28C16

M28C16 16K (2K x 8) PARALLEL EEPROM with SOFTWARE DATA PROTECTION NOT FOR NEW DESIGN FAST ACCESS TIME: 90ns SINGLE 5V ± 10% SUPPLY VOLTAGE LOW POWER CONSUMPTION FAST WRITE CYCLE: – 64 Bytes Page Write Operation – Byte or Page Write Cycle: 3ms Max ENHANCED END OF WRITE DETECTION: – Data Polling – Toggle Bit PAGE LOAD TIMER STATUS BIT HIGH RELIABILITY SINGLE POLYSILICON, CMOS TECHNOLOGY: – Endurance >100,000 Erase/Write Cycles – Data Retention >40 Years JEDEC APPROVED BYTEWIDE PIN OUT SOFTWARE DATA PROTECTION M28C16 is replaced by the products described on the document M28C16A DESCRIPTION The M28C16 is a 2K x 8 low power Parallel EEPROM fabricatedwith SGS-THOMSON proprietary single polysilicon CMOS technology. The device offers fast access time with low power dissipation and requires a 5V power supply. The circuit has been designed to offer a flexible microcontroller interface featuring both hardware and software handshaking with Data Polling and Toggle Bit. The M28C16 supports 64 byte page write operation. A Software Data Protection (SDP) is also possible using the standard JEDEC algorithm. Table 1. Signal Names A0 - A10 DQ0 - DQ7 W E G RB VCC VSS Address Input Data Input / Output Write Enable Chip Enable Output Enable Ready / Busy Supply Voltage Ground 24 1 PDIP24 (P) PLCC32 (K) 24 1 SO24 (MS) 300 mils TSOP28 (N) 8 x13.4mm Figure 1. Logic Diagram VCC 11 A0-A10 8 DQ0-DQ7 W E G M28C16 RB * VSS AI01518B Note: * RB function is offered only with TSOP28 package. November 1997 This is information on a product still in production bu t not recommended for new de sign. 1/18 M28C16 Figure 2A. DIP Pin Connections Figure 2B. LCC Pin Connections AI01485 DQ1 DQ2 VSS DU DQ3 DQ4 DQ5 AI01486C A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 VSS 1 24 2 23 3 22 4 21 5 20 6 19 M28C16 7 18 8 17 9 16 10 15 11 14 12 13 VCC A8 A9 W G A10 E DQ7 DQ6 DQ5 DQ4 DQ3 A6 A5 A4 A3 A2 A1 A0 NC DQ0 A7 NC NC DU VCC W NC 1 32 A8 A9 NC NC G A10 E DQ7 DQ6 9 M28C16 25 17 Warning: NC = Not Connected, DU = Don’t Use Figure 2C. SO Pin Connections Figure 2D. TSOP Pin Connections A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 VSS 1 2 3 4 5 6 M28C16 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 16 15 AI01519 VCC A8 A9 W G A10 E DQ7 DQ6 DQ5 DQ4 DQ3 G NC A9 A8 NC W VCC RB NC A7 A6 A5 A4 A3 22 21 28 1 M28C16 15 14 7 8 AI01175C A10 E DQ7 DQ6 DQ5 DQ4 DQ3 VSS DQ2 DQ1 DQ0 A0 A1 A2 Warning: NC = Not Connected. 2/18 M28C16 Table 2. Absolute Maximum Ratings Symbol TA TSTG VCC VIO VI VESD (1) Parameter Ambient Operating Temperature Storage Temperature Range Supply Voltage Input/Output Voltage Input Voltage Electrostatic Discharge Voltage (Human Body model) (2) Value – 40 to 125 – 65 to 150 – 0.3 to 6.5 – 0.3 to VCC +0.6 – 0.3 to 6.5 4000 Unit °C °C V V V V Notes: 1. Except for the rating ”Operating Temperature Range”, stresses above those listed in the Table ”Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the SGS-THOMSON SURE Program and other relevant quality documents. 2. 100pF through 1500Ω; MIL-STD-883C, 3015.7 Table 3. Operating Modes Mode Standby Output Disable Write Disable Read Write (1) E 1 X X 0 0 G X 1 X 0 1 W X X 1 1 0 DQ0 - DQ7 Hi-Z Hi-Z Hi-Z Data Out Data In Chip Erase Note: 1. 0 = VIL; 1 = VIH; X = VIL or VIH; V = 12 ± 5%. 