done until LEDs have returned to room temperature (by nature-cooling) after first soldering process. 2014/7/16 Page : 8 Soldering condition VFHY1111C-3BX2D-TR 4. If soldering manually, Stanley recommends using a soldering iron equipped with temperature control. During the actual soldering process, make sure that the soldering iron never touch the LED itself, and avoid the LED's electrode heating temperature reaching above the heating temperature of the solder pad. All repairs must be performed only once in the same spot, and please avoid reusing components. 5. In soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature before using. Also, please avoid applying any type of pressure to the soldered components before the solder has been cooled and hardened, as it may deteriorate solder performance and solder quality. 【Recommended Manual Soldering Condition】 Temperature of Iron Tip 350℃MAX. Soldering Duration, Time 3sec.Max.,1 time 6. When using adhesive material for tentative fixatives, thermosetting resin or Ultraviolet radiation (UV) setting resin with heat shall be recommended. 《The curing condition, Temperature:150℃Max./Time:120sec.Max.》 7. Flow soldering (dip soldering) is not recommended for this product. 8. lsopropyl alcohol is recommended for cleaning. Some chemicals, including Freon substitute detergent could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. Please review the reference chart below for cleaning. If water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the component before using. 2014/7/16 Chemical Adaptability Isopropyl Alcohol ○ Trichloroethylene × Chlorothene × Acetone × Thinner × Page : 9 Handling Precaution VFHY1111C-3BX2D-TR 【 Other Precautions 】 1. Stanley LED Lamps have semiconductor characteristics and are designed to ensure high reliability. However, the performance may vary depending on usage conditions 2. Absolute Maximum Ratings are set to prevent LED lamps from failing due to excess stress( temperature, current, voltage, etc.). Usage conditions must not exceed the ratings for a moment, nor do reach one item of absolute maximum ratings simultaneously. 3. In order to ensure high reliability from LED Lamps, variable factors that arise in actual usage conditions should be taken into account for designing. ( Derating of TYP., MAX Forward Voltage, etc.) 4. Please insert Protective Resistors into the circuit in order to stabilize LED operation and to prevent the device from igniting due to excess current. 5. Please avoid the stick of foreign material because molding resin in the products have adhesiveness. Also please don't touch lens portion. 6. Please check the actual performance in the assembly because the Specification Sheets are described for LED device only. 7. Please refrain from looking directly at the light source of LED at high output, as it may harm your vision. 8. The products are designed to operate without failure in recommended usage conditions. However, please take the necessary precautions to prevent fire, injury, and other damages should any malfunction or failure arise. 9. The products are manufactured to be used for ordinary electronic equipment. Please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on). 10. When there is a process of supersonic wave welding etc. after mounting the product, there is a possibility of affecting on the reliability of junction part in package (junction part of die bonding and wire bonding). Please make sure there is no problem before using. 11. The formal specification sheets shall be valid only by exchange of documents signed by both parties. 2014/7/16 Page : 10 Packaging Specifications VFHY1111C-3BX2D-TR This product is baked (moisture removal) before packaging, and is shipped in moisture-proof packaging (as shown below) to minimize moisture absorption during transportation and storage. However, with regard to storing the products, Stanley recommends the use of dry-box under the following conditions is recommended. Moisture-proof bag as the packaging is made of anti-static material but packaging box is not. 