BALF-NRG-01D3

BALF-NRG-01D3 50 ohm nominal input / conjugate match balun balun to BlueNRG tranceiver, with integrated harmonic filter Datasheet - production data Description STMicroelectronics BALF-NRG-01D3 is an ultra miniature balun. The BALF-NRG-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the BlueNRG ST transceiver (both QFN and WLCSP versions). It is using STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance. Flip-Chip (4 bumps) package Figure 1: Application schematic with QFN type BlueNRG Features      50 Ω nominal input / conjugate match to BlueNRG device Low insertion loss Low amplitude imbalance Low phase imbalance Wafer level chip scale package (WLCSP) Benefits     Very low profile < 670 μm High RF performance RF BOM reduction Small footprint Figure 2: Application schematic with WLCSP type BlueNRG Solder a 10u_0805 between 1-2 or a 0R0_0805 between 1-3 Applications   Bluetooth low energy impedance matched balun filter Optimized for ST BlueNRG RFIC May 2017 DocID026543 Rev 5 This is information on a product in full production. 1/15 www.st.com Characteristics 1 BALF-NRG-01D3 Characteristics Table 1: Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min. PIN VESD TOP Input power RFIN Typ. Max. - 20 ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 Ω, air discharge) 2000 ESD ratings machine model (MM: C = 200 pF, R = 25 W, L = 500 nH) 200 - Operating temperature -40 - dBm V +105 °C Table 2: Impedances (Tamb = 25 °C) Value Symbol ZOUT ZIN Parameter Unit Min. Typ. Max. Nominal differential output impedance - Match to BlueNRG - Ω Nominal input impedance - 50 - Ω Table 3: RF performance (Tamb = 25 °C) Value Symbol Parameter Test condition Unit Min. f 2400 Max. 2500 MHz S11 Input return loss bandwidth -20 dB S21 Insertion loss -1.1 dB S21 2/15 Frequency range (bandwidth) Typ. Harmonic rejection (differential mode) ɸimb Output phase imbalance Aimb Output amplitude imbalance DocID026543 Rev 5 H2 -8 H3 -38 H4 -31 H5 -23 dB 7 ° 0.5 dB BALF-NRG-01D3 1.1 Characteristics RF measurement Figure 3: Differential transmission Figure 4: Return loss dB 0 -10 -19 dB -20 -20 -30 -21 -40 -50 -60 -22 -23 -24 f(GHz) -70 -80 0 2 4 6 8 10 12 14 f(GHz) -25 2.40 Figure 5: Insertion loss -0.8 2.42 2.44 2.46 2.48 2.50 Figure 6: H2 filtering dB -5 -0.9 dB -7 -1.0 -9 -1.1 -11 -1.2 -1.3 -13 f(GHz) -1.4 2.40 2.42 2.44 2.46 2.48 2.50 f(GHz) -15 4.80 Figure 7: H3 filtering -30 -20 -35 -25 -40 -30 -45 -35 -50 -40 -60 7.20 7.25 7.30 7.35 7.40 4.88 4.92 4.96 5.00 Figure 8: H4 filtering dB -55 4.84 dB f(GHz) -45 7.45 -50 9.60 7.50 DocID026543 Rev 5 f(GHz) 9.70 9.80 9.90 10 3/15 Characteristics BALF-NRG-01D3 Figure 9: H5 filtering -15 Figure 10: Amplitude imbalance dB 1.0 dB 0.8 -20 0.6 -25 0.4 -30 0.2 f(GHz) -35 12.00 12.10 12.20 12.30 12.40 12.50 f(GHz) 0 2.40 2.42 2.44 Figure 11: Phase imbalance 10 deg 8 6 4 2 f(GHz) 0 2.40 4/15 2.42 2.44 DocID026543 Rev 5 2.46 2.48 2.50 2.46 2.48 2.50 BALF-NRG-01D3 with QFN type BlueNRG BALF-NRG-01D3 2 BALF-NRG-01D3 with QFN type BlueNRG Figure 12: Application board EVB (2 layers) Figure 13: Recommended balun land pattern (EVB) 254 µm SMT = 320 µm TOP and SPT = 220 µm 180 µm DocID026543 Rev 5 5/15 BALF-NRG-01D3 with QFN type BlueNRG 2.1 BALF-NRG-01D3 BALF-NRG-01D3 