A1C15S12M3

A1C15S12M3

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

  • 描述:

    A1C15S12M3 Series 1200 V 15 A Trench Gate Field-Stop IGBT - ACEPACK™ 1

  • 数据手册
  • 价格&库存
A1C15S12M3 数据手册
A1C15S12M3 ACEPACK™ 1 converter inverter brake, 1200 V, 15 A trench gate field-stop IGBT M series, soft diode and NTC Datasheet - production data Features    ACEPACK™ 1 power module  DBC Cu Al2O3 Cu Converter inverter brake topology  1600 V, very low drop rectifiers for converter  1200 V, 15 A IGBTs and diodes  VCE(sat): 1.95 V @ IC = 15 A  Soft and fast recovery diode Integrated NTC ACEPACK™ 1 Applications Figure 1: Internal electrical schematic   Inverters Motor drives Description This power module is a converter-inverter brake (CIB) topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate fieldstop technology from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz. Table 1: Device summary Order code Marking Package Leads type A1C15S12M3 A1C15S12M3 ACEPACK™ 1 Solder contact pins October 2017 DocID029292 Rev 5 This is information on a product in full production. 1/18 www.st.com Contents A1C15S12M3 Contents 1 Electrical ratings ............................................................................. 3 1.1 1.2 Inverter stage .................................................................................... 3 1.1.1 IGBTs.................................................................................................. 3 1.1.2 Diode .................................................................................................. 4 Brake stage ....................................................................................... 5 1.2.1 IGBT ................................................................................................... 5 1.2.2 Diode .................................................................................................. 7 1.3 Converter stage................................................................................. 7 1.4 NTC ................................................................................................... 8 1.5 Package ............................................................................................ 9 2 Electrical characteristics curves .................................................. 10 3 Test circuits ................................................................................... 13 4 Topology and pin description ...................................................... 14 5 Package information ..................................................................... 15 5.1 6 2/18 ACEPACK™ 1 CIB solder pins package information ...................... 16 Revision history ............................................................................ 17 DocID029292 Rev 5 A1C15S12M3 Electrical ratings 1 Electrical ratings 1.1 Inverter stage Limiting values at Tj = 25 °C, unless otherwise specified. 