BALF-NRG-02D3

BALF-NRG-02D3 50 ohm nominal input / conjugate match to BlueNRG tranceiver, with integrated harmonic filter Datasheet - production data Description This device is an ultra-miniature balun which integrates matching network and harmonics filter. Matching impedance has been customized for the BlueNRG ST transceiver. The BALF-NRG-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance. Figure 1: Pin configuration (bump view) Features     50 Ω nominal input / conjugate match to BlueNRG device Low insertion loss Low amplitude imbalance Low phase imbalance Benefits    Small footprint RF BOM reduction High RF performance Applications   Bluetooth low energy impedance matched balun filter Optimized for ST BlueNRG RFIC June 2017 DocID030797 Rev 1 1/11 www.st.com Application schematic 1 BALF-NRG-02D3 Application schematic Figure 2: Application diagram example (refer to BlueNRG reference design) 2/11 DocID030797 Rev 1 BALF-NRG-02D3 2 Characteristics Characteristics Table 1: Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min. PIN VESD TOP Input power RFIN Typ. Max. - 10 ESD ratings human body model, all I/O one at a time while others connected to GND 2000 ESD ratings machine model (MM: C = 200 pF, R = 25 Ω, L = 500 nH) 200 - Operating temperature -40 - dBm V +105 °C Table 2: Electrical characteristics (Tamb = 25 °C) Value Symbol Definition Unit Min. Zdiff Nominal differential impedance ZANT Nominal antenna impedance f Frequency range (bandwidth) IL Insertion loss in bandwidth Typ. Max. Match to BlueNRG Ω 50 Ω 2400 2500 1.33 MHz 1.85 RLSE Single ended return loss in bandwidth 21 30 RLDIFF Differential return loss in bandwidth 17 19 H2 Second harmonic attenuation (differential mode) 40 49 H3 Third harmonic attenuation (differential mode) 46 55 H4 Fourth harmonic attenuation (differential mode) 42 50 H5 Fifth harmonic attenuation (differential mode) 31 56 H6 Fifth harmonic attenuation (differential mode) 29 45 H7 Fifth harmonic attenuation (differential mode) 30 42 Φimb Output phase imbalance -3.5 0 3.5 ° Aimb Output amplitude imbalance -1 0 1 dB DocID030797 Rev 1 dB 3/11 Characteristics 2.1 4/11 BALF-NRG-02D3 RF measurement Figure 3: Differential transmission (dB) Figure 4: Insertion loss (dB) Figure 5: Return loss single ended (dB) Figure 6: Return loss differential (dB) Figure 7: H2 harmonic attenuation (dB) Figure 8: H3 harmonic attenuation (dB) DocID030797 Rev 1 BALF-NRG-02D3 Characteristics Figure 9: H4 harmonic attenuation (dB) Figure 10: H5 harmonic attenuation (dB) Figure 11: H6 harmonic attenuation (dB) Figure 12: H7 harmonic attenuation (dB) Figure 13: Amplitude imbalance in dB Figure 14: Phase imbalance in deg DocID030797 Rev 1 5/11 Application information BALF-NRG-02D3 3 Application information 3.1 BALF-NRG-02D3 with BlueNRG Figure 15: Recommended balun land pattern 6/11 DocID030797 Rev 1 BALF-NRG-02D3 4 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 4.1 CSPG 0.4 package information Figure 16: CSPG package outline (bump view) DocID030797 Rev 1 7/11 Package information BALF-NRG-02D3 Figure 17: Footprint - 3 mils stencil -non solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Copper pad diameter: 320 µm recommended 300 µm minimum Solder stencil opening: 220 µm recommended Solder stencil opening: 220 µm recommended Figure 19: Footprint - 5 mils stencil -non solder mask defined Figure 20: Footprint - 5 mils stencil - solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Copper pad diameter: 320 µm recommended 300 µm minimum Solder stencil opening: 330 µm recommended* Solder stencil opening: 330 µm recommended* *depending on paste, it can go down to 270 µm 8/11 Figure 18: Footprint - 3 mils stencil - solder mask defined *depending on paste, it can go down to 270 µm DocID030797 Rev 1 BALF-NRG-02D3 4.2 Package information CSPG 0.4 packing information Figure 21: Marking Figure 22: Flip Chip tape and reel specifications More packing information is available in the application note:  AN2348 Flip-Chip: “Package description and recommendations for use” DocID030797 Rev 1 9/11 Ordering information 5 BALF-NRG-02D3 Ordering information Figure 23: Ordering information scheme BAL F - NRG – 02 D3 Balun Package type Integrated Harmonics Filter D3=Flip Chip on Glass 250µm ball diameter Custom impedance Design version NRG = BlueNRG from STMicroelectronics Table 4: Ordering information 6 Order code Marking Package Weight Base qty. Delivery mode BALF-NRG-02D3 TK CSPG 1.37 mg 5000 Tape and reel Revision history Table 5: Document revision history 10/11 Date Revision 23-Jun-2017 1 DocID030797 Rev 1 Changes Initial release. BALF-NRG-02D3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID030797 Rev 1 11/11