measurements on QFN EVB Figure 14: Harmonics Figure 15: Sensitivity 6/15 DocID026543 Rev 5 BALF-NRG-01D3 BALF-NRG-01D3 with QFN type BlueNRG Figure 16: Pout DocID026543 Rev 5 7/15 BALF-NRG-01D3 with WLCSP type BlueNRG 3 BALF-NRG-01D3 BALF-NRG-01D3 with WLCSP type BlueNRG Figure 17: Recommended balun land pattern (WLCSP) 800 µm 220 µm µ µ µ Figure 18: PCB stack-up recommendation 8/15 DocID026543 Rev 5 BALF-NRG-01D3 3.1 BALF-NRG-01D3 with WLCSP type BlueNRG BALF-NRG-01D3 measurements on WLCSP EVB Figure 19: Harmonics Figure 20: Sensitivity DocID026543 Rev 5 9/15 BALF-NRG-01D3 with WLCSP type BlueNRG BALF-NRG-01D3 Figure 21: Pout 10/15 DocID026543 Rev 5 Package information BALF-NRG-01D3 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   4.1 Epoxy meets UL94, V0 Lead-free package Flip-Chip 4 bumps package information Figure 22: Flip-Chip 4 bumps package outline Table 4: Flip-Chip 5 bumps dimensions Dimesions (in mm) Parameter Min. Typ. Max. A 0.580 0.630 0.680 A1 0.180 0.205 0.230 A2 0.380 0.400 0.420 b 0.230 0.255 0.280 D 1.375 1.400 1.425 D1 0.990 1.000 1.010 E 0.825 0.850 0.875 E1 0.390 0.400 0.410 SE 0.200 fD 0.170 0.200 0.230 fE 0.195 0.225 0.255 ccc 0.050 Ø 0.025 DocID026543 Rev 5 11/15 Package information BALF-NRG-01D3 Figure 23: Footprint - 3 mils stencil -non solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Copper pad diameter: 320 µm recommended 300 µm minimum Solder stencil opening: 220 µm recommended Solder stencil opening: 220 µm recommended Figure 25: Footprint - 5 mils stencil -non solder mask defined Figure 26: Footprint - 5 mils stencil - solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Copper pad diameter: 320 µm recommended 300 µm minimum Solder stencil opening: 330 µm recommended* Solder stencil opening: 330 µm recommended* *depending on paste, it can go down to 270 µm 12/15 Figure 24: Footprint - 3 mils stencil - solder mask defined *depending on paste, it can go down to 270 µm DocID026543 Rev 5 Package information BALF-NRG-01D3 4.2 Flip-chip 4 bumps packing information Figure 27: Marking Table 5: Document revision history Ball Name Description A1 ANT Antenna connection A2 GND Ground B1 Rx_P Balun receive positive output B2 Rx_N Balun receive negative output Figure 28: Flip Chip tape and reel specifications More packing information is available in the application note:  AN2348 Flip-Chip: “Package description and recommendations for use” DocID026543 Rev 5 13/15 Ordering information 5 BALF-NRG-01D3 Ordering information Table 6: Ordering information 6 Order code Marking Package Weight Base qty. Delivery mode BALF-NRG-01D3 SV Flip-Chip package (4 bumps) 1.35 mg 5000 Tape and reel (7'') Revision history Table 7: Document revision history 14/15 Date Revision Changes 17-Jun-2014 1 Initial release. 17-Jul-2014 2 Updated Figure 13, Figure 17, Figure 22 and package view on cover page. Corrected typo error on Table 2. 18-Aug-2014 3 Updated title and description in cover page. 29-Sep-2015 4 Updated Figure 22. Added Figure 25 and Figure 26. Reformatted to current standards. 04-May-2017 5 Updated Figure 2: "Application schematic with WLCSP type BlueNRG". DocID026543 Rev 5 BALF-NRG-01D3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID026543 Rev 5 15/15