1N5908

1N5908 SM5908 Transil™ Features ■ Peak pulse power: – 1500 W (10/1000 μs) ■ Stand off voltage: 5 V ■ Unidirectional ■ Operating Tj max: 175 °C ■ High power capability at Tj max: – 1500 W (10/1000 µs) ■ JEDEC registered package outline A A K SMC (JEDEC DO-214AB) K DO-201 Complies with the following standards ■ IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) Description ■ IEC 61000-4-5 ■ MIL STD 883G, method 3015-7 Class 3B – 25 kV HBM (human body model) ■ Resin meets UL 94, V0 ■ MIL-STD-750, method 2026 solderability ■ EIA STD RS-481 and IEC 60286-3 packing ■ IPC 7531 footprint This Transil series has been designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2, and MIL STD 883, method 3015, and electrical over stress according to IEC 61000-4-4 and 5. These devices are more generally used against surges below 1500 W (10/1000 μs). The Planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. They are packaged in SMC (SMC footprint in accordance with IPC 7531 standard) and DO-201. TM: Transil is a trademark of STMicroelectroniocs September 2011 Doc ID 2914 Rev 3 1/9 www.st.com 9 Characteristics 1N5908, SM5908 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit 1500 W PPP Peak pulse power dissipation (1) Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s. 260 °C Tj initial = Tamb 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Thermal resistances Symbol Rth(j-l) Parameter Value SMC 15 DO-201 20 Junction to ambient on printed circuit on recommended pad layout SMC 90 Junction to ambient DO-201 75 Unit Junction to leads ° C/W Rth(j-a) Figure 1. Electrical characteristics - definitions I Symbol VRM VBR VCL IRM IPP aT VF RD Figure 2. Parameter Stand-off voltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Voltage temperature coefficient Forward voltage drop Dynamic resistance IF Pulse definition for electrical characteristics Repetitive pulse current tr = rise time (µs) tp = pulse duration time (µs) tr 2/9 VF VCL VBR VRM tp Doc ID 2914 Rev 3 IRM IR IPP V 1N5908, SM5908 Table 3. Characteristics Electrical characteristics - parameter values (Tamb = 25 °C) IRM @VRM Order code 1N5908 SM5908 max VBR @IR (1) min VCL @IPP, 10/1000 µs max VCL @IPP, 10/1000 µs VCL @IPP, 10/1000 µs αT (2) C max max max typ µA V V mA V A(3) V A(3) V A(3) 10-4/ °C pF 300 5 6 1 7.6 30 8 60 8.5 120 5.7 9500 1. Pulse tes: tp < 50 ms 2. To calculate VBR or VCL versus junction temperature, use the following formulas: VBR @ TJ = VBR @ 25°C x (1 + αT x (TJ – 25)) VCL @ TJ = VCL @ 25°C x (1 + αT x (TJ – 25)) 3. Surge capability given for both directions Figure 3. Peak pulse power dissipation versus initial junction temperature Ppp (W) Figure 4. 100.0 2000 Peak pulse power versus exponential pulse duration (Tj initial = 25 °C) PPP(kW) Tj initial = 25 °C 1500 10.0 1000 1.0 500 Tj(°C) tP(ms) 0 0.1 0 25 50 75 100 125 150 175 200 1.0E-03 Doc ID 2914 Rev 3 1.0E-02 1.0E-01 1.0E+00 1.0E+01 3/9 Characteristics Figure 5. 1N5908, SM5908 Clamping voltage versus peak pulse current (exponential waveform, typical values) I PP(A ) 1000.0 8/20 µs Tj initial=25 °C 10/1000 µs 100.0 10.0 1.0 VCL(V) 0.1 1 Figure 6. 10 Junction capacitance versus reverse applied voltage (typical values) 100 Figure 7. C(nF) 1.0E+02 10 Peak forward voltage drop versus peak forward current (typical values) IFM(A) F=1 MHz VOSC=30 mVRMS Tj=25 °C 1.0E+01 Tj =125 °C Tj =25 °C 1.0E+00 VFM(V) VR(V) 1 1.0E-01 1 4/9 2 3 4 5 0.0 Doc ID 2914 Rev 3 0.5 1.0 1.5 2.0 2.5 3.0 1N5908, SM5908 Figure 8. Characteristics Relative variation of thermal impedance, junction to ambient, versus pulse duration (SMC) Figure 9. Zth(j-a) / Rth(j-a) 1.00 1.00 Relative variation of thermal impedance, junction to ambient, versus pulse duration (DO-201) Zth(j-a) / Rth(j-a) Recommended pad layout PCB FR4, copper thickness = 35 µm 0.10 0.10 tP(s) tP(s) 0.01 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (SMC) 0.01 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 11. Leakage current versus junction temperature (typical values) Rth(j-a) (°C/W) IR (µA) 100 1.E+02 PCB FR4, copper thickness = 35 µm 90 80 70 60 1.E+01 50 40 30 20 Tj(°C) 10 SCU(cm²) 1.E+00 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 25 Doc ID 2914 Rev 3 50 75 100 125 150 175 5/9 Package information 2 1N5908, SM5908 Package information ● Case: JEDEC DO-214AB molded plastic over planar junction ● Terminals: solder plated, solderable per MIL-STD-750, Method 2026 ● Polarity: for unidirectional types the band indicates cathode ● Flammability: epoxy is rated UL94V-0 ● RoHS package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 4. SMC dimensions Dimensions Ref. E1 D E A1 A2 C E2 L b Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 Figure 12. SMC footprint dimensions mm Figure 13. SMC marking layout(1) (inches) 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) Cathode bar 3.14 (0.124) 8.19 (0.322) 1. Marking layout can vary according to assembly location. 6/9 Doc ID 2914 Rev 3 x x x z y ww : ECOPACK status XXX: Marking Z: Manufacturing location Y: Year WW: week 1N5908, SM5908 Package information Table 5. DO-201 Dimensions Dimensions B B A Ref. ØD ØC Table 6. Millimeters Inches Min. Max. Min. Max. A 8.5 9.5 0.335 0.374 B 25.4 ØC 4.8 5.3 0.189 0.209 ØD 0.96 1.06 0.038 0.042 1 DO-201 marking layout Cathode bar x x x x x x x x x x x m m m y w w e, G : Ecopack status x: Marking mmm : Manufacturing location y: Year ww: week Doc ID 2914 Rev 3 7/9 Ordering information 3 1N5908, SM5908 Ordering information Table 7. Ordering information Order code 4 Marking Package Weight Base qty Delivery mode SM5908 MDC SMC 0.25 g 2500 Tape and reel 1N5908 1N5908 DO-201 0.9 g 600 Ammopack Revision history 02-Jul Table 8. Document revision history Date Revision Aug-1999 2A 20-Sep-2011 8/9 3 Changes Previous release Added cathode bands. Added standards compliance statements. Updated Description. Updated Table 1 and Table 2. Updated Figures 3 through 11. Updated Section 2: Package information. Doc ID 2914 Rev 3 1N5908, SM5908 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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