BALF-ATM-01E3

BALF-ATM-01E3 50 ohms / matched to ATSAMR21E18 balun transformer, with integrated harmonic filter Datasheet - production data Description The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a nonconductive glass substrate to optimize RF performance. Coated CSP on glass bumpless Figure 1: Pin configuration (pad view) Features        2.4 – 2.5 GHz balun with integrated matching network Matching optimized for following chipsets: ATSAMR21E18 Low insertion loss Low amplitude imbalance Low phase imbalance Coated CSP on glass bumpless Small footprint 2.5 mm² BAL+ GND GND BAL- GND SE PAD VIEW Benefits      Very low profile High RF performance PCB space saving versus discrete solution BOM count reduction Efficient manufacturability June 2017 DocID030654 Rev 1 This is information on a product in full production. 1/12 www.st.com Characteristics 1 BALF-ATM-01E3 Characteristics Table 1: Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min. PIN VESD TOP Input power RFIN Typ. Max. - 4 ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 Ω, air discharge) 2000 ESD ratings machine model (MM: C = 200 pF, R = 25 W, L = 500 nH) 500 - Operating temperature -40 - dBm V +105 °C Table 2: Electrical characteristics (Tamb = 25 °C) Value Symbol Parameter Unit Min. ZOUT ZIN 2/12 Nominal differential output impedance Typ. Max. Conjugate match to ATSAMR21E18 Ω 50 Nominal input impedance f Frequency range (bandwidth) IL Insertion loss at 2.45 GHz RL Single ended side at 2.45 GHz 15 26.3 dB RL Differential side at 2.45 GHz 15 26.1 dB ɸimb Phase imbalance at 2.45 GHz -9 0 9 ° Aimb Amplitude imbalance at 2.45 GHz -0.4 0 0.4 dB H2 Harmonic 2 attenuation at 4.9 GHz 20 35 dB H3 Harmonic 3 attenuation at 7.35 GHz 20 25 dB DocID030654 Rev 1 2400 Ω 0.91 2500 MHz 1.3 dB BALF-ATM-01E3 1.1 Characteristics RF measurement Figure 2: Transmission (dB) Figure 3: Insertion loss (dB) Transmission (dB) (dB) 0 0.0 -0.2 -10 -0.4 -20 -0.6 -0.8 -30 -1.0 -40 -1.2 F(GHz) -50 0 2 4 6 8 F(GHz) -1.4 10 2.40 2.41 2.42 2.43 2.44 2.45 Figure 4: H2 attenuation (dB) 2.46 2.47 2.48 2.49 2.50 Figure 5: H3 attenuation (dB) H2 (dB) H3 (dB) 0 0 -10 -10 -20 -20 -30 -30 -40 -40 F(GHz) -50 4.80 4.82 4.84 4.86 4.88 4.90 4.92 4.94 4.96 4.98 5.00 F(GHz) -50 7.20 Figure 6: Return Loss SE (dB) 7.25 7.30 7.35 7.40 7.45 7.50 Figure 7: Return Loss diff (dB) Return loss SE (dB) 0 0 Return loss diff (dB) -10 -10 -20 -20 -30 -30 -40 F(GHz) 2.40 2.41 2.42 2.43 2.44 2.45 F(GHz) -50 -40 2.46 2.47 2.48 2.49 2.50 2.40 DocID030654 Rev 1 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 3/12 Characteristics BALF-ATM-01E3 Figure 8: Amplitude imbalance (dB) Figure 9: Phase imbalance (°) 1.0 Amplitude imbalance (dB) 0.8 15 Phase imbalance (°) 0.6 10 0.4 0.2 5 -0.0 0 -0.2 -0.4 -5 -0.6 -10 -0.8 F(GHz) -1.0 2.40 4/12 F(GHz) -15 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 2.40 DocID030654 Rev 1 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Application schematic BALF-ATM-01E3 Application schematic PB22 PB23 PA27 RESETN PA28 GND VDDCORE PA00 VDDIN SWCLK SWDIO PB02 PB03 Figure 10: Application schematic VDDIO PA01 GND GND XTAL2 USB_DP XTAL1 USB_DM AGND PA23 AVDD PA22 ATSAMR21E18 