1.1.1 IGBTs Table 2: Absolute maximum ratings of the IGBTs, inverter stage Symbol VCES Description Collector-emitter voltage (VGE = 0) IC Continuous collector current at Tc = 100 °C Value Unit 1200 V 15 A ICP(1) Pulsed collector current (tP = 1 ms) 30 A VGE Gate-emitter voltage ± 20 V PTOT Total power dissipation IGBT (TJMAX = 175 °C) 142.8 W TJMAX Maximum junction temperature 175 °C -40 to 150 °C TJop Operative temperature range under switching conditions Notes: (1)Pulse width limited by maximum junction temperature. Table 3: Electrical characteristics of the IGBTs, inverter stage Symbol Parameter Test conditions Min. Typ. V(BR)CES Collector-emitter breakdown voltage VGE = 15 V, IC= 15 A 1.95 VCE(sat) Collector-emitter saturation voltage VGE = 15 V, IC = 15 A, TJ = 150 ˚C 2.3 VGE(th) Gate threshold voltage VCE = VGE, IC = 1 mA ICES Collector cut-off current IGES Gate-emitter leakage current Cies Input capacitance Coes Output capacitance Cres Reverse transfer capacitance Qg Total gate charge td(on) Turn-on delay time tr Current rise time Eon(1) Turn-on switching energy IC = 1 mA, VGE = 0 V Max. 1200 V V V V VGE = 0 V, VCE = 1200 V 100 μA VCE = 0 V, VGE = ± 20 V ±500 nA VCC = 960 V, IC = 15 A, VGE = ±15 V VCC = 600 V, IC = 15 A, RG = 22 Ω, VGE = ±15 V, di/dt = 820 A/µs DocID029292 Rev 5 6 2.45 7 VCE = 25 V, f = 1 MHz, VGE = 0 V 5 Unit 985 pF 118 pF 40 pF 71 nC 120 ns 14.5 ns 0.59 mJ 3/18 Electrical ratings A1C15S12M3 Symbol Parameter Test conditions Min. Turn-off delay time td(off) VCC = 600 V, IC = 15 A, R G = 22 Ω, VGE = ±15 V, dv/dt = 8200 V/µs; Current fall time tf Eoff(2) Turn-off switching energy td(on) Turn-on delay time tr Current rise time Eon(1) Turn-on switching energy td(off) Turn-off delay time VCC = 600 V, IC = 15 A, RG = 22 Ω, VGE = ±15 V, di/dt = 690 A/µs, TJ = 150 °C VCC = 600 V, IC = 15 A, RG = 22 Ω, VGE = ±15 V, dv/dt = 7000 V/µs, TJ = 150 °C Current fall time tf Turn-off switching energy Eoff(2) Typ. Unit 115 ns 84 ns 0.83 mJ 122 ns 17 ns 1.08 mJ 122 ns 146 ns 1.06 mJ Short-circuit withstand time VCC ≤ 600V, VGE ≤ 15 V, Tjstart ≤ 150 °C RTHj-c Thermal resistance junction to case each IGBT 0.95 RTHc-h Thermal resistance case to heatsink each IGBT, λgrease = 1 W/(m·°C) 0.90 tSC Max. 10 µs 1.05 °C/W °C/W Notes: (1) Including the reverse recovery of the diode. (2)Including 1.1.2 also the tail of the collector current. Diode Limiting values at Tj = 25 °C, unless otherwise specified. Table 4: Absolute maximum ratings of the diode, inverter stage Symbol VRRM Parameter Repetitive peak reverse voltage IF Unit 1200 V Continuous forward current at (TC = 100 °C) 15 A IFP(1) Pulsed forward current 30 A TJMAX Maximum junction temperature 175 °C -40 to 150 °C TJop Operative temperature range under switching conditions Notes: (1)Pulse 4/18 Value width limited by maximum junction temperature. DocID029292 Rev 5 A1C15S12M3 Electrical ratings Table 5: Electrical characteristics of the diode, inverter stage Symbol 1.2 Parameter Test conditions VF Forward voltage trr Reverse recovery time Qrr Reverse recovery charge Irrm Reverse recovery current Erec Reverse recovery energy trr Reverse recovery time Qrr Reverse recovery charge Irrm Reverse recovery current Erec Reverse recovery energy Min. Typ. Max. IF = 15 A - 3.0 3.8 IF = 15 A, TJ = 150 ˚C - 2.1 - 190 ns - 1.45 µC - 23 A - 0.55 mJ IF = 15 A, VR = 600 V, VGE = ±15 V, diF/dt = 690 A/μs, TJ = 150 °C - 400 ns - 2.75 µC - 25 A - 1.2 mJ IF = 15 A, VR = 600 V, VGE = ±15 V, diF/dt = 820 A/μs RTHj-c Thermal resistance junction to case Each diode - 1.60 RTHc-h Thermal resistance case to heatsink Each diode, λgrease = 1 W/(m·°C) - 1.15 1.75 Unit V °C/W °C/W Brake stage Limiting values at Tj= 25 °C, unless otherwise specified. 