VTPS1192HB

Standard Product Reference Sheet VTPS1192HB-TR Features Package Flat lens package, Photo transistor (Photo detector), Visible ray cut resin Outer Dimension 2.0 x 1.25 x 0.8mm ( L x W x H ) Product features ・Equivalent to JEDEC level 3 (IPC/JEDEC J-STD-020D) ・Lead–free soldering compatible ・RoHS compliant Recommended Applications ・Media disc detector for car audio, etc. 2014.9.26 Page : 1 Outline Dimensions VTPS1192HB-TR Unit :mm Weight :2.84mg Tolerance :±0.1 NO. PART NAME MATERIAL QTY. ① Photo Transistor Si 1 ② Mold Resin Epoxy Resin 1 ③ Substrate Glass Fabrics 1 Recommended Pad Unit :mm 2014.9.26 Page : 2 VTPS1192HB-TR Specifications 【 Absolute Maximum Ratings 】 (Ta=25℃) ITEM SYMBOL MAXIMUM RATINGS UNIT Power Dissipation Pc 75 mW Collector-Emitter Voltage VCEO 12 V Emitter-Collector Voltage VECO 5 V Collector Current Ic 20 mA Operating Temperature Topr -40 ～ +85 ℃ Storage Temperature Tstg -40 ～ +100 ℃ 【 Electro-Optical Characteristics 】 (Ta=25℃) ITEM SYMBOL CONDITIONS MIN. TYP. MAX. UNIT Dark Current ICEO VCEO = 10V - - 0.1 μA Photo Current Ic 0.45 1.30 2.27 mA Peak Wavelength λ p - 900 - nm Collector-Emitter saturation voltage Vce(Sat) - 0.10 - V VCE = 5V, ※1　Ee = 5mW/cm 2 VCE = 5V IC = 0.5mA, ※1　Ee = 10mW/cm 2 Rise Time tr ※2　VCE = 10V, - 1.8 - μｓ Fall Time tf Ic = 2mA, RL = 100Ω - 2.6 - μｓ Δθ Longitudinal direction - 130 - deg. Angle of half sensitivity Lterarl direction - 120 - deg. Response Time ※1 The illuminances refer unfiltered radiation of a tungsten filament lamp at a color temperature of 2,856K. ※2 Response time test circuit : as follows 2014.9.26 Page : 3 VTPS1192HB-TR Specifications 【 Sorting for Photo current 】 Photo Transistors shall be sorted out into the following ranks. The each shipping lot shall consist of mixed ranks (VA to VG), and the quantity of this product in each rank can not be specified. Rank 2014.9.26 Photo Current Ic（ｍA) MIN. MAX. VA 0.45 0.57 VB 0.57 0.71 VC 0.71 0.90 VD 0.90 1.13 VE 1.13 1.43 VF 1.43 1.80 VG 1.80 2.27 Conditions VCE=5V Ee=5mW/c㎡ Ta=25℃ Page : 4 VTPS1192HB-TR Technical Data Wavelength vs. Relative Sensitivity Condition: VCR=5V, Ta = 25℃ 1.2 Relative Sensitivity 1.0 0.8 0.6 0.4 0.2 0.0 400 500 600 700 Wavelength: (nm) 800 900 1,000 1,100 Spatial Distribution Condition: Vce = 5V, Ta = 25℃ x 0 100 -30 y 30 ｘ direction ｙ direction -60 -90 100 -100 50 60 -50 0 50 0 50 50 90 100 100 Relative Photo Current : (%) 2014.9.26 Page : 5 VTPS1192HB-TR Technical Data Radiation Luminance vs. Relative Photo Current Collector-Emitter Voltage vs. Photo Current Condition : Vce=5V Condition: Ta=25℃ 10 ・Criterion : Ee=5mW/cm2 ・Using standard tungsten lamp Color temp.:2,856K Photo Current Ic (mA) Relative Photo Current 10 1 1 0.1 10mW/cm2 5mW/cm2 3mW/cm2 1mW/cm2 ・Using standard tungsten lamp Color temp.:2,856K 0.01 0.1 1 0 10 5 10 Radiation Luminance : Ee (mW/c㎡) Collector - Emitter Voltage : Vce (V) Ambient Temperature vs. Relative Photo Current Ambient Temperature vs. Collector Dissipation Condition : Vce=5V 10 80 Collector Dissipation : Pc (mW) Relative Photo Current 70 1 60 50 40 30 20 10 0 0.1 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Ambient Temperature : Ta (℃) 2014.9.26 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Ambient Temperature : Ta (℃) Page : 6 Technical Data VTPS1192HB-TR Ambient Temperature vs. Dark Current Condition : Vceo=10V 1.E+02 Dark Current : Iceo (μA) 1.E+01 1.E+00 1.E-01 1.E-02 1.E-03 1.E-04 1.E-05 1.E-06 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Ambient Temperature Ta(℃) 2014.9.26 Page : 7 Soldering condition VTPS1192HB-TR 【Soldering Precaution】 (acc.to EIAJ-4701/300) 1. Heat stress during soldering will influence the reliability of Photo detectors, however that effect will vary on heating method. Also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount device). 2. Photo detector parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. Please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials. 3. Recommended temperature profile for the Reflow soldering is listed as the temperature of the resin surface. Temperature distribution varies on heating method, PCB material, other components in the assembly, and mounting density . Please do not repeat the heating process in Reflow process more than twice. 