BALF-SPI2-02D3

BALF-SPI2-02D3 Datasheet 50 Ω nominal input / conjugate matched balun to ST S2-LP, 433 MHz with integrated harmonic filter Features • Flip-Chip (6 bumps) package Pinout diagram - Top view GND ANT GND • • • • • • • 50 Ω nominal input / conjugate matched to ST S2-LP for 433 MHz frequency operation Low insertion loss Low amplitude imbalance Low phase imbalance Small footprint Very low profile < 620 μm after reflow High RF performance RF BOM and area reduction • ECOPACK®2 compliant component Applications RXP RXN TX • • 433 MHz impedance matched balun filter Optimized for ST S2-LP sub GHz RFIC Description Product status This device is an ultra-miniature balun. The BALF-SPI2-02D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance. BALF-SPI2-02D3 DS12508 - Rev 1 - May 2018 For further information contact your local STMicroelectronics sales office. www.st.com BALF-SPI2-02D3 Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter PIN Input power RFIN VESD TOP Value Unit 20 dBm ESD ratings human body model (JESD22-A114), all I/O one at a time while others connected to GND 2000 ESD ratings machine model (JESD22-A115), all I/O 200 Operating temperature V -40 to +105 °C Table 2. Impedances (Tamb = 25 °C) Symbol Parameter ZRX Nominal differential RX balun impedance ZTX Nominal TX filter impedance ZANT Antenna impedance Value Unit Min. Typ. Max. - matched ST S2-LP - Ω - 50 - Ω Table 3. Electrical characteristics and RF performances (Tamb = 25 °C) Symbol f Test condition Value Min. Typ. Max. Unit Frequency range 433 ILRX-ANT Insertion loss in bandwidth without mismatch loss (RX balun) 1.95 2.20 dB ILTX-ANT Insertion loss in bandwidth without mismatch loss (TX filter) 3.15 3.60 dB RLRX-ANT Input return loss in bandwidth (RX balun) 11 12 dB RLTX-ANT Input return loss in bandwidth (TX filter) 6.5 8.0 dB ɸimb Output phase imbalance (RX balun) -2.1 2.1 ° Aimb Output amplitude imbalance (RX balun) -1.1 1.1 dB Att DS12508 - Rev 1 Parameter Harmonic levels (TX filter) Attenuation at 2fo 52 58 Attenuation at 3fo 53 63 Attenuation at 4fo 54 55 Attenuation at 5fo 54 55 Attenuation at 6fo 55 56 Attenuation at 7fo 56 57 MHz dB page 2/13 BALF-SPI2-02D3 RF measurements (Rx balun) 1.1 RF measurements (Rx balun) Figure 1. Insertion loss Figure 2. Return loss on antenna (dB) 0.0 (dB) 0 -0.5 -5 -1.0 -10 -1.5 -15 -2.0 -20 -2.5 f(MHz) f(MHz) -3.0 -25 430 435 440 445 450 455 460 465 470 430 435 Figure 3. Amplitude imbalance 445 450 455 460 465 470 Figure 4. Phase imbalance (dB) 1.5 440 4 (deg) 3 1.0 2 0.5 1 0 0.0 -1 -0.5 -2 -1.0 -2 f(MHz) f(MHz) -1.5 430 -4 435 DS12508 - Rev 1 440 445 450 455 460 465 470 430 435 440 445 450 455 460 465 470 page 3/13 BALF-SPI2-02D3 RF measurements (Tx filter) 1.2 RF measurements (Tx filter) Figure 5. Transmission 0 Figure 6. Insertion loss (dB) (dB) 0.0 -0.5 -10 -1.0 -20 -1.5 -30 -2.0 -40 -2.5 -50 -3.0 -60 -3.5 f(GHz) -70 0.0 0.5 1.0 1.5 2.0 3.0 2.5 f(MHz) -4.0 430 3.5 435 440 445 450 455 460 465 470 Figure 7. Return loss on antenna (dB) 0 -5 -10 -15 -20 f(MHz) -25 430 DS12508 - Rev 1 435 440 445 450 455 460 465 470 page 4/13 BALF-SPI2-02D3 ST S2-LP application diagram example 1.3 ST S2-LP application diagram example Figure 8. ST S2-LP application diagram example DS12508 - Rev 1 page 5/13 BALF-SPI2-02D3 