【Recommended Storage Condition / Products Warranty Period 】 Temperature +5～30℃ Humidity Under 70% In the case of the package unopened , 6 months under 【 Recommended Storage Condition 】. Please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. 【Time elapsed after Package Opening】 The package should not be opened until immediately prior to its use, and please keep the time frame between package opening and soldering as is 【maximum 1week(168h)】. If the device needs to be soldered twice, both soldering operations must be completed within the 4weeks(672h). If any components should remain unused, please reseal the package and store them under the conditions described in the 【 Recommended Storage Condition 】 above. This product must be required to perform baking process (moisture removal) for at 10h( MIN.).∼12h(MAX.) at 60±5 degrees Celsius if following conditions apply. 1.In the case of silica gel (blue) which indicates the moisture level within the package, changes or loses its blue color. 2. In the case of time passes for 1week(168h) after the package is opened once. Baking process should be performed after LED having been taken out of the package. Baking may be performed in the tape-reel form , however if it is performed with the reel stacked over one another, it may cause deformation of the reels and taping materials and later obstruct mounting. Please handle only once it has returned to room temperature. Provided that, baking process shall be 2 times MAX. 2014/7/16 Page : 11 Packaging Specification VFHY1111C-3BX2D-TR 【Moisture-proof Packaging Specification】 Fastener for re-storage after opening bag ① Customer's opening position A Product Label Heat Sealing position (after product being put in) (Desiccant with indicator for moisture level is enclosed.) SYM. PART NAME MATELRIAL REMARKS ① Moisture-proof bag with Aluminum layer PET+Al+PE with ESD protection 【Flow Chart-package OpeningOpening to Mounting】 Flow chart：Package to Mounting Stored under recommended condition Moisture-proof package first time opening Allowable leaving time exceeded (*) Yes No Discoloration of silica gel Yes No Baking LED under recommended condition Product Mounting Allowable leaving time means the maximum allowable leaving time after opening package, which depends on each LED type. The allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. When judging if the allowable leaving time has exceeded or not, please subtract the soldering time. The allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. Unused-product remained Yes Return to moisture-proof package and seal No Finished Reopen the moisture-proof package 2014/7/16 Page : 12 Packaging Specifications VFHY1111C-3BX2D-TR 【 Packing box 】 ( RoHS・ELV Compliant) Box Type Outline dimension L × W × H (mm) Capacity of the box Type A 280 × 265 × 45 (mm) 3 reels Type B 310 × 235 × 265 (mm) 15 reels Type C 440 × 310 × 265 (mm) 30 reels The above measure is all the reference value. The box is selected out of the above table by shipping quantity. B Type A Material / box ： Cardboard C5BF 2014/7/16 Type B,C Material / box ： Cardboard K5AF Partition ： Cardboard K5AF Page : 13 Packaging Specifications VFHY1111C-3BX2D-TR 【 Label Specification】 ( acc.to JIS-X0503(Code-39) A Product label A. Parts number B. Bar-code for parts number C. Parts code (In-house identification code for each parts number) D. Packed parts quantity E. Bar-Code for packed parts quantity F. Lot number & Rank (refer to Lot Number Notational System for details ) G. Bar-Code for Lot number & Rank B Opto device label A. Customer Name B. Parts Type C. Parts Code D. Parts Number E. Packed Parts Quantity F. Carton Number G. Shipping Date H. Bar-Code for In-house identification Number Bar-code font : acc.to Code-39(JIX0503) 2014/7/16 Page : 14 Taping and Reel Specifications VFHY1111C-3BX2D-TR (acc.to JIS-C0806-03） 【Appearance】 Direction to take out Note "-TR" means cathode side of LEDs should be placed on the sprocket-hole side. Items Cover-tape Specifications Remarks Cover-tape shall be longer than 320mm without carrier-tape The end of cover-tape shall be held with adhesive tape. Empty pocket shall be more than 20 pieces. Please refer to the above figure for Taping & reel orientation . Empty pocket shall be more than 15 pieces. The end of taping shall be inserted into a slit of the hub. Leader area Carrier-tape Trailer area 2014/7/16 Page : 15 Taping and Reel Specifications VFHY1111C-3BX2D-TR (acc.to JIS-C0806-03） 【 Qty. per Reel】 4,000parts/reel Minimum Qty. per reel might be 500 parts when getting less than 4,000 parts. In such case, parts of 500-unit-qty. shall be packed in a reel and the qty. shall be identified on the label. 