ACST4

ACST4 AC power switch Main applications ■ ■ AC static switching in appliance control systems Drive of low power high inductive or resistive loads like – spray pump in dishwashers – an in air-conditioners OUT G COM G OUT COM DPAK ACST4-7SB/CB OUT TO-220FPAB ACST4-7SFP/CFP Features ■ ■ ■ ■ ■ ■ ■ Blocking voltage: VDRM /VRRM = ±700 V Avalanche controlled: VCL typ = 1100 V Nominal conducting current : IT(RMS) = 4 A High surge current capability: 30 A for 20 ms full wave Gate triggering current: IGT < 10 mA or 25 mA Switch integrated driver High noise immunity: static dV/dt > 500 V/µs Figure 1. Functional diagram OUT G OUT COM IPAK ACST4-7SH/CH Benefits ■ ■ ■ ■ ■ ■ Enables equipment to meet IEC 61000-4-5 High off-state reliability with planar technology No external overvoltage protection needed Reduces the power component factor Interfaces directly with the microcontroller Direct interface with the microcontroller for the ACST4-7S (IGT < 10 mA) COM G Description The ACST4 belongs to the AC power switch family built around the ASD™ technology. This high performance device is adapted to home appliances or inductrial systems and drives loads up to 4 A. The ACS™ switch embeds a Triac structure with a high voltage clamping device to absorb the inductive turn-off energy and withstand line transients such as those described in the IEC 61000-4-5 standards. TM: ASD and ACS are trademarks of STMicroelectronics. July 2007 Rev 4 1/13 www.st.com Characteristics ACST4 1 Table 1. Symbol VDRM/VRRM IT(RMS) Characteristics Absolute ratings (limiting values) For either positive or negative polarity of pin OUT voltage in respect to pin COM voltage Parameter Repetitive peak off-state voltage RMS on-state current full cycle sine wave 50 to 60 Hz DPAK, IPAK Tj = -10° C Tc = 110° C Value 700 4 30 33 6.4 50 2 - 40 to + 150 - 30 to + 125 260 Unit V A A A A2 s A/μs kV °C °C °C TO-220FPAB Tc = 100° C F = 50 Hz F = 60 Hz tp = 10 ms F = 120 Hz Non repetitive surge peak on-state current ITSM It dI/dt VPP Tstg Tj Tl 2 Tj initial = 25° C, full cycle sine wave Fusing capability Repetitive on-state current critical rate of Tj = 125° C rise IG = 10 mA (tr < 100 ns) Non repetitive line peak pulse voltage(1) Storage temperature range Operating junction temperature range Maximum lead soldering temperature during 10 s 1. according to test described by IEC 61000-4-5 standard and Figure 3. Table 2. Symbol PG(AV) PGM IGM Gate characteristics (maximum values) Parameter Average gate power dissipation Peak gate power dissipation (tp = 20 µs) Peak gate current (tp = 20 µs) Value 0.1 10 1 Unit W A V Table 3. Symbol Rth (j-a) Thermal resistances Parameter S(1) = 0.5 cm2 Junction to ambient TO-220FPAB Junction to tab/lead for full cycle sine wave conduction DPAK, IPAK TO-220FPAB 60 2.6 4.6 ° C/W ° C/W ° C/W DPAK, IPAK Value 70 Unit ° C/W Rth (j-l) 1. S = Copper surface under Tab 2/13 ACST4 Table 4. Parameter description Parameter description Triggering gate current Triggering gate voltage Non-triggering gate voltage Holding current Latching current Peak on-state voltage drop On state threshold voltage On state dynamic resistance Maximum forward or reverse leakage current Critical rate of rise of off-state voltage Critical rate of rise of commutating off-state voltage Critical rate of decrease of commutating on-state current Clamping voltage Clamping current Characteristics Parameter symbol IGT VGT VGD IH IL VTM VTO Rd IDRM / IRRM dV/dt (dV/dt)c (dI/dt)c VCL ICL Table 5. Symbol IGT VGT VGD IH IL VTM VTO Rd IDRM / IRRM dV/dt (dI/dt)c VCL Electrical characteristics For either positive or negative polary of pin OUT voltage respect to pin COM voltage Test conditions VOUT = 12 V DC RL = 33 Ω VOUT = 12 V DC RL = 33 Ω VOUT = VDRM IOUT = 100 mA IG = 2 x IGtmax IOUT = 5.6 A