1.2.1 IGBT Table 6: Absolute maximum ratings of the IGBT, brake stage Symbol VCES Parameter Unit 1200 V Continuous collector current (Tc = 100 °C) 15 A ICP(1) Pulsed collector current 30 A VGE Gate-emitter voltage ±20 V PTOT Total power dissipation 142.8 W TJMAX Maximum junction temperature 175 °C -40 to 150 °C IC TJop Collector-emitter voltage (VGE = 0) Value Operative temperature range under switching conditions Notes: (1)Pulse width limited by maximum junction temperature. DocID029292 Rev 5 5/18 Electrical ratings A1C15S12M3 Table 7: Electrical characteristics of the IGBT, brake stage Symbol Parameter Test conditions Typ. Max. Unit V(BR)CES Collector-emitter breakdown voltage VCE(sat) Collector-emitter saturation voltage VGE(th) Gate threshold voltage VCE = VGE, IC = 1 mA 7 V ICES Collector cut-off current VGE = 0 V, VCE = 1200 V 100 µA IGES Gate-emitter leakage current VCE = 0 V, VGE = ±20 V ±500 nA Cies Input capacitance Coes Output capacitance Cres Reverse transfer capacitance Qg Total gate charge td(on) Turn-on delay time tr Current rise time Eon(1) Turn-on switching energy td(off) Turn-off delay time tf IC = 1 mA, VGE = 0 V Turn-off switching energy td(on) Turn-on delay time tr Current rise time Eon Turn-on switching energy td(off) Turn-off delay time 1200 V VGE = 15 V, IC = 15 A 1.95 VGE = 15 V, IC = 15 A, TJ = 150 ˚C 2.3 5 VCE = 25 V, f = 1MHz, VGE = 0 V VCC = 960 V, IC = 15 A, VGE = ±15 V VCC = 600 V, IC = 15 A, RG = 22 Ω, VGE = ±15 V, di/dt = 820 A/µs VCC = 600 V, IC = 15 A, RG = 22 Ω, VGE = ±15 V, dv/dt = 8200 V/µs; Current fall time Eoff(2) VCC = 600 V, IC = 15 A, RG = 22 Ω, VGE = ±15 V, di/dt = 690 A/µs, TJ = 150 °C 6 118 pF 40 pF 71 nC 120 ns 14.5 ns 0.59 mJ 115 ns 84 ns 0.83 mJ 122 ns 17 ns 1.08 mJ 122 ns 146 ns 1.06 mJ Turn-off switching energy tSC Short-circuit withstand time VCC ≤ 600 V, VGE ≤ 15 V, TJstart ≤ 150 °C RTHj-c Thermal resistance junction to case Each IGBT 0.95 RTHc-h Thermal resistance case to heatsink Each IGBT, λgrease = 1 W/(m·°C) 0.90 Notes: (1)Including the reverse recovery of the diode. (2)Including the tail of the collector current. DocID029292 Rev 5 V pF Eoff Current fall time 2.45 985 VCC = 600 V, IC = 15 A, RG = 22 Ω, VGE = ±15 V, dv/dt = 7000 V/µs, TJ = 150 °C tf 6/18 Min. 10 µs 1.05 °C/W °C/W A1C15S12M3 1.2.2 Electrical ratings Diode Table 8: Absolute maximum ratings of the diode, brake stage Symbol VRRM Parameter Repetitive peak reverse voltage IF Continuous forward current at (TC = 100 °C) Value Unit 1200 V 15 A IFP(1) Pulsed forward current 30 A TJMAX Maximum junction temperature 175 °C -40 to 150 °C TJop Operative temperature range under switching conditions Notes: (1)Pulse width limited by maximum junction temperature. Table 9: Electrical characteristics of the diode, brake stage Symbol Test conditions VF Forward voltage trr Reverse recovery time Qrr Reverse recovery charge Irrm Reverse recovery current Erec Reverse recovery energy trr 1.3 Parameter Min. Typ. Max. IF = 15 A - 3.0 3.8 IF = 15 A, TJ = 150 ˚C - 2.1 - 190 ns - 1.45 µC IF = 15 A, VR = 600 V, VGE = ±15 V, di/dt = 820 A/μs Reverse recovery time Qrr Reverse recovery