0 V 0 Hi-Z PIN DESCRIPTION Addresses (A0-A10). The address inputs select an 8-bit memory location during a read or write operation. Chip Enable (E). The chip enable input must be low to enable all read/write operations. When Chip Enable is high, power consumption is reduced. Output Enable (G). The Output Enable input controls the data output buffers and is used to initiate read operations. Data In/ Out (DQ0 - DQ7). Data is written to or read from the M28C16 through the I/O pins. Write Enable (W). The Write Enable input controls the writing of data to the M28C16. Ready/Busy (RB). Ready/Busy is an open drain output that can be used to detect the end of the internal write cycle. It is offered only with the TSOP28 package. The reader should refer to the M28C17 datasheet for more information about the Ready/Busy function. OPERATION In order to prevent data corruption and inadvertent write operations an internal VCC comparator inhibits Write operation if VCC is below VWI (see Table 7). Access to the memory in write mode is allowed after a power-up as specified in Table 7. Read The M28C16 is accessed like a static RAM. When E and G are low with W high, the data addressed is presented on the I/O pins. The I/O pins are high impedance when either G or E is high. Write Write operations are initiated when both W and E are low and G is high.The M28C16 supports both E and W controlled write cycles. The Address is latched by the falling edge of E or W which ever occurs last and the Data on the rising edge of E or W which ever occurs first. Once initiated the write operation is internally timed until completion. 3/18 M28C16 Figure 3. Block Diagram E G W VPP GEN RESET CONTROL LOGIC X DECODE A6-A10 (Page Address) ADDRESS LATCH 64K ARRAY A0-A5 ADDRESS LATCH Y DECODE SENSE AND DATA LATCH I/O BUFFERS PAGE LOAD TIMER STATUS TOGGLE BIT DATA POLLING AI01520 DQ0-DQ7 Page Write Page write allows up to 64 bytes to be consecutively latched into the memory prior to initiating a programming cycle. All bytes must be located in a single page address, that is A6-A10 must be the same for all bytes. The page write can be initiated during any byte write operation. Following the first byte write instruction the host may send another address and data with a minimum data transfer rate of 1/tWHWH (see Figure 13). If a transition of E or W is not detected within tWHWH, the internal programming cycle will start. Chip Erase The contents of the entire memory may be erased to FFh by use of the Chip Erase command by setting Chip Enable (E) Low and Output Enable (G) to VCC +7V. The chip is cleared when a 10ms low pulse is applied to the Write Enable pin. Figure 4. Status Bit Assignment DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 DP TB PLTS Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Microcontroller Control Interface The M28C16 provides two write operation status bits and one status pin that can be used to minimize the system write cycle. These signals are available on the I/O port bits DQ7 or DQ6 of the memory during programming cycle only. Data Polling bit (DQ7). During the internal write cycle, any attempt to read the last byte written will produce on DQ7 the complementary value of the previously latched bit. Once the write cycle is finished the true logic value appears on DQ7 in the read cycle. Toggle bit (DQ6). The M28C16 offers another way for determining when the internal write cycle is completed. During the internal Erase/Write cycle, DQ6 will toggle from ”0” to ”1” and ”1” to ”0” (the first read value is ”0”) on subsequent attempts to read the memory. When the internal cycle is completed the toggling will stop and the device will be accessible for a new Read or Write operation. Page Load Timer Status bit (DQ5). In the Page Write mode data may be latched by E or W. Up to 64 bytes may be input. The Data output (DQ5) indicates the status of the internal Page