tp = 380 µs QI - QII - QIII Tj = 25° C QI - QII - QIII Tj = 25° C RL = 3.3 Ω Gate open Tj = 125° C Tj = 25° C Tj = 25° C Tj = 25° C Tj = 125° C Tj = 125° C Tj = 25° C VOUT = 700 V VOUT = 460 V (dI/dt)c = 15 V/ µs ICL = 1mA tp = 1ms Gate open Tj = 125° C Tj = 110° C Tj = 125° C Tj = 25° C MAX MAX MIN MAX MAX MAX MAX MAX MAX MAX MIN MIN TYP 200 2.0 1100 20 40 1.5 0.90 100 10 µA 500 500 2.5 V/µs A/ms V ACST4-7S 10 1 0.2 35 60 ACST4-7C 25 1.1 Unit mA V V mA mA V V mΩ 3/13 AC line switch basic application ACST4 2 AC line switch basic application The ACST4 device has been designed to switch on and off low power, but highly inductive or resistive loads such as dishwashers spray pumps, and air-conditioners fan. ■ ■ ■ Pin COM: Common drive reference to connect to the power line neutral Pin G: Switch Gate input to connect to the digital controller Pin OUT: Switch Output to connect to the load ACST4-7S triggering current has to be sunk from the gate pin G. The switch can then be driven directly by logic level circuits through a resistor as shown on the typical application diagram . Thanks to its thermal and turn off commutation performances, the ACST4 switch is able to drive with no turn off additional snubber an inductive load up to 4 A. Figure 2. Typical application diagram LOAD L L AC MAINS R N OUT OUT M ACST4 COM G ST72 MCU - Vcc 4/13 ACST4 AC line transient voltage ruggedness 3 AC line transient voltage ruggedness The ACST4 switch is able to sustain safely the AC line transient voltages either by clamping the low energy spikes or by breaking over under high energy shocks, even with high turn-on current rises. The test circuit of the Figure 6. is representative of the final ACST application and is also used to stress the ACST switch according to the IEC 61000-4-5 standard conditions. Thanks to the load, the ACST switch sustains the voltage spikes up to 2 kV above the peak line voltage. It will break over safely even on resistive load where the turn on current rate of rise, is as high as shown on Figure 7. Such non-repetitive test can be done 10 times on each AC line voltage polarity. Figure 3. Overvoltage ruggedness test circuit for resistive and inductive loads according to IEC 61000-4-5 standards. R = 150 Ω, L = 10 µH, VPP = 2 kV. Figure 4. Current and voltage of the ACST4 during IEC 61000-4-5 standard test with R, L and VPP. R L OUT ACST4 SURGE VOLTAGE AC LINE & GENERATOR VAC + V PP COM G RG = 220Ω Figure 5. P(W) 5.0 4.5 4.0 3.5 3.0 α=180° Maximum power dissipation versus Figure 6. RMS on-state current. IT(RMS)(A) 4.5 4.0 3.5 RMS on-state current versus case temperature. DPAK IPAK TO-220FPAB 3.0 2.5 2.5 2.0 2.0 1.5 180° 1.5 1.0 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 α IT(RMS)(A) α 1.0 0.5 0.0 α=180° Tc(°C) 25 50 75 100 125 3.5 4.0 0 5/13 AC line transient voltage ruggedness ACST4 Figure 7. RMS on-state current versus ambient temperature. Figure 8. Relative variation of thermal impedance versus pulse duration. IT(RMS)(A) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 25 50 75 100 125 0.10 α=180° Printed circuit board FR4 Natural convection S=0.5cm² K = [Zth/Rth] 1.00 DPAK IPAK Zth(j-c) TO-220FPAB DPAK IPAK Zth(j-a) TO-220FPAB Tamb(°C) 0.01 1.E-02 1.E-01 1.E+00 tp(s) 1.E+01 1.E+02 1.E+03 Figure 9. Relative variation of gate trigger current, holding current and latching versus junction temperature (typical values). Figure 10. Relative variation of static dV/dt versus junction temperature. IGT, IH, IL [Tj] / IGT, IH, IL [Tj = 25°C] 3.0 2.5 IGT dV/dt [Tj] / dV/dt [Tj = 125°C] 8 Vout=460V 7 6 5 4 3 IL & I H 2.0 1.5 1.0 0.5 2 Tj(°C) 0.0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 1 0 25 50 Tj(°C) 75 100 125 Figure 11. Relative variation of critical rate of decrease of main current versus reapplied