charge Irrm Reverse recovery current Erec Reverse recovery energy IF = 15 A, VR = 600 V, VGE = ±15 V, di/dt = 690 A/μs, TJ = 150 °C Unit V - 23 A - 0.55 mJ - 400 ns - 2.75 µC - 25 A - 1.2 mJ RTHj-c Thermal resistance junction to case Each diode - 1.60 RTHc-h Thermal resistance case to heatsink Each diode, λgrease = 1 W/(m·°C) - 1.15 1.75 °C/W °C/W Converter stage Limiting values at Tj = 25 °C, unless otherwise specified. Table 10: Absolute maximum ratings of the bridge rectifiers Symbol VRRM IF IFSM I2 t TJMAX TJop Description Value Unit 1600 V RMS forward current 30 A Forward surge current tp = 10 ms, TC = 25 °C 315 Forward surge current tp = 10 ms, TC = 150 °C 250 tp = 10 ms, TC = 25 °C 496 tp = 10 ms, TC = 150 °C 312 Maximum junction temperature 175 °C -40 to 150 °C Repetitive peak reverse voltage Operative temperature range under switching conditions DocID029292 Rev 5 A A2 s 7/18 Electrical ratings A1C15S12M3 Table 11: Electrical characteristics of the bridge rectifiers Symbol 1.4 Parameter Test conditions Min. Typ. Max. IF = 15 A - 1.0 1.4 IF = 15 A, TJ = 150 ˚C - 0.9 VF Forward voltage IR Reverse current TJ = 150 ˚C, VR = 1600 V - 1 RTHj-c Thermal resistance junction to case Each diode - 1.20 RTHc-h Thermal resistance case to heatsink Each diode, λgrease = 1 W/(m·°C) - 1.15 Unit V mA 1.35 °C/W °C/W NTC Table 12: NTC temperature sensor, considered as stand-alone Symbol Parameter Test condition Typ. Max. Unit R25 Resistance T = 25 °C 5 kΩ R100 Resistance T = 100 °C 493 Ω ΔR/R Deviation of R100 B25/50 B-constant 3375 K B25/80 B-constant 3411 K T -5 Operating temperature range Figure 2: NTC resistance vs. temperature 8/18 Min. -40 +5 150 % °C Figure 3: NTC resistance vs. temperature, zoom DocID029292 Rev 5 A1C15S12M3 1.5 Electrical ratings Package Table 13: ACEPACK™ 1 package Symbol Parameter Min. Typ. Max. Unit 2500 V Visol Isolation voltage (AC voltage, t = 60 s) Md Screw mounting torque 40 80 Nm Tstg Storage temperature -40 125 °C CTI Comparative tracking index 200 Ls Stray inductance module P1 - EW loop 28.7 nH Rs Module lead resistance, terminal to chip 3.9 mΩ DocID029292 Rev 5 9/18 Electrical characteristics curves 2 A1C15S12M3 Electrical characteristics curves Figure 4: IGBT output characteristics (VGE = 15 V) Figure 5: IGBT output characteristics (TJ = 150 °C) Figure 6: IGBT transfer characteristics (VCE = 15 V) Figure 7: Switching energy vs. gate resistance Figure 8: Switching energy vs. collector current Figure 9: IGBT reverse biased safe operating area (RBSOA) 10/18 DocID029292 Rev 5 A1C15S12M3 Electrical characteristics curves Figure 10: Diode forward characteristics Figure 11: Diode reverse recovery energy vs. diode current slope Figure 12: Diode reverse recovery energy vs. forward current Figure 13: Diode reverse recovery energy vs. gate resistance Figure 14: Converter diode forward characteristics Figure 15: IGBT thermal impedance DocID029292 Rev 5 11/18 Electrical characteristics curves A1C15S12M3 Figure 16: Inverter diode thermal impedance 12/18 DocID029292 Rev 5 A1C15S12M3 3 Test circuits Test circuits Figure 17: Test circuit for inductive load switching C A Figure 18: Gate charge test circuit A L=100 µH G E B B 3.3 µF C G + RG 1000 µF VCC D.U.T E - AM01504v 1 Figure 19: Switching