Load Timer. DQ5 may be read by asserting Output Enable Low (tPLTS). DQ5 Low indicates the timer is running, High indicates time-out after which the write cycle will start and no new data may be input. DP = Data Polling TB = Toggle Bit PLTS = Page Load Timer Status 4/18 M28C16 Figure 5. Software Data Protection Enable Algorithm and Memory Write WRITE AAh in Address 555h Page Write Instruction (Note 1) Page Write Instruction (Note 1) WRITE AAh in Address 555h WRITE 55h in Address 2AAh WRITE 55h in Address 2AAh WRITE A0h in Address 555h WRITE A0h in Address 555h WRITE is enabled Write Page (1 up to 64 bytes) SDP is set SDP ENABLE ALGORITHM WRITE IN MEMORY WHEN SDP IS SET AI01509B Note: 1. MSB Address bits (A6 to A10) differ during these specific Page Write operations. Figure 6. Software Data Protection Disable Algorithm WRITE AAh in Address 555h WRITE 55h in Address 2AAh Page Write Instruction WRITE 80h in Address 555h WRITE AAh in Address 555h WRITE 55h in Address 2AAh WRITE 20h in Address 555h Unprotected State AI01510 Software Data Protection The M28C16 offers a software controlled write protection facility that allows the user to inhibit all write modes to the device including the Chip Erase instruction. This can be useful in protecting the memory from inadvertent write cycles that may occur due to uncontrolled bus conditions. The M28C16 is shipped as standard in the ”unprotected” state meaning that the memory contents can be changed as required by the user. After the Software Data Protection enable algorithm is issued, the device enters the ”Protect Mode” of operation where no further write commands have any effect on the memory contents. The device remains in this mode until a valid Software Data Protection (SDP) disable sequence is received whereby the device reverts to its ”unprotected” state. The Software Data Protection is fully nonvolatile and is not changed by power on/off sequences. To enable the Software Data Protection (SDP) the device requires the user to write (with a Page Write) three specific data bytes to three specific memory locations as per Figure 5. Similarly to disable the Software Data Protection the user has to write specific data bytes into six different locations as per Figure 6 (with a Page Write). This complex series ensures that the user will never enable or disable the Software Data Protection accidentally. 5/18 M28C16 Table 4. AC Measurement Conditions Input Rise and Fall Times Input Pulse Voltages Input and Output Timing Ref. Voltages ≤ 20ns 0.4V to 2.4V 0.8V to 2.0V 1N914 Figure 8. AC Testing Equivalent Load Circuit 1.3V Note that Output Hi-Z is defined as the point where data is no longer driven. 3.3kΩ Figure 7. AC Testing Input Output Waveforms 2.4V DEVICE UNDER TEST CL = 30pF OUT 2.0V 0.8V AI00826 0.4V CL includes JIG capacitance AI01129 Table 5. Capacitance (1) (TA = 25 °C, f = 1 MHz ) Symbol C IN C OUT Parameter Input Capacitance Output Capacitance Test Condition VIN = 0V VOUT = 0V Min Max 6 12 Unit pF pF Note: 1. Sampled only, not 100% tested. Table 6. Read Mode DC Characteristics (TA = 0 to 70°C or –40 to 85°C; VCC = 4.5V to 5.5V) Symbol ILI ILO ICC ICC1 ICC2 (1) Parameter Input Leakage Current Output Leakage Current Supply Current (TTL inputs) Supply Current (CMOS inputs) Test Condition 0V ≤ VIN ≤ VCC 0V ≤ VIN ≤ VCC E = VIL, G = VIL , f = 5 MHz E = VIL, G = VIL , f = 5 MHz E = VIH E > VCC –0.3V Min Max 10 10 30 25 1 100 Unit µA µA mA mA mA µA V V V V (1) (1) Supply Current (Standby) TTL Supply Current (Standby) CMOS Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage VIL VIH VOL VOH – 0.3 2 IOL = 2.1 mA IOH = –400 µA 2.4 0.8 VCC +0.5 0.4 Note: 1. All I/O’s open circuit. Table 7. Power Up Timing (1) (TA = 0 to 70°C or –40 to 85°C; VCC = 4.5V to 5.5V) Symbol tPUR tPUW VWI Parameter Time Delay to Read Operation Time Delay to Write Operation (once VCC ≥ 4.5V ) Write Inhibit Threshold Min 1 10 3.0 4.2 Max Unit µs ms V Note: 1. Sampled only, not 100% tested. 