dV/dt (typical values). (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 1.2 Vout=300V Figure 12. Relative variation of critical rate of decrease of main current versus reapplied dV/dt (typical values). (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 1.2 Vout=300V 1.0 0.8 0.6 0.4 0.2 0.0 0 10 20 30 40 50 60 70 80 90 100 1.0 0.8 0.6 0.4 0.2 ACST4-7C ACST4-7S (dV/dt)c(V/µs) 0.0 0 5 10 15 (dV/dt)c(V/µs) 20 25 30 35 40 45 50 6/13 ACST4 AC line transient voltage ruggedness Figure 13. Relative variation of critical rate of decrease of main current versus junction temperature. (dI/dt)c [Tj] / (dI/dt)c [Tj = 125°C] 6 Vout=300V Figure 14. Surge peak on-state current versus number of cycles. ITSM(A) 35 30 25 Non repetitive Tj initial=25°C t=20ms 5 4 20 3 15 2 10 5 Repetitive TC=100°C 1 Tj(°C) 0 25 50 75 100 125 Number of cycles 0 1 10 100 1000 Figure 15. Non repetitive surge peak on-state Figure 16. On-state characteristics (maximum values). current for a sinusoidal pulse with width tp < 10 ms, and corresponding value of I2t. ITSM(A), I²t (A²s) 1000 dI/dt limitation: 50A/µs Tj initial=25°C ITM(A) 100.00 Tj max. : Vto= 0.90 V Rd= 100 mΩ 100 ITSM 10.00 Tj=125°C 10 I²t 1.00 Tj=25°C tp(ms) 1 0.01 0.10 1.00 10.00 0.10 0.0 0.5 1.0 1.5 2.0 VTM(V) 2.5 3.0 3.5 4.0 4.5 5.0 Figure 17. Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm). Rth(j-a)(°C/W) 100 90 80 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40 DPAK IPAK S(cm²) 7/13 Ordering information scheme ACST4 4 Ordering information scheme Figure 18. Ordering information scheme ACST 4 - 7 AC Switch series Current 4 = 4 ARMS Voltage 7 = 700 V Gate sensitivity S = 10 mA C = 25 mA Package B = DPAK H = IPAK FP = TO-220FPAB X X 8/13 ACST4 Package information 5 Package information ● ● Epoxy meets UL94, V0 Recommended torque values 0.4 to 0.6 Nm DPAK dimensions Dimensions Ref. Millimeters Min. A E B2 C2 L2 A Table 6. Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 A1 A2 B B2 D H L4 B G A1 R C C2 R C D E A2 0.60 MIN. G H V2 L2 L4 V2 0.80 typ. 0.60 0° 1.00 8° 0.031 typ. 0.023 0° 0.039 8° Figure 19. Footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 9/13 Package information Table 7. IPAK dimensions Dimensions Ref. Millimeters Min. A A1 A3 A E B2 L2 C2 ACST4 Inches Min. Typ. Max. 0.094 0.043 0.051 0.035 0.212 0.037 0.035 Typ. Max. 2.20 0.90 0.70 0.64 5.20 2.40 0.086 1.10 0.035 1.30 0.027 0.90 0.025 5.40 0.204 0.95 0.30 B B2 B3 B5 D C C2 0.45 0.48 6 6.40 2.28 4.40 16.10 9 0.8 0.80 10° 0.60 0.017 0.60 0.019 6.20 0.236 6.60 0.252 0.090 4.60 0.173 0.634 9.40 0.354 1.20 0.031 1 0.023 0.023 0.244 0.260 H L L1 B3 B V1 A1 D E e C A3 e G B5 G H L L1 L2 V1 0.181 0.370 0.047 0.031 0.039 10° 10/13 ACST4 Table 8. TO-220FPAB dimensions Package information Dimensions Ref. Millimeters Min. A A H B Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 B D E Dia L6 L2 L3 L5 F1 L4 F2 D L7 F F1 F2 G G1 H L2 E 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G L3 L4 L5 L6 L7 Dia. In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 11/13 Ordering information ACST4 6 Ordering information Table 9. Ordering information Marking ACST47S ACST47S ACST47S ACST47S ACST47C ACST47C ACST47C ACST47C Package DPAK DPAK IPAK TO-220FPAB DPAK DPAK IPAK TO-220FPAB Weight 0.3 g 0.3 g 0.4 g 2.4 g 0.3 g 0.3 g 0.4 g 2.4 g Base qty 75 2500 75 50 75 2500 75 50 Packing mode Tube Tape and reel Tube Tube Tube Tape and reel Tube Tube Part number ACST4-7SB ACST4-7SB-TR ACST4-7SH ACST4-7SFP ACST4-7CB ACST4-7CB-TR ACST4-7CH ACST4-7CFP 7 Revision history Table 10. Date Jan-2003 04-Jul-2007 Revision history Revision 3A 4 Previous update Reformatted to current standard. Added IPAK package Changes 12/13 ACST4 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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