BAL-CC1101-01D3

BAL-CC1101-01D3 50 ohm nominal input / conjugate match balun to CC1101 / CC1150 (868-928 MHz), with integrated harmonic filter Datasheet  production data Description STMicroelectronics BAL-CC1101-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC1101 / CC1150 TI transceiver. It’s a design using STMicroelectronics IPD (integrated passive device) technology on nonconductive glass substrate to optimize RF performance. Flip-Chip package 4 bumps Figure 1. Application schematic Features  50 Ω nominal input / conjugate match to CC1101 / CC1150 BAL-CC1101-01D3  Low insertion loss CC1101 CC1150  Low amplitude imbalance  Low phase imbalance Z Harmonic filter  Coated Flip-Chip on glass  Small footprint: < 2.1 mm² Benefits  Extremely low profile (< 550 µm after reflow)  High RF performance  RF BOM and area reduction May 2016 This is information on a product in full production. DocID025629 Rev 3 1/10 www.st.com 10 Characteristics 1 BAL-CC1101-01D3 Characteristics Table 1. Absolute maximum rating (limiting values) Symbol PIN VESD TOP Parameter Input power RFIN Value Unit 20 dBm ESD ratings human body model (JESD22-A114C), all I/O one at a time while others connected to GND 2000 ESD ratings machine model, all I/O 500 ESD ratings charged device model (JESD22-C101D) 500 Operating temperature V -40 to +125 ºC Table 2. Electrical characteristics - RF performance (Tamb = 25 °C) Value Symbol Parameter Unit Min. ZOUT ZIN Typ. Max. Conjugate match to CC1101 / CC1150 Nominal differential output impedance Nominal input impedance Ω 50 F Frequency range (bandwidth) IL Insertion loss in bandwidth 1.7 Single ended return loss in bandwidth 15 dB 15 dB RL_SE 779 RL_DIFF Differential ended return loss in bandwidth 928 MHz 1.9 dB imb Phase imbalance -10 10 ° Aimb Amplitude imbalance -1 1 dB Att 2/10 Harmonic levels (TX filter) Attenuation at 2fo Attenuation at 3fo -25 -50 DocID025629 Rev 3 dB BAL-CC1101-01D3 1.1 Characteristics Measurements Figure 2. Transmission (S21) 0.0 Figure 3. Insertion loss in band S21 (dB) 0.0 IL (dB) -0.5 -20 -1.0 -1.5 -40 -2.0 -60 -2.5 F (MHz) F (GHz) -80 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 -3.0 780 Figure 4. Return loss single-ended 0 800 820 840 860 880 900 920 930 Figure 5. Return loss differential RL-SE (dB) 0 RL-DIFF (dB) -5 -10 -10 -20 -15 -20 -30 -25 F (MHz) F (MHz) -40 780 800 820 840 860 880 900 920 930 -30 780 800 Figure 6. Phase imbalance 10 820 840 860 880 900 920 930 Figure 7. Amplitude imbalance Φimb (dB) 1.0 Aimb (dB) 0.8 0.6 8 0.4 6 0.2 4 -0.2 2 -0.6 0.0 -0.4 F (MHz) 0 780 800 820 840 860 880 900 920 930 -0.8 -1.0 780 F (MHz) 800 DocID025629 Rev 3 820 840 860 880 900 920 930 3/10 Characteristics BAL-CC1101-01D3 Figure 8. H2 attenuation Figure 9. H3 attenuation 2f0 (dB) 0.0 0.0 -20 -20 -40 -40 -60 -60 F (GHz) -80 1.558 4/10 1.608 1.658 1.708 1.758 1.808 1.858 3f0 (dB) F (GHz) -80 2.337 2.387 DocID025629 Rev 3 2.437 2.487 2.537 2.587 2.637 2.687 2.737 2.784 BAL-CC1101-01D3 2 Package information Package information  Epoxy meets UL94, V0  Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Flip-Chip package information Figure 10. Flip-Chip package outline 2ULHQWDWLRQPDUNLQJ —P I( $ I( ' ',)) *1' *1' ',)) ( 6( 6( —P ( 2.1 ' E Table 3. Flip-Chip package mechanical data Description Parameter Min. Typ. Max. Unit A Bump height + substrate thickness 0.570 0.630 0.690 mm b Bump diameter 0.215 0.255 0.295 mm D Y dimension of the die 1.970 2.020 2.070 mm D1 Y pitch 1.200 E X dimension of the die E1 X pitch fE Distance from bump to edge of die on X axis 1.000 1.050 mm 1.100 0.500 DocID025629 Rev 3 mm mm 0.225 mm 5/10 Package information BAL-CC1101-01D3 Figure 11. Footprint - 3 mils stencil -non solder mask defined &RSSHUSDGGLDPHWHU —PUHFRPPHQGHG —PPLQLPXP —PPD[LPXP 6ROGHUPDVNRSHQLQJ —PUHFRPPHQGHG —PPLQLPXP —PPD[LPXP 6ROGHUPDVNRSHQLQJ —PUHFRPPHQGHG —PPLQLPXP —PPD[LPXP &RSSHUSDGGLDPHWHU —PUHFRPPHQGHG —PPLQLPXP 6ROGHUVWHQFLORSHQLQJ —PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ —PUHFRPPHQGHG Figure 13. Footprint - 5 mils stencil -non solder mask defined Figure 14. Footprint - 5 mils stencil - solder mask defined &RSSHUSDGGLDPHWHU —PUHFRPPHQGHG —PPLQLPXP —PPD[LPXP 6ROGHUPDVNRSHQLQJ —PUHFRPPHQGHG —PPLQLPXP —PPD[LPXP 6ROGHUPDVNRSHQLQJ —PUHFRPPHQGHG —PPLQLPXP —PPD[LPXP &RSSHUSDGGLDPHWHU —PUHFRPPHQGHG —PPLQLPXP 6ROGHUVWHQFLORSHQLQJ —PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ —PUHFRPPHQGHG GHSHQGLQJRQSDVWHLWFDQJRGRZQWR—P 6/10 Figure 12. Footprint - 3 mils stencil - solder mask defined GHSHQGLQJRQSDVWHLWFDQJRGRZQWR—P DocID025629 Rev 3 BAL-CC1101-01D3 Package information Figure 15. PCB view CC1101 with BAL-CC1101-01D3 Top 220 µm diameter SMT 320 µm diameter 1400 µm Figure 16. Marking Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode (y = year, ww = week) x x z y ww DocID025629 Rev 3 7/10 Package information BAL-CC1101-01D3 Figure 17. Flip Chip tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 8.0 3.5 2.19 1.75 0.20 1.14 4.0 0.71 All dimensions are typical values in mm Note: User direction of unreeling More information is available in the STMicroelectronics Application note: AN2348 Flip-Chip: “Package description and recommendations for use” 8/10 DocID025629 Rev 3 BAL-CC1101-01D3 3 Ordering information Ordering information Table 4. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode BAL-CC1101-01D3 SS Flip-Chip 2.21 mg 5000 Tape and reel (7”) Revision history Table 5. Document revision history Date Revision Changes 23-Jan-2014 1 Initial release 18-Sep-2015 2 Updated Figure 10. Added Figure 11, Figure 12, Figure 13, Figure 14 and Table 3. 02-May-2016 3 Updated Figure 10 and Table 3. DocID025629 Rev 3 9/10 BAL-CC1101-01D3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 10/10 DocID025629 Rev 3