4R2U

STTH4R02 Ultrafast recovery diode Main product characteristics IF(AV) VRRM Tj (max) VF (typ) trr (typ) 4A 200 V 175° C 0.76 V 16 ns A K K K A A K TO-220FPAC STTH4R02FP TO-220AC STTH4R02D Features and benefits ■ ■ ■ ■ Very low conduction losses Negligible switching losses Low forward and reverse recovery times High junction temperature K A NC DPAK STTH4R02B A K SMB STTH4R02U Description The STTH4R02 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. Packaged in TO-220AC, TO-220FPAC, DPAK, SMB, SMC, and DO-201AB, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. A A K K DO-201AB STTH4R02 SMC STTH4R02S Order codes Part Number STTH4R02D STTH4R02FP STTH4R02B STTH4R02B-TR STTH4R02U STTH4R02 STTH4R02RL STTH4R02S Marking STTH4R02 STTH4R02 STTH4R02 STTH4R02 4R2U STTH4R02 STTH4R02 4R2S October 2006 Rev 2 www.st.com 1/13 13 Characteristics STTH4R02 1 Table 1. Symbol VRRM Characteristics Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Parameter Repetitive peak reverse voltage TO-220AC DPAK IF(RMS) RMS forward current SMB / SMC TO-220FPAC DO-201AB TO-220AC DPAK IF(AV) Average forward current, δ = 0.5 SMB SMC TO-220FPAC DO-201AB IFSM Tstg Tj Surge non repetitive forward current Storage temperature range Maximum operating junction temperature tp = 10 ms Sinusoidal Tc = 160° C Tc = 160° C Tc = 95° C Tc = 95° C Tc = 150° C Tlead = 95° C 70 -65 to + 175 175 A °C °C 4 A 70 A Value 200 Unit V Table 2. Symbol Thermal parameters Parameter TO-220AC / DPAK SMB Value 3.5 20 6.5 20 20 °C/W Unit Rth(j-c) Junction to case TO-220FPAC DO-201AB SMC 2/13 STTH4R02 Table 3. Symbol IR(1) Characteristics Static electrical characteristics Parameter Test conditions Tj = 25° C Tj = 125° C Tj = 25° C VR = VRRM IF = 12 A IF = 4 A Min. Typ Max. 3 µA 2 1.15 0.95 0.76 20 1.25 1.05 0.83 V Unit Reverse leakage current VF(2) Forward voltage drop Tj = 25° C Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.67 x IF(AV) + 0.04 IF2(RMS) Table 4. Symbol Dynamic characteristics Parameter Test conditions IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25° C Reverse recovery current Forward recovery time Forward recovery voltage IF = 4 A, dIF/dt = -200 A/µs, VR = 160 V, Tj = 125° C IF = 4 A, dIF/dt = 50 A/µs VFR = 1.1 x VFmax, Tj = 25° C IF = 4 A, dIF/dt = 50 A/µs, Tj = 25° C Min. Typ 24 16 4.4 80 1.6 Max. 30 ns 20 5.5 A ns V Unit trr Reverse recovery time IRM tfr VFP Figure 1. IM(A) 50 peak current versus duty cycle Figure 2. IFM(A) Forward voltage drop versus forward current (typical values) T 100 45 40 35 30 25 20 15 10 5 P=2W P=5W IM δ d=tp/T tp 75 50 Tj=150°C Tj=25°C P=1W 25 δ 0 0.0 0.5 1.0 1.5 2.0 2.5 VFM(V) 3.0 3.5 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 3/13 Characteristics STTH4R02 Figure 3. Forward voltage drop versus forward current (maximum values) Figure 4. Relative variation of thermal impedance, junction to case, versus pulse duration (T0-220AC, DPAK) IFM(A) 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VFM(V) Tj=25°C Tj=150°C Zth(j-c)/Rth(j-c) 1.0 Single pulse TO-220AC DPAK tp(s) 0.1 1.E-03 1.E-02 1.E-01 1.E+00 Figure 5. Relative variation of thermal impedance, junction to case, versus pulse duration (TO-220FPAC) Figure 6. Relative variation of thermal impedance, junction to ambient, versus pulse duration (SMB) Zth(j-c)/Rth(j-c) 1.0 Single pulse TO-220FPAC Zth(j-a) /Rth(j-a) 1.0 0.9 0.8 0.7 0.6 SMB SCu=1cm² 0.1 0.5 0.4 0.3 0.2 0.1 tp(s) 0.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 0.0 1.E-01 1.E+00 1.E+01 1.E+02 tp(s) 1.E+03 Figure 7. Relative variation of thermal impedance, junction to ambient, versus pulse duration (DO-201AB) Figure 8. Relative variation of thermal impedance, junction to ambient, versus pulse duration (SMC) Zth(j-a) (°C/W) 100 Single pulse DO201AB Zth(j-a) /Rth(j-a) 1.0 0.9 0.8 0.7 0.6 SMC SCu=1cm² 10 0.5 0.4 0.3 0.2 tp(s) 1 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0.1 0.0 1.E-01 1.E+00 tp(s) 1.E+01 1.E+02 1.E+03 4/13 STTH4R02 Characteristics Figure 9. Junction capacitance versus reverse applied voltage (typical values) Figure 10. Reverse recovery charges versus dIF/dt (typical values) QRR(nC) 120 C(pF) 100 F=1MHz Vosc=30mVRMS Tj=25°C 100 IF=4A VR=160V Tj=125°C 80 60 40 Tj=25°C 20 VR(V) 10 1 10 100 1000 dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 Figure 11. Reverse recovery time versus dIF/dt Figure 12. Peak reverse recovery current (typical values) versus