6/18 M28C16 Table 8. Read Mode AC Characteristics (TA = 0 to 70°C or –40 to 85°C; VCC = 4.5V to 5.5V) Symbol Alt Parameter Test Condition min tAVQV tELQV tGLQV tEHQZ (1) M28C16 -90 max 90 90 40 0 0 0 40 40 0 0 0 min -120 max 120 120 45 45 45 0 0 0 min -150 max 150 150 50 50 50 ns ns ns ns ns ns Unit tACC tCE tOE tDF tDF tOH Address Valid to Output Valid Chip Enable Low to Output Valid Output Enable Low to Output Valid Chip Enable High to Output Hi-Z Output Enable High to Output Hi-Z Address Transition to Output Transition E = VIL, G = VIL G = VIL E = VIL G = VIL E = VIL E = VIL, G = VIL tGHQZ (1) tAXQX Note: 1. Output Hi-Z is defined as the point at which data is no longer driven. Figure 9. Read Mode AC Waveforms A0-A10 tAVQV E tGLQV G tELQV DQ0-DQ7 VALID tAXQX tEHQZ tGHQZ DATA OUT Hi-Z AI01511B Note: Write Enable (W) = High 7/18 M28C16 Table 9. Write Mode AC Characteristics (TA = 0 to 70°C or –40 to 85°C; VCC = 4.5V to 5.5V) Symbol tAVWL tAVEL tELWL tGHWL tGHEL tWLEL tWLAX tELAX tWLDV tELDV tELEH tWHEH tWHGL tEHGL tEHWH tWHDX tEHDX tWHWL tWLWH1 tWHWH tWHRH tDVWH tDVEH Alt tAS tAS tCES tOES tOES tWES tAH tAH tDV tDV tWP tCEH tOEH tOEH tWEH tDH tDH tWPH tWP tBLC tWC tDS tDS Parameter Address Valid to Write Enable Low Address Valid to Chip Enable Low Chip Enable Low to Write Enable Low Output Enable High to Write Enable Low Output Enable High to Chip Enable Low Write Enable Low to Chip Enable Low Write Enable Low to Address Transition Chip Enable Low to Address Transition Write Enable Low to Input Valid Chip Enable Low to Input Valid Chip Enable Low to Chip Enable High Write Enable High to Chip Enable High Write Enable High to Output Enable Low Chip Enable High to Output Enable Low Chip Enable High to Write Enable High Write Enable High to Input Transition Chip Enable High to Input Transition Write Enable High to Write Enable Low Write Enable Low to Write Enable High Byte Load Repeat Cycle Time Write Cycle Time Data Valid before Write Enable High Data Valid before Chip Enable High 50 50 E = VIL, G = VIH G = VIH , W = VIL 50 0 0 0 0 0 0 50 50 0.15 100 3 Test Condition E = VIL, G = VIH G = VIH , W = VIL G = VIH E = VIL W = VIL G = VIH Min 0 0 0 0 0 0 50 50 1 1 Max Unit ns ns ns ns ns ns ns ns µs µs ns ns ns ns ns ns ns ns ns µs ms ns ns 8/18 M28C16 Figure 10. Write Mode AC Waveforms - Write Enable Controlled A0-A10 tAVWL E tELWL G tGHWL W VALID tWLAX tWHEH tWLWH1 tWHGL tWLDV DQ0-DQ7 DATA IN tDVWH tWHWL tWHDX AI01207 Figure 11. Write Mode AC Waveforms - Chip Enable Controlled A0-A10 tAVEL E tGHEL G tWLEL W VALID tELAX tELEH tEHGL tELDV DQ0-DQ7 DATA IN tDVEH tEHDX tEHWH AI01522 9/18 M28C16 Figure 12. Page Write Mode AC Waveforms - Write Enable Controlled A0-A10 Addr 0 Addr 1 Addr 2 Addr n E tPLTS G tWHWL W tWLWH DQ0-DQ7 Byte 0 Byte 1 tWHWH Byte 2 tWHWH Byte n tWHRH DQ5 Byte n AI01523 Figure 13. Software Protected Write Cycle Waveforms G E tWLWH W tAVEL A0-A5 tWHDX A6-A10 555h tDVWH DQ0-DQ7 AAh 55h A0h Byte 0 Byte 62 Byte 63 AI01515 tWHWL tWHWH tWLAX Byte Address 2AAh 555h Page Address Note: A6 through A10 must specify the same page address during each high to low transition of W (or E) after the software code has been entered. G must be high only when W and