AVDDOUT VDDOUT 4 PA16 PA15 RFN RFP PA07 RFCTRL4 PA17 RFCTRL3 PA06 RFCTRL2 PA18 AGND_RFN PA05 AGND_RFP PA19 RFCTRL1 PA04 RFCTRL0 GND GND AGND VDDIO 2 3 BALFATM01E3 2 5 6 Antenna (50Ω) 1 DocID030654 Rev 1 5/12 Package information 3 BALF-ATM-01E3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 3.1 Coated CSP on glass bumpless package information Figure 11: Coated CSP on glass bumpless package outline T L c W a d b PAD VIEW Table 3: Coated CSP on glass bumpless dimensions Dimensions (in mm) Parameter 6/12 Min. Typ. Max. L 1.900 2.000 2.100 W 1.150 1.250 1.350 T 0.395 0.425 0.455 a 0.200 b 0.200 c 0.884 d 0.650 DocID030654 Rev 1 Package information BALF-ATM-01E3 Figure 12: Recommended balun land pattern 350µm Figure 13: PCB stackup Solder resist: 20 µm 180µm Finished copper: 85 µm (copper 70 µm + plating 15 µm) SE 1000µm GND BAL- 1000µm 300µm 180µm 800µm 200µm 300µm 200µm 600µm GND GND BAL+ 180µm GND plane Prepreg: 180 µm Copper: 35 µm Figure 14: Marking Figure 15: Pad bottom view ECOPACK grade BAL+ GND GND BAL- GND SE XX: marking X X Z y w w Z: manufacturing location yww: datecode PAD VIEW Table 4: Pin description Description Pad# Name 1 SE 2, 5, 6 GND Ground connection 3 BAL- Balun differential negative pin 4 BAL+ Balun differential positive pin Single ended antenna connection DocID030654 Rev 1 7/12 Package information 3.2 BALF-ATM-01E3 Coated CSP on glass bumpless packing information Figure 16: Tape mechanical data P0 Ø D0 F W + K0 + + P1 + P2 Ø D1 User direction of unreeling Note: Pocket dimensions are not on scale Pocket shape may vary depending on package Table 5: Tape dimension definitions Dimesions (in mm) Ref. 8/12 Min. Typ. Max. P1 3.90 4.00 4.10 P0 3.90 4.00 4.10 D0 1.40 1.50 1.60 D1 0.35 0.40 0.45 F 3.45 3.50 3.55 K0 0.47 0.52 0.57 P2 1.95 2.00 2.05 W 7.90 8.00 8.30 DocID030654 Rev 1 Package information BALF-ATM-01E3 Figure 17: Package orientation in reel Pin 1 located according to EIA-481 Note: 3.3 Pocket dimensions are not on scale Pocket shape may vary depending on package Stencil opening design Figure 18: Stencil opening in mm 200µm 200µm stencil opening footprint 3.4 Solder paste 1. 2. 3. 4. 5. 100 µm Solder stencil thickness is recommended Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Solder paste with fine particles: powder particle size is 20-45 µm. DocID030654 Rev 1 9/12 Package information 3.5 Placement 1. 2. 3. 4. 5. 6. 10/12 BALF-ATM-01E3 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeeze out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. DocID030654 Rev 1 Ordering information BALF-ATM-01E3 4 Ordering information Figure 19: Ordering information scheme BALF – ATM – 01 E3 Balun with filter Compatible with an Atmel Chip 01: version (compatible with ATSAMR21E18) E3: Coated CSP on glass bumpless Table 6: Ordering information 5 Order code Marking Package Weight Base qty. Delivery mode BALF-ATM-01E3 TJ Coated CSP on glass bumpless 2.28 mg 5000 Tape and reel (7'') Revision history Table 7: Document revision history Date Revision 07-Jun-2017 1 Changes Initial release. DocID030654 Rev 1 11/12 BALF-ATM-01E3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 12/12 DocID030654 Rev 1