【Recommended Reflow Soldering Conditio 】 Peak Temperature (Soldering） 260℃ MAX. +1.5～+5℃/s -1.5～-5℃/s 230℃ MAX. 120sec MAX. （ Pre-heating） 150℃～180℃ 40sec MAX. Note 1 Temperature Profile for the reflow should be set to the surface temperature of resin which is on the top of Photo detector. This should be the maximum temperature for soldering. Lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability. Note 2 The reflow soldering process should be done up to twice(2 times Max). When second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of Photo detector. The second soldering process should not be done until Photo detectors have returned to room temperature (by nature-cooling) after first soldering process. 2014.9.26 Page 8 Soldering condition VTPS1192HB-TR 4. If soldering manually, Stanley recommends using a soldering iron equipped with temperature control. During the actual soldering process, make sure that the soldering iron never touches the Photo detector itself, and avoid the Photo detector's electrode heating temperature reaching above the heating temperature of the solder pad. All repairs must be performed only once in the same spot, and please avoid reusing components. 5. In soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature, before using. Also, please avoid applying any types of pressure to the soldered components before the solder has been cooPhoto detector and hardened, as it may deteriorate solder performance and solder quality. 【Recommended Manual Soldering Condition】 Temperature of Iron Tip 350℃MAX. Soldering Duration, Time 3sec.Max.,1 time 6. When using adhesive material for tentative fixatives, thermosetting resin or Ultraviolet radiation (UV) setting resin with heat shall be recommended. 《The curing condition, Temperature:150℃Max./Time:120sec.Max.》 7. Isopropyl alcohol is recommended for cleaning. Some chemicals, including Freon substitute detergent could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. Please review the reference chart below for cleaning. If water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the component before using. Chemical Adaptability 2014.9.26 Ethyl Alcohol ○ Isopropyl Alcohol ○ Pure Water ○ Trichloroethylene × Chlorothene × Acetone × Thinner × Page 9 Handling Precaution VTPS1192HB-TR 【Other Precautions】 1. This product has semiconductor characteristics and are designed to ensure high reliability. However, the performance may vary depending on usage conditions. 2. Absolute Maximum Ratings are set to prevent Photo detector from failing due to excess stress( temperature, current, voltage, etc.). Usage conditions must not exceed the ratings for a moment, nor do reach one item of absolute maximum ratings simultaneously. 3. In order to ensure high reliability from Photo detector, variable factors that arise in actual usage conditions should be taken it to account for designing. ( Derating of TYP., MAX Forward Voltage, etc.) 4. Please insert Protective Resistors into the circuit in order to stabilize Photo detector operation and to prevent the device from igniting due to excess current. 5. Please check the actual performance in the assembly because the Specification Sheets are described for Photo detector device only. 6. Please refrain from looking directly at the light source of Photo detector at high output, as it may harm your vision. 7. The products are designed to operate without failure in recommended usage conditions. However, please take the necessary precautions to prevent fire, injury, and other damages should any malfunction or failure arise. 8. The products are manufactured to be used for ordinary electronic equipment. Please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on). 9. The formal specification sheets shall be valid only by exchange of documents signed by both parties. 