BALF-SPI-02D3

BALF-SPI-02D3 50 ohm nominal input / conjugate match balun to SPIRIT1 434 MHz, with integrated harmonic filter Datasheet - production data Figure 1: Pin coordinates (top view) Flip-Chip (6 bumps) package Features Figure 2: Application schematic (top view) C0 1.8 - 3.6 V 2 MISO 3 MOSI 4 SCLK 5 CSn 17 SPIRIT1 16 VBAT GPIO0 18 VREG 1 19 GPIO2 C13 20 GPIO1 GPIO3     50 Ω nominal input / conjugate match to SPIRIT1 Low insertion loss Low amplitude imbalance Low phase imbalance Small footprint Digital interface  C12 SDN 15 L7 SMPS Ext1 14 SMPS Ext2 13 TX 12 L8 C11 L0 7 8 9 RFN RFP Very low profile < 670 μm after reflow High RF performance RF BOM and area reduction 6 RBIAS XIN    XOUT VBAT Benefits R0 CX 11 Antenna (50 Ω) 10 BALF-SPI-02D3 1.8-3.6 V XTAL C9 C10 Applications   434 MHz impedance matched balun filter Optimized for ST chip set SPIRIT1 Table 1: Device summary SMD PN Value Description L0 LGQ15HSR15J02 150 nH STMicroelectronics BALF-SPI-02D3 is an ultra miniature balun. The BALF-SPI-02D3 integrates matching network and harmonics filter. Matching impedance has been customized for the SPIRIT1 ST transceiver. L7 LQM21FN100M70L 10 µH L8 LQW15AN62NG00 62 nH C11 GRM188R60J105KA01D 1 µF C12 GRM155R71C104KA88D 100 nF C13 GRM1555C1H331JA01D 330 pF CX GRM1555C1H221JA01 220 pF The BALF-SPI-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance. March 2017 DocID027278 Rev 4 This is information on a product in full production. 1/12 www.st.com Characteristics 1 BALF-SPI-02D3 Characteristics Table 2: Absolute ratings (limiting values) Value Symbol Parameter Unit Min. PIN VESD TOP Typ. Max. - 20 Input power RFIN ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 kΩ, air discharge) 2000 ESD ratings machine model (MM: C = 200 pF, R = 25 Ω, L = 500 nH) 200 - Operating temperature -40 - dBm V +85 °C Table 3: Impedances (Tamb = 25 °C) Value Symbol Parameter Unit ZRX Nominal differential RX balun impedance ZTX Nominal TX filter impedance ZANT Antenna impedance Min. Typ. Max. - matched SPIRIT1 - Ω - 50 - Ω Table 4: RF performances (Tamb = 25 °C) Value Symbol Parameter Test condition Unit Min. F 2/12 Typ. Max. Frequency range (bandwidth) 434 MHz S21RX-ANT Insertion loss in bandwidth without mismatch loss (RX balun) -2.3 -3.2 dB S21TX-ANT Insertion loss in bandwidth without mismatch loss (TX filter) -2.4 -3.2 dB S11ANT Input return loss in bandwidth (RX balun) -20 -10.5 dB S11ANT Input return loss in bandwidth (TX filter) -32 -11 dB ɸimb Output phase imbalance (RX balun) -30 10 30 ° Aimb Output amplitude imbalance (RX balun) -3.5 -1 2 dB Att Harmonic levels (TX filter) Attenuation at 2fo -40 -44 Attenuation at 2fo -40 -45 DocID027278 Rev 4 dBm BALF-SPI-02D3 1.1 Characteristics RF measurements (Rx balun) Figure 3: Insertion loss (Tamb = 25 °C) -1.0 Figure 4: Return loss antenna (Tamb = 25 °C) (dB) 0 (dB) -1.5 -5 -2.0 -2.5 -10 -3.0 -15 -3.5 F(MHz) -4.0 390 400 410 420 430 440 450 460 390 470 Figure 5: Phase imbalance (Tamb = 25 °C) 4 F(MHz) -20 400 410 420 430 440 450 460 470 Figure 6: Amplitude imbalance (Tamb = 25 °C) (dB) 30 3 (deg) 20 2 1 10 0 0 -1 -10 -2 -20 -3 F(MHz) -4 390 400 410 420 430 440 450 460 F(MHz) -30 470 DocID027278 Rev 4 390 400 410 420 430 440 450 460 3/12 470 Characteristics 1.2 BALF-SPI-02D3 RF measurements (Tx filter) Figure 7: Transmission (Tamb = 25 °C) Figure 8: Insertion loss (Tamb = 25 °C) 0 (dB) -1.0 Insertion loss in band (dB) -10 -1.5 -20 -2.0 -30 -40 -2.5 -50 -3.0 -60 F(GHz) -70 0.1 0.3 0.5 0.7 0.9 1.5 1.3 1.1 390 1.7 Figure 9: Attenuation (Tamb = 25 °C) -5 -20 -10 -30 -15 -40 -20 -50 -25 420 430 440 450 460 470 -30 -60 F(GHz) -70 4/12 410 0 (dB) -10 0.8 400 Figure 10: Return loss antenna (Tamb = 25 °C) (dB) 0 F(MHz) -3.5 0.9 1.0 1.1 1.2 1.3 F(MHz) -35 1.4 DocID027278 Rev 4 390 400 410 420 430 440 450 460 470 Application information BALF-SPI-02D3 2 Application information Figure 11: Application board EVB (4 layers) Figure 12: TX output measurements at 433 MHz (LQW15 62nH) 14 Pout measured (dBm) 12 10 8 6 4 2 Prequested (dBm) 0 0 2 4 6 DocID027278 Rev 4 8 10 12 14 5/12 Application information BALF-SPI-02D3 Figure 13: Harmonic measurements at Pout = 10 dBm (LQW15 62nH) 0 H3 H2 Att (dB) H4 H5 H6 H7 H8 -10 -20 -30 -40 -50 -60 F (MHz) -70 0 6/12 500 1000 1500 2000 DocID027278 Rev 4 2500 3000 3500 4000 Package information BALF-SPI-02D3 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   3.1 Epoxy meets UL94, V0 Lead-free package Flip-Chip 6 bumps package information Figure 14: Flip-Chip 6 bumps package outline (top and side view) Table 5: Flip-Chip 6 bumps dimensions Parameter Description Min. Typ. Max. Unit 0.590 0.650 0.710 mm A Bump height + substrate thickness A1 Bump height 0.200 mm A2 Substrate thickness 0.400 mm b Bump diameter 0.210 0.250 0.290 mm D Y dimension of the die 1.950 2.000 2.050 mm D1 Y pitch 0.960 1.000 1.040 mm D2 Y pitch2 0.460 0.500 0.540 mm E X dimension of the die 1.350 1.400 1.450 mm E1 X pitch 0.790 0.820 0.850 mm fD1 Distance from bump to edge of die on Y axis 0.295 mm fD2 Distance from bump to edge of die on Y axis 0.195 mm ccc 005 DocID027278 Rev 4 mm 7/12 Package information BALF-SPI-02D3 Figure 15: PCB stack-up recommendation RX Ground clearance 130 microns TX/ANT Ground clearance 100 microns Copper pads 8/12 = 220 µm DocID027278 Rev 4 Package information BALF-SPI-02D3 Figure 16: Footprint - 3 mils stencil -non solder mask defined Figure 17: Footprint - 3 mils stencil - solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Copper pad diameter: 320 µm recommended 300 µm minimum Solder stencil opening: 220 µm recommended Solder stencil opening: 220 µm recommended Figure 18: Footprint - 5 mils stencil -non solder mask defined Figure 19: Footprint - 5 mils stencil - solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Copper pad diameter: 320 µm recommended 300 µm minimum Solder stencil opening: 330 µm recommended* Solder stencil opening: 330 µm recommended* *depending on paste, it can go down to 270 µm *depending on paste, it can go down to 270 µm DocID027278 Rev 4 9/12 Package information 3.2 BALF-SPI-02D3 Flip-chip 6 bumps packing information Figure 20: Marking Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode x x z y ww Figure 21: Flip Chip tape and reel specifications More packing information is available in the application note:  10/12 AN2348 Flip-Chip: “Package description and recommendations for use” DocID027278 Rev 4 Ordering information BALF-SPI-02D3 4 Ordering information Table 6: Ordering information 5 Order code Marking Package Weight Base qty. Delivery mode BALF-SPI-02D3 TD Flip-Chip 6 bumps 3.0 mg 5000 Tape and reel Revision history Table 7: Document revision history Date Revision Changes 13-Jan-2015 1 Initial release. 15-May-2015 2 Updated Table 4. Added Figure 12, Figure 13, Figure 18 and Figure 19. 18-Sep-2015 3 Updated Figure 14 and added Figure 5. 22-Mar-2017 4 Updated Figure 14: "Flip-Chip 6 bumps package outline (top and side view)". DocID027278 Rev 4 11/12 BALF-SPI-02D3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 12/12 DocID027278 Rev 4