【 Mechanical strength】 Cover-tape adhesive strength shall be 0.1～1.0N ( An angle between carrier-tape and cover-tape shall be170 deg. ) Both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. 【 Others】 Reversed-orientation, Up-side down placing, side placing and out of spec. parts mixing shall not be held. Max. qty. of empty pocket per reel shall be defined as follows. 2014/7/16 Qty./reel Max. qty. of empty pocket Remaks a500 1 - 1,000 1 - 1,500 1 - 2,000 2 No continuance 2,500 2 No continuance 3,000 3 No continuance 3,500 3 No continuance 4,000 4 No continuance Page : 16 Taping and Reel Specifications VFHY1111C-3BX2D-TR Unit ：mm (acc.to JIS-C0806-03） 【Taping Dimensions】 1 2 【Reel Dimensions】 3 2014/7/16 SYM. PART NAME REMARKS ① Carrier-tape without ESD protection ② Cover-tape without ESD protection ③ Carrier-reel with ESD protection Page : 17 Lot Number Notational System ① ② ③ ④ VFHY1111C-3BX2D-TR ⑤ ⑥ ⑦ ⑧ ⑨ ① - 1digit ： Production Location (Mark identify alphabet) ② - 1digit ： Production Year (Last digit of Production Year 2009→9,2010→0,2011→1,･･･) ③ - 2digits ： Production Month (Jan. to Sep. , should be 01,02,03,･････) ④ - 2digits ： Production Date ⑤ - 3digits ： Serial Number ⑥ - 2digits ： Tape and Reel following Number ⑦ - 2digits ： Luminous Intensity Rank. (If luminous intensity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑧ - 2digits ： Chromaticity Rank (If chromaticity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑨ - 1digit ： Option Rank (Stanley normally print "-" to indicate) 2014/7/16 Page : 18 Correspondence to RoHS・ELV instruction VFHY1111C-3BX2D-TR This product is in compliance with RoHS・ELV. Prohibition substance and it's criteria value of RoHS・ELV are as follows. ・RoHS instruction …… Refer to following (1)～(6). ・ELV instruction ………. Refer to following (1)～(4). 2014/7/16 Substance Group Name Criteria Value (1) Lead and its compounds 1,000ppm Max (2) Cadmium and its compounds 100ppm Max (3) Mercury and its compounds 1,000ppm Max (4) Hexavalent chromium 1,000ppm Max (5) PBB 1,000ppm Max (6) PBDE 1,000ppm Max Page : 19 Reliability Testing Result VFHY1111C-3BX2D-TR 1. Reliability Testing Result Reliability Testing Result Applicable Standard Room Temp. Operating Life EIAJ ED4701/100(101) Resistance to Soldering Heat EIAJ ED4701/300(301) Temperature Cycling EIAJ ED4701/100(105) Wet High Temp. Storage Life EIAJ ED4701/100(103) High Temp. Storage Life EIAJ ED4701/200(201) Low Temp. Storage Life Vibration, Variable Frequency EIAJ ED4701/200(202) EIAJ ED4701/400(403) Testing Conditions Duration Ta = 25℃, IF = Maxium Rated Current Failure 1,000 h 0/25 Twice 0/25 5 cycles 0/25 Ta = 60±2℃, RH = 90±5% 1,000 h 0/25 Ta = Maximum Rated Storage Temperature 1,000 h 0/25 Ta = Minimum Rated Storage Temperature 1,000 h 0/25 2h 0/10 Pre-heating : 150～180℃ 120s Max. Operation Heating : 230℃ 40s Max. Peak Temperature : 260℃ Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) 98.1m/s 2 (10G), 100 ～ 2KHz sweep for 20min., XYZ each direction 2. Failure Criteria Items Symbols Conditions Failure criteria Luminous Intensity Iv IF Value of each product Luminous Intensity Testing Min. Value ＜ Spec. Min. Value x 0.5 Forward Voltage VF Reverse Current IR Cosmetic Appearance - 2014/7/16 IF Value of each product Forward Voltage VR = Maximum Rated Reverse Voltage V - Testing Max. Value ≧ Spec. Max. Value x 1.2 Testing Max. Value ≧ Spec. Max. Value x 2.5 Occurrence of notable decoloration, deformation and cracking Page : 20 VFHY1111C-3BX2D-TR Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com/en/ 2014/7/16 Page : 21