2014.9.26 Page 10 Packaging Specifications VTPS1192HB-TR This product is baked (moisture removal) before packaging, and is shipped in moisture-proof packaging (as shown below) to minimize moisture absorption during transportation and storage. However, with regard to storing the products, Stanley recommends the use of dry-box under the following conditions is recommended. Moisture-proof bag as the packaging is made of anti-static material but packaging box is not. 【Recommended Storage Condition / Products Warranty Period 】 Temperature +5～30℃ Humidity Under 70% In the case of the package unopened , 6 months under 【 Recommended Storage Condition 】. Please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. 【Time elapsed after Package Opening】 The package should not be opened until immediately prior to its use, and please keep the time frame between package opening and soldering which is 【maximum 168h】. If the device needs to be soldered twice, both soldering operations must be completed within the 168h. If any components should remain unused, please reseal the package and store them under the conditions described in the 【 Recommended Storage Condition 】 above. This product must be required to perform baking process (moisture removal) for at least 10h and not exceed for 12h at 60±5 degrees Celsius if following conditions apply. 1. In the case of silica gel (blue) which indicates the moisture level within the package, changes or loses its blue color. 2. In the case of time passes for 168h after the package is opened once. Baking process should be performed after Photo detector having been taken out of the package. Baking may be performed in the tape-reel form , however if it is performed with the reel stacked over one another, it may cause deformation of the reels and taping materials and later obstruct mounting. Please handle only once it has returned to room temperature. Provided that, baking process shall be 2 times MAX. 2014.9.26 Page 11 Packaging Specifications VTPS1192HB-TR 【Moisture-proof Packaging Specification】 Fastener for re-storage after opening bag. Customer's opening position. A Product Label Heat sealing position (after product being put in) Desiccant with indicator for moisture level is enclosed. 1 SYM. PART NAME MATAL. REMARKS ① Moisture-proof bag with Aluminum layer PET+Al+PE with ESD protection 【Flow Chart-package OpeningOpening to Mounting】 Flow chart：Package to Mounting Stored under recommended condition Moisture-proof package first time opening Allowable leaving time exceeded (*) Yes No Discoloration of silica gel Yes No Baking LED under recommended condition Product Mounting Allowable leaving time means the maximum allowable leaving time after opening package, which depends on each Photo detector type. The allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. When judging if the allowable leaving time has exceeded or not, please subtract the soldering time. The allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. Unused-product remained Yes Return to moisture-proof package and seal No Finished Reopen the moisture-proof package 2014.9.26 Page 12 Packaging Specifications VTPS1192HB-TR 【 Packing box 】 (RoHS・ELV Compliant) Box TYPE Outline dimension L × W × H (mm) Capacity of the box Type A 280 × 265 × 45 3 reels Type B 310 × 235 × 265 15 reels Type C 440 × 310 × 265 30 reels The above measure is all the reference value. The box is selected out of the above table by shipping quantity. B ② Type A Material / box ： Cardboard C5BF 2014.9.26 Type B,C Material / box ： Cardboard K5AF Partition ： Cardboard K5BF No. PART NAME MATELRIAL REMARKS ② Packing Box Corrugated Cardboard without ESD protection Page 13 Packaging Specifications VTPS1192HB-TR 【Label Specification】 ( acc.to JIS-X0503(Code-39)) A Product Label A. Parts number B. Bar-code for parts number C. Parts code (In-house identification code for each parts number) D. Packed parts quantity E. Bar-Code for packed parts quantity F. Lot number & Rank (Refer to Lot Number Notational System for details ) G. Bar-Code for Lot number & Rank B Opto Device Label A. Customer Name B. Parts Type C. Parts Code