BALF-NRF01E3

BALF-NRF01E3 50 Ω nominal input / conjugate match balun to nRF51822-QFAA /AB/AC and nRF51422-QFAA/AB/AC with integrated filter Datasheet  production data Applications  2.45 GHz balun with integrated matching network  Matching optimized for following chipsets: nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC (see Figure 19: nRF51822 and nRF51422 compatibility matrix). WHUPLQDO/*$ Description STMicroelectronics BALF-NRF01E3 is an ultraminiature balun. The BALF-NRF01E3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC RF transceivers. Features  Low insertion loss  Low amplitude imbalance It uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.  Low phase imbalance  Coated CSP on glass  Small footprint: < 1.5 mm2 Figure 1. Pinout diagram (bottom view) Benefits  Very low profile  High RF performance  PCB space saving versus discrete solution %$/ 9&& 1&       %$/  *1' $17 ',(,'  BOM count reduction  Efficient manufacturability January 2016 This is information on a product in full production. DocID027131 Rev 3 1/12 www.st.com 12 Characteristics 1 BALF-NRF01E3 Characteristics Table 1. Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min. Typ. PIN VESD TOP Input power RFIN - ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 k Ω , air discharge) 2000 - ESD ratings charge device model (JESD22-C101-C) 500 - ESD ratings machine model (MM: C = 200 pF, R = 25 Ω , L = 500 nH) 500 - Operating temperature -40 - Max. 20 dBm V +105 °C Table 2. Electrical characteristics (Tamb = 25 °C) Value Symbol Parameter Unit Min. Typ. Max. Conjugate match to: ZOUT ZIN Nominal differential output impedance – nRF51822-QFAA/AB/AC – nRF51422-QFAA/AB/AC Ω 50 Ω Nominal input impedance F Frequency range (bandwidth) IL Insertion loss in bandwidth RL Return loss in band 14 15 imb Phase imbalance -10 4 10 ° Aimb Amplitude imbalance -1 0.3 1 dB 2/12 2400 2.2 2540 MHz 2.7 dB dB 2f0 (4800-5080 MHz) 15.8 16.3 dB 3f0 (7200-7620 MHz) 22.7 24.1 dB DocID027131 Rev 3 BALF-NRF01E3 1.1 Characteristics RF performance (Tamb = 25 °C) Figure 2. Wide band frequency response Figure 3. Insertion loss  ',))WUDQVPLVVLRQG%  ,QVHUWLRQORVVLQEDQGG%            )*+]             )*+]    Figure 4. Phase imbalance        Figure 5. Amplitude imbalance  $PSOLWXGHLPEDODQFHG% 3KDVHLPEDODQFHGHJ              )*+]           Figure 6. Return loss on SE port  )*+]         Figure 7. Conducted measurement (at 4 dBm mode) 5/RQ6(SRUWG%   &RQGXFWHG3RZHUG%P /,0,76 %$/)15)(             )*+]              3RXW              /2 + + +  DocID027131 Rev 3 3/12 Application information 2 BALF-NRF01E3 Application information Figure 8. Application schematic & S) & S) '(& ;& ;& 3 3 3 3 3 3 3 3 3 3 3 3  9'' $9''   '&& $9''   3 966   3 966   3 $17   3  3 125',& Q5) *1' 3DG 4/12 $17  9''3$  3   3 3   9'' 3  6:'&/. 3 6:',2Q5(6(7  3              3 3 3 3 3  3  3 '(& 3 3 3  9&&BQ5) & Q) & Q) $QWHQQD :    %$/)15)( 3 3 9&&BQ5) 3 3  3 3  3 3  3 3  3 3  3 3  3 3  3 3  3 Q)  966 &  3 9&&BQ5)  3 3 3  3 3 ;0+] DocID027131 Rev 3 5 N    1&RU*1' & Q) 3 3 3 3 & Q) BALF-NRF01E3 3 Package information Package information  Epoxy meets UL94, V0  Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 3.1 LGA package information Figure 9. LGA package outline / [ [ ] \ ZZ : 7RSYLHZ * 3URILOHYLHZ 7 E   ',(,'  %RWWRPYLHZ F E  D  G D DocID027131 Rev 3  G D 5/12 Package information BALF-NRF01E3 Table 3. LGA package mechanical data mm Dim. Min. Typ. Max. L 1.40 1.50 1.60 W 0.90 1.00 1.10 T 0.42 0.45 0.48 a 0.18 0.20 0.20 b 0.18 0.20 0.20 c 0.38 0.40 0.42 d 0.28 0.30 0.32 Figure 10. PCB layout recommendation /DQGSDWWHUQ H[SRVHGSDGGLVWDQFH —P ([SRVHGSDG —P[—P /DQGSDWWHUQZLGWK —P 6/12 [—P /DQGSDWWHUQ OHQJWK —P &HQWHURI4)1ODQGSDWWHUQ WR%$/)15)(SDG &HQWHU —P DocID027131 Rev 3 BALF-NRF01E3 Package information Figure 11. Solder-mask recommendation PLFURQV PLFURQV PLFURQV PLFURQV &RSSHU 6ROGHUVWHQFLO Solder paste  100 µm solder stencil thickness is recommended.  