BAL-NRF01D3

BAL-NRF01D3 50 Ω nominal input / conjugate match balun to nRF51422-QFAA, nRF24LE1, nRF51822-QFAA/AB, with integrated harmonic filter Datasheet - production data Description Lead-free Flip-Chip (5 bumps) package The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance. Features      STMicroelectronics BAL-NRF01D3 is an ultraminiature balun. The device integrates matching network and harmonics filter. Matching impedance has been customized for the following Nordic Semiconductor circuits: nRF24LE1 QFN32 pins, nRF24AP2-1CH, nRF24AP2-8CH, nRF51422-QFAA (build code CA/C0), nRF51822-QFAA (build code CA/C0) and nRF51822-QFAB (build code AA/A0). 50 Ω nominal input / conjugate match to Nordic Semiconductor chips nRF24LE1 QFN32, nRF24AP2-1CH, nRF24AP2-8CH, nRF51422-QFAA (build code CA/C0), nRF51822-QFAA (build code CA/C0) and nRF51822-QFAB (build code AA/A0) Low insertion loss Low amplitude imbalance Low phase imbalance Small footprint < 1.5 mm2 The BAL-NRF01D3 has been tested and approved by Nordic Semiconductor in their nRF2723 and nRF2752 nRFgo modules. Figure 1: Application schematic 3 DIFF 2 1 A GND SE Benefits    Very low profile < 595 μm after reflow High RF performance RF BOM and area reduction DIFF VCC B C Applications   2.45 GHz impedance matched balun filter Optimized for Nordic's chip set nRF24LE1/AP2, nRF51422-QFAA (build code CA/C0), nRF51822-QFAA (build code CA/C0) and nRF51822-QFAB (build code AA/A0) June 2017 DocID023215 Rev 7 This is information on a product in full production. 1/10 www.st.com Characteristics 1 BAL-NRF01D3 Characteristics Table 1: Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min. PIN VESD TOP Typ. Max. - 20 Input power RFIN ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 Ω, air discharge) 2000 ESD ratings charge device model (JESD22-C101-C) 500 ESD ratings machine model (MM: C = 200 pF, R = 25 W, L = 500 nH) 200 - Operating temperature -40 - dBm V +105 °C Table 2: Impedances (Tamb = 25 °C) Value Symbol Parameter Unit Min. Typ. Max. - Ω - Ω ZOUT Nominal differential output impedance - Conjugate match to: nRF24LE1/AP2 nRF51422-QFAA (build code CA/C0) nRF51822-QFAA (build code CA/C0) nRF51822-QFAB (build code AA/A0) ZIN Nominal input impedance - 50 Table 3: RF performance (Tamb = 25 °C) Value Symbol Parameter Test condition Unit Min. 2/10 F Frequency range (bandwidth) 2400 2540 Typ. 2400 Max. 2540 MHz IL Insertion loss in bandwidth 2.25 dB RL Return loss in bandwidth 10 dB ɸimb Phase imbalance 3 ° Aimb Amplitude imbalance 0.1 dB 2f0 2nd harmonic filtering 4880 MHz 10 dB 3f0 3rd harmonic filtering 7320 MHz 20 dB DocID023215 Rev 7 BAL-NRF01D3 1.1 Characteristics RF measurement Figure 2: Transmission (Tamb = 25 °C) Figure 3: Return loss on SE port (Tamb = 25 °C) Figure 4: Return loss on DIFF port (Tamb = 25 °C) Figure 5: Amplitude imbalance (Tamb = 25 °C) Figure 6: Phase imbalance (Tamb = 25 °C) DocID023215 Rev 7 3/10 Application information 2 BAL-NRF01D3 Application information Figure 7: Application schematic (courtesy of Nordic Semiconductor) BAL-NRF01D3 Figure 8: nRF2723 application board (courtesy of Nordic Semiconductor) 4/10 DocID023215 Rev 7 Application information BAL-NRF01D3 Figure 9: nRF2752 application board (courtesy of Nordic Semiconductor) BAL-NRF01D3 DocID023215 Rev 7 5/10 Package information 3 BAL-NRF01D3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   3.1 Epoxy meets UL94, V0 Lead-free package Flip-Chip 5 bumps package information Figure 10: Flip-Chip 5 bumps package outline X B1 T GND D Y B DIFF SE B2 VCC B1 DIFF A1 A A2 A1 T1 H Table 4: Flip-Chip 5 bumps dimensions Parameter 6/10 Description Min. Typ. Max. Unit X X dimension of the die 1445 1485 1525 mm Y Y dimension of the die 980 1020 1060 mm A X pitch 604 mm B Y pitch 500 mm A1 Distance from bump to edge of die on X axis 224 mm B1 Distance from bump to edge of die on Y axis 260 mm A2 Distance from VCC bump to SE bump on X axis 433 mm B2 Distance from bump to edge of die on Y axis 510 mm C GND, VCC bump to SE bump pitch 500 mm D Bump diameter T1 Substrate thickness 425 mm H Bump height 205 mm T Total die thickness 240 DocID023215 Rev 7 570 255 630 260 690 mm Package information BAL-NRF01D3 Figure 11: Footprint - 3 mils stencil -non solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Copper pad diameter: 320 µm recommended 300 µm minimum Solder stencil opening: 220 µm recommended Solder stencil opening: 220 µm recommended Figure 13: Footprint - 5 mils stencil -non solder mask defined Figure 14: Footprint - 5 mils stencil - solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Copper pad diameter: 320 µm recommended 300 µm minimum Solder stencil opening: 330 µm recommended* Solder stencil opening: 330 µm recommended* *depending on paste, it can go down to 270 µm 3.2 Figure 12: Footprint - 3 mils stencil - solder mask defined *depending on paste, it can go down to 270 µm Flip-chip 5 bumps packing information Figure 15: Marking Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode DocID023215 Rev 7 x x z y ww 7/10 Package information BAL-NRF01D3 Figure 16: Flip Chip tape and reel specifications More packing information is available in the application note:   8/10 AN2348 Flip-Chip: “Package description and recommendations for use” AN4111: “BAL-NRF01D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers” DocID023215 Rev 7 Ordering information BAL-NRF01D3 4 Ordering information Table 5: Ordering information 5 Order code Marking Package Weight Base qty. Delivery mode BAL-NRF01D3 SC Flip-Chip package (5 bumps) 1.82 mg 5000 Tape and reel Revision history Table 6: Document revision history Date Revision Changes 15-Oct-2012 1 First issue. 13-Nov-2012 2 Added references to nRF51 series. Added Figure 9. Updated y-axis labels in Figure 2. 04-Mar-2013 3 Updated footprint illustrations in Figure 13, and Figure 14. 06-Aug-2013 4 Added dimensions in Figure 10. Updated marking orientation in Figure 11 and Figure 12. 13-Jan-2014 5 Updated document title and product references. 07-Jul-2015 6 Updated Table 1. 21-Jun-2017 7 Updated Figure 10: "Flip-Chip 5 bumps package outline" and Table 4: "Flip-Chip 5 bumps dimensions". DocID023215 Rev 7 9/10 BAL-NRF01D3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 10/10 DocID023215 Rev 7