D. Parts Number E. Packed Parts Quantity F. Carton Number G. Shipping Date H. Bar-Code for In-house identification Number Bar-code font : acc.to Code-39(JIX0503) 2014.9.26 Page 14 Taping and Reel Specifications VTPS1192HB-TR (acc.to ; JIS-C0806-03） 1. Appearance Note "-TR" means Cathode Side of Photo detectors should be placed on the sprocket-hole side. Items Specifications Remarks Cover-tape Cover-tape shall be longer than 200mm without carrier-tape The end of cover-tape shall be held with adhesive tape. Carrier-tape Empty pocket shall be more than 10 pieces. Please refer to the above figure for Taping & reel orientation . Empty pocket shall be more than 15 pieces. The end of taping shall be inserted into a slit of the hub. Leader area Trailer area 2014.9.26 Page 15 Taping and Reel Specifications VTPS1192HB-TR 【Qty. per Reel】 4,000parts/reel Minimum Qty. per reel might be 500 parts when getting less than 4,000 parts. In such case, parts of 500-unit-qty. shall be packed in a reel and the qty. shall be identified on the label. 【Mechanical strength】 Cover-tape adhesive strength shall be 0.1～1.0N ( An angle between carrier-tape and cover-tape shall be170 deg. ) Both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. 【Others】 Reversed-orientation, Up-side down placing, side placing and out of spec. parts mix shall not be held. Max qty. of empty pocket per reel shall be defined as follows. 2014.9.26 Qty./reel Max. qty. of empty pocket Remark 500 1 - 1,000 1 - 1,500 1 2,000 2 No continuance 2,500 2 No continuance 3,000 3 No continuance 4,000 4 No continuance - Page 16 Taping and Reel Specifications VTPS1192HB-TR Unit：mm (acc.to ; JIS-C0806-03） 5. Taping Dimensions 6. Reel Dimensions 2014.9.26 NO. PART NAME REMARKS ① Carrier-tape Conductive Grade ② Cover-tape Anti-Static Grade ③ Carrier-reel Anti-Static Grade Page 17 Lot Number Notational System ① ② ③ ④ ⑤ VTPS1192HB-TR ⑥ ⑦ ⑧ ⑨ ① - 1digit ： Production Location (Mark identify alphabet) ② - 1digit ： Production Year (Last digit of production Year 2009→9,2010→0,2011→1,･･･) ③ - 2digits ： Production Month (Jan. to Sep. ,should be 01,02,03,･････) ④ - 2digits ： Production Date ⑤ - 3digits ： Serial Number ⑥ - 2digits ： Tape and Reel following Number ⑦ - 2digits ： Luminous Intensity Rank. (If luminous intensity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑧ - 2digits ： Chromaticity Rank (If chromaticity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑨ - 1digit ： Option Rank (Stanley normally print "-" to indicate) 2014.9.26 Page 18 Correspondence to RoHS・ELV instruction VTPS1192HB-TR This product is in compliance with RoHS・ELV. Prohibition substance and it's criteria value of RoHS・ELV are as follows. ・RoHS instruction …… Refer to following (1)～(6). ・ELV instruction ………. Refer to following (1)～(4). 2014.9.26 Substance Group Name Criteria Value (1) Lead and its compounds 1,000ppm Max (2) Cadmium and its compounds 100ppm Max (3) Mercury and its compounds 1,000ppm Max (4) Hexavalent chromium 1,000ppm Max (5) PBB 1,000ppm Max (6) PBDE 1,000ppm Max Page 19 Reliability Testing Condition VTPS1192HB-TR Test Item Test Condition Endurance Operational Test Ta=25℃, 1,000h , VCE=12V Humidity-Resistance Operational Test Ta=60℃, RH=90% , 1,000h , VCE=5V High Temperature Operational Test Ta=85℃, 1,000h , VCE=12V Low Temperature Operational Test Ta=-30℃, 1,000h , VCE=12V Heat Cycle Test Storage Temp. Min, value（15min.）～ Storage Temp. Max,value（15min.） 1,000cycle High Temperature Shelf Test Ta=Storage Temp. Max., value t=1,000h Low Temperature Shelf Test Ta=Storage Temp. Min., value t=1,000h Reflow Resistance Test Moisture Soak ：Ta=30℃, RH=70%, 168h Preheating ： 150～180℃　120sec. Max. Soldering ： 230～260℃ 40sec. Max. Failure Criteria Item Symbol Test Condition Failure Criteria Dark current ID VCE = 5V ID < 0.1μ A Photo current Ic VCE = 5V , Ee = 5mW/c㎡ Initial value × 0.7 < Ic < Initial value × 1.3 Cosmetic appearance － － Notable, discoloration, deformation and cracking 2014.9.26 Page : 20 VTPS1192HB-TR Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com/en 2014.9.26 Page : 21