Halide-free flux qualification ROL0 according to ANSI/J-STD-004.  “No Clean” solder paste is recommended.  Offers a high tack force to resist component movement during high speed.  Solder paste with fine particles: powder particle size is 20-45 µm. Placement  Manual positioning is not recommended.  It is recommended to use the lead recognition capabilities of the placement system, not the outline centering.  Standard tolerance of ±0.05 mm is recommended.  3.5 N placement force is recommended. Too much placement force can lead to squeeze out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.  To improve the package placement accuracy, a bottom side optical control should be performed with high resolution.  For assembly, a strong PCB support is recommended (especially on low thickness PCB) during solder paste printing, pick and place and reflow soldering by using optimized tools. DocID027131 Rev 3 7/12 Package information BALF-NRF01E3 Figure 12. Marking Figure 13. Pad bottom view [ [ ] \ ZZ 'RW67 ORJR (&23$&.JUDGH [[ PDUNLQJ ] PDQXIDFWXULQJ ORFDWLRQ \ZZ GDWHFRGH %$/ 9&& 1&             %$/  *1' $17 ',(,' Table 4. Pad assignment details LGA Name Description 6 NC 5 VCC Common collector voltage 4 BAL+ Balun positive output 3 BAL- Balun negative output 2 GND Ground 1 ANT Antenna connection Not connected 'RWLGHQWLI\LQJ3LQ $ORFDWLRQ “ ‘“ “ “ “  “ “ Figure 14. Tape and reel specifications 67 [[] \ZZ “ “ “ $OOGLPHQVLRQVDUHW\SLFDOYDOXHVLQPP Note: 8VHUGLUHFWLRQRIXQUHHOLQJ More information is available in the STMicroelectronics technical note: TN1197: “IPAD™, CSPG w/o bump: package description and recommendations for use”. 8/12 DocID027131 Rev 3 BALF-NRF01E3 Package information Figure 15. Footprint - 3 mils stencil -non solder mask defined Figure 16. Footprint - 3 mils stencil - solder mask defined &RSSHUSDGGLDPHWHU —PUHFRPPHQGHG —PPLQLPXP —PPD[LPXP 6ROGHUPDVNRSHQLQJ —PUHFRPPHQGHG —PPLQLPXP —PPD[LPXP 6ROGHUPDVNRSHQLQJ —PUHFRPPHQGHG —PPLQLPXP —PPD[LPXP &RSSHUSDGGLDPHWHU —PUHFRPPHQGHG —PPLQLPXP 6ROGHUVWHQFLORSHQLQJ —PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ —PUHFRPPHQGHG Figure 17. Footprint - 5 mils stencil -non solder mask defined Figure 18. Footprint - 5 mils stencil - solder mask defined &RSSHUSDGGLDPHWHU —PUHFRPPHQGHG —PPLQLPXP —PPD[LPXP 6ROGHUPDVNRSHQLQJ —PUHFRPPHQGHG —PPLQLPXP —PPD[LPXP 6ROGHUPDVNRSHQLQJ —PUHFRPPHQGHG —PPLQLPXP —PPD[LPXP &RSSHUSDGGLDPHWHU —PUHFRPPHQGHG —PPLQLPXP 6ROGHUVWHQFLORSHQLQJ —PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ —PUHFRPPHQGHG GHSHQGLQJRQSDVWHLWFDQJRGRZQWR—P GHSHQGLQJRQSDVWHLWFDQJRGRZQWR—P DocID027131 Rev 3 9/12 Package information BALF-NRF01E3 Figure 19. nRF51822 and nRF51422 compatibility matrix 5),&3DUW1XPEHU Q5)4)$$&$ Q5)4)$$& Q5)4)$$&$ Q5)4)$$& 3DFNDJH 67%DOXQ 4)1 %$/15)' 4)1 %$/15)' RU %$/15)( Q5)4)$%$$ Q5)4)$%$ Q5)4)$$* Q5)4)$$* Q5)4)$$* Q5)4)$$* Q5)4)$$( Q5)4)$%% Q5)4)$%% Q5)4)$%$ Q5)4)$$+ Q5)4)$$+ Q5)4)$$) Q5)4)$%& Q5)4)$%% %$/15)( 4)1 Q5)4)$&$ Q5)4)$&$ Q5)4)$&$ Q5)&[$[ Q5)&[$[ 10/12 1$ %$/15)( :/&63 DocID027131 Rev 3 %$/15)' BALF-NRF01E3 4 Ordering information Ordering information Figure 20. Ordering information scheme %$/)15)( %DOXQ ,QWHJUDWHGKDUPRQLFILOWHU 0DWFKLQJ1RUGLFQ5)  /*$SDFNDJH 6HHFRPSDWLELOLW\PDWUL[ Table 5. Ordering information 5 Order code Marking Package Weight Base Qty Delivery mode BALF-NRF01E3 SYN LGA 1.324 mg 5000 Tape and Reel(7”) Revision history Table 6. Document revision history Date Revision 28-Nov-2014 1 Initial release. 07-Jul-2015 2 Updated Table 1. 3 Updated document title and cover page. Updated Table 2 and Figure 8 and Figure 20. Added Figure 19. Format updated to current standard. 22-Jan-2016 Changes DocID027131 Rev 3 11/12 BALF-NRF01E3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 12/12 DocID027131 Rev 3