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 Flip-Chip 6 bumps package information Figure 9. Flip-Chip 6 bumps package outline (bottom and side view) D1 D2 A2 fD1 A1 fE2 fD2 E1 E fE1 Diam : b D A Table 4. Flip-Chip 6 bumps dimensions (in mm) Parameter Min. Typ. Max. A 0.580 0.630 0.680 A1 0.180 0.205 0.230 A2 0.380 0.400 0.420 b 0.230 0.255 0.280 D 2.050 2.100 2.150 D1 1.210 D2 0.500 E DS12508 - Rev 1 1.500 1.550 E1 1.060 fD1 0.195 fD2 0.195 fE1 0.195 fE2 0.295 1.600 page 6/13 BALF-SPI2-02D3 Flip-chip 6 bumps packing information 2.2 Flip-chip 6 bumps packing information Figure 10. Marking Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode x x z y ww Figure 11. Flip Chip tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.50 4.0 8.0 3.5 2.19 1.75 0.22 x x z y ww x x z y ww x x z y ww 1.64 4.0 0.72 All dimensions are typical values in mm DS12508 - Rev 1 User direction of unreeling page 7/13 BALF-SPI2-02D3 PCB assembly recommendations 3 PCB assembly recommendations 3.1 Land pattern Figure 12. Recommended balun land pattern Note: (*)Clearance 250 µm is needed to ensure good sensitivity. (**)1000 µm length between S2-LP & balun (between center QFN pads to center IPD pads). Figure 13. PCB stack-up recommendations DS12508 - Rev 1 page 8/13 BALF-SPI2-02D3 Stencil opening design 3.2 Stencil opening design Figure 14. Footprint - 3 mils stencil -non solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Solder stencil opening: 220 µm recommended Figure 16. Footprint - 5 mils stencil -non solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Solder stencil opening: 330 µm recommended* *depending on paste, it can go down to 270 µm 3.3 Solder mask opening: 220 µm recommended 180 µm minimum 260 µm maximum Copper pad diameter: 320 µm recommended 300 µm minimum Solder stencil opening: 220 µm recommended Figure 17. Footprint - 5 mils stencil - solder mask defined Solder mask opening: 220 µm recommended 180 µm minimum 260 µm maximum Copper pad diameter: 320 µm recommended 300 µm minimum Solder stencil opening: 330 µm recommended* *depending on paste, it can go down to 270 µm Solder paste 1. 2. 3. 4. DS12508 - Rev 1 Figure 15. Footprint - 3 mils stencil - solder mask defined Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Use solder paste with fine particles: powder particle size 20-38 µm. page 9/13 BALF-SPI2-02D3 Placement 3.4 Placement 1. 2. 3. 4. 5. 6. 3.5 PCB design preference 1. 2. 3.6 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 18. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 30 60 90 120 150 180 210 240 270 Note: Minimize air convection currents in the reflow oven to avoid component movement. Note: More information is available in the application note: • AN2348 Flip-Chip: “Package description and recommendations for use” DS12508 - Rev 1 300 page 10/13 BALF-SPI2-02D3 Ordering information 4 Ordering information Table 5. Ordering information DS12508 - Rev 1 Order code Marking Package Weight Base qty. Delivery mode BALF-SPI2-02D3 TN Flip-Chip 6 bumps 3.4 mg 5000 Tape and reel page 11/13 BALF-SPI2-02D3 Revision history Table 6. Document revision history DS12508 - Rev 1 Date Revision 02-May-2018 1 Changes Initial release. page 12/13 BALF-SPI2-02D3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS12508 - Rev 1 page 13/13