FBGA

FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Available in 1.40mm (LFBGA), 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness • Laminate substrate based package which enables 2 and 4 layers of routing flexibility FEATURES • Thin, lightweight, space saving package • Flexible body sizes range from 4mm x 4mm to 23mm x 23mm • 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch • Eutectic & Pb free solder balls • Green package available • Multiple routing layers and dedicated ground/power planes available for improved electrical performance • BT laminate materials (2 and 4 metal layers) • JEDEC standard compliant DESCRIPTION STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. The FBGA package’s reduced outline and thickness and higher density options make it an ideal advanced technology packaging solution for high performance and/or portable applications. The use of the latest materials and advanced assembly infrastructure produce a reliable and cost effective package. Lead free and halogen free compatible material sets are available. STATS ChipPAC’s FBGA is available in a broad range of JEDEC standard body sizes with LFBGA (