waveform Figure 20: Diode reverse recovery waveform DocID029292 Rev 5 13/18 Topology and pin description 4 A1C15S12M3 Topology and pin description Figure 21: Electrical topology and pin description P P1 G5 G3 G1 B T1 U L1 L2 V W GB L3 G6 G4 G2 T2 EU NB N EV EW Figure 22: Package top view with CIB pinout B L1 L2 L3 G5 W P NB P1 GB T1 N T2 G6 G3 EW V G4 EV G1 G2 U EU GIPD270320151420FSR 14/18 DocID029292 Rev 5 A1C15S12M3 5 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DocID029292 Rev 5 15/18 Package information 5.1 A1C15S12M3 ACEPACK™ 1 CIB solder pins package information Figure 23: ACEPACK™ 1 CIB solder pins package outline (dimensions are in mm) 32.00 25.60 B 22.40 P NB 19.20 P1 GB L1 L2 L3 G5 W 16.00 N T1 G6 T2 G3 EW V G4 12.80 9.60 EV G1 G2 U EU 6.40 3.20 0.00 15.5±0.50 □0.64±0.03 12±0.35 0.00 6.40 12.80 16.00 19.20 25.60 3.2 BSC 0.2 33.8±0.3 28.1±0.2 2.3 REF Section B-B 19.4±0.2 8.5 16.4±0.2 1.3±0.2 B Detail A 53±0.1 42.5±0.2 41±0.2 48±0.3 36.8 REF 62.8±0.5 3.2 BSC B 2.5±0.2 A A 3.5 REF x45° 4.5±0.1 GADG110720171247SA_8569715_2    16/18 The lead size includes the thickness of the lead plating material. Dimensions do not include mold protrusion. Package dimensions do not include any eventual metal burrs. DocID029292 Rev 5 A1C15S12M3 6 Revision history Revision history Table 14: Document revision history Date Revision 02-May-2016 1 Initial release. 2 Added Section 2: "Electrical characteristics curves" and Section 3: "Test circuits". Updated Section 5.1: "ACEPACK™ 1 CIB solder pins package information". Minor text changes. 10-Mar-2017 26-Jul-2017 3 24-Aug-2017 4 05-Oct-2017 5 Changes Datasheet promoted from production data to preliminary data. Modified Table 2: "Absolute maximum ratings of the IGBTs, inverter stage", Table 3: "Electrical characteristics of the IGBTs, inverter stage", Table 6: "Absolute maximum ratings of the IGBT, brake stage", Table 7: "Electrical characteristics of the IGBT, brake stage", Table 4: "Absolute maximum ratings of the diode, inverter stage", Table 5: "Electrical characteristics of the diode, inverter stage", Table 10: "Absolute maximum ratings of the bridge rectifiers", Table 11: "Electrical characteristics of the bridge rectifiers", Table 12: "NTC temperature sensor, considered as stand-alone", Table 13: "ACEPACK™ 1 package". Modified Figure 10: "IGBT thermal impedance" and. Modified Figure 22: "Package top view with CIB pinout". Modified Section 5: "Package information". Minor text changes. Updated Table 3: "Electrical characteristics of the IGBTs, inverter stage", Table 5: "Electrical characteristics of the diode, inverter stage", Table 7: "Electrical characteristics of the IGBT, brake stage", Table 9: "Electrical characteristics of the diode, brake stage", Table 11: "Electrical characteristics of the bridge rectifiers", Section 2: "Electrical characteristics curves". Minor text changes. Updated Table 13: "ACEPACK™ 1 package", Figure 15: "IGBT thermal impedance" and Figure 16: "Inverter diode thermal impedance". Minor text changes. DocID029292 Rev 5 17/18 A1C15S12M3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 18/18 DocID029292 Rev 5
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A1C15S12M3

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