dIF/dt (typical values) tRR(ns) 80 70 60 50 40 Tj=125°C IF=4A VR=160V IRM(A) 10 IF=4A VR=160V 8 6 Tj=125°C 30 20 10 0 10 100 1000 Tj=25°C 4 Tj=25°C 2 dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 dIF/dt(A/µs) 400 450 500 Figure 13. Dynamic parameters versus junction temperature Figure 14. Thermal resistance, junction to ambient, versus copper surface under tab - DPAK (Epoxy printed circuit board FR4, eCU = 35 µm) Rth(j-a) (°C/W) 100 90 80 DPAK QRR; IRM [T j] / Q RR; IRM [T j=125°C] 1.4 1.2 1.0 0.8 0.6 QRR IRM IF=4A VR=160V 70 60 50 40 30 20 0.4 0.2 Tj(°C) 0.0 25 50 75 100 125 150 10 0 0 5 10 15 20 25 30 SCU(cm²) 35 40 5/13 Ordering information scheme STTH4R02 Figure 15. Thermal resistance, junction to ambient, versus copper surface under tab - SMB (Epoxy printed circuit board FR4, eCU = 35 µm) Rth(j-a) (°C/W) 110 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SCU(cm²) SMB Figure 16. Thermal resistance, junction to ambient, versus copper surface under tab - SMC (Epoxy printed circuit board FR4, eCU = 35 µm) Rth(j-a) (°C/W) 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SCU(cm²) SMC Figure 17. Thermal resistance versus lead length - DO-201AB 90 80 70 60 50 40 30 20 10 0 5 10 15 20 25 LLEADS(mm) Rth(j-l) Rth(°C/W) Rth(j-a) DO201AB 2 Ordering information scheme STTH Ultrafast switching diode Average forward current 4=4A Model R Repetitive peak reverse voltage 02 = 200 V Package Blank = DO-201 in Ammopack RL = DO201 in Tape and reel D = TO220AC in Tube FP = TO-220FPAC in Tube B = DPAK in Tube B-TR = DPAK in Tape and reel U = SMB in Tape and reel S = SMC in Tape and reel 4R 02 XXX 6/13 STTH4R02 Package information 3 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm Table 5. T0-220AC dimensions DIMENSIONS REF. Millimeters Min. H2 ØI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 A C D E F F1 G 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E L5 L6 G L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 7/13 Package information Table 6. DPAK dimensions STTH4R02 DIMENSIONS REF . Millimeters Min. E B2 L2 C2 A Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 A A1 A2 B D 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 B2 C C2 H L4 B G A1 R R C D E G A2 0.60 MIN. H L2 V2 0.80 typ. 0.60 0° 1.00 8° 0.031 typ. 0.023 0° 0.039 8° L4 V2 Figure 18. DPAK footprint 1.6 6.7 3 3 2.3 6.7 2.3 1.6 Dimensions in mm 8/13 STTH4R02 Table 7. T0-220FPAC dimensions Package information DIMENSIONS REF Millimeters Min. A H B Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 A B D 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 Dia L6 L2 L3 L5 F1 L4 D L7 E F F1 G G1 H L2 L3 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 E L4 L5 G L6 L7 Dia. 9/13 Package information Table 8. SMB dimensions STTH4R02 DIMENSIONS E1 REF. Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.60 Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063 A1 D 1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75 A2 b E A1 A2 L b c E c E1 E2 D L Figure 19. SMB footprint (dimensions in mm) 5.25 2.22 1.75 1.75 1.75 10/13 STTH4R02 Table 9. SMC dimensions Package information Dimensions Ref. E1 Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.60 Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063 A1 D 1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75 A2 b E c E A1 E1 b C E2 L A2 E2 D L Figure 20. SMC footprint (dimensions in mm) 2.20 4.25 2.20 3.30 8.65 Table 10. DO-201AB Dimensions DIMENSIONS B A B REF. Millimeters Min. Max. 9.5 Inches Min. 0.335 1 Max. 0.374 ØD ØC A B ØC ØD 8.5 25.4 4.8 0.96 5.3 1.06 0.189 0.038 0.209 0.042 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 11/13 Ordering information STTH4R02 4 Ordering information Part Number STTH4R02D STTH4R02FP STTH4R02B STTH4R02B-TR STTH4R02U STTH4R02 STTH4R02RL STTH4R02S Marking STTH4R02 STTH4R02 STTH4R02 STTH4R02 4R2U STTH4R02 STTH4R02 4R2S Package TO-220AC TO-220FPAC DPAK DPAK SMB DO-201AB DO-201AB SMC Weight 1.86 g 2.2 g 0.30 g 0.30 g 0.107 g 0.876 g 0.876 g 0.243 g Base qty 50 50 75 2500 2500 600 1900 2500 Delivery mode Tube Tube Tube Tape and reel Tape and reel Ammopack Tape and reel Tape and reel 5 Revision history Date 03-May-2006 10-Oct-2006 Revision 1 2 First issue. Added SMC package Description of Changes 12/13 STTH4R02 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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