BALF-NRG-02J5

BALF-NRG-02J5 Datasheet 50 Ω ultra thin balun with integrated harmonic filter / conjugate match balun to ST BlueNRG-134 and BlueNRG-234 Features • Flip-Chip (4 bumps) package DIFF SE DIFF GND Top view • • • 50 Ω nominal input / conjugate match to STMicroelectronics chips BlueNRG-134 WLCSP and BlueNRG-234 WLCSP Low insertion loss Low amplitude imbalance Low phase imbalance • • • • Ultraminiature footprint: < 1.2 mm2 Extra low profile < 350 μm after reflow High RF performance RF BOM and area reduction Applications • • • 2.45 GHz impedance matched balun filter Optimized for STMicroelectronics chip set BlueNRG-134 and BlueNRG-234 WLCSP Wearable applications Description This device is an ultraminiature extra thin balun that integrates matching network and harmonics filter. Product status link BALF-NRG-02J5 Matching impedance has been customized for the BLUENRG-134 and BlueNRG-234 WLCSP from STMicroelectronics. Based on IPD technology on high resistivity silicium it optimizes the RF performance. STMicroelectronics qualified this product intended to be used in system in package module based on standard reliability procedure. For more details, please contact ST representatives. It is the responsibility of the customer to perform qualification reliability verifications as it is related to customer specific application, mission profile and module design, process. DS12630 - Rev 1 - July 2018 For further information contact your local STMicroelectronics sales office. www.st.com BALF-NRG-02J5 Characteristics 1 Characteristics Figure 1. Application schematic Table 1. Absolute ratings (limiting values) Symbol Parameter PIN VESD TOP DS12630 - Rev 1 Value Min. Typ. Max. Input power RFIN - ESD ratings human body model (JESD22-A114-C), all I/O one at a time while others connected to GND 2000 - ESD ratings charge device model (JESD22-C101-C) 500 - ESD ratings machine model, all I/O 200 - Operating temperature -40 - 10 Unit dBm V +105 °C page 2/13 BALF-NRG-02J5 Characteristics Table 2. Impedances (Tamb = 25 °C) Symbol ZDIFF ZSE Value Parameter Unit Min. Typ. Max. Nominal differential impedance - matched - Ω Nominal single ended impedance - 50 - Ω Table 3. RF performance (Tamb = 25 °C) Symbol f Frequency range (bandwidth) IL Insertion loss in bandwidth (differential mode) RLSE Value Min. Typ. 2400 1.35 Max. Unit 2500 MHz 1.65 dB Single ended return loss in bandwidth (differential mode) 26 34 dB Differential return loss in bandwidth 18 24 dB H2 Second harmonic attenuation (differential mode) 37 47 dB H3 Third harmonic attenuation (differential mode) 50 56 dB H4 Fourth harmonic attenuation (differential mode) 45 50 dB H5 Fifth harmonic attenuation (differential mode) 39 60 dB H6 Sixth harmonic attenuation (differential mode) 37 46 dB H7 Seventh harmonic attenuation (differential mode) 38 58 dB RLDIFF DS12630 - Rev 1 Parameter φimb Phase imbalance -4.5 4.5 ° Aimb Amplitude imbalance -1.1 +1.1 dB page 3/13 BALF-NRG-02J5 On-board measurements 1.1 On-board measurements Figure 2. Return loss on SE port (Tamb = 25 °C) Figure 3. Return loss on DIFF port (Tamb = 25 °C) (dB) 0 (dB) 0 -5 -5 -10 -10 -15 -15 -20 -20 -25 -25 -30 -30 -35 -35 -40 -40 f(GHz) -45 2.42 2.40 2.44 2.46 2.40 2.50 2.48 f(GHz) -45 Figure 4. Transmission (Tamb = 25 °C) 0 2.42 2.44 2.46 2.50 2.48 Figure 5. Insertion loss (Tamb = 25 °C) (dB) (dB) 0 -10 -0.5 -20 -30 -1.0 -40 -1.5 -50 -60 -2.0 -70 f(GHz) f(GHz) -2.5 -80 0 2 DS12630 - Rev 1 4 6 8 10 12 14 16 18 20 2.40 2.42 2.44 2.46 2.48 2.50 page 4/13 BALF-NRG-02J5 On-board measurements Figure 6. H2 attenuation (Tamb = 25 °C) 0 Figure 7. H3 attenuation (Tamb = 25 °C) (dB) 0 -10 -10 -20 -20 -30 -30 -40 -40 -50 -50 -60 -60 -70 f(GHz) -80 4.80 4.84 4.88 4.92 4.96 5.00 (dB) -70 f(GHz) -80 7.20 7.26 Figure 8. H4 attenuation (Tamb = 25 °C) 0 0 -10 -10 -20 -20 -30 -30 -40 -40 -50 -50 -60 -60 f(GHz) -80 9.60 9.68 9.76 9.84 9.92 10.00 -70 f(GHz) -80 12.0 0 -10 -10 -20 -20 -30 -30 -40 -40 -50 -50 -60 -60 -80 14.40 DS12630 - Rev 1 f(GHz) 14.52 14.64 14.76 14.88 7.50 12.1 12.2 12.3 12.4 12.5 Figure 11. H7 attenuation (Tamb = 25 °C) (dB) -70 7.44 (dB) Figure 10. H6 attenuation (Tamb = 25 °C) 0 7.38 Figure 9. H5 attenuation (Tamb = 25 °C) (dB) -70 7.32 15.00 (dB) -70 -80 16.80 f(GHz) 16.94 17.08 17.22 17.36 17.50 page 5/13 BALF-NRG-02J5 On-board measurements Figure 12. Amplitude imbalance (Tamb = 25 °C) 2.0 Figure 13. Phase imbalance (Tamb = 25 °C) (dB) (deg) 4.5 3.5 1.5 2.5 1.0 1.5 0.5 0.5 0.0 -0.5 -0.5 -1.5 -1.0 -2.5 -1.5 -3.5 f(GHz) -2.0 2.40 DS12630 - Rev 1 2.42 2.44 2.46 2.48 f(GHz) -4.5 2.50 2.40 2.42 2.44 2.46 2.48 2.50 page 6/13 BALF-NRG-02J5 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 Ultra thin Flip-Chip 4 bumps package information • • Epoxy meets UL94, V0 Lead-free package Figure 14. Ultra thin Flip-Chip 4 bumps package outline T B2 B1 X DIFF SE DIFF GND D Y B A1 A BOTTOM VIEW H SIDE VIEW TOP VIEW Table 4. Ultra thin Flip-Chip 4 bumps package mechanical data Parameter DS12630 - Rev 1 Description Min. Typ. Max. X X dimension of the die 1355 1385 1415 Y Y dimension of the die 825 855 885 A X pitch 1000 B Y pitch 400 A1 Distance from bump to edge of die on X axis 192.5 B1 Distance from bump to edge of die on Y axis 227.5 B2 Distance from bump to center of die on Y axis 200 D Bump diameter 202 227 252 T Substrate thickness 190 200 210 H Bump height 117 142 167 Unit µm page 7/13 BALF-NRG-02J5 Ultra thin Flip-Chip 4 bumps package information Figure 15. Recommended land pattern BALF-NRG-02J5 800 µm BlueNRG 50 Ω RF antenna Clearance = 100µm DS12630 - Rev 1 page 8/13 BALF-NRG-02J5 Ultra thin Flip-chip 4 bumps packing information 2.2 Ultra thin Flip-chip 4 bumps packing information Figure 16. Marking Note: More packing information is available in the application note: • AN2348 Flip-Chip: “Package description and recommendations for use” Figure 17. Flip Chip tape and reel specification P0 Pin 1 located according to EIA-481 Ø D0 A0 F W B0 K0 P1 P2 Ø D1 User direction of unreeling Note: Pocket dimensions are not on scale Pocket shape may vary depending on package Table 5. Ultra thin Flip-Chip 4 bumps package mechanical data Dimensions Ref. DS12630 - Rev 1 Millimeters Min. Typ. Max. A0 0.91 0.96 1.01 B0 1.44 1.49 1.54 page 9/13 BALF-NRG-02J5 Ultra thin Flip-chip 4 bumps packing information Dimensions Ref. Millimeters Min. Typ. Max. P1 3.90 4.00 4.10 P0 3.90 4.00 4.10 Ø D0 1.40 1.50 1.60 Ø D1 0.15 0.20 0.25 F 3.45 3.50 3.55 K0 0.38 0.43 0.48 P2 1.95 2.00 2.05 W 7.90 8.00 8.30 Figure 18. Footprint - non solder mask defined Figure 19. Footprint - solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Copper pad diameter: 320 µm recommended 300 µm minimum Solder stencil opening: 220 µm recommended Solder stencil opening: 220 µm recommended DS12630 - Rev 1 page 10/13 BALF-NRG-02J5 Ordering information 3 Ordering information Figure 20. Ordering information scheme BAL F - NRG - 02 J5 Balun Integrated harmonic filter Custom impedance NRG = BlueNRG from STMicroelectronics Design version Package typpe J5 = Flip Chip on HRSi ultra thin Table 6. Ordering information DS12630 - Rev 1 Order code Marking Package Weight Base qty. Delivery mode BALF-NRG-02J5 TP Flip-Chip 4 bumps 0.645 mg 5000 Tape and reel page 11/13 BALF-NRG-02J5 Revision history Table 7. Document revision history DS12630 - Rev 1 Date Revision 12-Jul-2018 1 Changes Initial release. page 12/13 BALF-NRG-02J5 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS12630 - Rev 1 page 13/13