E are both low. 10/18 M28C16 Figure 14. Data Polling Waveform Sequence A0-A10 Address of the last byte of the Page Write instruction E G W DQ7 DQ7 DQ7 DQ7 DQ7 DQ7 LAST WRITE INTERNAL WRITE SEQUENCE READY AI01516 Figure 15. Toggle Bit Waveform Sequence A0-A10 E G W DQ6 (1) LAST WRITE TOGGLE INTERNAL WRITE SEQUENCE READY AI01517 Note: 1. First Toggle bit is forced to ’0’ 11/18 M28C16 Figure 16. Chip Erase Wavforms tWHEH E G tGLWH W tELWL tWLWH2 tWHRH AI01484B Table 10. Chip Erase AC Characteristics (TA = 0 to 70°C or –40 to 85°C; VCC = 4.5V to 5.5V) Symbol tELWL tWHEH tWLWH2 tGLWH tWHRH Parameter Chip Enable Low to Write Enable Low Write Enable High to Chip Enable High Write Enable Low to Write Enable High Output Enable Low to Write Enable High Write Enable High to Write Enable Low Test Condition G = VCC + 7V G = VCC + 7V G = VCC + 7V G = VCC + 7V G = VCC + 7V Min 1 0 10 1 3 Max Unit µs ns ms µs ms 12/18 M28C16 ORDERING INFORMATION SCHEME Example: M28C16 -90 K 1 T Speed -90 -120 -150 90ns 120ns 150ns P (2) Package PDIP28 PLCC32 (2) Temperature Range 1 6 0 to 70 °C –40 to 85 °C T Option Tape & Reel Packing K MS SO28 300mils N (1) TSOP28 8 x 13.4mm Notes: 1. The M28C16 in TSOP28 package has a Ready/Busy output on pin 1. 2. Packages available on request only. Devices are shipped from the factory with the memory content set at all ”1’s” (FFh). For a list of available options (Package, etc...) or for further information on any aspect of this device, please contact the SGS-THOMSON Sales Office nearest to you. 13/18 M28C16 PDIP24 - 24 pin Plastic DIP, 600 mils width Symb Typ A A1 A2 B B1 C D E E1 e1 eA L S α N PDIP24 mm Min 3.94 0.38 3.56 0.38 1.14 0.20 Max 5.08 1.78 4.06 0.56 1.78 0.30 32.26 14.80 12.50 2.54 – 15.20 3.05 1.02 0° 24 16.26 13.97 – 17.78 3.82 2.29 15° 0.100 Typ inches Min 0.155 0.015 0.140 0.015 0.045 0.008 Max 0.200 0.070 0.160 0.021 0.070 0.012 1.270 0.583 0.492 – 0.598 0.120 0.040 0° 24 0.640 0.550 – 0.700 0.150 0.090 15° A2 A1 B1 D S N A L α eA C B e1 E1 1 E PDIP Drawing is not to scale. 14/18 M28C16 PLCC32 - 32 lead Plastic Leaded Chip Carrier, rectangular Symb Typ A A1 B B1 D D1 D2 E E1 E2 e j N Nd Ne CP PLCC32 mm Min 2.54 1.52 0.33 0.66 12.32 11.35 9.91 14.86 13.89 12.45 1.27 0.89 – – 32 7 9 0.10 Max 3.56 2.41 0.53 0.81 12.57 11.56 10.92 15.11 14.10 13.46 – – 0.050 0.035 Typ inches Min 0.100 0.060 0.013 0.026 0.485 0.447 0.390 0.585 0.547 0.490 – – 32 7 9 0.004 Max 0.140 0.095 0.021 0.032 0.495 0.455 0.430 0.595 0.555 0.530 – – D D1 j 1N A1 B1 Ne E1 E D2/E2 B e Nd A CP PLCC Drawing is not to scale. 15/18 M28C16 SO24 - 24 lead Plastic Small Outline, 300 mils body width Symb Typ A A1 A2 B C D E e H L α N CP SO24 mm Min 2.46 0.13 2.29 0.35 0.23 15.20 7.42 1.27 – 10.16 0.61 0° 24 0.10 Max 2.64 0.29 2.39 0.48 0.32 15.60 7.59 – 10.41 1.02 8° 0.050 Typ inches Min 0.097 0.005 0.090 0.014 0.009 0.598 0.292 – 0.400 0.024 0° 24 0.004 Max 0.104 0.011 0.094 0.019 0.013 0.614 0.299 – 0.410 0.040 8° A2 B e D A C CP N E 1 H A1 α L SO-b Drawing is not to scale. 16/18 M28C16 TSOP28 - 28 lead Plastic Small Outline, 8 x 13.4mm Symb Typ A A1 A2 B C D D1 E e L α N CP TSOP28 mm Min Max 1.25 0.20 0.95 0.17 0.10 13.20 11.70 7.90 0.55 – 0.50 0° 28 0.10 1.15 0.27 0.21 13.60 11.90 8.10 – 0.70 5° 0.022 Typ inches Min Max 0.049 0.008 0.037 0.007 0.004 0.520 0.461 0.311 – 0.020 0° 28 0.004 0.045 0.011 0.008 0.535 0.469 0.319 – 0.028 5° A2 22 21 e 28 1 E B 7 8 D1 D A CP DIE C TSOP-c Drawing is not to scale. A1 α L 17/18 M28C16 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1997 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 18/18